CN105633583A - Near-field communication module and manufacture method thereof - Google Patents
Near-field communication module and manufacture method thereof Download PDFInfo
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- CN105633583A CN105633583A CN201410588579.8A CN201410588579A CN105633583A CN 105633583 A CN105633583 A CN 105633583A CN 201410588579 A CN201410588579 A CN 201410588579A CN 105633583 A CN105633583 A CN 105633583A
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Abstract
The present invention relates to the field of the communication technology, and discloses a near-field communication module and a manufacture method thereof. The near-field communication module comprises in order a magnetic separating layer, a first adhesive layer, an annular coil and a second adhesive layer. The annular coil includes a first end portion and a second end portion which are respectively connected with a first feed point and a second feed point. The near-field communication module has simplified structure, ultrathin thickness and good machinery performance and communication performance. The present invention also provides the manufacture method of a near-field communication module, and the method comprises: performing laser cutting of a conductive metal film, making an annular coil with a first end portion and a second end portion, respectively performing laser welding a first feed point and a second feed point at the first end portion and the second end portion to make the antenna of a near-field communication module, and bonding and fixing the antenna made by adhesive to a magnetic separating layer surface. The manufacture method of a near-field communication module is simple and easy in step and high in yield and is helpful for controlling the manufacture cost.
Description
Technical field
The present invention relates to communication technique field, particularly to a kind of near-field communication module and preparation method thereof.
Background technology
Near field communication system is based on the communication system that closely (is generally 0.1��10 cm range) of 13.56MHz frequency. In numerous applications, particularly in the application of mobile-phone payment, it shows the advantage of this uniqueness. Being provided with antenna in the label of near field communication system, read/write device, this antenna utilizes transmitting terminal antenna and the receiving terminal antenna magnetic field coupling effect under the frequency of 13.56MHz to carry out signal transmission. Antenna plays critically important role in near-field communication technology, and the intensity flowing through the magnetic flux of antenna is a key factor of the quality directly affecting signal transmission. But, when antenna is close to metal surface, time such as battery of mobile phone surface, the magnetic field that antenna is launched can produce eddy-current loss in metal surface, thus reducing magnetic flux, causes the corresponding decline of the quality factor of antenna.
In conventional near-field communication module, generally the antenna of near-field communication is etched or plating is on polyimide piece, then the polyimide piece with etching or the antenna of plating is pasted onto on ferrite sheet. Therefore; conventional near-field communication module is provided with protecting film, antenna, polyimide layer, adhesive phase, ferrite layer and PET/ adhesive phase generally in the following order, and wherein the annulus of antenna and feed point are separately positioned on two surfaces of polyimide layer. But such modular structure be unfavorable for reducing the thickness of whole module and generally polyimide piece not there is the intensity being enough to support antenna feed point. And, along with miniaturization and the ultrathin of handheld device, it is necessary to reduce the thickness of near-field communication module further.
A kind of there is the suitable structure near-field communication module with the thickness of satisfied reduction and the requirement of the mechanical performance of raising accordingly, it would be desirable to develop.
Summary of the invention
It is an object of the present invention to provide a kind of ultrathin near-field communication module, this near-field communication module has the structure being greatly simplified and significantly reduced gross thickness.
Further object is that the manufacture method that this kind of ultrathin near-field communication module is provided.
For solving above-mentioned technical problem, embodiments of the present invention provide a kind of ultrathin near-field communication module, comprise magnetic isolation layer, the first adhesive phase, annulus and the second adhesive phase successively, this annulus has first end and the second end, first end is connected to the first feed point, and the second end is connected to the second feed point.
In embodiments of the present invention, have together with annulus and the first feed point connected, second feed point of first end and the second end, constitute the antenna of this near-field communication module. Compared with the near-field communication module being constituted antenna with flexible PCB (FPC) of the prior art, in the near-field communication module that embodiments of the present invention provide, flexible PCB is instead of, it is achieved that simplify structure, reduce cost, environment amenable feature with the conducting metal ring-type coil with first, second feed point. Compared with prior art, the near-field communication module prepared by embodiments of the present invention is thinner on thickness, more meets the development trend that electronic product is increasingly compact in design.
Further, the near-field communication module that embodiments of the present invention provide, it is provided with mould release membrance at the second adhesive phase away from the surface of annulus. The effect of this mould release membrance is isolation the second adhesive phase, after near-field communication module is made, and the mould release membrance set by the upper surface of the second adhesive phase, can avoid near-field communication module, with extraneous, unnecessary adhesion occurs; That peels off that this mould release membrance can realize between this near-field communication module with used electric product conveniently and efficiently when needed is bonding.
Preferably, the near-field communication module that embodiments of the present invention provide, magnetic isolation layer is the complex of ferrite sheet, magnetic composite thin film or above two material, and the thickness of magnetic isolation layer is 5��500 microns. Above-mentioned ferrite sheet can be the ferrite that nickel-copper-zinc (Ni-Cu-Zn) sinters, and it contains the ferrum oxide (Fe as key component3O4) and as the nickel of additive element, copper and zinc. The film that above-mentioned magnetic composite thin film can be made up of the composite of magnetic particle such as ferrum-silicon-aluminum (Fe-Si-Al), ferrum-silicon-chromium (Fe-Si-Cr), ferrum-cobalt (Fe-Co) or ferrum-nickel (Fe-Ni) alloy particle Yu macromolecular material. The complex of above two material can be purchased with any adhesive linkage, jointing tape, screw or card with magnetic composite thin film by ferrite sheet etc. mode be adhered or fastened to together with complex.
Preferably, in the ultrathin near-field communication module that embodiments of the present invention provide, the material of annulus, the first feed point and the second feed point is conducting metal, above-mentioned conducting metal is preferably gold, silver, copper or aluminum and the thickness of this annulus, the first feed point and the second feed point respectively 2��80 microns.
Preferably, in the near-field communication module that embodiments of the present invention provide, first adhesive phase and the second adhesive phase are acrylic adhesives, hot melt class binding agent, thermosetting class binding agent, bi-component class binding agent, above-mentioned binding agent is preferably acrylic adhesives, thermosetting class binding agent, the thickness of this first adhesive phase and the second adhesive phase respectively 1��30 micron.
Embodiments of the present invention provide a kind of manufacture method of above-mentioned near-field communication module simultaneously, and the method includes the steps of: on the surface of magnetic isolation layer by the first bonding conductive metal film of adhesive phase; Conductive metal film is cut, makes the annulus with first end and the second end; Use laser weld, weld the first feed point at first end, weld the second feed point at the second end; Finally set the second adhesive phase on the surface of annulus, namely prepare near-field communication module.
Embodiments of the present invention also provide for the second manufacture method of above-mentioned near-field communication module, and the method includes the steps of: conductive metal film is cut, and make the annulus with first end and the second end; Use laser weld, weld the first feed point at first end, weld the second feed point at the second end; Then the annulus of the first feed point and the second feed point will be welded with it will be bonded in by the first adhesive phase the surface of magnetic isolation layer; Last set the second adhesive phase at annulus away from the surface of the first adhesive phase, namely prepare near-field communication module.
Preferably, in above-mentioned first and second kinds of preparation methoies, what conductive metal film carried out cutting employing is cut, cutting die cutting or cutter cutting, for instance the modes such as the cutting of UV cut, flat board cutting die, cutter or circular knife die cut.
Compared with prior art, the preparation method of the near-field communication module that embodiments of the present invention provide, is not be attached on magnetic isolation layer as antenna using the flexible PCB made by binding agent; But after first conductive metal film being attached on magnetic isolation layer, again this conductive metal film is carried out cut, prepare the annulus with first end and the second end, then again through the method for laser weld, two ends of annulus connect first, second feed point respectively; Or first by conductive metal film cut, prepare the annulus with first end and the second end, the method then passing through laser weld, is connected first, second feed point respectively on two ends of annulus, is finally attached on magnetic isolation layer by binding agent. Above-mentioned manufacturing process step is simple, operationally do not have difficulty, and qualified yield rate is higher; And its making apparatus is common laser cutting machine and laser-beam welding machine, the acquisition expenses of equipment and maintenance cost are all relatively low, are also beneficial to control further the production cost of near-field communication module. The structure of the near field communication module prepared by said method is also relatively new, and this structure can be substantially reduced the thickness of module.
Accompanying drawing explanation
Fig. 1 is the structural representation of the near-field communication module in first embodiment of the invention;
Fig. 2 is the sectional side view of the near-field communication module sandwich in first embodiment of the invention;
Fig. 3 is the sectional side view of the near-field communication module sandwich in second embodiment of the invention;
Fig. 4 is the structural representation of the near-field communication module in third embodiment of the invention.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the embodiments of the present invention are explained in detail. But, it will be understood by those skilled in the art that in each embodiment of the present invention, propose many ins and outs in order to make reader be more fully understood that the application. But, even without these ins and outs with based on the many variations of following embodiment and amendment, it is also possible to realize the application each claim technical scheme required for protection.
First embodiment of the present invention relates to a kind of near-field communication module, its structure is as shown in Figure 1, specifically, this near-field communication module comprises magnetic isolation layer the 1, first adhesive phase 2, annulus 3 and the second adhesive phase 4 successively, this annulus 3 has first end 3-1 and the second end 3-2, this first end 3-1 is connected to the first feed point 5-1, and this second end 3-2 is connected to the second feed point 5-2. Accompanying drawing 2 is the sectional side view of the layer structure of the near-field communication module in present embodiment.
In the present embodiment, magnetic isolation layer 1 adopts the ferrite sheet of 60 �� m-thick, and the first adhesive phase 2 and the second adhesive phase 4 are acrylic adhesives, and annulus 3, feed point 5-1 and feed point 5-2 adopt the Copper Foil of 12 �� m-thick to be cut into.
The near-field communication module of present embodiment is made by following method: on the surface of magnetic isolation layer 1 by the first bonding conductive metal film of adhesive phase 2; Conductive metal film is carried out cut, makes the annulus 3 with first end 3-1 and the second end 3-2; Use laser weld, weld the first feed point 5-1 at first end 3-1, weld the second feed point 5-2 at the second end 3-2; Last set the second adhesive phase 4 at annulus 3 away from the surface of described first adhesive phase 2, namely prepare near-field communication module.
Specifically, the operation of above-mentioned making step is:
First, the Copper Foil of 12 �� m-thick is coated with acrylic adhesives and glues binder course 2 as first, the thickness of the first adhesive phase 2 is 5 ��m, and the Copper Foil after application of adhesive is pasted onto the surface of the ferrite sheet of 60 �� m-thick, and ferrite sheet is as magnetic isolation layer 1.
Secondly, make aerial coil: use laser will as above Copper Foil hemisection coil 3 circlewise, damage magnetic isolation layer 1, this annulus 3 has a first end 3-1 and the second end 3-2, and all docile on the surface of magnetic isolation layer 1.
Then, the preparation of antenna feed point and welding: take 12um thickness Copper Foil, use laser that its hemisection 12um is deep, be configured to the first feed point 5-1 and the second feed point 5-2. Being connected by the first end 3-1 of annulus 3 made above and the first feed point 5-1, the second end 3-2 and the second feed point 5-2 of annulus 3 is connected, and uses laser to be welded, it is ensured that electrical connection. So far, NFC antenna is prepared to, and it comprises the first feed point 5-1, the second feed point 5-2, and connects the annulus 3 of the first feed point 5-1 and the second feed point 5-2. Linked together by after laser spot welding between feed point and annulus 1, and antenna is bonded on the surface of magnetic isolation layer 1 by the first bond layer 2.
Finally, setting up of the second adhesive phase: setting up the second adhesive phase 4 at annulus 3 again away from the surface of the first adhesive phase 2, this second adhesive phase 4 is also acrylic adhesives, and thickness is 10 ��m, namely prepare near-field communication module.
Near-field communication module prepared by present embodiment has simplification structure, reduce cost, environment amenable feature, existing FPC comprises multiple structure generally in the following order: protecting film, antenna, polyimide layer, adhesive phase, ferrite layer and PET/ adhesive phase etc., and in the present embodiment, the metallic film being directly bonded on sealing coat is utilized to make the coil obtained, instead of FPC, relatively existing near-field communication module, eliminate protection rete and polyimide layer, substantially reduce the thickness of near-field communication module, simplify the structure of near-field communication module, also assures that this near-field communication module has good mechanical strength and gravity load simultaneously,
Second embodiment of the present invention is directed to a kind of near-field communication module, and its structure is as shown in Figure 3. The structure of the near-field communication module of the second embodiment and the first embodiment are essentially identical, are distinctive in that, it is provided with mould release membrance 6 at the second adhesive phase 4 away from the surface of annulus 3. The effect of this mould release membrance 6 is isolation the second adhesive phase 4, after near-field communication module is made, and the mould release membrance 6 set by upper surface of the second adhesive phase 4, there is unnecessary adhesion with the external world in that can avoid near-field communication module; That peels off that this mould release membrance 6 can realize between this near-field communication module with used electric product conveniently and efficiently when needed is bonding.
The making step of the near-field communication module of present embodiment is: first conductive metal film is carried out cutting die cutting, makes the annulus 3 with first end 3-1 and the second end 3-2; Use laser weld, weld the first feed point 5-1 at first end 3-1, weld the second feed point 5-2 at the second end 3-2; Then the annulus 3 being welded with the first feed point 5-1 and the second feed point 5-2 is passed through the first adhesive phase 2 and be bonded in the surface of magnetic isolation layer 1; Last setting the second adhesive phase 4 at annulus 3 away from the surface of the first adhesive phase 2, this second adhesive phase 4 with mould release membrance 6, namely prepares near-field communication module on the surface away from annulus 3.
In actual fabrication process, material is according to following selection: select ferrum-nickel magnetic composite as magnetic isolation layer 1; The aluminium foil cutting making selecting 20um thickness becomes annulus the 3, first feed point 5-1 and the second feed point 5-2; Selecting thermosetting class binding agent as the first adhesive phase 2, thickness is 10um, selects the acrylic psa adhesive tape carrying mould release membrance 6 as the second adhesive phase 4, and thickness is 20um.
Specifically, the operation of making step is:
First, antenna and welding feed point are made: the aluminium foil of 20 �� m-thick being carried out cutter die cutting and is slit into annulus 3, this annulus 3 has first end 3-1 and the second end 3-2; The aluminium foil taking 20 �� m-thick again uses cutting die by its hemisection, it is configured to the first feed point 5-1 and the second feed point 5-2, be connected by this annulus 3 first end 3-1 and the first feed point 5-1, the second end 3-2 and the second feed point 5-2 is connected, and uses laser to be welded, it is ensured that electrical connection. So far, NFC antenna is prepared to, and it comprises the first feed point 5-1, the second feed point 5-2, and connects the annulus 3 of the first feed point 5-1 and the second feed point 5-2.
Then, bonding: to be adhered on ferrum-nickel magnetic composite layer by making complete NFC antenna by the first adhesive phase 2, this first adhesive phase 2 is thermosetting class binding agent, and this ferrum-nickel magnetic composite layer is as magnetic isolation layer 1.
Finally, setting up of second adhesive phase: set up the second adhesive phase 4 again away from the surface of the first adhesive phase 2 at annulus 3, this the second adhesive phase 4 is the acrylic psa glue carrying mould release membrance 6, and thickness is 20 ��m, namely prepares near-field communication module.
When the near-field communication module using present embodiment to prepare, mould release membrance 6 can be peeled off, the second adhesive phase 4 can be made to expose, use this second adhesive phase 4 bonding by carrying out between this near-field communication module prepared and electric product further.
A kind of near-field communication module involved by 3rd embodiment of the present invention, its structure is as shown in Figure 4, structure of near-field communication module in present embodiment and preparation method thereof is all similar with the first embodiment, the difference is that only: the annulus 3 of the near-field communication module of present embodiment is not as in the first embodiment for the coil of square ring, but forms circular coil. It is true that the concrete shape of this annulus 3 all can convert according to actual needs, variously-shaped annulus all can realize the purpose of the present invention.
The manufacture method of the near-field communication module of present embodiment carries out according to the step that the first embodiment is identical, therefore no longer repeats.
It will be understood by those skilled in the art that the respective embodiments described above are to realize specific embodiments of the invention, and in actual applications, it is possible in the form and details it is done various change, without departing from the spirit and scope of the present invention.
Claims (10)
1. a near-field communication module, it is characterized in that comprising magnetic isolation layer (1), the first adhesive phase (2), annulus (3) and the second adhesive phase (4) successively, described annulus (3) has first end (3-1) and the second end (3-2), described first end (3-1) is connected to the first feed point (5-1), and described the second end (3-2) is connected to the second feed point (5-2).
2. near-field communication module according to claim 1, it is characterised in that be provided with mould release membrance (6) away from the surface of described annulus (3) described second adhesive phase (4).
3. near-field communication module according to claim 1, it is characterized in that, described magnetic isolation layer (1) is ferrite sheet, the complex of magnetic composite thin film or above two material, and the thickness of described magnetic isolation layer (1) is 5��500 microns.
4. near-field communication module according to claim 1, it is characterised in that the material of described annulus (3), the first feed point (5-1) and the second feed point (5-2) is conducting metal.
5. near-field communication module according to claim 4, it is characterised in that described conducting metal is gold, silver, copper or aluminum.
6. near-field communication module according to claim 1, it is characterised in that the thickness of described annulus (3), the first feed point (5-1) and the second feed point (5-2) respectively 2��80 microns.
7. near-field communication module according to claim 1, it is characterized in that, described first adhesive phase (2) and the second adhesive phase (4) are acrylic adhesives or thermosetting class binding agent, and the thickness of the first adhesive phase (2) and the second adhesive phase (4) respectively 1��30 micron.
8. the manufacture method of a near-field communication module, it is characterised in that comprise the steps of on the surface of magnetic isolation layer (1) by the first adhesive phase (2) bonding conductive metal film; Described conductive metal film is cut, makes the annulus (3) with first end (3-1) and the second end (3-2); Use laser weld, weld the first feed point (5-1) at described first end (3-1), weld the second feed point (5-2) at described the second end (3-2); Last set the second adhesive phase (4) at described annulus (3) away from the surface of described first adhesive phase (2), namely prepare near-field communication module.
9. the manufacture method of a near-field communication module, it is characterised in that comprise the steps of and conductive metal film is cut, make the annulus (3) with first end (3-1) and the second end (3-2); Use laser weld, weld the first feed point (5-1) at described first end (3-1), weld the second feed point (5-2) at described the second end (3-2); Then the annulus (3) of the first feed point (5-1) and the second feed point (5-2) will be welded with it will be bonded in by the first adhesive phase (2) surface of magnetic isolation layer (1); Last set the second adhesive phase (4) at described annulus (3) away from the surface of described first adhesive phase (2), namely prepare near-field communication module.
10. the manufacture method of near-field communication module according to claim 8 or claim 9, it is characterised in that described cutting adopts the cutting of cut, cutting die or cutter cutting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410588579.8A CN105633583A (en) | 2014-10-28 | 2014-10-28 | Near-field communication module and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410588579.8A CN105633583A (en) | 2014-10-28 | 2014-10-28 | Near-field communication module and manufacture method thereof |
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| CN105633583A true CN105633583A (en) | 2016-06-01 |
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| CN201410588579.8A Pending CN105633583A (en) | 2014-10-28 | 2014-10-28 | Near-field communication module and manufacture method thereof |
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| CN102427158A (en) * | 2011-08-11 | 2012-04-25 | 瑞声声学科技(深圳)有限公司 | Method for making radio frequency identification antenna |
| CN102437414A (en) * | 2011-08-04 | 2012-05-02 | 瑞声声学科技(深圳)有限公司 | Making method of radio frequency identification antenna |
| EP1901394A4 (en) * | 2005-07-07 | 2012-09-26 | Toda Kogyo Corp | Magnetic antenna |
| CN103947040A (en) * | 2011-09-14 | 2014-07-23 | 兰克森控股公司 | Rfid antenna |
-
2014
- 2014-10-28 CN CN201410588579.8A patent/CN105633583A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1901394A4 (en) * | 2005-07-07 | 2012-09-26 | Toda Kogyo Corp | Magnetic antenna |
| CN102437414A (en) * | 2011-08-04 | 2012-05-02 | 瑞声声学科技(深圳)有限公司 | Making method of radio frequency identification antenna |
| CN102427158A (en) * | 2011-08-11 | 2012-04-25 | 瑞声声学科技(深圳)有限公司 | Method for making radio frequency identification antenna |
| CN103947040A (en) * | 2011-09-14 | 2014-07-23 | 兰克森控股公司 | Rfid antenna |
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Effective date of registration: 20160712 Address after: 201600, -990, room 3, building 15, No. 44, Qiu Jia Wan, Songjiang District, Shanghai Applicant after: Shanghai Yong Hai Asset Management Co., Ltd. Address before: 215128 Jiangsu city of Suzhou province Wuzhong District Sunshine Garden Garden 1 Room 305 Applicant before: Lin Xiaoqun |
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