CN105628218A - Optical module chip temperature calibration method - Google Patents
Optical module chip temperature calibration method Download PDFInfo
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- CN105628218A CN105628218A CN201510973407.7A CN201510973407A CN105628218A CN 105628218 A CN105628218 A CN 105628218A CN 201510973407 A CN201510973407 A CN 201510973407A CN 105628218 A CN105628218 A CN 105628218A
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Abstract
The invention discloses an optical module chip temperature calibration method. The maximum preheating time is set, and a to-be-calibrated chip and a standard sample are preheated and timed; a plurality of times of temperature values are acquired from the to-be-calibrated chip, a deviation value is calculated according to the plurality of times of temperature values, and whether the deviation value is no more than a specified threshold is judged; if yes, a temperature compensation value is calculated according to the acquired plurality of temperature values; and the to-be-calibrated chip is calibrated according to the compensation value. According to the optical module temperature calibration method disclosed by the invention, through automatically judging whether the chip temperature achieves a stable value, errors caused due to manual judgment in the prior art are overcome, the calibration accuracy is improved, the automatic degree is high, human participation is not needed, and the method is convenient and high-efficiency.
Description
Technical field
The present invention relates to optical module field, particularly to a kind of optical module chip temperature correction method.
Background technology
It is a link of necessity in chip production that optical module chip temperature is calibrated, and existing temperature correction method is generally adopted multi-channel plate that chip is preheated, then temperature is calibrated by infrared sensor at normal temperatures, whole process is both needed to want artificial Non-follow control, but owing to operator do not know when chip temperature can reach to stablize, the accuracy of calibration is created large effect by this, simultaneously the efficiency of manual calibration also relatively low under.
Summary of the invention
The invention reside in the above-mentioned deficiency overcoming prior art, it is provided that a kind of accuracy is high, the optical module chip temperature correction method of convenience and high-efficiency.
In order to realize foregoing invention purpose, the technical solution used in the present invention is:
A kind of optical module chip temperature correction method, including:
Maximum preheating time is set, treats calibration chip and standard sample carries out preheating timing;
Described chip to be calibrated is gathered several times temperature value, calculates according to described several times temperature value and obtain deviation value, it is judged that whether described deviation value is not more than appointment threshold value;
If so, then temperature compensation value is calculated according to the described some temperature values collected;
According to described offset, described chip to be calibrated is calibrated.
Further, described maximum preheating time is 10-30min.
Further, described deviation value is variance or the standard deviation of described several times temperature value, and described appointment threshold value is determined by described variance corresponding to described deviation value or described standard deviation.
Further, described to described chip to be calibrated gather several times temperature value, according to described several times temperature value calculate obtain deviation value, including:
Every scheduled time sampling once chip temperature to be calibrated, until collecting predetermined quantity temperature value, then calculate according to described predetermined quantity temperature value and obtain deviation value.
Further, the described scheduled time is 15s-45s.
Further, if described deviation value is more than specifying threshold value, it is judged that whether the present timing time exceedes described maximum preheating time, if it is not, then continue gather the temperature value of several described chips to be calibrated and again calculate deviation value.
Further, if described deviation value is more than specifying threshold value and present timing time to exceed maximum preheating time, then resets described timing, and described chip to be calibrated is re-started temperature acquisition.
Further, if described deviation value is more than specifying threshold value and present timing time to exceed maximum preheating time, then described chip to be calibrated is overhauled.
Compared with prior art, beneficial effects of the present invention
Whether a kind of optical module temperature correction method of the present invention reaches stationary value by automatic decision chip temperature, overcomes the error that artificial judgment in prior art causes, and improves calibration accuracy, and automaticity is high simultaneously, it is not necessary to artificially participate in, convenience and high-efficiency.
Accompanying drawing explanation
Fig. 1 is a kind of optical module chip temperature correction method flow diagram of the present invention.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the present invention is described in further detail. But this should not being interpreted as, the scope of the above-mentioned theme of the present invention is only limitted to below example, and all technology realized based on present invention belong to the scope of the present invention.
Embodiment 1:
Fig. 1 is a kind of optical module chip temperature correction method flow diagram of the present invention, including:
Maximum preheating time is set, treats calibration chip and standard sample carries out preheating timing;
Described chip to be calibrated is gathered several times temperature value, calculates according to described several times temperature value and obtain deviation value, it is judged that whether described deviation value is not more than appointment threshold value;
If so, then temperature compensation value is calculated according to the described some temperature values collected;
According to described offset, described chip to be calibrated is calibrated.
A precondition as the present invention, optical module product is when fully heat radiation, skin temperature can immediate stability, the product of model of the same race skin temperature after stabilizing the temperature is basically identical, and the product of different power consumption skin temperature after stabilizing the temperature also has same profiling temperatures.
General, maximum preheating time is more big, specify threshold value more little, the temperature value gathered is more many, then the precision of data is more high, in actual production, it is necessary to consider that production efficiency arranges corresponding parameter and is calibrated with practical situation, deviation value represents the degree that module temperature to be calibrated deviates, and more little expression temperature is more stable.
Whether a kind of optical module temperature correction method of the present invention reaches stationary value by automatic decision chip temperature, overcomes the error that artificial judgment in prior art causes, and improves calibration accuracy, and automaticity is high simultaneously, it is not necessary to artificially participate in, convenience and high-efficiency.
Further, described maximum preheating time is 15-45min.
As previously described, preheating time is more short, then the data obtained are likely to inaccurate; Preheating time is more long, then can reduce production efficiency, indirectly increase cost, therefore, through repeatedly testing, be 10-30min by set of time is preferably select.
Further, described deviation value is variance or the standard deviation of described several times temperature value, and described appointment threshold value is determined by described variance corresponding to described deviation value or described standard deviation.
In theory, after temperature is carried out unlimited measurement, can ensure that its variance or standard deviation are that namely 0(specifies threshold value to be 0), in actual production, due to the impact from the error of each side and pendulous frequency, then need appointment threshold value to be arranged in a rational scope, through repeatedly testing, if value of calculation is variance, then appointment threshold value is set to 0.2-0.5 and preferably selects.
Further, described to described chip to be calibrated gather several times temperature value, according to described several times temperature value calculate obtain deviation value, including:
Every scheduled time sampling once chip temperature to be calibrated, until collecting predetermined quantity temperature value, then calculate according to described predetermined quantity temperature value and obtain deviation value.
Further, the described scheduled time is 15s-45s.
In gathering multiple temperature value processes, will necessarily relating to data acquiring frequency, frequency acquisition is too fast, the temperature when temperature that may result in collecting is not yet to reach stable, and this can affect follow-up judgement; Gathered and then caused that production efficiency was low slowly, therefore, through a large amount of tests, 15s-45s will be set to the scheduled time to overcome drawbacks described above, simultaneously, the predetermined quantity selected is generally 10-15, this selection guarantee a test process required for time will not be oversize, do not affect calibration efficiency, be generally 4-6 minute calibration once, in reality is tested, can be adjusted according to test environment.
Further, if described deviation value is more than specifying threshold value, it is judged that whether the present timing time exceedes described maximum preheating time, if it is not, then continue gather the temperature value of several described chips to be calibrated and again calculate deviation value.
Here diverse ways can be taked to be calculated, method 1, identical temperature value of several quantity that Resurvey gathered with first time, and again calculate deviation value according to several temperature values gathered afterwards, and judge whether deviation value satisfies condition; Method 2, continues collecting temperature, often collects a temperature value, then it calculates deviation value together with all temperature values collected before, or only takes rear predetermined quantity the data collected and be calculated deviation value.
Further, if described deviation value is more than specifying threshold value and present timing time to exceed maximum preheating time, then resets described timing, and described chip to be calibrated is re-started temperature acquisition.
Further, if described deviation value is more than specifying threshold value and present timing time to exceed maximum preheating time, then described chip to be calibrated is overhauled.
Occur when preheating time, time-out was still not up to permissible accuracy, generally there are two kinds of situations, one is that in calibration process, calibration result is created considerable influence by external environment, and this situation needs filtering interfering again chip to be calibrated, and now can also reset calibration parameter; Two is that chip self is defective so that it is cannot satisfy condition, and this situation then needs this chip is sent to repair.
Embodiment 2:
In of the present invention is embodied as, embodiment of the present invention following steps:
S1: parameter is arranged. Arrange sampling time parameter be 30min, to specify threshold value be 0.3, predetermined quantity is 10, the scheduled time is 30s.
S2: be acquired according to the method described in the present invention, finally gives one group of deviation value and meets the temperature value specifying threshold value, and 26.34,26.94,27.09,27.19,27.28,27.31,27.25,27.31,27.31,27.28,27.28.
Taking the temperature value 27.28 that collects for the last time temperature as chip to be calibrated, reading standard sample Current Temperatures is 27.10.
S3: calculate deviation value with standard sample Current Temperatures according to the temperature of chip to be calibrated.
The formula calculating deviation value is T2=k �� T1+offset, and wherein T1 represents the temperature of chip to be calibrated; T2 represents standard sample Current Temperatures; Offset represents deviation value; K is constant, and its size determines according to the characteristic of different product, and the computational methods of K value are prior art, do not repeat them here.
S4: the deviation value obtained by S3 compensates on product to be calibrated, completes calibration; Above-mentioned concrete compensation method falls within prior art, does not repeat them here.
Above in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail, but the present invention is not restricted to above-mentioned embodiment, without departing from the spirit and scope situation of claims hereof, those skilled in the art may be made that various amendment or remodeling.
Claims (8)
1. an optical module chip temperature correction method, it is characterised in that including:
Maximum preheating time is set, treats calibration chip and standard sample carries out preheating timing;
Described chip to be calibrated is gathered several times temperature value, calculates according to described several times temperature value and obtain deviation value, it is judged that whether described deviation value is not more than appointment threshold value;
If so, then temperature compensation value is calculated according to the described some temperature values collected;
According to described offset, described chip to be calibrated is calibrated.
2. a kind of optical module chip temperature correction method according to claim 1, it is characterised in that described maximum preheating time is 10-30min.
3. a kind of optical module chip temperature correction method according to claim 1, it is characterised in that described deviation value is variance or the standard deviation of described several times temperature value, described appointment threshold value is determined by described variance corresponding to described deviation value or described standard deviation.
4. a kind of optical module chip temperature correction method according to claim 1, it is characterised in that described described chip to be calibrated is gathered several times temperature value, calculates according to described several times temperature value and obtains deviation value, including:
Every scheduled time sampling once chip temperature to be calibrated, until collecting predetermined quantity temperature value, then calculate according to described predetermined quantity temperature value and obtain deviation value.
5. a kind of optical module chip temperature correction method according to claim 4, it is characterised in that the described scheduled time is 15s-45s.
6. a kind of optical module chip temperature correction method according to any one of claim 1-5, it is characterized in that, if described deviation value is more than specifying threshold value, judge whether the present timing time exceedes described maximum preheating time, if it is not, then continue gather the temperature value of several described chips to be calibrated and again calculate deviation value.
7. a kind of optical module chip temperature correction method according to claim 6, it is characterized in that, if described deviation value is more than specifying threshold value and present timing time to exceed maximum preheating time, then resets described timing, and described chip to be calibrated is re-started temperature acquisition.
8. a kind of optical module chip temperature correction method according to claim 6, it is characterised in that if described deviation value is more than specifying threshold value and present timing time to exceed maximum preheating time, then described chip to be calibrated is overhauled.
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Cited By (7)
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| CN107228719A (en) * | 2017-06-13 | 2017-10-03 | 青岛海信宽带多媒体技术有限公司 | Temperature correction method, module to be measured and temperature calibration instrument |
| CN108227468A (en) * | 2017-12-26 | 2018-06-29 | 北方智能装备有限公司 | A kind of electric energy meter error of time of day calibration method |
| CN109443598A (en) * | 2018-10-15 | 2019-03-08 | 武汉光迅科技股份有限公司 | A kind of optical module temperature correction method and apparatus |
| WO2020119261A1 (en) * | 2018-12-04 | 2020-06-18 | 中兴通讯股份有限公司 | Method, device and electronic apparatus for detecting performance status of optical module in engineering application |
| CN114088224A (en) * | 2021-11-22 | 2022-02-25 | 上海聪链信息科技有限公司 | Computer board chip temperature monitoring system |
| WO2022052428A1 (en) * | 2020-09-10 | 2022-03-17 | 翱捷科技(深圳)有限公司 | Automatic calibration method and system for chip radio frequency signal delay measurement parameters |
| CN117109776A (en) * | 2023-10-24 | 2023-11-24 | 成都明夷电子科技有限公司 | New single-point temperature calibration method for optical module |
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| WO2022052428A1 (en) * | 2020-09-10 | 2022-03-17 | 翱捷科技(深圳)有限公司 | Automatic calibration method and system for chip radio frequency signal delay measurement parameters |
| CN114088224A (en) * | 2021-11-22 | 2022-02-25 | 上海聪链信息科技有限公司 | Computer board chip temperature monitoring system |
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| CN117109776A (en) * | 2023-10-24 | 2023-11-24 | 成都明夷电子科技有限公司 | New single-point temperature calibration method for optical module |
| CN117109776B (en) * | 2023-10-24 | 2024-01-19 | 成都明夷电子科技有限公司 | Single-point temperature calibration method for optical module |
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