CN105655757A - 用于电连接不平坦二维和三维表面的可伸缩印刷电子片 - Google Patents

用于电连接不平坦二维和三维表面的可伸缩印刷电子片 Download PDF

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CN105655757A
CN105655757A CN201510872807.9A CN201510872807A CN105655757A CN 105655757 A CN105655757 A CN 105655757A CN 201510872807 A CN201510872807 A CN 201510872807A CN 105655757 A CN105655757 A CN 105655757A
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W·刘
M·库瓦
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    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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Abstract

描述了用于在不平坦二维(2D)或三维(3D)表面上形成导体的方法和设备。形成物体的表面上的两个点之间的导体所需的导电材料的量被确定。确定的量的导电材料被沉积在衬底上。具有该沉积的导电材料的衬底被应用到物体以在该物体的表面上的两个点之间形成导体。导电材料和衬底可以是可伸缩的。导电材料可以通过喷墨打印机或嵌入式3D打印机被沉积。具有沉积的导电材料的衬底可以通过将该具有沉积的导电材料的衬底层压到该物体而被应用到该物体。

Description

用于电连接不平坦二维和三维表面的可伸缩印刷电子片
技术领域
本公开一般涉及在可伸缩衬底上进行印刷以电连接不平坦二维和三维表面，且更具体地涉及用于在不平坦二维和三维表面上印刷可伸缩导电材料的方法和设备。
背景技术
三维打印(“3D打印”)，也称为加法制造(即3D打印的工业版本)已经被应用于产品开发、快速原型机设计以及专用制造中，以产生各种3D物体，例如汽车部件、医学植入物、珠宝、眼镜、消费者产品、药品等。这些3D物体通常具有不平坦的二维(“2D”)和3D表面。
一些3D物体可能需要包括电气组件的2D和3D表面。这些电气组件，例如传感器等，可能需要被电连接。目前添加电气组件和其到3D物体的表面的连接的方法是复杂的，需要花费大量熟练技工，且非常昂贵。这在这些3D和2D表面不平坦时尤其如此。因此，期待用于电连接3D物体的不平坦二维和三维表面的高性价比的方法和设备。
发明内容
描述了用于在不平坦二维(2D)或三维(3D)表面上形成导体的方法和设备。形成物体的表面上的两个点之间的导体所需的导电材料的量被确定。确定的量的导电材料被沉积在衬底上。具有该沉积的导电材料的衬底被应用到物体以在该物体的表面上的两个点之间形成导体。导电材料和衬底可以是可伸缩的。导电材料可以通过喷墨打印机或嵌入式3D打印机来沉积。具有沉积的导电材料的衬底可以通过将该具有沉积的导电材料的衬底层压到该物体来被应用到该物体。
附图说明
图1是具有不平坦表面的示例3D物体的示意图；
图2是用于在不平坦2D或3D表面上形成电路或导体的方法的流程图；
图3是具有沉积的连续导电材料条的示例衬底的示意图；以及
图4是应用到图1的3D物体的图3的具有沉积的导电材料条的示例衬底的示意图。
具体实施方式
可以理解用于电连接不平坦二维和三维表面的可伸缩印刷电子片的实施方式的附图和描述被简化以示出与清楚理解有关的元件，同时为了清楚去除了在典型打印***和电子器件中能找到的许多其他元件。本领域技术人员可以理解其他元件和/或步骤是实施本发明可以有的和/或所需要的。但是，由于这些元件和步骤是本领域公知的，且由于它们不能便于更好理解本发明，因此这里没有提供对这些元件和步骤的描述。
这里描述的非限制性实施方式关于用于印刷可伸缩电子片以电连接不平坦二维和三维表面的***和方法。根据这些教示，在不偏离这里描述的实质和范围的情况下，也可以使用其他电子设备、模块和应用。这里描述的***和方法可以针对各种应用和使用被修改而仍然在权利要求的实质和范围内。这里描述的和/或附图示出的实施方式和变形仅通过示例的方式给出且不限制本申请的范围和实质。这里的描述可以应用于用于电连接不平坦二维和三维表面的可伸缩印刷电子片的所有实施方式，虽然其可能关于特定实施方式被描述。
图1是具有不平坦表面的示例3D物体100的示意图。如图1所示，示例3D物体100的上表面是不平坦的，因为其包括不同尺寸的各种尖刺和凹陷。在示例应用中，可能需要形成电路或导体，其连接在3D物体100的不平坦上表面上相隔一距离的两个选择的点110、120。
图2是根据本发明的一个实施方式的用于在例如图1中提供的示例3D物体100的不平坦2D或3D表面上形成电路或导体的方法的流程图。参考图2，在步骤210，在物体的两个点之间生成电路或导体所需的导电材料的量被确定。该步骤可以包括测量该物体的表面上的两个选择的点之间的不平坦表面的长度并计算在该测量的长度形成电路或导体所需的导电材料的所需量。可替换地，该步骤可以包括在物体的表面的两个选择的点之间的不平坦表面的长度上测量形成图案的电路的总几何参数，例如马蹄形图案，并计算形成具有该图案的电路或导体所需的导体材料的所需量。
在步骤220，确定长度的导体材料可以被沉积在衬底上。图3是具有沉积的导电材料的连续条320的示例衬底310的示意图。导电材料可以以各种方式被沉积。例如，可以通过喷墨打印机以印刷的导电墨水的连续条的形式来沉积导电材料。喷墨打印机是一般用于在表面上分配小量墨水的设备。导电墨水是一种包括导电颗粒(例如粉末状或片状的银和/或碳类颗粒等)的墨水。使用导电墨水的喷墨打印机可以用于分配各种导电轨迹图案，在多种表面材料上形成连续电路或导体。
在另一实施方式中，导电材料可以通过嵌入式3D打印机来沉积。嵌入式3D打印机是可以用于通过沉积针将导电墨水直接挤压到衬底内的蓄积区域，而不是在衬底的表面的设备。应当理解可以使用沉积导电材料的其他方法。
具有不同属性的不同导电墨水也可以被使用。例如，一些导电墨水可以是当“被处理”时可伸缩的、挠性的、可压缩的以及可折皱的，且当被伸缩、弯曲、压缩或折皱时可以有效保持其性能水平、可靠性水平和功能水平。具有不同属性的不同衬底材料也可以被使用。例如，衬底材料可以是变化厚度的弹性材料，其允许衬底伸缩、弯曲、折皱等。
再参考图2，在步骤230，具有导电材料的衬底可以被应用到物体以在物体的两个点之间生成电路或导体。图4是应用到图1的3D物体的图3的具有沉积的导电材料连续条的示例衬底的示意图。如图4所示，具有沉积的导电材料的连续条320的衬底310连接3D物体100的点110和120。具有沉积的导电材料的连续条320的衬底310在3D物体100的不平坦上表面上延伸。具有沉积的导电材料的连续条320的衬底310可以以各种方式被应用到3D物体100。例如，衬底可以被层压在物体的不平坦表面。此外，衬底可以使用粘结剂贴到物体的不平坦表面。
如这里所述，这里描述的方法不限于执行任意特定功能的任意特定元件且所示方法的一些步骤不需要必须以示出的顺序发生。例如，在一些情况中，两个或更多方法步骤可以以不同顺序或同时发生。此外，所述方法的一些步骤可以是可选的(即使没有明确描述是可选的)且因此可以被省略。所公开的方法的这些和其他变形是容易理解的，尤其是根据这里所述的***的描述，且这些变形被认为是在本发明的范围内。
虽然以上以特定组合描述了特征和元件，但是每个特征和元件可以在没有其他特征和元件的情况下单独使用，或以与或不与其他特征和元件的各种组合来使用。

Claims (9)

1.一种用于在不平坦二维(2D)或三维(3D)表面上形成导体的方法，该方法包括：
确定用于在物体的表面上的两个点之间形成导体的导电材料的量；
在衬底上沉积所确定的量的导电材料；以及
将具有沉积的导电材料的所述衬底应用到所述物体以在所述物体的所述表面上的所述两个点之间形成导体。
2.根据权利要求1所述的方法，其中所述导电材料是可伸缩导电材料。
3.根据权利要求1所述的方法，其中所述衬底是可伸缩衬底。
4.根据权利要求1所述的方法，其中所述导电材料通过将导电材料印刷到所述衬底的所述表面上的喷墨打印机被沉积在所述衬底上。
5.根据权利要求1所述的方法，其中所述导电材料通过将导电材料沉积在所述衬底内的蓄积区的嵌入式三维(3D)打印机被沉积在所述衬底上。
6.根据权利要求1所述的方法，其中所述导电材料在所述衬底上被沉积为马蹄形图案。
7.根据权利要求1所述的方法，其中具有所述沉积的导电材料的所述衬底通过将具有所述沉积的导电材料的所述衬底层压在所述物体上而被应用到所述物体。
8.根据权利要求1所述的方法，其中所述物体在所述两个点之间具有至少一个不平坦表面。
9.根据权利要求8所述的方法，其中所述导体被形成在所述两个点之间的所述至少一个不平坦表面上。
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