CN105586570A - Radiation source evaporation system and evaporation control method - Google Patents
Radiation source evaporation system and evaporation control method Download PDFInfo
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- CN105586570A CN105586570A CN201410654319.6A CN201410654319A CN105586570A CN 105586570 A CN105586570 A CN 105586570A CN 201410654319 A CN201410654319 A CN 201410654319A CN 105586570 A CN105586570 A CN 105586570A
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Abstract
The invention provides a radiation source evaporation system and an evaporation control method. The evaporation system comprises a carrying table used for carrying an evaporation material, and a radiation generator used for generating a radiation source to radiate the evaporation material on the carrying table and making the evaporation material heated to be evaporated. The evaporation material is sprayed onto the carrying table through a nozzle tool and is covered with a protective body. The evaporation control method includes the steps that firstly, the carrying table is arranged, and the material is sprayed; secondly, the radiation source is additionally arranged on the carrying table; thirdly, evaporation is conducted on the material through the radiation source; and fourthly, the output power of the radiation source is controlled so that the evaporation rate can be controlled. A traditional heat conduction manner is thoroughly replaced with a radiation manner, and the problems existing in the traditional heat conduction manner are solved. The radiation source evaporation system and the evaporation control method have the beneficial effects that a traditional evaporation manner is improved, and the evaporation efficiency can be better effectively controlled.
Description
Technical field
The present invention relates to a kind of vapo(u)rization system for material evaporation and method. Be specifically related to a kind of for OLEDThe vapo(u)rization system with radiation source in evaporated device and evaporation control method.
Background technology
In vacuum environment, material is heated and be plated to and on substrate, be called vacuum evaporation, or cry vacuum coating.In OLED light emitting diode field, vacuum evaporation is the technology of an extremely important key, and this technology is directAffect quality and the manufacturing cost of OLED product. Vacuum evaporation is material to be filmed to be placed in to vacuum carry outEvaporation or distillation, make it the process of separating out at workpiece or substrate surface. Evaporation conventionally can be at cylindrical coatingIndoorly carry out in batches. Coating chamber diameter can reach several meters, depends on the size and number of coating part. Part canTo do planetary motion around vapour source, with at the each limit of part coated metal layer equably.
It is that evaporation mode is that material is inserted to crucible that current OLED evaporated device adopts, and then passes through electric heatingSilk crucible heat, whole heating process by monitoring evaporation rate, by PID to resistance heating wire's meritRate is controlled, to reach steady-state evaporation speed.
As shown in the feedback control loop of Fig. 1, in whole feedback control loop, the variation that changes to speed of electric current is logicalOverheated conduction completes, and the time of this response is longer. Especially for sublimability material, be more difficult to accuratelyControl. need the long period from being heated to rate stabilization. Cause longer reason of time to have: heating wire heating rateSlowly quality and this heating power of material of material in lower, the crucible of the coefficient of heat conduction between heating wire and crucible,Learn characteristic etc.
For example: number of patent application is: 201020203146.3 Chinese utility model patent, discloses oneEvaporated device, comprises deposited chamber, is positioned at the crucible of deposited chamber, the evaporation source of heating crucible, and substrate, alsoComprise porose baffle plate, baffle plate is between crucible and substrate, and baffle plate is provided with heater. This patent justBe to adopt traditional heat exchange pattern to carry out the prominent example of evaporation, its heater generally adopts heater strip, addsHeat pipe or heating plate etc. Therefore, rate temperature change is relatively slow, and wayward.
In view of the situation of traditional evaporated device, we particularly need a kind of more efficiently more easily effectively controlEvaporation vapo(u)rization system, meets progressive demand of epoch.
Summary of the invention
The object of the present invention is to provide a kind of radiation source vapo(u)rization system and evaporation control method, existing to overcomeThe existing rate temperature change of technology is relatively slow, and the defect such as wayward.
The present invention provides a kind of radiation source vapo(u)rization system on the one hand, comprising:
For carrying the microscope carrier of deposition material, and
Make deposition material be subject to the radiation of thermal evaporation for generation of radiation source with the deposition material irradiating on microscope carrierGenerator.
Beneficial effect of the present invention is: thoroughly change tradition heat conduction evaporation evaporation mode, by swashingLight radiation is as radiation source, effectively to control the speed of evaporation.
The further improvement of radiation source vapo(u)rization system of the present invention is,
Be arranged at the nozzle instrument of microscope carrier top, for deposition material being sprayed on to described microscope carrier.
The further improvement of radiation source vapo(u)rization system of the present invention is,
Microscope carrier is the circular microscope carrier of rotation start;
Utilize the deposition material of the sprinkling of nozzle instrument on described circular microscope carrier in the form of a ring.
The further improvement of radiation source vapo(u)rization system of the present invention is,
On circular microscope carrier, be provided with for accommodating described deposition material corresponding to described radiation generator connecingReceive the heating ring of described radiation source, radiation source by heating ring to deposition material heating evaporation.
The further improvement of radiation source vapo(u)rization system of the present invention is,
Microscope carrier is the rectangle microscope carrier of left and right start;
Nozzle instrument comprises to be located at the first nozzle instrument of rectangle microscope carrier left-hand end and to be positioned at rectangle microscope carrier right-hand endSecond nozzle instrument; The first deposition material and the utilization that utilize the first nozzle instrument to spray on rectangle microscope carrierThe second deposition material that second nozzle instrument sprays on rectangle microscope carrier is strip;
Radiation generating is disposed at the centre position place of rectangle microscope carrier, and the radiation source of generation is used at rectangle microscope carrierWhen left and right start, the first deposition material and the heating of the second deposition material that move under described radiation source are steamedSend out.
The further improvement of radiation source vapo(u)rization system of the present invention is,
Also comprise the protective for covering deposition material; Protective offers the opening passing through for radiation source,Radiation source comprises laser emission.
The present invention also provides a kind of evaporation control method, comprises the following steps:
1) microscope carrier is set, and sprays deposition material on described microscope carrier;
2) by the radiation generating adding, deposition material is carried out to heating evaporation;
3) power output of control radiation generating, to control the evaporation speed of deposition material.
The further improvement of evaporation control method of the present invention is,
Step 1) step 2 afterwards) be also included in before the step that covers one deck protective on deposition material,To form preliminary protection.
Advantage of the present invention: improve traditional evaporation mode, the better evaporation efficiency of effectively controlling.
Brief description of the drawings
Fig. 1 is traditional deposition system schematic flow sheet;
Fig. 2 is the schematic flow sheet of evaporation control method of the present invention;
Fig. 3 is embodiment mono-schematic top plan view of radiation source vapo(u)rization system of the present invention;
Fig. 4 is A-A section signal intention in Fig. 3 of radiation source vapo(u)rization system of the present invention;
Fig. 5 is embodiment bis-schematic top plan view of radiation source vapo(u)rization system of the present invention;
Fig. 6 is embodiment tri-schematic top plan view of radiation source vapo(u)rization system of the present invention;
Fig. 7 is embodiment tetra-schematic top plan view of radiation source vapo(u)rization system of the present invention.
Detailed description of the invention
For the benefit of the understanding to structure of the present invention, describes below in conjunction with drawings and Examples.
As shown in Figure 1, in figure, illustrated traditional heat exchange pattern to carry out the roughly logic flow of evaporation. Wherein,First material is inserted to crucible, then heat by heating wire crucible, then resistance heating wire's power is carried outControl. Such evaporation mode, all has response time length, is difficult to precisely control asking of evaporation efficiencyTopic.
In conjunction with shown in Fig. 2 to Fig. 7, the present invention is directed to above-mentioned defect, a kind of radiation source vapo(u)rization system is providedAnd evaporation control method, thoroughly replace traditional heat exchange pattern in the mode of radiation, solve heat exchange patternDefect, and make evaporation efficiency obtain better more effective control.
With reference to Fig. 3 or Fig. 6, paper radiation source vapo(u)rization system, comprising: microscope carrier 5 and irradiating in instituteState the radiation generating 4 on microscope carrier. Microscope carrier 5 is for carrying deposition material 1, and radiation generating 4 is for producingRaw radiation source also makes deposition material 1 be subject to thermal evaporation.
Be below the comparatively preferred structure setting of native system:
Deposition material 1 is sprayed on microscope carrier 5 by a nozzle instrument 2, and deposition material 1 produces by a radiationThe radiation source that raw device 4 produces carries out evaporation. On deposition material 1, cover a protective 6, protective 6 is offeredThere is the opening 7 passing through for radiation generating 4.
With reference to Fig. 2, secondly introduce a kind of evaporation control method of stating system based on upper radiation source evaporation, concreteComprise following key step:
1) microscope carrier 5 is set, and on microscope carrier 5, sprays deposition material 1;
2) by the radiation generating 4 adding, deposition material 1 is carried out to heating evaporation;
3) power output of control radiation generating 4, to control the evaporation speed of deposition material 1.
For the deposition material 1 after spraying is tentatively protected, can be in step 1) step 2 afterwards) before,On deposition material 1, cover one deck protective 6.
Several comparatively preferred embodiments that provide for native system below:
Embodiment mono-: shown in Fig. 3 and Fig. 4, a circular microscope carrier 5 is set, this circular microscope carrier 5 can edgeAxle center rotation. One heating ring 3 is first set on microscope carrier 5. Again deposition material 1 is sprayed at by nozzle 2In heating ring 3, present a ring. Then radiation generating 4 is arranged to the corresponding position of heating ring 3Put, radiation generating 4 now can be lasing source. Finally on whole circular microscope carrier 5, cover oneProtective 6, to prevent that in evaporation cavity, flow perturbation produces airborne dust.
When running, microscope carrier 5 rotates, and radiation generating 4 produces laser emission, and it adopts high density radiant energyHeating ring 3 is irradiated, and this heating ring 3 can rise to material sublimation temperature wink. While needing evaporation,Just by this mode, deposition material 1 is distilled, and by controlling power and the effect of radiation generating 4Time is controlled the efficiency of the evaporation of deposition material 1, when evaporation, does not reduce radiation generating 4 power,Make material maintain 250 DEG C of left and right, to reduce material evaporation rate.
Embodiment bis-: on the basis of embodiment mono-, in a heating ring 3, add again a heating ring 3, withCause and form two rings with deposition material 1, on same microscope carrier 5, increase deposition material 1 with thisEvaporation capacity. Wherein, but the material of 1 two kinds of unlike materials of deposition material, and both can be on microscope carrier 5A radiation generating 4 is set, also can on inside and outside two heating rings 3, a radiation generating 4 be all set.
In the time of running, suppose
Radiation generating 4 has been arranged on microscope carrier 5, only need directly operation on operating position.In the time being a radiation generating 4, can utilize the sprinkling gap of deposition material 1, have internally additional in successionHeat ring 3 irradiates, and on processing procedure, can cushion to some extent; When two radiation generatings 4 work is simultaneously set respectivelyWhile work, deposition material 1 its evaporation efficiency of unlike material is fine the embodying of energy just, and it irradiates heatingThe efficiency of evaporation also can be higher.
Embodiment tri-: as shown in Figure 5, a rectangle microscope carrier 5 is set, this microscler microscope carrier 5 can move left and right.On microscope carrier 5, do not add heating ring 3, but directly on 5 of microscope carriers, spray the deposition material 1 of required evaporation,And spaced row's nozzle instrument 2 is set, and be specially, be positioned at the first nozzle instrument of left-hand end and be positioned atThe second nozzle instrument of rectangle microscope carrier right-hand end. Nozzle 2 sprays a deposition material 1 along straight line. SprayAfter completing, protective layer 6 in covering, can arrange an opening 7 at protective layer 6 medium positions, and open along thisMouth 7 arranges a radiation generating 4, and radiation generating 4 adds deposition material 1 by this opening 7Hot evaporation; Also or, before sprinkling completes, suppose that radiation generating 4 has been arranged on microscope carrier 5, thisTime, in covering, after protective layer 6, need the operating position of corresponding radiation generating 4 to set out an opening 7, thisSample, radiation generating 4 just can heat evaporation to plating material 1 by this opening 7.
When running, in the time that rectangle microscope carrier 5 moves from left to right, the first nozzle instrument of left-hand end is by evaporationMaterial 1 is sent forth on microscope carrier 5, and shape is into a line. In the process of moving to right, radiation generating 4 is opened at middle partEvaporate the deposition material 1 moving to right mouth 7 positions; After evaporating, microscope carrier 5 finishes to move to right,The second nozzle instrument of right-hand end is prepared spray material; In the time that microscope carrier 5 moves from right to left, right-hand endSecond nozzle instrument ejection deposition material 1, and in the process of moving to right, radiation generating 4 is in intermediate openings 7Position is to the evaporation deposition material 1 moving to left, in the process that microscope carrier 5 moves to left, and the first nozzle of left-hand endInstrument stops spraying deposition material 1.
If desired, when high efficiency is evaporated deposition material 1 again, can on protective layer 6, offer multiple openings 7,And left and right arranges, and at each opening 7 places, one radiation generating 4 is set respectively. Like this, first and secondNozzle, in the time that microscope carrier 5 moves left and right, can continue to spray deposition material 1, and can pass through radiation generating 4High-efficiency evaporating.
Embodiment tetra-: on the basis of embodiment tri-, the left and right sides on rectangle microscope carrier 5, arranges multipleThe first nozzle instrument and the second nozzle instrument of longitudinally arranging, form the parallel spaced nozzle instrument of two row,To form the parallel deposition material 1 of multirow. And on the deposition material 1 of every row, arrange respectively one radiation produceDevice 4, the radiation generating 4 of longitudinally arranging to form row, thus deposition material 1 is carried out to evaporation. Also canWith the embodiment according to embodiment bis-, the deposition material 1 of unlike material is set, also or in every a lineMultiple radiation generatings 4 are set on deposition material 1, with this, totally promote heating evaporation usefulness. Wherein toolThe operation of body is due to similar with the process described in embodiment bis-and embodiment tri-, therefore, and not at thisAdd to repeat.
Below embodiment has been described in detail the present invention by reference to the accompanying drawings, and those skilled in the art canAccording to the above description the present invention is made to many variations example. Thereby some details in embodiment should not formLimitation of the invention, the present invention by the scope defining using appended claims as protection domain.
Claims (9)
1. a radiation source vapo(u)rization system, is characterized in that, comprising:
For carrying the microscope carrier of deposition material;
Make the steaming of being heated of described deposition material for generation of radiation source to irradiate deposition material on described microscope carrierThe radiation generating of sending out.
2. radiation source vapo(u)rization system according to claim 1, is characterized in that: also comprise and be arranged at instituteState the nozzle instrument of microscope carrier top, for described deposition material is sprayed on to described microscope carrier.
3. radiation source vapo(u)rization system according to claim 2, is characterized in that:
Described microscope carrier is the circular microscope carrier of rotation start;
Utilize deposition material that described nozzle instrument sprays on described circular microscope carrier in the form of a ring.
4. radiation source vapo(u)rization system according to claim 3, is characterized in that:
On described circular microscope carrier, be provided with for accommodating described deposition material and corresponding with described radiation generator withFor the heating ring that receives described radiation source;
Described radiation source passes through described heating ring to described deposition material heating evaporation.
5. radiation source vapo(u)rization system according to claim 2, is characterized in that:
Described microscope carrier is the rectangle microscope carrier of left and right start;
Described nozzle instrument comprises to be located at the first nozzle instrument of described rectangle microscope carrier left-hand end and to be positioned at described squareThe second nozzle instrument of shape microscope carrier right-hand end; Utilize described the first nozzle instrument to spray on described rectangle microscope carrierThe first deposition material and the second evaporation material of utilizing described second nozzle instrument to spray on described rectangle microscope carrierMaterial is strip;
Described radiation generating is disposed at the centre position place of described rectangle microscope carrier, and the described radiation source of generation is usedWhen in the start of described rectangle microscope carrier left and right to move to described the first deposition material under described radiation source andDescribed the second deposition material heating evaporation.
6. radiation source vapo(u)rization system according to claim 1 and 2, is characterized in that:
Also comprise the protective for covering described deposition material;
Described protective offers the opening passing through for described radiation source.
7. radiation source vapo(u)rization system according to claim 1, is characterized in that:
Described radiation source comprises laser emission.
8. the evaporation control of the radiation source vapo(u)rization system based on as described in any one in claim 1 to 7Method processed, is characterized in that comprising the following steps:
1) microscope carrier is set, and sprays deposition material on described microscope carrier;
2) by the radiation generating adding, deposition material is carried out to heating evaporation;
3) power output of control radiation generating, to control the evaporation speed of described deposition material.
9. evaporation control method according to claim 8, is characterized in that:
Step 1) step 2 afterwards) be also included in before the step of covering protection body on described deposition material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410654319.6A CN105586570A (en) | 2014-11-17 | 2014-11-17 | Radiation source evaporation system and evaporation control method |
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Citations (7)
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| JPS5114181A (en) * | 1974-06-19 | 1976-02-04 | Airco Inc | KISHITSUNOHI FUKUHOHO |
| JPH08225932A (en) * | 1995-02-16 | 1996-09-03 | Shincron:Kk | Electron beam heating vapor deposition method and apparatus thereof |
| CN1405630A (en) * | 2001-09-14 | 2003-03-26 | 精工爱普生株式会社 | Pattern formation method and device, electric sensitive element and colour filter producing method |
| JP2003197531A (en) * | 2001-12-21 | 2003-07-11 | Seiko Epson Corp | Patterning device, patterning method, method of manufacturing electronic element, method of manufacturing circuit board, method of manufacturing electronic device, electrooptical device and its manufacturing method, and electronic apparatus |
| CN1711368A (en) * | 2002-11-05 | 2005-12-21 | 特瓦薄膜技术有限公司 | Device and method for the evaporation of lamina material |
| CN101641457A (en) * | 2007-03-26 | 2010-02-03 | 株式会社爱发科 | Evaporation source, vapor deposition apparatus and method of film formation |
| CN102131950A (en) * | 2008-06-19 | 2011-07-20 | 实用光有限公司 | Light induced patterning |
-
2014
- 2014-11-17 CN CN201410654319.6A patent/CN105586570A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114181A (en) * | 1974-06-19 | 1976-02-04 | Airco Inc | KISHITSUNOHI FUKUHOHO |
| JPH08225932A (en) * | 1995-02-16 | 1996-09-03 | Shincron:Kk | Electron beam heating vapor deposition method and apparatus thereof |
| CN1405630A (en) * | 2001-09-14 | 2003-03-26 | 精工爱普生株式会社 | Pattern formation method and device, electric sensitive element and colour filter producing method |
| JP2003197531A (en) * | 2001-12-21 | 2003-07-11 | Seiko Epson Corp | Patterning device, patterning method, method of manufacturing electronic element, method of manufacturing circuit board, method of manufacturing electronic device, electrooptical device and its manufacturing method, and electronic apparatus |
| CN1711368A (en) * | 2002-11-05 | 2005-12-21 | 特瓦薄膜技术有限公司 | Device and method for the evaporation of lamina material |
| CN101641457A (en) * | 2007-03-26 | 2010-02-03 | 株式会社爱发科 | Evaporation source, vapor deposition apparatus and method of film formation |
| CN102131950A (en) * | 2008-06-19 | 2011-07-20 | 实用光有限公司 | Light induced patterning |
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Application publication date: 20160518 |