CN105623581B - A kind of low viscosity, underfill of low thermal coefficient of expansion and preparation method thereof - Google Patents
A kind of low viscosity, underfill of low thermal coefficient of expansion and preparation method thereof Download PDFInfo
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- CN105623581B CN105623581B CN201610013488.0A CN201610013488A CN105623581B CN 105623581 B CN105623581 B CN 105623581B CN 201610013488 A CN201610013488 A CN 201610013488A CN 105623581 B CN105623581 B CN 105623581B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of underfills, it includes filler, epoxy resin, curing agent and auxiliary agent, the filler has nucleocapsid structure, wherein, kernel is spherical, and shell is the clad being made of the polymer containing amino or epoxy functionality.Because being provided with the clad being made of the polymer containing amino or epoxy functionality on the surface of spherical, promote underfill of the invention that there is low viscosity, low thermal coefficient of expansion, while working life is long.
Description
Technical field
The present invention relates to a kind of underfill more particularly to the underfills of a kind of low viscosity, low thermal coefficient of expansion；
The invention further relates to a kind of preparation methods of underfill, belong to adhesive field.
Background technique
Underfill is a kind of liquid phase adhesive, usually the epoxy resin-base composite material of high filling silica.
Underfill is the critical material in flip-chip packaging techniques, to disperse on soldered ball due to chip and polymeric substrates it
Between thermal expansion coefficient mismatch generate internal stress, to protect soldered ball, to improve the reliability and service life of packaging.
Underfill should have shelf life, good of the thermal expansion coefficient to match with soldered ball, lower viscosity, length
Cementability and excellent mechanical performance.And these performances and the size of filler, size distribution, pattern, loading, especially its
Surface chemical property is closely related.
In addition, as electronic product develops towards high integration, portable direction, the arrangement of soldered ball in flip chip technology (fct)
More and more intensive, volume is smaller and smaller, so that the silica dioxide granule of some tens of pm size used in traditional underfill
This high density, thin space flip-chip Process of Applying Glue in the problems such as easily cause blocking, hole and dispensing uneven.
Therefore, the silica dioxide granule of smaller size substitutes the silica dioxide granule of traditional some tens of pm size the bottom of as
The filler of portion's filling glue has become a kind of inevitable development trend.However, since height can be brought when silica size reduces
Specific surface area and its compatibility poor with epoxy resin substrate, often lead to underfill viscosity increase severely, be applicable in
Phase shortens.Therefore, viscosity problem has become the critical issue and head that current small size silica is applied in underfill
Want problem.
Summary of the invention
One of the object of the invention is to provide a kind of underfill, with low viscosity, low thermal coefficient of expansion, and is applicable in
Phase is long.
It is easy to operate, be easily achieved the second object of the present invention is to provide a kind of preparation method of underfill, by this
The underfill of preparation method preparation has low viscosity, low thermal coefficient of expansion, and working life is long.
Underfill of the present invention, includes filler, epoxy resin, curing agent and auxiliary agent, and the filler has core-
Shell structure, wherein kernel is spherical, and shell is to be made of the polymer containing amino or epoxy functionality
Clad.
Preferably, the kernel is monodisperse silica sphere particle shape particle.
Preferably, the partial size of the spherical be 50~5000nm, preferably 50~4000nm, further
Preferably 100~3000nm is still more preferably 500~1500nm.
The partial size of the spherical can for 60nm, 100nm, 200nm, 500nm, 800nm, 1000nm,
1200nm、1250nm、1500nm、1800nm、2000nm、2300nm、2500nm、2800nm、3000nm、3300nm、3500nm、
3700nm, 4000nm, 4200nm, 4500nm or 4800nm.
Preferably, the polymer is polymethyl methacrylate, poly (glycidyl methacrylate), polyethyleneimine
One or more of amine, polyimides, polyurethane.
Preferably, the clad with a thickness of 10~50nm, preferably 15~45nm, further preferably 15~
40nm is still more preferably 15~25nm.
The thickness of the clad can for 12nm, 15nm, 18nm, 20nm, 22nm, 25nm, 27nm, 30nm, 32nm,
35nm, 37nm, 40nm, 42nm, 45nm or 48nm.
Preferably, underfill of the present invention, comprising following weight percentage components:
For example, filler can for 12%, 15%, 17%, 20%, 22%, 25%, 28%, 30%, 32%, 35%,
37%, 40%, 45%, 48%, 50%, 53%, 55%, 59%, 62%, 65% or 68%；
Epoxy resin can for 22%, 25%, 28%, 30%, 32%, 35%, 37%, 40%, 45%, 48%, 50%,
53%, 55% or 59%；
Curing agent can for 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%,
18%, 19%, 20%, 21%, 22%, 23% or 24%；
Auxiliary agent can for 5.2%, 5.5%, 5.8%, 6%, 6.3%, 6.5%, 6.8%, 7%, 7.2%, 7.5%,
7.7%, 8%, 8.3%, 8.5%, 8.8%, 9%, 9.2%, 9.5%, 9.6%, 10%, 11%, 12%, 13%, 14%,
15%, 16%, 17%, 18% or 19%.
Preferably, the epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, cycloaliphatic epoxy resin,
One or more of Ppolynuclear aromatic epoxy resin, phenol aldehyde type epoxy resin, epoxy resin of biphenyl structural.Described group
Close the typical infinite combination for bisphenol A type epoxy resin and bisphenol f type epoxy resin, bisphenol A type epoxy resin and alicyclic ring
The combination of the combination of race's epoxy resin, bisphenol f type epoxy resin and phenol aldehyde type epoxy resin, bisphenol A type epoxy resin, Bisphenol F
The combination of type epoxy resin and cycloaliphatic epoxy resin, Ppolynuclear aromatic epoxy resin, phenol aldehyde type epoxy resin and biphenyl structural
Combination etc..
Preferably, the curing agent is alicyclic acid anhydride type curing agent, amine curing agent, phenolic curing agent, thio-alcohol
One or more of curing agent.The combination is typical infinite for alicyclic acid anhydride type curing agent and amine curing agent
Combination, the combination of amine curing agent and phenolic curing agent, the combination of alicyclic acid anhydride type curing agent and thio-alcohol curing agent,
The combination of alicyclic acid anhydride type curing agent, amine curing agent and phenolic curing agent, alicyclic acid anhydride type curing agent, phenolic are solid
The combination etc. of agent and thio-alcohol curing agent.
Preferably, the auxiliary agent includes one or more of promotor, diluent, toughener, defoaming agent；
Preferably, the promotor is metal carboxylate promotor, imidazoles, imdazole derivatives, tertiary amine salt complex compound, three
ー kind or two or more in fluorination boron complex, microcapsules subsidence feed；
Preferably, the diluent is single epoxide diluent and/or multi-epoxy diluent；
Preferably, the toughener is polysulfide rubber, thermoplastic elastomer (TPE), liquid silastic, hydroxyl terminated butyl nitrile (HTBN) rubber
One or more of glue, carboxyl-terminated liguid nitrile rubber；
Preferably, the defoaming agent is polysiloxane defoamer and/or acryl-based antifoaming agent.
Above-mentioned promotor, diluent, toughener, defoaming agent specific substance be auxiliary agent commonly used in the art, this hair
It is bright not limit this.
The preparation method of underfill of the present invention, includes the following steps:
(1) filler is mixed according to the ratio with epoxy resin, the first mixture is made；
(2) curing agent and auxiliary agent are added according to the ratio into the first mixture, are mixed, vacuum defoamation, bottom is made
Fill glue.
Filler of the present invention can be made by the way that spherical is dispersed to ultrasound in polymer solution.
Compared with the prior art, the advantages of the present invention are as follows: the filler of underfill of the present invention has core-shell structure copolymer
Structure, wherein being the clad being made of polymer for shell.The clad being made of polymer can replace or coat dioxy
The hydroxyl group on SiClx surface, to reduce the high surface energy of silica and reactivity, to improve silica in ring
Dispersibility in oxygen resin, and then reduce the viscosity of underfill.
In addition, the polymer in clad passes through in the riveted effect and polymerized segment between epoxy resin macromolecular
Functional group and epoxy molecule or solidify chemical reaction between agent molecule, silica dioxide granule and asphalt mixtures modified by epoxy resin can be improved
The interfacial interaction of rouge to further decrease the viscosity of underfill, thermal expansion coefficient, and has and extends underfill
The effect of glue working life.
After tested, when silica surface coated polymer and after be applied to underfill, underfill
Viscosity highest can reduce by 89% or so, and thermal expansion coefficient can highest reduction by 12% or so.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the filler that the embodiment of the present invention 1 has nucleocapsid structure；
Fig. 2 is the structural schematic diagram of 1 filler kernel of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of 1 filler shell of the embodiment of the present invention.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
Embodiment 1
The present embodiment underfill includes the component of following weight: filler 40g, epoxy resin 25g, curing agent 21.5g
With auxiliary agent 13.5g, wherein auxiliary agent includes promotor 1.2g, dispersing agent 0.2g, defoaming agent 0.1g and diluent 12g.
The preparation method of the underfill of the present embodiment includes the following steps:
(1) filler 40g and bisphenol A type epoxy resin 25g are weighed, the two is uniformly mixed, and the first mixture is made；
(2) methyl hexahydrophthalic anhydride curing agent 21.5g, promotor are added respectively into the first mixture --- 2- phenyl -4-
Methylimidazole 1.2g, dispersing agent 0.2g, defoaming agent 0.1g, diluent 12g are uniformly mixed, vacuum defoamation, and underfill is made
Glue.
As shown in Figure 1, filler used in the present embodiment has nucleocapsid structure；Wherein, kernel is that partial size as shown in Figure 2 is
The spherical of 500nm, shell are the clad being made of polymethyl methacrylate as shown in Figure 3.
Embodiment 2
The present embodiment underfill includes the component of following weight: filler 30g, epoxy resin 50g, curing agent 13.3g
With auxiliary agent 6.7g, wherein auxiliary agent includes dispersing agent 0.2g, defoaming agent 0.1g, diluent 5g and toughener 1.4g.
The preparation method of the underfill of the present embodiment includes the following steps:
(1) filler 30g and bisphenol f type epoxy resin 50g are weighed, the two is uniformly mixed, and the first mixture is made；
(2) diamine curing agent 13.3g, dispersing agent 0.2g, defoaming agent 0.1g, diluent are added respectively into the first mixture
5g, toughener 1.4g are uniformly mixed, vacuum defoamation, and underfill is made.
Filler used in the present embodiment has nucleocapsid structure, wherein kernel is silica spherical that partial size is 50nm
Grain, shell is the clad being made of polyethyleneimine.
Embodiment 3
The present embodiment underfill includes the component of following weight: filler 30g, epoxy resin 47g, curing agent 10.0g
With auxiliary agent 13g, wherein auxiliary agent includes dispersing agent 4g, defoaming agent 1g, diluent 5g and toughener 3g.
The preparation method of the underfill of the present embodiment includes the following steps:
(1) filler 30g, bisphenol A type epoxy resin 25g and phenol aldehyde type epoxy resin 22g are weighed, three is uniformly mixed, system
Obtain the first mixture；
(2) curing agent is added respectively into the first mixture --- the chloro- 4,4- diaminodiphenylmethane 10.0g of 3,3- bis-,
Dispersing agent 4g, defoaming agent 1g, diluent 5g, toughener 3g are uniformly mixed, vacuum defoamation, and underfill is made.
Filler used in the present embodiment has nucleocapsid structure, wherein kernel is silica spherical that partial size is 50nm
Grain, shell is the clad being made of polyethyleneimine.
Embodiment 4
The present embodiment underfill include following weight component: filler 20g, epoxy resin 40g, curing agent 25g and
Auxiliary agent 15g, wherein auxiliary agent includes promotor 2-ethyl-4-methylimidazole 0.5g, dispersing agent 0.4g, defoaming agent 0.1g, diluent
5g and toughener 9g.
The preparation method of the underfill of the present embodiment includes the following steps:
(1) it weighs filler 20g and weighs o-cresol type phenol aldehyde type epoxy resin 40.0g, the two is uniformly mixed, and is made first
Mixture；
(2) curing agent 4,4 '-diaminodiphenylsulfone 25g, promotor 2- ethyl -4- first are added respectively into the first mixture
Base imidazoles 0.5g, dispersing agent 0.4g, defoaming agent 0.1g, diluent 5g and toughener 9g are uniformly mixed, vacuum defoamation, and bottom is made
Fill glue in portion.
Filler used in the present embodiment has nucleocapsid structure, wherein kernel is silica spherical that partial size is 1000nm
Grain, shell is the clad being made of polyimides.
Embodiment 5
The present embodiment underfill includes the component of following weight: filler 30g, epoxy resin 40g, curing agent 10.65g
With auxiliary agent 19.35g, wherein auxiliary agent includes dispersing agent 0.2g, defoaming agent 0.15g, diluent 10g and toughener 9g.
The preparation method of the underfill of the present embodiment includes the following steps:
(1) filler 30g, bisphenol A type epoxy resin 20g and bisphenol f type epoxy resin 20g are weighed, three is uniformly mixed, system
Obtain the first mixture；
(2) diamine curing agent 10.65g, dispersing agent 0.2g, defoaming agent 0.15g, dilution are added into the first mixture respectively
Agent 10g, toughener 9g are uniformly mixed, vacuum defoamation, and underfill is made.
Filler used in the present embodiment has nucleocapsid structure, wherein kernel is silica spherical that partial size is 100nm
Grain, shell is the clad being made of poly (glycidyl methacrylate).
Embodiment 6
The present embodiment underfill includes the component of following weight: filler 40g, epoxy resin 40g, curing agent 10.7g
With auxiliary agent 9.3g, wherein auxiliary agent includes promotor 2- phenyl -4-methylimidazole 0.1g, dispersing agent 0.1g, defoaming agent 0.1g, dilution
Agent 5g and toughener 4g.
The preparation method of the underfill of the present embodiment includes the following steps:
(1) filler 40g, bisphenol f type epoxy resin 25g and cycloaliphatic epoxy resin 15.0g are weighed, three is uniformly mixed,
The first mixture is made；
(2) m-phenylene diamine (MPD) curing agent 10.7g, promotor 2- phenyl -4-methylimidazole are added respectively into the first mixture
0.1g, dispersing agent 0.1g, defoaming agent 0.1g, diluent 5g, toughener 4g are uniformly mixed, vacuum defoamation, and underfill is made
Glue.
Filler used in the present embodiment has nucleocapsid structure, wherein kernel is silica spherical that partial size is 3000nm
Grain, shell is the clad being made of polyurethane.
Comparative example 1
The formula difference from Example 1 of the present embodiment underfill is: filler is the dioxy that partial size is 500nm
SiClx spheric granules, surface do not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 1.
Comparative example 2
The formula difference from Example 2 of the present embodiment underfill is: filler is the dioxy that partial size is 50nm
SiClx spheric granules, surface do not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 2.
Comparative example 3
The formula difference from Example 3 of the present embodiment underfill is: filler is the dioxy that partial size is 50nm
SiClx spheric granules, surface do not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 3.
Comparative example 4
The formula difference from Example 4 of the present embodiment underfill is: filler is two that partial size is 1000nm
Silica spheric granules, surface do not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 4.
Comparative example 5
The formula difference from Example 5 of the present embodiment underfill is: filler is the dioxy that partial size is 100nm
SiClx spheric granules, surface do not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 5.
Comparative example 6
The formula difference from Example 6 of the present embodiment underfill is: filler is two that partial size is 3000nm
Silica spheric granules, surface do not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 6.
The performance of the underfill of each embodiment preparation is tested, test result is shown in Table 1.
The performance of each embodiment underfill of table 1.
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (17)
1. a kind of underfill includes filler, epoxy resin, curing agent and auxiliary agent, it is characterised in that: the filler has
Nucleocapsid structure, wherein kernel is spherical, and shell is by the polymer containing amino or epoxy functionality
The clad of composition；
Wherein, the partial size of the spherical is 800 ~ 3000nm.
2. underfill as described in claim 1, it is characterised in that: the kernel is monodisperse silica sphere particle shape
Grain.
3. underfill as described in claim 1, it is characterised in that: the polymer is polymethyl methacrylate, gathers
One or more of glycidyl methacrylate, polyethyleneimine, polyimides, polyurethane.
4. underfill as described in claim 1, it is characterised in that: the clad with a thickness of 10 ~ 50nm.
5. underfill as claimed in claim 4, it is characterised in that: the clad with a thickness of 15 ~ 45nm.
6. underfill as claimed in claim 5, it is characterised in that: the clad with a thickness of 15 ~ 40nm.
7. underfill as claimed in claim 6, it is characterised in that: the clad with a thickness of 15 ~ 25nm.
8. underfill as described in claim 1, which is characterized in that comprising following weight percentage components:
Filler 10 ~ 70%；
Epoxy resin 20 ~ 60%；
Curing agent 5 ~ 25%；
Auxiliary agent 5 ~ 20%.
9. underfill as claimed in claim 8, it is characterised in that: the epoxy resin is cycloaliphatic epoxy resin, more
One or more of cyclic aromatic series epoxy resin, phenol aldehyde type epoxy resin.
10. underfill as claimed in claim 9, it is characterised in that: the epoxy resin be bisphenol A type epoxy resin,
One or more of bisphenol f type epoxy resin, epoxy resin of biphenyl structural.
11. underfill as claimed in claim 8, it is characterised in that: the curing agent be alicyclic acid anhydride type curing agent,
One or more of amine curing agent, phenolic curing agent, thio-alcohol curing agent.
12. underfill as claimed in claim 8, it is characterised in that: the auxiliary agent includes promotor, diluent, toughening
One or more of agent, defoaming agent.
13. underfill as claimed in claim 12, it is characterised in that: the promotor be metal carboxylate promotor,
Imidazoles, imdazole derivatives, tertiary amine salt complex compound, boron trifluoride complex, the ー kind or two in microcapsules subsidence feed
Kind or more.
14. underfill as claimed in claim 12, it is characterised in that: the diluent be single epoxide diluent and/or
Multi-epoxy diluent.
15. underfill as claimed in claim 12, it is characterised in that: the toughener is polysulfide rubber, thermoplastic elastomehc
One or more of property body, liquid silastic, hydroxyl terminated butyl nitrile (HTBN) rubber, carboxyl-terminated liguid nitrile rubber.
16. underfill as claimed in claim 12, it is characterised in that: the defoaming agent is polysiloxane defoamer
And/or acryl-based antifoaming agent.
17. a kind of preparation method of any one of such as claim 1 ~ 16 underfill, which is characterized in that including walking as follows
It is rapid:
(1) filler is mixed according to the ratio with epoxy resin, the first mixture is made；
(2) curing agent and auxiliary agent are added according to the ratio into the first mixture, are mixed, vacuum defoamation, underfill is made
Glue.
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| CN106589464B (en) * | 2016-11-28 | 2019-04-02 | 深圳先进技术研究院 | Polyvinyl coats the preparation method of nano silica microsphere and modified epoxy |
| CN106590494A (en) * | 2016-12-01 | 2017-04-26 | 烟台信友新材料股份有限公司 | Low-thermal expansion coefficient low-viscosity rapid-penetration bottom filling glue and preparation method thereof |
| US11643577B2 (en) | 2017-08-08 | 2023-05-09 | Sony Corporation | Adhesive, electronic apparatus, and optical apparatus |
| CN109456620A (en) * | 2018-11-19 | 2019-03-12 | 江苏联瑞新材料股份有限公司 | A kind of low viscosity filler composition and preparation method thereof |
| CN110982436A (en) * | 2019-12-19 | 2020-04-10 | 安徽微威环保科技有限公司 | Acrylic sealant and preparation method thereof |
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| CN104962224A (en) * | 2015-07-06 | 2015-10-07 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
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