CN105636343B - Hardboard and mobile terminal with it - Google Patents
Hardboard and mobile terminal with it Download PDFInfo
- Publication number
- CN105636343B CN105636343B CN201610029792.4A CN201610029792A CN105636343B CN 105636343 B CN105636343 B CN 105636343B CN 201610029792 A CN201610029792 A CN 201610029792A CN 105636343 B CN105636343 B CN 105636343B
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- substrate
- hardboard
- pad
- mobile terminal
- antenna
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of hardboard and with its mobile terminal.Hardboard is used to electronic component being connected to mounting circuit boards, and hardboard includes：Substrate and multiple wiring pads, substrate are equipped with circuit trace, and electronic component is suitable for being located on substrate and being electrically connected with circuit trace, and substrate includes antenna field and non-antenna field.Multiple wiring pads are located in the non-antenna field of substrate to be welded to connect with mounting circuit boards, and multiple wiring pads are electrically connected with circuit trace respectively.Hardboard according to the present invention may be used in the device for having aerial signal to propagate, and can be spaced apart the antenna field of substrate with signal propagation regions to the setting of induction signal propagation regions rather than antenna field, to avoid generating interference to aerial signal.This structure for evading signal interference, it is flexible design, at low cost.
Description
Technical field
The present invention relates to electronic circuit technology fields, more particularly, to a kind of hardboard and with its mobile terminal.
Background technology
It is logical close to sensing device (IR Sensor, infrared sensor) in the design of the mobile electronic products such as mobile phone
Chang Huixian is mounted on a small hardboard, then the hardboard module after attachment as an IC parts attachment to cell phone mainboard
On.This design scheme can save structure space and switching soft board (FPC), and structure design is flexible, and design cost is low, most
Number cell phone manufacturer is widely used.
When hardboard module just designs the antenna area in mobile phone, mobile phone using when it is possible that signal interference is asked
Topic, the communication quality of mobile phone are to be improved.
Invention content
The application is made to the discovery of following facts and problem and understanding based on inventor：
In the related technology using hardboard transfer electronic component mobile phone may presence signal difference problem.Inventor passes through
It crosses the study found that when hardboard module just falls the antenna area in mobile phone, signal solder pad can also be distributed in antenna headroom
In area, when working close to sensing device, signal solder pad has operating current fluctuation, generates and interferes and influence antenna performance.
For this purpose, the present invention is intended to provide a kind of hardboard, the interference which propagates aerial signal in application are smaller.
It is another object of the present invention to provide a kind of mobile terminals with above-mentioned hardboard.
Hardboard according to the ... of the embodiment of the present invention, the hardboard is used to electronic component being connected to mounting circuit boards, described
Hardboard includes：Substrate, the substrate be equipped with circuit trace, the electronic component be suitable for set on the substrate and with the electricity
Road cabling electrical connection, the substrate includes antenna field and non-antenna field；Multiple wiring pads, the multiple wiring pad are located at institute
State in the non-antenna field of substrate to be welded to connect with the mounting circuit boards, the multiple wiring pad respectively with the electricity
Road cabling electrical connection.
Hardboard according to the ... of the embodiment of the present invention, by the way that substrate is marked off antenna field and non-antenna field, wiring pad is located at
In non-antenna field, hardboard may be used in the device for having aerial signal to propagate, and can propagate induction signal the antenna field of substrate
Region is arranged rather than antenna field is spaced apart with signal propagation regions, to avoid generating interference to aerial signal.It is this to evade letter
The structure of number interference, it is flexible design, at low cost.
In some embodiments, hardboard further includes anchor pad, and the anchor pad is located at the antenna of the substrate
To be welded to connect with the mounting circuit boards in area, the anchor pad and the circuit trace mutually insulated.When hardboard is installed
Position when just having aerial signal propagation, anchor pad will not generate interference to antenna.The anchor pad of abortive haul network can prevent from pasting
Hardboard module generates the case where drift when piece, improves patch welding yield, and since the quantity of pad increases, hardboard and peace
It is more secured when device, circuit board is welded to connect.
Advantageously, the symmetrical center line of the anchor pad substrate opposite at least partly described wiring pad is symmetrical
Setting.The case where hardboard module generates drift when patch can be further prevented as a result, and yield is welded to further increase patch.
In some embodiments, the multiple wiring pad is concordant with the periphery wall of the substrate respectively is arranged.It is hard as a result,
The solder joint adjacent substrates edge that plate is formed after being welded to connect with mounting circuit boards, hardboard connection are more firm.
In certain embodiments, is respectively equipped on the periphery wall of the multiple wiring pad of the correspondence of the substrate
One metal half bore, the metal layer in each first metal half bore are connected with the corresponding wiring pad.Hardboard with
When mounting circuit boards are welded to connect, the first metal half bore can reinforce connectivity robustness.
In certain embodiments, the anchor pad is multiple, the multiple anchor pad interval setting.As a result,
Also it can achieve the purpose that pad overall distribution is balanced on substrate, prevent the case where hardboard module generates drift when patch.
Specifically, the anchor pad is concordant with the periphery wall of the substrate is arranged.In this way, hardboard with mounting circuit boards
The solder joint adjacent substrates edge formed after being welded to connect, hardboard connection are more firm.
Further, the periphery wall of the correspondence of the substrate anchor pad is equipped with the second metal half bore, and described the
Metal layer in two metal half bore is connected with the anchor pad.Thus when hardboard and mounting circuit boards are welded to connect, the
Two metal half bore can reinforce connectivity robustness.
In some embodiments, the substrate is equipped with the location hole for scoreboard positioning.Divide after patch can be facilitated as a result,
Plate positions, and improves scoreboard efficiency.
Specifically, the location hole is located on the periphery wall of the substrate and penetrates through institute on the thickness direction of the substrate
State substrate.Can avoid substrate overall construction intensity as a result, reduces excessive problem.
Advantageously, the location hole is multiple, and the multiple location hole is respectively provided on the opposite peripheral wall of the substrate.By
This, clamping force when positioning on substrate is symmetrical, and positioning is more prone to.
Mobile terminal according to the ... of the embodiment of the present invention, including：Mainboard, the mainboard are equipped with antenna；Hardboard, the hardboard
For the hardboard according to the above embodiment of the present invention, the multiple wiring pad on the hardboard respectively with the mainboard it
Between be welded to connect, the antenna field of the substrate corresponds to the signal propagation regions setting of the antenna；Electronic component, the electricity
Subcomponent is located on the hardboard.
Mobile terminal according to the ... of the embodiment of the present invention is connect by the way that hardboard upper substrate is marked off antenna field and non-antenna field
Wire bonding disk is located in non-antenna field, can be by the setting of antenna field respective antenna signal propagation regions rather than antenna field and aerial signal
Propagation regions are spaced apart, to avoid generating interference to aerial signal.This structure for evading signal interference, flexible design, at
This is low.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination following accompanying drawings to embodiment
Obviously and it is readily appreciated that, wherein：
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination following accompanying drawings to embodiment
Obviously and it is readily appreciated that, wherein：
Fig. 1 is the structural schematic diagram of hardboard according to the ... of the embodiment of the present invention.
Reference numeral：
Hardboard 10, substrate 1, pad 2, wiring pad 21, anchor pad 22, location hole 3, metal half bore 4, the first metal half
Hole 41, the second metal half bore 42, half bore pad 5,
Antenna field Q1, non-antenna field Q2.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " length ", " width ", " height ", " thickness ",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For convenience of description of the present invention and simplification of the description, specific side must be had by not indicating or implying the indicated device or element
Position, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.
In the description of the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ",
" fixation " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；Can be machinery
Connection can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary two elements
The interaction relationship of internal connection or two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Hardboard 10 according to the ... of the embodiment of the present invention is described below with reference to Fig. 1.
It should be noted that common circuit board includes printed circuit board and flexible circuit board, printing electricity in electronic product
Road plate (Printed Circuit Board, abbreviation pcb board) may be generally referred to as hardboard.Flexible circuit board (Flexible
Printed circuit Board, abbreviation FPC plate either FPCB plates) also it is flexible printed circuit board or flex circuit application
Deng may be generally referred to as soft board.
There are a kind of Rigid Flex, Rigid Flex (Rigid-Flex Printed Circuit in circuit board
Board, abbreviation RFPC plates or RFPCB plates), as its name suggests, exactly have hardboard and a kind of novel wiring board of soft board feature concurrently.
The rigid body portion of Rigid Flex has certain thickness and intensity, can install electronic component and bear certain mechanical force,
And software part is typically to be used for realizing three-dimensional installation, the use of software part can make monoblock Rigid Flex can be in part
Bending.
In electronic product, usually there is the case where interconnection between each function module.The interconnection of function module is mainly hard
The interconnection between interconnection or soft board between plate and soft board, also there is that there are the interconnection between hardboard.
Hardboard 10 according to the ... of the embodiment of the present invention, hardboard 10 are used to electronic component being connected to mounting circuit boards, also
It is to say, in embodiments of the present invention, the hardboard 10 referred to refers to pcb board, and the type of the mounting circuit boards referred to is not made specifically
It limits.Electronic component is located on hardboard 10, after hardboard 10 is welded to connect with mounting circuit boards, can make electronic component and installation circuit
Plate is electrically connected.In embodiments of the present invention, there may be the propagation of aerial signal in the application environment of hardboard 10.
Referring to Fig.1, hardboard 10 includes：Substrate 1 and multiple wiring pads 21, it is (not shown that substrate 1 is equipped with circuit trace
Go out), electronic component is suitable for setting on substrate 1 and being electrically connected with circuit trace, and substrate 1 includes antenna field Q1 and non-antenna field Q2.
Multiple wiring pads 21 are located in the non-antenna field Q2 of substrate 1, and to be welded to connect with mounting circuit boards, multiple wiring pads 21 divide
It is not electrically connected with circuit trace.
Wherein, wiring pad 21 is that the connection medium for welding, wiring pad 21 are contacted with circuit trace on hardboard 10
Connection with electronic component to be conducted.After the wiring pad 21 on hardboard 10 is welded to connect with mounting circuit boards, electronic component
Pass sequentially through circuit trace, wiring pad 21 is conducted with mounting circuit boards, to can between mounting circuit boards and electronic component
It is transmitted into row information.
When hardboard 10, which is mounted on, to be had on the device of aerial signal transmission structure, the antenna field Q1 of substrate 1 can be corresponded to day
Line signal transmission structure is arranged, and the non-antenna field Q2 of substrate 1 is then mutually separate with aerial signal transmission structure.When electronic component work
When making, operating current fluctuation is will produce on wiring pad 21, but since multiple wiring pads 21 are each provided at the non-antenna of substrate 1
In area Q2, therefore wiring pad 21 does not interfere with antenna performance.
Hardboard 10 according to the ... of the embodiment of the present invention, by the way that substrate 1 is marked off antenna field Q1 and non-antenna field Q2, wiring weldering
Disk 21 is located in non-antenna field Q2, and hardboard 10 may be used in the device for having aerial signal to propagate, and can be by the antenna field of substrate 1
Induction signal propagation regions are arranged Q1 rather than antenna field Q2 is spaced apart with signal propagation regions, to avoid producing to aerial signal
Raw interference.This structure for evading signal interference, it is flexible design, at low cost.
In embodiments of the present invention, the pads 2 such as wiring pad 21 are welded to connect by Reflow Soldering in installation electricity on hardboard 10
On the plate of road.Temperature is easily controllable when welding as a result, is also avoided that oxidation, manufacturing cost are also easier to control in welding process.
Optionally, the thickness of substrate 1 is 0.3mm-3.0mm.
Specifically, wiring pad 21 is multiple on hardboard 10, and multiple wiring pads 21 are spaced apart setting, it is ensured that adjacent two
Isolation between a wiring pad 21 effectively avoids short circuit phenomenon occur in welding between adjacent wiring pad 21, then
It ensure that welding quality.
In some embodiments, as shown in Figure 1, multiple wiring pads 21 are concordant with the periphery wall of substrate 1 respectively is arranged.This
Sample, 1 edge of solder joint adjacent substrates that hardboard 10 is formed after being welded to connect with mounting circuit boards, the connection of hardboard 10 are more firm.
For example, when hardboard 10 is by impact force, the impact force is with immediate solder joint on hardboard 10 due to apart from small, the couple of generation
It is small, therefore solder joint is survivable, it is hardboard 10 and mounting circuit boards stable connection, reliable.
Optionally, the difference that the form of wiring pad 21 can be as requested has different size and shapes, for example, connecing
Wire bonding disk 21 can be that either circle wiring pad 21 can also be water-drop-shaped or other profiled shapes for rectangle, rectangular, octagonal.
In certain embodiments, as shown in Figure 1, on the periphery wall of the multiple wiring pads of the correspondence of substrate 1 21 respectively
Equipped with the first metal half bore 41, the metal layer in each first metal half bore 41 is connected with corresponding wiring pad 21.
It should be noted that metal half bore is also known as half PTH (plating through hole, plated-through-hole).Metal half
Hole refer to half is only stayed on circuit board shape side, and the other half in sharp processing will by mill off plated through-hole (or
Slot), the internal perisporium of metal half bore is equipped with metal layer.
Due to having divided antenna field Q1 and non-antenna field Q2 on substrate 1, and wiring pad 21 can only be located at non-antenna field
In Q2, therefore the substrate 1 of the embodiment of the present invention is relatively large sized, and it is also big that risk is connected when being hit.
Therefore first metal half bore 41 is set at the correspondence wiring pad 21 of substrate 1, in hardboard 10 and mounting circuit boards
When being welded to connect, the first metal half bore 41 can reinforce connectivity robustness.
Optionally, a diameter of 0.25mm-1.0mm of the first metal half bore 41.
In some embodiments, as shown in Figure 1, hardboard 10 further includes anchor pad 22, anchor pad 22 is located at substrate 1
To be welded to connect with mounting circuit boards in antenna field Q1, anchor pad 22 and circuit trace mutually insulated.
Increase anchor pad 22 in the antenna field Q1 of substrate 1, anchor pad 22 is abortive haul network pad, does not take over what signal.
I.e. when electronic component on hardboard 10 works, anchor pad 22 does not have work due to being disconnected with circuit trace in anchor pad 22
Make electric current.When just there is aerial signal propagation in the position that hardboard 10 is installed, anchor pad 22 will not generate interference to antenna.
And due on substrate 1 wiring pad 21 be each provided in non-antenna field Q2, antenna field Q1 does not have wiring pad 21.It is anti-
Only because pad asymmetry generates drift when hardboard module sticker, it is therefore desirable to anchor pad 22 be arranged in antenna field Q1.By
This, the anchor pad 22 of abortive haul network can prevent the case where hardboard module generates drift when patch, improve patch welding yield, and
And since the quantity of pad 2 increases, hardboard 10 is more secured when being welded to connect with mounting circuit boards.
Advantageously, anchor pad 22 and the symmetrical center line of at least partly 21 opposing substrate 1 of wiring pad are symmetrical arranged.It will
21 symmetric design of wiring pad of anchor pad 22 and relative direction is conducive to the symmetrical of pad 2 on substrate 1, can be into one
Step prevents the case where hardboard module generates drift when patch, and yield is welded to further increase patch.
In Fig. 1, substrate 1 is rectangle, in the width direction of anchor pad 22 and 21 opposing substrate 1 of part line pad
Symmetrical center line is symmetrical.
In certain embodiments, anchor pad 22 is multiple, the setting of the interval of multiple anchor pads 22.In this way, also can
Achieve the purpose that 5 overall distribution of pad is balanced on substrate 1, prevents the case where hardboard module generates drift when patch.Certainly, fixed
Pad 22 is alternatively one, when for one, can also reach hardboard when preventing patch by the size of increase anchor pad 22
The purpose of module drift.
Specifically, it is arranged as in Fig. 1, anchor pad 22 is concordant with the periphery wall of substrate 1.In this way, hardboard 10 with installation
1 edge of solder joint adjacent substrates formed after welding circuit board connection, the connection of hardboard 10 are more firm.
Optionally, the difference that the form of anchor pad 22 can be as requested has different size and shapes, for example, solid
It can be that either circle anchor pad 22 can also be water-drop-shaped or other profiled shapes for rectangle, rectangular, octagonal to determine pad 22.
Further, as shown in Figure 1, the periphery wall of the correspondence anchor pad 22 of substrate 1 is equipped with the second metal half bore 42,
Metal layer in second metal half bore 42 is connected with anchor pad 22, to be welded to connect with mounting circuit boards in hardboard 10
When, the second metal half bore 42 can also reinforce connectivity robustness.
Optionally, a diameter of 0.25mm-1.0mm of the second metal half bore 42.
In some embodiments, hardboard 10 is cut by a monoblock printed circuit board, and processing method is：First printing
Multiple pads separately are processed on circuit board, printed circuit board are then cut into multiple platelets with pad, each
Platelet constitutes a hardboard 10.That is, in the example, hardboard 10 be by printed circuit board by scoreboard technique is processed
At.Also some examples, hardboard 10 are the printed circuit boards by bulk after it machined pad, and margins of excision waste material forms.
During printed circuit board is cut, printed circuit board, which needs to position, to be fixed, and is equipped with is used for scoreboard on substrate 1
The location hole 3 of positioning, scoreboard positions after can facilitating patch, improves scoreboard efficiency.
Specifically, as shown in Figure 1, location hole 3 is located on the periphery wall of substrate 1 and is penetrated through on the thickness direction of substrate 1
Substrate 1.Location hole 3 is located at 1 edge of substrate, also can avoid 1 overall construction intensity of substrate reduces excessive problem.
Optionally, the cross-sectional shape of location hole 3 is semicircle, rectangle, trapezoidal or other shapes, is not made here specific
It limits.
Advantageously, location hole 3 is multiple, and multiple location holes 3 are respectively provided on the opposite peripheral wall of substrate 1.That is, fixed
The quantity at least two in position hole 3, also can more than two.And multiple location holes 3 are located on the opposite peripheral wall of substrate 1, to base
The clamping force of plate 1 is symmetrical, and positioning is more prone to.
In a specific example of the invention, as shown in Figure 1, substrate 1 is rectangle, the faces top of substrate 1 are for connecting electronics
The faces bottom of element, substrate 1 are equipped with pad 2.A small half of rectangular area is set as antenna field Q1, a greater part of rectangle on substrate 1
Region is set as non-antenna field Q2.On substrate 1 there are six wiring pads 21, wherein four are fully located at non-antenna field along substrate 1
Side setting in Q2, is left two and is arranged respectively along the two neighboring side of the side.Anchor pad 22 is two, and two solid
Determine pad 22 along the side of substrate 1 being fully located in antenna field Q1 to be arranged, two anchor pads 22 and six wiring pads 21
In two symmetrically.Shape, the size all same of multiple pads 2, in Fig. 1, multiple pads 2 are rectangle.
In the example of fig. 1, location hole 3 is three, and three location holes 3 are respectively provided in the opposing sidewalls of substrate 1.Wherein
It is located at side peripheral wall there are two location hole 3, next location hole 3 is remained and is located on the peripheral wall of the other side.
In addition, at each metal half bore 4 (including the first metal half bore 41, second metal half bore 42), also set on substrate 1
There is a half bore pad 5, i.e. in Fig. 1,2 total of eight of pad of rectangle, corresponding metal half bore 4 is also eight, half be correspondingly arranged
Hole pad 5 is also eight.
The structure of mobile terminal according to the ... of the embodiment of the present invention is described below.Mobile terminal can be mobile phone, tablet computer, vehicle
The mobile electrons communication equipments such as computer are carried, for convenience of describing, are hereafter illustrated so that mobile terminal is mobile phone as an example.
Mobile terminal according to the ... of the embodiment of the present invention, including：Mainboard, hardboard and electronic component, mainboard are equipped with antenna, firmly
Plate is the hardboard 10 according to the above embodiment of the present invention, and multiple wiring pads 21 on hardboard 10 weld between mainboard respectively
It connects in succession, the signal propagation regions setting of the antenna field Q1 respective antennas of substrate 1, the letter of non-the antenna field Q2 and antenna of substrate 1
Separately, electronic component is located on hardboard 10 for number propagation regions.
Pinboard of the hardboard 10 between electronic component and mainboard.By 10 connecting electronic component of hardboard and mainboard, not only
The structure space of mobile terminal can be saved, hardboard 10 also corresponds to the backing plate of electronic component, and hardboard 10 can raise electronic component and exist
Height on mainboard.And by adjusting the thickness of hardboard 10, moreover it is possible to the distance between electronic component and mainboard are adjusted, to full
The installation site requirement of sufficient electronic component.
Mobile terminal according to the ... of the embodiment of the present invention, by the way that 10 upper substrate 1 of hardboard is marked off antenna field Q1 and non-antenna
Area Q2, wiring pad 21 are located in non-antenna field Q2, can be by the setting of antenna field Q1 respective antenna signal propagation regions rather than antenna
Area Q2 is spaced apart with aerial signal propagation regions, to avoid generating interference to aerial signal.This knot for evading signal interference
Structure, it is flexible design, at low cost.
In mobile phone, when hardboard module is just fallen in antenna for mobile phone region, the embodiment of the present invention can be still used
For hardboard conceptual design close to sensing device, structure design is flexible, at low cost.
Specifically, mainboard is flexible board, hard plate or Rigid Flex, that is to say, that electronic component can pass through hardboard
10 are connected on pcb board, FPC plates or RFPC plates, and the hardboard 10 of this structure has a wide range of application, adaptable.
Optionally, electronic component is sensor, for example, sensor is infrared sensor.In this way, sensor passes through hardboard 10
It is connected on mainboard, raises height of the sensor on mainboard, ensure that the installation site of sensor is correct.
In the description of this specification, the description of reference term " embodiment ", " example " etc. mean combine the embodiment or
Example particular features, structures, materials, or characteristics described are included at least one embodiment or example of the invention.At this
In specification, schematic expression of the above terms may not refer to the same embodiment or example.Moreover, description is specific
Feature, structure, material or feature can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of being detached from the principle of the present invention and objective a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The range of invention is limited by claim and its equivalent.
Claims (11)
1. a kind of mobile terminal, which is characterized in that including：
Mainboard, the mainboard are equipped with antenna；
Hardboard；
Electronic component, the electronic component are located on the hardboard；Wherein, the hardboard includes：
Substrate, the substrate are equipped with circuit trace, and the electronic component is electrically connected with the circuit trace, and the substrate includes
Antenna field and non-antenna field；
Multiple wiring pads, the multiple wiring pad are located in the non-antenna field of the substrate, the multiple wiring weldering
Disk is electrically connected with the circuit trace respectively；
The multiple wiring pad on the hardboard is welded to connect between the mainboard respectively, the antenna of the substrate
Area corresponds to the signal propagation regions setting of the antenna.
2. mobile terminal according to claim 1, which is characterized in that further include anchor pad, the anchor pad is located at
To be welded to connect with the mainboard in the antenna field of the substrate, the anchor pad and the circuit trace are mutually exhausted
Edge.
3. mobile terminal according to claim 2, which is characterized in that the anchor pad is welded at least partly described wiring
The symmetrical center line of the relatively described substrate of disk is symmetrical arranged.
4. mobile terminal according to claim 1, which is characterized in that the multiple wiring pad respectively with the substrate
Periphery wall is concordantly arranged.
5. mobile terminal according to claim 4, which is characterized in that the multiple wiring pad of correspondence of the substrate
The first metal half bore is respectively equipped on periphery wall, the metal layer in each first metal half bore is welded with the corresponding wiring
Disk is connected.
6. mobile terminal according to claim 2, which is characterized in that the anchor pad is multiple, the multiple fixation
Pad interval is arranged.
7. mobile terminal according to claim 2, which is characterized in that the anchor pad and the periphery wall of the substrate are flat
Neat setting.
8. mobile terminal according to claim 7, which is characterized in that the periphery of the correspondence anchor pad of the substrate
Wall is equipped with the second metal half bore, and the metal layer in the second metal half bore is connected with the anchor pad.
9. according to the mobile terminal described in any one of claim 1-8, which is characterized in that the substrate, which is equipped with, is used for scoreboard
The location hole of positioning.
10. mobile terminal according to claim 9, which is characterized in that the location hole is located at the periphery wall of the substrate
Above and on the thickness direction of the substrate penetrate through the substrate.
11. mobile terminal according to claim 10, which is characterized in that the location hole is multiple, the multiple positioning
Hole is respectively provided on the opposite peripheral wall of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610029792.4A CN105636343B (en) | 2016-01-15 | 2016-01-15 | Hardboard and mobile terminal with it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610029792.4A CN105636343B (en) | 2016-01-15 | 2016-01-15 | Hardboard and mobile terminal with it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105636343A CN105636343A (en) | 2016-06-01 |
| CN105636343B true CN105636343B (en) | 2018-09-11 |
Family
ID=56050670
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610029792.4A Active CN105636343B (en) | 2016-01-15 | 2016-01-15 | Hardboard and mobile terminal with it |
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| CN (1) | CN105636343B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550539B (en) * | 2017-01-24 | 2019-03-01 | 维沃移动通信有限公司 | A kind of production method of Rigid Flex, Rigid Flex and terminal |
| CN110473857A (en) * | 2018-05-10 | 2019-11-19 | Oppo广东移动通信有限公司 | Semiconductor element, chip mounter and patch system |
| CN108541131B (en) * | 2018-05-30 | 2020-04-17 | 业成科技（成都）有限公司 | Circuit board connecting structure and display device using same |
| CN110881251B (en) * | 2019-11-29 | 2021-05-07 | 捷开通讯(深圳)有限公司 | Main board |
| CN113219737B (en) * | 2021-04-20 | 2022-06-07 | 绵阳惠科光电科技有限公司 | Display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101057365A (en) * | 2004-11-11 | 2007-10-17 | 脉冲芬兰有限公司 | Antenna component |
| CN101175368A (en) * | 2006-11-01 | 2008-05-07 | 三星电子株式会社 | Circuit board and display device having the same |
| CN104684253A (en) * | 2013-11-28 | 2015-06-03 | 京瓷电路科技株式会社 | Wiring board and method for mounting semiconductor element on wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06334298A (en) * | 1993-05-27 | 1994-12-02 | Fujitsu Ltd | Mounting structure of surface mount part |
| US8319114B2 (en) * | 2008-04-02 | 2012-11-27 | Densel Lambda K.K. | Surface mount power module dual footprint |
-
2016
- 2016-01-15 CN CN201610029792.4A patent/CN105636343B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101057365A (en) * | 2004-11-11 | 2007-10-17 | 脉冲芬兰有限公司 | Antenna component |
| CN101175368A (en) * | 2006-11-01 | 2008-05-07 | 三星电子株式会社 | Circuit board and display device having the same |
| CN104684253A (en) * | 2013-11-28 | 2015-06-03 | 京瓷电路科技株式会社 | Wiring board and method for mounting semiconductor element on wiring board |
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| Publication number | Publication date |
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| CN105636343A (en) | 2016-06-01 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |