CN105592640B - A kind of preparation method of flexible printed circuit - Google Patents
A kind of preparation method of flexible printed circuit Download PDFInfo
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- CN105592640B CN105592640B CN201410571224.8A CN201410571224A CN105592640B CN 105592640 B CN105592640 B CN 105592640B CN 201410571224 A CN201410571224 A CN 201410571224A CN 105592640 B CN105592640 B CN 105592640B
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- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 30
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- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 30
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 30
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- 239000000741 silica gel Substances 0.000 claims description 21
- 229910002027 silica gel Inorganic materials 0.000 claims description 21
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 14
- 229910052733 gallium Inorganic materials 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
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- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
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Abstract
The present invention relates to flexible printed circuit preparation methods, more particularly to one kind can be in plane, the preparation method of curved surface or the one-time formed flexible printed circuit of three-dimensional surface.The preparation method includes S1: drawing, on the surface of transfer base material, is drawn a design with conductive fluid material；S2: molding adds curable flexible material, as molded substrate material on said surface；S3: transfer, after the molded substrate material solidification, by transfer base material removal；S4: encapsulating material is added in encapsulation on the molded substrate material, completes encapsulation.The present invention can not only produce the increasingly complex single-layer or multi-layer circuit of figure by simpler method, can also realize plane, curved surface and one-time formed three-dimensional printed circuit, it applies more widely.
Description
Technical field
The present invention relates to flexible printed circuit preparation methods more particularly to one kind can be in plane, curved surface or three-dimensional surface
The preparation method of one-time formed flexible printed circuit.
Background technique
Traditional printed circuit board processing generally uses hard copper clad laminate, with modern comfort appearance and application scenarios
Diversified development, electronics processing is to light-weight, thickness is thin, flexible, stretchable flexible circuit produces a large amount of demand.And
And flexible circuit all has well in the portable electronic devices such as liquid crystal display, digital camera, mobile phone, laptop
Application prospect.Traditional hard circuit is unable to satisfy above-mentioned requirements, thus, possesses that the processing is simple, the features such as low in cost
Flexible circuit already becomes the product of industry urgent need.
Flexible circuit board acceptable substrate is PI (polyimides) copper-clad plate at present, can be with free bend, winding, folding
It is folded, any arrangement can be required according to space layout, can arbitrarily be moved in three-dimensional space and flexible, can achieve components and parts assembling
The integration connected with conducting wire；Also have many advantages, such as excellent radiating effect and solderability and to be easy to load, overall cost lower.But
Also there is the disadvantages of disposable initial cost height, complex manufacturing technology, retractility is limited simultaneously.
In recent years, it is some research using PDMS (dimethyl siloxane) silica gel as flexible circuit substrate, by PDMS direct write,
Mask spray printing etches conduit, and circuit is printed on PDMS substrate by the mode for refilling conductive fluid, is flexible circuit
Manufacture provides new selection.But it since the flexible materials such as PDMS surface elasticity and frictional force are larger, is not easy on the surface thereof
The direct write of conductive fluid is realized by printing type, it is more difficult to print complicated circuit.And under the auxiliary of mask, although can lead to
It crosses the modes such as spraying, smearing and draws relative complex circuit, but due to the stronger mobility of conductive fluid material and to substrate
Weaker wetability feature, is unable to ensure the precision of processing circuit.And the method that conduit is etched in PDMS by template,
When PDMS is separated with template, since the variation of conduit bearing capacity is easy to happen dimensional contraction deformation and the damage of fine structure.
In addition, the occasion of some special applications, it is desirable that circuit is distributed as the stereochemical structure of different spaces plane, but above-mentioned skill
Art can only rely on by muti-piece, can not process the three-dimensional surface printed circuit an of straight forming.
Since the processing method of traditional PDMS flexible circuit can not fundamentally solve the above problems, so that generally
The processing link of PDMS flexible circuit is more cumbersome, time-consuming, and cost will also greatly promote, it is difficult to realize really batch production with
Large-scale application.Therefore, against the above deficiency, the present invention provides a kind of easy to operate, low-cost flexible extensibles
The preparation method of plane, curved surface or three-dimensional surface printed circuit.
Summary of the invention
(1) technical problems to be solved
The technical problem to be solved by the present invention is to compared with existing PDMS flexible circuit, the present invention provides a kind of operations
Simply, the plane of low-cost flexible extensible, the preparation method of curved surface or three-dimensional surface printed circuit.
(2) technical solution
In order to solve the above-mentioned technical problems, the present invention provides a kind of preparation methods of flexible printed circuit.This method packet
Include following steps:
S1: drawing, and on the surface of transfer base material, is drawn a design with conductive fluid material；
S2: molding adds curable flexible material, as molded substrate material on said surface；
S3: transfer, after the molded substrate material solidification, by transfer base material removal；
S4: encapsulating material is added in encapsulation on the molded substrate material, completes encapsulation.
Preferably, the flexible circuit step S4 completed realizes the more of connection by heeling-in, break-through, stack manner
The preparation of layer flexible circuit.
Preferably, for the printed circuit in multiple-level stack, the mode of communicating of each interlayer is to be inserted between the layers
Solid conduction object；Or solid conduction object is connected in the molded substrate material in advance in transfer process；Or heeling-in solid
Conductive or non-conductive object is extracted out after process to be formed, to form the duct connected between layers.
Preferably, the printed circuit is that two-dimensional surface circuit or curved surface circuit or route are distributed in multiple and different put down
Face, curved surface stereo circuit.
Preferably, the surface is two-dimensional surface or curved surface；Position is the sheet surface of the transfer base material
Or planar surface, or by each inner and outer surfaces for transferring base material and being formed by three-dimensional shape material, or by the transfer
Sheet of base material or plate fit in the inner and outer surfaces of default three-dimensional shape material.
Preferably, the conductive fluid material is with the transfer base material, the deformation of the molded substrate material, drawing
It stretches and generates corresponding deformation, stretching, and keep in the pattern in the step S1 on-off of circuit and Local Phase to geometry
The not changed material of relationship.
Preferably, the transfer base material is to have high adhesion to the conductive fluid material, and keep described in drafting
The material of extra flowing does not occur for the fluid of the pattern in step S1.
Preferably, the molded substrate material is with flexible；It can be in liquid form on the transfer base material
It covered, wrapped up or is filled, and curing molding；There is high adhesion to the conductive fluid material, and can be with the transfer
The material that base material mutually separates.
Preferably, the encapsulating material is the gummed paper material or plastics, rubber same or similar with the molded substrate material
Glue thin film flexible closed material.
Preferably, the conductive fluid material is that gallium, mercury, gallium indium, gallium indium tin room temperature liquid metal or graphene, carbon are received
Conductive fluid made of mitron, metal nanoparticle；The transfer base material is PVC plastic；The molded substrate material is
PDMS silica gel；The encapsulating material is PDMS silica gel or sulphurated siliastic.
(3) beneficial effect
Above-mentioned technical proposal of the invention has the advantages that material requested is easily prepared, and manufacture craft is simple, at low cost
Honest and clean, the liquid metal circuit for being not required to that the flexible circuit with good flexibility and draftability can be obtained with adhesive, and obtaining holds
Easily repair.It is compared with existing PDMS flexible circuit, the present invention not only can produce figure more by simpler method
For complicated single-layer or multi-layer circuit, plane, curved surface and one-time formed three-dimensional printed circuit, the scope of application can also be realized
It is more extensive.
Detailed description of the invention
Fig. 1 is the method flow diagram of the preparation method of flexible printed circuit provided by the invention；
Fig. 2 (a), Fig. 2 (b), Fig. 2 (c), Fig. 2 (d), Fig. 2 (e) are the flexible prints provided by the invention in simple flat surface
The preparation method schematic diagram of circuit processed；
Fig. 3 is the preparation method schematic diagram of layer flexible printed circuit provided by the invention；
Fig. 4 (a) is the preparation method schematic diagram of the flexible printed circuit provided by the invention on three-dimensional surface；
Fig. 4 (b) is the A-A section signal of the preparation method of the flexible printed circuit provided by the invention on three-dimensional surface
Figure.
In figure: 1:PVC plastic tab；2: liquid metal circuit；3: mold；4:PDMS silica gel；5: solid implant；6: even
Through-hole；7: stereo shaping substrate.
Specific embodiment
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawings and examples.Following embodiment
For illustrating the present invention, but it is not intended to limit the scope of the invention.
As shown in Figure 1, the method flow diagram of the preparation method of flexible printed circuit provided by the invention.
The preparation method the following steps are included:
S1: drawing, and on the surface of transfer base material, is drawn a design with conductive fluid material；
S2: molding adds curable flexible material, as molded substrate material on the surface；Wherein, surface is that two dimension is flat
Face or curved surface；Position is the sheet surface or planar surface for transferring base material, or by transfer base material institute shape
At three-dimensional shape material each inner and outer surfaces, or default solid figure fitted in by the transfer sheet of base material or plate
The inner and outer surfaces of shape object.
S3: transfer, after the molded substrate material solidification, by transfer base material removal；
S4: encapsulating material is added in encapsulation on the molded substrate material, completes encapsulation.
Further, flexible circuit step S4 completed realizes the multilayer of connection by heeling-in, break-through, stack manner
The preparation of flexible circuit.Wherein, for printed circuit in multiple-level stack, the mode of communicating of each interlayer is that insertion is solid between the layers
Body conductive material；Or solid conduction object is connected in the molded substrate material in advance in transfer process；Or heeling-in solid is led
Electric or non-conductive object is extracted out after process to be formed, to form the duct connected between layers.
Further, printed circuit be two-dimensional surface circuit or curved surface circuit or route be distributed in multiple and different planes,
The stereo circuit of curved surface.
Further, conductive fluid material is to generate correspondence with transfer base material, the deformation of molded substrate material, stretching
Deformation, stretch, and keep in the pattern in step S1 the on-off of circuit and the not changed material of local relative geometrical relation
Material.Wherein, conductive fluid material is room temperature liquid metals or graphene, carbon nanotube, the metals such as gallium, mercury, gallium indium, gallium indium tin
Conductive fluid made of nano particle etc., is not limited thereto.
Further, transfer base material is to have high adhesion to conductive fluid material, and keep in plot step S1
The material of extra flowing does not occur for the fluid of pattern.Wherein, transfer base material is not limited thereto by taking PVC plastic as an example.
Further, molded substrate material is with flexible；It can be enterprising in the transfer base material in liquid form
Row covering, package or filling, and curing molding；There is high adhesion to conductive fluid material, and can be with transfer base material phase
Isolated material.Wherein, molded substrate material is PDMS silica gel, is not limited thereto.
Further, encapsulating material is the gummed paper material or plastics, rubber film same or similar with molded substrate material
Flexible closure material, the encapsulating material are PDMS silica gel or sulphurated siliastic etc., are not limited thereto.
Embodiment one, the preparation method for the flexible printed circuit in simple flat surface that Fig. 2 the present invention is described in detail provides.
Further, thin in PVC (polyvinyl chloride) plastics using gallium indium room temperature liquid metal alloy as shown in Fig. 2 (a)
The liquid metal circuit 2 with objective circuit mirror image each other is drawn on piece 1.Liquid metal circuit 2 can be printed by liquid metal
Machine directly prints, and can also be drawn in such a way that exposure mask sprays or smears.
Further, as shown in Fig. 2 (b), mold 3 is placed on PVC plastic tablet 1, the selection of dimension of mold 3 is only to expose
The size of liquid metal circuit 2.The effect of mold 3 is to make PDMS silica gel 4 when solidifying in regular shape, while preventing PVC plastic
Piece 1 is subjected to displacement.The PDMS silica gel 4 of liquid is poured into mold 3, after spreading uniformly.It is put into vacuum oven and sets
Temperature between 60 DEG C~80 DEG C, after one hour can curing molding, can also be placed directly in and place 48 hours at room temperature or more
Carry out curing molding.
Further, as shown in Fig. 2 (c), after molding is fully cured to PDMS silica gel 4, slowly PVC plastic tablet 1 is taken off
It removes, circuit can be transferred on PDMS silica gel 4.
Further, as shown in Fig. 2 (d), by component be inserted into or the circuit that is attached on PDMS silica gel 4 on, then by mold 3
It is placed in top, the PDMS silica gel of liquid is poured into, component and liquid metal circuit 2 is packaged.
Further, as shown in Fig. 2 (e), solidified with above-mentioned same method, packaged single layer can be obtained
Stretchable flexible circuit.
Embodiment two, the preparation method for the layer flexible printed circuit that Fig. 3 the present invention is described in detail provides.
Further, the stretchable circuit of layer flexible can be by several single circuits obtained according to one method of embodiment
It is bonded together to obtain.For example, all silica gel materials are PDMS, can be bonded by plasma treatment bonding technology.
Further, the mode of communicating between multilayer circuit is that solid implant 5 is erected on PVC plastic tablet 1 and is needed
The position of multilayer circuit connection, and one layer of gallium indium room temperature liquid metal alloy or lubricant are brushed in 5 side of solid implant.With
Method filling PDMS silica gel 4 in above-described embodiment one prepares single-layer flex circuit, and the flexible circuit obtained from is taking out admittedly
Intercommunicating pore 6 is formd after body implant 5.The effect for brushing one layer of gallium indium room temperature liquid metal alloy or lubricating oil is to be easy to consolidate
The damage that body implant 5 is extracted from PDMS silica gel 4 without causing silica gel.Multilayer circuit heap poststack has the place of intercommunicating pore 6 to use
The filling of gallium indium room temperature liquid metal alloy.Wherein, liquid metal alloy is by taking gallium indium room temperature liquid metal alloy as an example, not with this
It is limited.
Embodiment three, the preparation method for the flexible printed circuit on three-dimensional surface that Fig. 4 the present invention is described in detail provides.
Further, as shown in Fig. 4 (a), Fig. 4 (b), stereo shaping substrate 7 has a truncated cone-shaped inner surface, by liquid gold
Belong to circuit 2 to be plotted on the inner bottom surface and N-Side surf of truncated cone-shaped.PDMS silica gel 4 is poured into truncated cone-shaped first, rotary table is complete
Filling, or make under suitable mold booster action very thin one layer of 4, PDMS silica gel covering truncated cone-shaped inner surfaces, it places into
Vacuum oven curing molding.Transfer PDMS silica gel 4 can be taken out after solidification, obtain being printed on the round table-like vertical of the patterns such as circuit
Body transfers substrate.Component is inserted into or is attached to later on the circuit of round table-like three-dimensional transfer substrate, then by the PDMS silicon of liquid
Glue pours into the truncated cone-shaped mold of suitable dimension, and the round table-like solid with component is placed on truncated cone-shaped mold and is sealed
Dress.It can be obtained by the flexible extensible solid printed circuit on a packaged truncated cone-shaped surface after solidification.
In conclusion the present invention provides a kind of preparation methods of easy to operate, low-cost flexible printed circuit.This
Invention can not only produce the increasingly complex single-layer or multi-layer circuit of figure by simpler method, can also realize flat
Face, curved surface and one-time formed three-dimensional printed circuit, it applies more widely.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (8)
1. a kind of preparation method of flexible printed circuit, which comprises the following steps:
S1: drawing, and on the surface of transfer base material, is drawn a design with conductive fluid material；
S2: molding adds curable flexible material, as molded substrate material on said surface；
S3: transfer, after the molded substrate material solidification, by transfer base material removal；
S4: encapsulating material is added in encapsulation on the molded substrate material, completes encapsulation, the molded substrate material be with
It is flexible；It covered, wrapped up or is filled on the transfer base material in liquid form, and curing molding；To described
Conductive fluid material has high adhesion, and the material that can mutually separate with the transfer base material.
2. the preparation method of flexible printed circuit according to claim 1, which is characterized in that complete the step S4
Flexible circuit realizes the preparation of the multi-layer flexible circuit of connection by heeling-in, break-through or stack manner, wherein
The preparation of the multi-layer flexible circuit that connection is realized by stack manner, specially the printed circuit is in multilayer heap
When folded, the mode of communicating of each interlayer is to be inserted into solid conduction object between the layers；Or described connection is realized by heeling-in mode
Multi-layer flexible circuit preparation, solid conduction object is connected to the molded substrate material in advance specially in transfer process
In；Or the preparation of the multi-layer flexible circuit that connection is realized by punch through mode, specially heeling-in solid conduction or non-conductive
Object is extracted out after process to be formed, to form the duct connected between layers.
3. the preparation method of flexible printed circuit described in any one of -2 according to claim 1, which is characterized in that the printing
Circuit is two-dimensional surface circuit and/or curved surface circuit.
4. the preparation method of flexible printed circuit described in any one of -2 according to claim 1, which is characterized in that the surface
For two-dimensional surface or curved surface；The position on the surface is the sheet surface or planar surface of the transfer base material, or
Position is to be formed by each inner and outer surfaces of three-dimensional shape material by the transfer base material or position is served as reasons
The transfer sheet of base material or plate fit in the surface that the inner and outer surfaces of default three-dimensional shape material are constituted.
5. the preparation method of flexible printed circuit according to claim 4, which is characterized in that the conductive fluid material is
Corresponding deformation, stretching are generated with the transfer base material, the deformation of the molded substrate material, stretching, and described in holding
The on-off of circuit and the not changed material of local relative geometrical relation in the pattern in step S1.
6. the preparation method of flexible printed circuit according to claim 5, which is characterized in that the transfer base material is
There is high adhesion to the conductive fluid material, and it is extra to keep the fluid for drawing the pattern in the step S1 not occur
The material of flowing.
7. the preparation method of flexible printed circuit according to claim 1, which is characterized in that the encapsulating material for institute
State the identical gummed paper material of molded substrate material；
Or, the encapsulating material is plastics；
Or, the encapsulating material is rubber film flexible encapsulant material.
8. the preparation method of flexible printed circuit according to claim 7, which is characterized in that the conductive fluid material is
Gallium, mercury, gallium indium, gallium indium tin room temperature liquid metal or graphene, carbon nanotube, conductive fluid made of metal nanoparticle；Institute
Stating transfer base material is PVC plastic；The molded substrate material is PDMS silica gel；The encapsulating material is PDMS silica gel or sulphur
SiClx rubber.
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| CN201410571224.8A CN105592640B (en) | 2014-10-22 | 2014-10-22 | A kind of preparation method of flexible printed circuit |
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| CN201410571224.8A CN105592640B (en) | 2014-10-22 | 2014-10-22 | A kind of preparation method of flexible printed circuit |
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