CN112457808A - Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method - Google Patents
Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method Download PDFInfo
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- CN112457808A CN112457808A CN202011308819.6A CN202011308819A CN112457808A CN 112457808 A CN112457808 A CN 112457808A CN 202011308819 A CN202011308819 A CN 202011308819A CN 112457808 A CN112457808 A CN 112457808A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention discloses a low-warpage high-adhesion liquid mold sealing adhesive for a gallium nitride power device and a preparation method thereof, wherein the liquid mold sealing adhesive comprises 10-30 parts by mass of epoxy resin, 15-40 parts by mass of a curing agent, 0.1-5 parts by mass of a curing accelerator, 3-6 parts by mass of a toughening modifier, 110-200 parts by mass of an inorganic filler and 0.1-5 parts by mass of a silane coupling agent; the epoxy resin is one or more of aminophenol trifunctional epoxy resin and naphthol epoxy resin; the chemical structure of the toughening modifier is a highly branched spheroidal dendritic structure, and the end group is a hydroxyl group. The liquid molding sealing glue has the functions of molding sealing and gap filling, and also has the advantages of low warpage and high adhesive force.
Description
Technical Field
The invention belongs to the technical field of preparation of gallium nitride power devices, and particularly relates to a low-warpage high-adhesion liquid mold sealing adhesive for a gallium nitride power device and a preparation method thereof.
Background
Gallium nitride, as a third generation semiconductor material, can provide a number of advantages over silicon. Gallium nitride achieves a dramatic performance jump in power conversion efficiency and power density compared to silicon devices. However, the lattice mismatch (about 17%) and the thermal mismatch (about 118%) of large-sized silicon substrates and gallium nitride devices cause cracking and warpage of the epitaxial layers, and the larger the substrate size, the more severe the warpage and cracking phenomena. Therefore, a GaN epitaxial layer with no cracks, low warping degree and high crystal quality is required to be obtained during the production of the gallium nitride device, which is a precondition for preparing the GaN power device with high reliability. Therefore, higher requirements are also put on the mold sealing glue applied to the gallium nitride power device. Most of the existing mold sealing glue for the gallium nitride power device is solid mold sealing glue, and the flowability is poor, so that the filling of a gap between the device and a substrate is not facilitated; and also has a phenomenon of easy warping.
Disclosure of Invention
The invention breaks through the current situation of the existing solid mold sealing adhesive, provides the low-warpage high-adhesion liquid mold sealing adhesive for the gallium nitride power device and the preparation method thereof, and the liquid mold sealing adhesive has the functions of mold sealing and gap filling and also has the advantages of low warpage and high adhesion.
The invention provides a low-warpage high-adhesion liquid mold sealing adhesive for a gallium nitride power device, which comprises the following components:
the epoxy resin is one or more of aminophenol trifunctional epoxy resin and naphthol epoxy resin;
the chemical structure of the toughening modifier is a highly branched spheroidal dendritic structure, and the end group is a hydroxyl group. The liquid mold sealing compound also comprises 0.1-5 parts by mass of a coloring agent, and the coloring agent is only used for providing color for the liquid mold sealing compound.
The curing agent is one or more of amines, thiols, acid anhydrides and phenolic resin curing agents, and acid anhydrides are preferred.
Further, the curing accelerator is preferably an organic amine.
Furthermore, the toughening modifier adopts a T60 model product of Weihaichen molecular new material company Limited.
Further, as the inorganic filler, silica having a particle diameter of 0.1 to 20 μm, preferably silica having a surface hydroxyl group modified, for example, FB-3SDC type silica available from Denka of Japan, is used.
Preferably, gamma-glycidoxypropyltrimethoxysilane is used as the silane coupling agent.
The preparation method of the low-warpage high-adhesion liquid mold sealing adhesive for the gallium nitride power device comprises the following steps:
mixing epoxy resin, a curing agent, a curing accelerator, a toughening modifier, an inorganic filler and a silane coupling agent according to the mass parts, grinding the mixture into jelly, and defoaming the jelly in vacuum. Specifically, three rollers can be used for grinding.
Compared with the prior art, the invention has the following characteristics and beneficial effects:
(1) the liquid mold sealing adhesive combines the mold sealing function and the gap filling function, can save an expensive bottom filling process, simplifies the process, reduces the cost and increases the operability.
(2) The liquid molding sealing adhesive has low viscosity and easy flowing, can realize gap filling, is used for molding sealing and filling, and has main performance indexes reaching the molding sealing requirement after curing. Meanwhile, the liquid mold sealing adhesive also has the advantages of low warpage and high adhesive force, and can avoid cracking and falling of an adhesive layer.
(3) The dendritic structure toughening modifier with the highly branched, polyhydroxy and spherical-like structure is added to bring multiple action sites, so that the interaction between the mold sealing adhesive and the base material is increased, the adhesion force of the surface of the base material is effectively improved, and the warping condition is obviously reduced.
(4) In the preferred scheme, the surface hydroxyl modified silicon dioxide is adopted, so that the silicon dioxide can be better combined with epoxy groups, and the problems of aggregation and agglomeration of fine inorganic fillers in a resin system are reduced.
(5) The liquid mold sealing adhesive can realize the mold sealing outside the chip and the protection of the bottom metal contact at the same time, and can be applied to the miniaturization of A Processor (AP) and the System In Package (SiP) of a base frequency processor (BB) in the future.
Drawings
FIG. 1 is a schematic structural diagram of a toughening modifier used in the present invention, wherein B represents an-OH group.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of the embodiments of the present invention is provided. It should be understood that the detailed description is merely illustrative of the invention and is not intended to limit the invention.
The liquid mold sealing compound comprises 10-30 parts by mass of epoxy resin, 15-40 parts by mass of curing agent, 0.1-5 parts by mass of curing accelerator, 3-6 parts by mass of toughening modifier, 110-200 parts by mass of inorganic filler and 0.1-5 parts by mass of silane coupling agent. The epoxy resin is one or more of aminophenol trifunctional epoxy resin and naphthol epoxy resin; when the aminophenol trifunctional epoxy resin is adopted, products of MY0510 and AFG-90H types can be selected specifically; when naphthol epoxy resin is adopted, a 4032D product can be selected specifically. The chemical structure of the toughening modifier is a highly branched spheroidal dendritic structure, the end group is hydroxyl, and a product T60 model of Wehaichen molecular new material company Limited can be specifically selected. The curing agent is any curing agent corresponding to the adopted epoxy resin, and one or more of amine curing agents, thiol curing agents, acid anhydride curing agents and phenolic resin curing agents can be selected according to requirements, and acid anhydride curing agents are preferred. The curing accelerator is organic amine such as N, N-dimethylbenzylamine, and can be added in a conventional amount. The inorganic filler may be a conventional inorganic filler such as silica, calcium silicate, boron nitride, etc., preferably silica having a particle size of 0.1 to 20 μm, and in order to improve the dispersion problem of the inorganic filler in the resin system, the silica is preferably surface hydroxyl group-modified silica such as FB-3SDC type silica of Denka corporation of japan. Silane coupling agents are used to form a bonding layer between the organic and inorganic substrates, preferably gamma-glycidoxypropyltrimethoxysilane. The mold sealing adhesive also comprises 0.1-5 parts by mass of a colorant, wherein the colorant is used for providing color, and specifically, pigments such as carbon black and the like can be adopted, and the colorant is an unnecessary component.
The preparation method of the mold sealing adhesive comprises the following steps: mixing epoxy resin, a curing agent, a curing accelerator, a toughening modifier, an inorganic filler and a silane coupling agent according to parts by mass, grinding the mixture on three rollers, and rolling into jelly; and (4) carrying out vacuum defoaming on the jelly to obtain the liquid molding compound.
To further demonstrate the advantages of the liquid molding compounds of the present invention, the following comparative tests were conducted. In the following examples and comparative examples, the aminophenol trifunctional epoxy resin was a MY0510 type product, and the naphthol epoxy resin was a 4032D type product; the curing agents adopt methyl hexahydrophthalic anhydride, and the curing accelerators adopt N, N-dimethylbenzylamine; the inorganic fillers are all silica with D50 of 10 μm, and are specifically FB-3SDC type silica of Denka company of Japan; the coloring agent adopts carbon black, and the silane coupling agent adopts gamma-glycidyl ether oxygen propyl trimethoxy silane. The formulation of the examples and the comparative examples is shown in Table 1, and the warpage and the adhesion of the products obtained in the examples and the comparative examples are tested, and the test data are shown in Table 1. As can be seen from Table 1, the addition of the toughening modifier can significantly improve warpage and significantly improve adhesion.
In this embodiment, the warpage testing method includes: and uniformly coating the molding sealing glue solution on a glass slide, baking for 1 hour at the temperature of 130 ℃, and taking out after natural cooling. The resin remaining around the slide was removed, one side of the slide was fixed, and the distance the slide was tilted up was measured with a ruler, which was recorded as warp. The method for testing the adhesive force comprises the following steps: referring to standard ASTM D1002-2010, the mold sealing glue solution was respectively dispensed on a square area of 5mm × 5mm in size on the test interface, cured at 180 ℃ for 1 hour, and then tested for shear adhesion strength with a universal tensile machine.
TABLE 1 compounding ratio and test results of examples and comparative examples
In the present invention, the curing accelerator, the silane coupling agent and the colorant are added in conventional amounts, and the amounts of the curing accelerator, the silane coupling agent and the colorant are fixed in several groups of examples for comparison.
The above-described embodiment is only one of many embodiments, and those skilled in the art can make other variations or modifications on the basis of the above description, and such other variations or modifications may be made without departing from the spirit of the present invention.
Claims (9)
1. The low-warpage high-adhesion liquid mold sealing adhesive for the gallium nitride power device is characterized by comprising the following components:
the epoxy resin is one or more of aminophenol trifunctional epoxy resin and naphthol epoxy resin;
the chemical structure of the toughening modifier is a highly branched spheroidal dendritic structure, and the end group is a hydroxyl group.
2. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 1, wherein:
and 0.1-5 parts by mass of a coloring agent.
3. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 1, wherein:
the curing agent is one or more of amine curing agents, thiol curing agents, acid anhydride curing agents and phenolic resin curing agents.
4. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 1, wherein:
the curing accelerator adopts organic amines.
5. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 1, wherein:
the toughening modifier is a T60 model product of Weihaichen molecular new material Co.
6. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 1, wherein:
the inorganic filler is silicon dioxide with the particle size of 0.1-20 mu m.
7. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 6, wherein:
the silicon dioxide is surface hydroxyl modified silicon dioxide.
8. The low warpage high adhesion liquid molding compound for gallium nitride power device according to claim 1, wherein:
the silane coupling agent adopts gamma-glycidol ether oxygen propyl trimethoxy silane.
9. The method for preparing the low-warpage high-adhesion liquid molding compound for the gallium nitride power device as claimed in claim 1, wherein the method comprises the following steps:
mixing epoxy resin, a curing agent, a curing accelerator, a toughening modifier, an inorganic filler and a silane coupling agent according to the mass parts, grinding the mixture into jelly, and defoaming the jelly in vacuum.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011308819.6A CN112457808A (en) | 2020-11-20 | 2020-11-20 | Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method |
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| CN202011308819.6A CN112457808A (en) | 2020-11-20 | 2020-11-20 | Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113150730A (en) * | 2021-05-13 | 2021-07-23 | 湖北三选科技有限公司 | Protective adhesive for wafer cutting |
| CN116694275A (en) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
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Cited By (3)
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