CN105602195A - Resin composition, prepreg and copper-clad plate - Google Patents
Resin composition, prepreg and copper-clad plate Download PDFInfo
- Publication number
- CN105602195A CN105602195A CN201511029228.4A CN201511029228A CN105602195A CN 105602195 A CN105602195 A CN 105602195A CN 201511029228 A CN201511029228 A CN 201511029228A CN 105602195 A CN105602195 A CN 105602195A
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- Prior art keywords
- resin
- prepreg
- epoxy resin
- copper
- parts
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- 0 CC(C(*)c1ccc(CC2[U]C2)cc1)(c1ccc(CC2OC2)cc1)c(cc1)ccc1C(C1OC1)=C Chemical compound CC(C(*)c1ccc(CC2[U]C2)cc1)(c1ccc(CC2OC2)cc1)c(cc1)ccc1C(C1OC1)=C 0.000 description 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention relates to the technical field of printed circuit boards, in particular to a resin composition. The resin composition is prepared from, by weight, 60-100 parts of epoxy resin, 20-60 parts of phenoxy resin and 1-10 parts of a curing agent. The epoxy resin comprises, by weight, 90-100% of biphenyl epoxy resin and 0-10% of tetra-functional UV resisting epoxy resin. The molecular weight of the phenoxy resin is 30000-80000. The invention further relates to a prepreg prepared from the resin composition and a copper-clad plate. The problem that because fragility of a current prepreg and a current copper-clad plate is high, dust falls in the operation processes of trimming, drilling and punching, operation environment of staff is improved, performance reliability of the printed circuit boards (PCB) is improved, and the quality yield is improved. The prepared prepreg is high in long-storage ability, and the prepreg and the copper-clad plate prepared by the pregreg can be stored for a long term.
Description
Technical field
The present invention relates to copper-clad plate technical field, relate in particular to a kind of resin combination and adopt the prepreg of its makingAnd copper-clad plate.
Background technology
Prepreg, claims again bonding sheet, is for the production of requisite half one-tenth in copper-clad plate and multilayer boardProduct, it, is infiltrated on resin adhesive liquid post-drying and makes as glass fibre, nonwoven or wood pulp paper etc. mainly by reinforcing material; ItsIn resin adhesive liquid semi-solid preparation after at high temperature can be again melt bonded and completely curing, therefore can utilize dissimilar semi-solid preparationSheet is superimposed, after employing laminating machine high temperature hot pressing, forms and meets different copper-clad plate or the multilayered printed circuit laminates that require.
Current prepreg is being processed into common FR-4 copper-clad plate and is continuing to be processed into multilayered printed circuit laminateTime, need to carry out multiple processing workshop section, and its specifically as cut, boring, punching etc. add man-hour, in the tree of semi-cured stateFat is sheared fracture, a large amount of resin-oatmeal that can drop, and these resin-oatmeals accumulate over a long period, on the one hand can severe contamination equipment and impactThe high workshop purifying, the healthy adverse effect of bringing to employee on the other hand, easily causes employee allergic etc.,The people of indivedual physique sensitivities, after contact, may bring compared with major injury respiratory tract and skin; And resin-oatmeal is easy to be takenBand enters next workshop section, directly the quality of copper-clad plate and multilayered printed circuit laminate is brought to harmful effect, seriously time evenAffect product quality and production efficiency.
For reducing dropping of resin-oatmeal on the copper-clad plate of prepreg and preparation thereof and pcb board, at present, researcher is to stickyThe production technology of knot sheet has been carried out many improvement, such as the bonding sheet after shearing is carried out to hot edge seal processing immediately, will dropResin-oatmeal be again melted on bonding sheet; Or directly bonding sheet is carried out to preheating at sheared edge place, to be bonded is softeningAfter shear again, this method can to a certain degree reduce resin-oatmeal produce; But the applicable scope of these methods is narrower, and nothingMethod reduces dropping of resin-oatmeal from source.
Therefore, be necessary to provide a kind of and can effectively reduce the method that prepreg processing, resin-oatmeal drops, tool from sourceBody is to provide the prepreg that a kind of new resin combination can not be prepared resin-oatmeal.
Summary of the invention
For above-mentioned the deficiencies in the prior art, one of object of the present invention is to provide a kind of resin that do not fall in the time shearingThe resin combination of powder;
Two of object of the present invention is to provide a kind of prepreg that adopts this resin combination preparation not fall resin-oatmeal;
Three of object of the present invention is to provide a kind of copper-clad plate that adopts this cured sheets to prepare.
To achieve these goals, technical scheme of the present invention is as follows:
A kind of resin combination, by weight, it comprises: 60～100 parts of epoxy resin, 20～60 parts of phenoxy resins and1～10 part, curing agent; Wherein, described epoxy resin is percentage meter by weight, comprises biphenyl epoxy resin 90%～100% and fourSense UV block epoxy resin 0%～10%;
The molecular weight of described phenoxy resin is 30000～80000, and its chemical structural formula isWherein, be respectively-H of R1, R2 ,-OH or epoxy radicals, containing POne in organic salt.
Preferably, the chemical structural formula of described biphenyl epoxy resin isDescribed four sense UV barrier type epoxy resin are 1,1,2,2-tetra-(p-hydroxybenzene) ethene, four glycidol ethers, its chemical constitutionFormula isDescribed curing agent is amine curing agent.
Than prior art, it is real that resin combination of the present invention utilizes the combination of special phenolic resins and epoxy resinThe now high rigidity of the prepreg of preparation and not dry linting characteristic.
A prepreg that adopts resin combination as above to prepare, its preparation method comprises the steps: headFirst weigh the each component in resin combination by formula, subsequently each component is mixed with organic solvent and curing accelerator, be made intoResin adhesive liquid; Then glass-fiber-fabric is infiltrated in this resin adhesive liquid, takes out post-drying and remove solvent, obtain prepreg.
This prepreg is owing to having adopted above-mentioned special resin combination, and its keeping quality is higher, this prepreg andAdopt copper-clad plate prepared by this prepreg all can preserve for a long time, and its characteristic of dry linting not when thering is high rigidity and shearing.
Preferably, described curing accelerator accounts for described resin combination gross weight 0.1%～2%, described curing acceleratorFor glyoxal ethyline, 1-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-A kind of, two or more mixture in phenylimidazole, 2-undecyl imidazole, 2-phenyl-4-methylimidazole.
Preferably, described organic solvent is acetone, butanone, cyclohexanone, cyclohexane, dioxane, glycol monoethyl ether, threeThe mixing of one or more in glyme, toluene, dimethylbenzene, DMF.
Preferably, the solid content of described resin adhesive liquid is 50%～70%.
A kind of pcb board that adopts prepreg described above to prepare.
Beneficial effect of the present invention: resin combination of the present invention utilizes the combination one of special phenolic resins and epoxy resinAspect realizes the prepreg of preparation and the not dry linting characteristic of copper-clad plate, has solved current prepreg and copper-clad plate fragility is high leadsCause cut, the weakness of the operating process dry linting dirt such as punching and boring, effectively improve the dust pollution of workshop, improved employeeOperating environment, has improved performance reliability and the up-to-standard rate of printed wiring board (PCB); On the other hand, utilize this resin groupPrepreg prepared by compound and copper-clad plate, have high rigidity, can be used as stiffening plate, has preferably characteristic; In addition, due to treeThe particularity of oil/fat composition, the prepreg keeping quality preparing is higher, this prepreg and this prepreg system of employingStandby copper-clad plate can be preserved for a long time; This prepreg is prepared in the process of copper-clad plate at pressing plate simultaneously, and gummosis is easily controlled, pressing plateWindow is large, has improved the product percent of pass during prepreg is produced.
Detailed description of the invention
Technological means and the effect thereof taked for further setting forth the present invention, below in conjunction with preferred enforcement of the present inventionExample is described in detail.
Embodiment 1
A kind of resin combination, by weight, comprises 30 parts of phenoxy resins, 54 parts of biphenyl epoxy resin, four sense UV6 parts of barrier type epoxy resin, 5 parts of amine curing agents, 1 part of curing accelerator (glyoxal ethyline) and appropriate organic solvent; WhereinBe-H of R1, R2 in phenolic resins.
Adopt above-mentioned resin combination to prepare prepreg and copper-clad plate:
First get the mixed organic solvents of appropriate dimethyl formamide and butanone (DMF:MEK is 1:1 in mass ratio), willThe glyoxal ethyline (2-MI) of the amine curing agent of formula ratio and 1 weight portion is dissolved in this mixed organic solvents, by its mixingEvenly (more than stirring 60min), obtains mixed solution;
Then phenoxy resin, biphenyl epoxy resin and the four sense UV barrier type epoxy resin of getting formula ratio join successivelyIn above-mentioned mixed solution, after stirring, form resin adhesive liquid, its solid content is 50%～70%;
Use subsequently this resin adhesive liquid to flood gluing to glass-fiber-fabric, after gluing completes, baking semi-solid preparation, is speciallyIn baking oven, 155 DEG C of bakings are removed organic solvent in 5 minutes, obtain prepreg;
Finally get above-mentioned prepreg,, stack with 18u electrolytic copper foil (or mould release membrance) respectively, in vacuum thereon belowLamination in press, lamination is 190 DEG C, 90 minutes, makes copper-clad plate.
Embodiment 2
A kind of resin combination, by weight, comprises that 20 parts of phenoxy resins, 100 parts of biphenyl epoxy resin, amine solidify5 parts of agent, 0.5 part of curing accelerator (glyoxal ethyline) and appropriate organic solvent; Wherein be-H of R1, R2 in phenolic resins.
Adopt above-mentioned resin combination to prepare prepreg and copper-clad plate:
First get the mixed organic solvents of appropriate dimethyl formamide and butanone (DMF:MEK is 1:1 in mass ratio), willThe glyoxal ethyline (2-MI) of the amine curing agent of formula ratio and 0.5 weight portion is dissolved in this mixed organic solvents, is mixedClose evenly (more than stirring 60min), obtain mixed solution;
Phenoxy resin and the biphenyl epoxy resin of then getting formula ratio join in above-mentioned mixed solution successively, stir(more than stirring 4h), forms resin adhesive liquid afterwards, and its solid content is 50%～70%;
Use subsequently this resin adhesive liquid to flood gluing to glass-fiber-fabric, after gluing completes, baking semi-solid preparation, is speciallyIn baking oven, 155 DEG C of bakings are removed organic solvent in 5 minutes, obtain prepreg;
Finally get above-mentioned prepreg,, stack with 18u electrolytic copper foil (or mould release membrance) respectively, in vacuum thereon belowLamination in press, lamination is 190 DEG C, 90 minutes, makes copper-clad plate.
Embodiment 3
A kind of resin combination, by weight, comprises 30 parts of phenoxy resins, 70 parts of biphenyl epoxy resin, four sense UV5 parts of block epoxy resin, 5 parts of amine curing agents, 0.5 part of curing accelerator (glyoxal ethyline) and appropriate organic solvent; ItsIn middle phenolic resins, R1 is-H, and R2 is epoxy radicals.
Adopt above-mentioned resin combination to prepare prepreg and copper-clad plate:
First get the mixed organic solvents of appropriate dimethyl formamide and butanone (DMF:MEK is 1:1 in mass ratio), willThe glyoxal ethyline (2-MI) of the amine curing agent of formula ratio and 0.5 weight portion is dissolved in this mixed solvent, is mixed allEven (more than stirring 60min), obtains mixed solution;
Then phenoxy resin, biphenyl epoxy resin and the four sense UV barrier type epoxy resin of getting formula ratio join successivelyIn above-mentioned mixed solution, after stirring, (more than stirring 4h), forms resin adhesive liquid, and its solid content is 50%～70%;
Use subsequently this resin adhesive liquid to flood gluing to glass-fiber-fabric, after gluing completes, baking semi-solid preparation, is speciallyIn baking oven, 155 DEG C of bakings are removed organic solvent in 5 minutes, obtain prepreg;
Finally get above-mentioned prepreg,, stack with 18u electrolytic copper foil (or mould release membrance) respectively, in vacuum thereon belowLamination in press, lamination is 190 DEG C, 90 minutes, makes copper-clad plate.
Embodiment 4
A kind of resin combination, by weight, comprises 20 parts of phenoxy resins, 70 parts of biphenyl epoxy resin, four sense UV5 parts of block epoxy resin, 5 parts of amine curing agents, 1.5 parts of curing accelerators (glyoxal ethyline) and appropriate organic solvent; ItsIn middle phenolic resins, R1 is-H, and R2 is epoxy radicals.
While adopting this resin combination to prepare this cured sheets, identical with the method for embodiment 1, difference is, usesOrganic solvent is the mixed organic solvents of toluene and dimethylbenzene, and has added the curing accelerator 1-methylimidazole of 1.5 weight portions;Its method of preparing copper-clad plate is also identical with embodiment 1.
Embodiment 5
A kind of resin combination, by weight, comprises 60 parts of phenoxy resins, 55 parts of biphenyl epoxy resin, four sense UV5 parts of block epoxy resin, 5 parts of amine curing agents, 1.5 parts of curing accelerators (1-methylimidazole) and appropriate organic solvent, itsIn middle phenolic resins, R1 is-H, and R2 is phosphorous organic salt.
While adopting this resin combination to prepare this cured sheets, identical with the method for embodiment 1, difference is, usesOrganic solvent is butanone solvent, and has added the curing accelerator 1-methylimidazole of 1.5 weight portions; It prepares the method for copper-clad plateAlso identical with embodiment 1.
Embodiment 6
A kind of resin combination, by weight, comprises that 50 parts of phenoxy resins, 80 parts of biphenyl epoxy resin, amine solidify5 parts of agent, 1.5 parts of curing accelerators (1-methylimidazole) and appropriate organic solvent, wherein in phenolic resins, R1 is-OH, R2 is-H.
While adopting this resin combination to prepare this cured sheets, identical with the method for embodiment 2, difference is, usesOrganic solvent is dimethyl formamide, and has added the curing accelerator 1-methylimidazole of 1.5 weight portions; It prepares copper-clad plateMethod is also identical with embodiment 2.
Embodiment 7
A kind of resin combination, by weight, comprises 60 parts of phenoxy resins, 55 parts of biphenyl epoxy resin, four sense UV5 parts of block epoxy resin, 9 parts of amine curing agents, 1.5 parts of curing accelerators (1-methylimidazole) and appropriate organic solvent, itsBe-H of R1, R2 in middle phenolic resins.
While adopting this resin combination to prepare this cured sheets, identical with the method for embodiment 1, difference is, usesOrganic solvent is the mixed organic solvents of butanone and acetone, and has added the curing accelerator 1-methylimidazole of 1.5 weight portions; ItsThe method of preparing copper-clad plate is also identical with embodiment 1.
Embodiment 8
A kind of resin combination, by weight, comprises 40 parts of phenoxy resins, 80 parts of biphenyl epoxy resin, four sense UV4 parts of block epoxy resin, 2 parts of amine curing agents, 1.5 parts of curing accelerators (1-methylimidazole) and appropriate organic solvent, itsIn middle phenolic resins, R1 is-OH, and R2 is-H.
While adopting this resin combination to prepare this cured sheets, identical with the method for embodiment 3, difference is, usesOrganic solvent is dimethyl formamide agent, and has added the curing accelerator 1-methylimidazole of 1.5 weight portions; It prepares copper-clad plateMethod also identical with embodiment 3.
Embodiment 9
A kind of resin combination, by weight, comprises 50 parts of phenoxy resins, 60 parts of biphenyl epoxy resin, four sense UV2 parts of block epoxy resin, 1 part of amine curing agent, 1 part of curing accelerator (glyoxal ethyline) and appropriate organic solvent, whereinIn phenolic resins, R1 is-H, and R2 is-OH.
While adopting this resin combination to prepare this cured sheets, identical with the method for embodiment 3, it prepares the method for copper-clad plateAlso identical with embodiment 3.
In addition, this resin combination also can be according to specific needs, add filler, dispersant, levelling agent, defoamer etc. otherAuxiliary agent, to make dissimilar prepreg and copper-clad plate, makes it meet different needs; Concrete additive can be according to makingThe needs of the copper-clad plate of doing are selected.
Performance test is carried out in the prepreg that above-described embodiment is made and copper-clad plate, and its performance data is compared as follows table 1Shown in.
Table 1
Above-mentioned prepreg and copper-clad plate are in the time carrying out Performance Detection, and detection method is as follows:
Peel strength (copper-clad plate): test according to IPC-TM-6502.4.9 method
Heat resistance test: 288 DEG C/10Sec
Alkali resistance test: this prepreg is soaked in to 90 DEG C, and 20min in 10% sodium hydroxide solution, observes and tableSee and change
Bin stability test: 25 DEG C, RH≤60%
Flame retardant type test: test with reference to UL94 standard, V-0 level is qualified
As the results shown in Table 1, the peel strength of embodiment 1-embodiment 9 can be more than 1.2N/mm, prepregCutting or all dry lintings not of the process such as punching with copper-clad plate, and its bin stability all can reach more than 12 months heat resistanceThe combination properties such as alkali resistance are good, can meet present printed circuit board (PCB) processing request.
In sum, resin combination of the present invention utilizes the combination of special phenolic resins and epoxy resin to realize on the one handThe prepreg of preparation and the not dry linting characteristic of copper-clad plate, solved current prepreg and copper-clad plate fragility highly cause cutting,The weakness of the operating process such as punching and punching dry linting dirt, effectively improves dust pollution, has improved employee's operating environment, has improved sealThe performance reliability of wiring board processed (PCB) and up-to-standard rate; On the other hand, the prepreg that utilizes this resin combination to prepareAnd copper-clad plate, there is high rigidity, can be used as stiffening plate, there is preferably characteristic; In addition, due to the particularity of resin combination,The prepreg keeping quality preparing is higher, and this prepreg and the copper-clad plate that adopts this prepreg to prepare can be protected for a long timeDeposit; This prepreg is prepared in the process of copper-clad plate at pressing plate simultaneously, and gummosis is easily controlled, and pressing plate window is large, has improved half admittedlyChange the product percent of pass in sheet production.
Above-described embodiment, is preferred embodiment of the present invention, is not used for limiting the scope of the present invention, therefore all with thisThe equivalence that structure, feature and principle described in invention claim done changes or modifies, and all should be included in right of the present invention and wantWithin asking scope.
Claims (9)
1. a resin combination, is characterized in that, by weight, it comprises: 60～100 parts of epoxy resin, phenoxy resin1～10 part, 20～60 parts and curing agent; Wherein, described epoxy resin is percentage meter by weight, comprises biphenyl epoxy resin 90%～100% and four sense UV block epoxy resin 0%～10%;
The molecular weight of described phenoxy resin is 30000～80000, and its chemical structural formula isWherein, be respectively-H of R1, R2 ,-OH or epoxy radicals,Containing the one in P organic salt.
2. resin combination according to claim 1, is characterized in that: the chemical structural formula of described biphenyl epoxy resin is
3. resin combination according to claim 1, is characterized in that: described four sense UV barrier type epoxy resin are 1,1,2,2-tetra-(p-hydroxybenzene) ethene, four glycidol ethers.
4. resin combination according to claim 1, is characterized in that: described curing agent is amine curing agent.
5. the employing prepreg that as described in claim 1～4 any one prepared by resin combination, is characterized in that, itsPreparation method comprises the steps: first to weigh the each component in resin combination by formula, subsequently by each component and organic moltenAgent and curing accelerator mix, and are made into resin adhesive liquid; Then glass-fiber-fabric is infiltrated in this resin adhesive liquid, takes out post-drying and removeOrganic solvent, obtains prepreg.
6. prepreg according to claim 5, is characterized in that: it is total that described curing accelerator accounts for described resin combination0.1%～2% of weight.
7. prepreg according to claim 5, is characterized in that: described organic solvent be acetone, butanone, cyclohexanone,In cyclohexane, dioxane, glycol monoethyl ether, triglyme, toluene, dimethylbenzene, DMF onePlant or several mixing.
8. prepreg according to claim 5, is characterized in that: the solid content of described resin adhesive liquid is 50%～70％。
9. a copper-clad plate, adopts prepreg preparation as claimed in claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029228.4A CN105602195A (en) | 2015-12-30 | 2015-12-30 | Resin composition, prepreg and copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029228.4A CN105602195A (en) | 2015-12-30 | 2015-12-30 | Resin composition, prepreg and copper-clad plate |
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| CN105602195A true CN105602195A (en) | 2016-05-25 |
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| CN201511029228.4A Pending CN105602195A (en) | 2015-12-30 | 2015-12-30 | Resin composition, prepreg and copper-clad plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686914A (en) * | 2016-12-30 | 2017-05-17 | 生益电子股份有限公司 | PCB stepped groove processing method capable of avoiding resin residue |
| CN107286583A (en) * | 2017-06-20 | 2017-10-24 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg made using it |
| CN110121532A (en) * | 2017-04-07 | 2019-08-13 | 松下知识产权经营株式会社 | Resin combination, prepreg, metal-clad, printed circuit board and flexible rigid print circuit board |
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| CN101798439A (en) * | 2010-02-09 | 2010-08-11 | 广东生益科技股份有限公司 | Halogen-free high-thermal-conductivity resin composition and conductive adhesive film made from same |
| CN101974205A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same |
| CN102311614A (en) * | 2011-04-03 | 2012-01-11 | 广东生益科技股份有限公司 | Resin composition and prepreg prepared by using same |
| CN102311612A (en) * | 2011-04-03 | 2012-01-11 | 广东生益科技股份有限公司 | Resin composition and resin coated copper foil made of same |
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2015
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101798439A (en) * | 2010-02-09 | 2010-08-11 | 广东生益科技股份有限公司 | Halogen-free high-thermal-conductivity resin composition and conductive adhesive film made from same |
| CN101974205A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same |
| CN102311614A (en) * | 2011-04-03 | 2012-01-11 | 广东生益科技股份有限公司 | Resin composition and prepreg prepared by using same |
| CN102311612A (en) * | 2011-04-03 | 2012-01-11 | 广东生益科技股份有限公司 | Resin composition and resin coated copper foil made of same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686914A (en) * | 2016-12-30 | 2017-05-17 | 生益电子股份有限公司 | PCB stepped groove processing method capable of avoiding resin residue |
| CN106686914B (en) * | 2016-12-30 | 2019-04-16 | 生益电子股份有限公司 | A kind of processing method for the PCB step groove avoiding resin residue |
| CN110121532A (en) * | 2017-04-07 | 2019-08-13 | 松下知识产权经营株式会社 | Resin combination, prepreg, metal-clad, printed circuit board and flexible rigid print circuit board |
| CN107286583A (en) * | 2017-06-20 | 2017-10-24 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg made using it |
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Application publication date: 20160525 |