CN105568333B - A kind of copper conduction fin local silver-plating device - Google Patents
A kind of copper conduction fin local silver-plating device Download PDFInfo
- Publication number
- CN105568333B CN105568333B CN201511035192.0A CN201511035192A CN105568333B CN 105568333 B CN105568333 B CN 105568333B CN 201511035192 A CN201511035192 A CN 201511035192A CN 105568333 B CN105568333 B CN 105568333B
- Authority
- CN
- China
- Prior art keywords
- fixed seat
- conduction fin
- silver
- copper conduction
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Abstract
The present invention provides a kind of copper conduction fin local silver-plating device, belongs to electrochmical power source lithium-ions battery technical field.Copper conduction fin local silver-plating device, including cover the upper fixed seat in the upper non-silver-plated area of the lower fixed seat in non-silver-plated area and covering copper conduction fin under copper conduction fin.The locating slot for the positioning sleeve for accommodating copper conduction fin is provided on the lower fixed seat.Fixed seat is equipped with fixed link, and the diameter of the fixed link is less than the diameter of the through-hole of copper conduction fin, is provided with and the matched mounting hole of fixed link on lower fixed seat.Upper fixed seat and lower fixed seat cover the non-silver-plated area of copper conduction fin by the cooperation of fixed link and mounting hole.The application realizes the local silver-plating of copper conduction fin, avoids being protected using paint film, substantially increases production efficiency, 50% or more silver-plated cost savings, while avoiding the pollution that coating paint film is brought.
Description
Technical field
The present invention relates to electrochmical power source lithium-ions battery technical field more particularly to a kind of copper conduction fin local silver-platings
Device.
Background technology
Single battery is using a kind of part being called copper conduction fin, to improve the conduction of the external output interface of single battery
Ability, copper conduction fin need local silver-plating.The usual way of local silver-plating is part all to be coated protective paint, then will need
Silver-plated position paint film removal, the position progress exposed after paint film removal is silver-plated, again removes the paint film on part after silver-plated
It removes.Due to the higher adhesive force and insulating effect of paint film, it can guarantee that the non-silver-plated area of part is isolated with silver plating solution.However this
When kind technique is applied to copper conduction fin, since copper conduction fin has many dead angles, and paint film adhesion is big, toughness is high, the later stage
Paint film is not easily cleaned when processing, expends a large amount of manpower and materials.
Therefore design a kind of detachable mechanical device, make the non-silver-plated area of copper conduction fin be isolated with silver plating solution thus
Avoid coating and the removal of paint film necessary.
Invention content
The problem to be solved in the present invention be existing copper conduction fin silver plating process in paint film be not easy to remove, labor intensive
Material resources.
In order to solve the above technical problems, the technical solution adopted by the present invention is：A kind of copper conduction fin local silver-plating is provided
Device, including cover the upper non-silver-plated area of the lower fixed seat in non-silver-plated area and covering copper conduction fin under copper conduction fin
Upper fixed seat.The locating slot for the positioning sleeve for accommodating copper conduction fin is provided on the lower fixed seat.Fixed seat is equipped with
Fixed link, the diameter of the fixed link are less than the diameter of the through-hole of copper conduction fin, are provided on lower fixed seat and match with fixed link
The mounting hole of conjunction.Upper fixed seat and lower fixed seat cover the non-silver-plated of copper conduction fin by the cooperation of fixed link and mounting hole
Area.
Preferably, the fixed link and mounting hole are spirally connected, and external screw thread is provided in fixed link, be provided in mounting hole with it is described outer
The matched internal thread of screw thread.
Further, the device of the application further includes the lower seal for sealing copper conduction fin and being connect with lower fixed seat, institute
State the lower holding tank for being provided on lower fixed seat and accommodating lower seal, lower seal and non-silver-plated area's phase under copper conduction fin
Match.
Preferably, the lower seal is O-ring.
Further, the device in the application further includes the upper sealing ring for sealing copper conduction fin and being connect with upper fixed seat,
The upper holding tank for accommodating upper sealing ring, upper non-silver-plated area's phase of upper sealing ring and copper conduction fin are provided on fixed seat
Match.
Preferably, the upper sealing ring is O-ring.
Further, one end that the fixed link is connected with upper fixed seat is additionally provided with positioning convex platform；The positioning convex platform
Diameter is matched with the diameter of the through-hole of copper conduction fin.
Preferably, side of the fixed seat far from lower fixed seat is additionally provided with upper fixed of easily operated upper fixed seat
Hand.
Preferably, side of the lower fixed seat far from upper fixed seat is additionally provided with lower fixed of easily operated lower fixed seat
Hand.
The invention has the advantages and positive effects that：(1) this application provides a kind of devices with sealing function, real
The existing non-silver-plated area of copper conduction fin is isolated with silver plating solution, prevents non-silver-plated area silver-plated, remaining part exposed can be achieved
Silver-plated purpose.(2) the application realizes the local silver-plating of copper conduction fin, avoids being protected using paint film, greatly improve
Production efficiency, silver-plated cost savings 50% or more, while avoiding the pollution that coating paint film is brought.(3) provided by the present application
Device can be recycled, and be equipped with upper fixed seat and lower fixed seat, convenient using dismounting, and be further provided with sealing ring so that upper solid
The connection flavor of reservation and lower fixed seat and copper conduction fin is close, avoids contact of the non-silver-plated area with silver plating solution.
Description of the drawings
Fig. 1 is the schematic front view of copper conduction fin.
Fig. 2 is the schematic top plan view of copper conduction fin.
Fig. 3 is that copper conduction fin is looked up regarding schematic diagram.
Fig. 4 is the use state diagram of the application.
Fig. 5 is the front view of upper fixed seat in the application.
Fig. 6 is the left view of upper fixed seat in the application.
Fig. 7 is the front view of lower fixed seat in the application.
Fig. 8 is the left view of lower fixed seat in the application.
In figure：1- copper conduction fins, 101- through-holes, 102- positioning sleeves, the upper silver-plated areas 103-, the upper non-silver-plated areas 104-,
Silver-plated area under 105-, non-silver-plated area under 106-, 2- lower fixed seats, 201- lower bases, 202- mounting holes, 203- internal threads, 204-
Locating slot, holding tank under 205- fix handle, 3- upper fixed seats, 301- upper pedestals, 302- fixed links, the outer spiral shells of 303- under 206-
Line, 304- positioning convex platforms, 305- upper holding tanks fix handle, 4- lower seals, the upper sealing rings of 5- on 306-.
Specific implementation mode
In order to better understand the present invention, the present invention is further retouched with reference to specific embodiments and the drawings
It states.
As shown in Figs. 1-3, through-hole 101 is provided on the upper surface of copper conduction fin 1, lower face is equipped with positioning sleeve 102.Copper
The upper surface of conductive fin 1 is divided into silver-plated area 103 and upper non-silver-plated area 104, lower face silver-plated area 105 and lower non-plated under being divided into
Silver-colored area 106.
Copper conduction fin local silver-plating device in the application, by the upper non-silver-plated area 104 of copper conduction fin 1 and lower non-plated
Silver-colored area 106 covers, and upper silver-plated area 103 is appeared in silver-plated area 105 under, is convenient for copper conduction fin local silver-plating.
Copper conduction fin local silver-plating device in the application, including cover non-silver-plated area 103 under copper conduction fin 1
The upper fixed seat 3 and lower seal 4 and upper sealing ring 5 in the upper non-silver-plated area 104 of lower fixed seat 2, covering copper conduction fin 1.
2 include lower base 201 and the lower fixed handle 206 that 201 side of lower base is arranged on lower fixed seat.Lower base 201
Side far from lower fixed handle 206 is provided with the locating slot 204 for the positioning sleeve 102 for accommodating copper conduction fin 1.Upper fixed seat 3 wraps
Upper pedestal 301 is included, the both sides of upper pedestal 301 are fixed with fixed link 302 and upper fixed handle 306 respectively.Fixed link 302 with it is upper
The connected one end of pedestal 301 is additionally provided with positioning convex platform 304.The diameter of positioning convex platform 304 and the through-hole 101 of copper conduction fin 1
Diameter matches, and the diameter of fixed link 302 is less than the diameter of the through-hole 101 of copper conduction fin 1.It is provided on lower fixed seat 2 and solid
302 matched mounting hole 202 of fixed pole.
Fixed link 302 passes through through-hole 101 to coordinate with mounting hole 202, and upper fixed seat 3 and lower fixed seat 2 pass through fixed link 302
Non- silver-plated area 106 under of the upper non-silver-plated area 104 of masking copper conduction fin 1 respectively.
As an implementation, fixed link 302 and mounting hole 202 are spirally connected, and external screw thread 303 is provided in fixed link 302, Gu
Determine to be provided in hole 202 and 303 matched internal thread 202 of external screw thread so that upper fixed seat 3 and lower fixed seat 2 are readily disassembled.
Lower seal 4 seals the connection of the lower face and lower fixed seat 2 of copper conduction fin 1.The lower base of lower fixed seat 2
The lower holding tank 205 for accommodating lower seal 4, lower seal 4 and non-106 phase of silver-plated area under copper conduction fin 1 are provided on 201
Match.When lower seal 4 is set in lower holding tank 205, lower holding tank 205 is stretched out in upper end.Preferably, lower seal 4 is under
Holding tank 205 is interference fitted, and lower seal 4 is O-ring, and material can be the corrosion resistant elastic materials such as rubber.
Upper sealing ring 5 seals the connection of copper conduction fin 1 and upper fixed seat 3.The upper sealing ring of receiving is provided on upper fixed seat 3
5 upper holding tank 305, upper sealing ring 5 and the upper non-silver-plated area 104 of copper conduction fin 1 match.Upper sealing ring 5 is set in
When in holding tank 305, upper holding tank 305 is stretched out in lower end.Preferably, upper sealing ring 5 is interference fitted with upper holding tank 305, on
Sealing ring 5 is O-ring, and material can be the corrosion resistant elastic materials such as rubber.
When use：Lower seal 4 is arranged in the lower holding tank 205 of lower fixed seat 2, by the positioning of copper conduction fin 1
Set 102 is inserted into the lower locating slot 204 of lower fixed seat 2, until lower seal 4 contacts the lower face of copper conduction fin 1.Later will
It takes sealing ring 5 to be arranged in the upper holding tank 305 of upper fixed seat 3, fixed link 302 is passed through to the through-hole 101 of copper conduction fin 1
It screws in the mounting hole 202 of lower fixed seat 2.Internal thread 203 and external screw thread 303 coordinate upper fixed seat 3 and lower fixed seat 2 and bottom
Seat fastening, until two sealing rings have certain deformation.The copper conduction fin 1 for installing local silver-plating device can be put into later molten
It is silver-plated in liquid, upper fixed seat 3 and lower fixed seat 2 are unscrewed after silver-plated and remove the part that can be obtained needs.
The application is coordinated using upper fixed seat 3 and lower fixed seat 2, the non-silver-plated area of masking copper conduction fin 1.Further profit
With the flexibility of sealing ring, so that the contact surface of upper fixed seat 3, copper conduction fin 1, lower fixed seat 2 is formed sealing surface, make copper conduction wing
The non-silver-plated area of piece 1 is in a closed cavity, and non-silver-plated area and silver plating solution is isolated, and is conducive to copper conduction fin and is locally plated
The use of silver.
The embodiments of the present invention have been described in detail above, but content is only the preferred embodiment of the present invention,
It should not be construed as limiting the practical range of the present invention.All changes and improvements made in accordance with the scope of the present invention, should all
It still belongs within this patent covering scope.
Claims (8)
1. a kind of copper conduction fin local silver-plating device, it is characterised in that：Including covering non-silver-plated area under copper conduction fin
The upper fixed seat in the upper non-silver-plated area of lower fixed seat and covering copper conduction fin；
The locating slot for the positioning sleeve for accommodating copper conduction fin is provided on the lower fixed seat,
Fixed seat is equipped with fixed link, and the diameter of the fixed link is less than the diameter of the through-hole of copper conduction fin, lower solid
It is provided in reservation and the matched mounting hole of fixed link；
Upper fixed seat and lower fixed seat cover the non-silver-plated area of copper conduction fin by the cooperation of fixed link and mounting hole；
Further include the lower seal for sealing copper conduction fin and being connect with lower fixed seat, the lower sealing of receiving is provided on the lower fixed seat
The lower holding tank of circle, lower seal match with non-silver-plated area under copper conduction fin.
2. copper conduction fin local silver-plating device according to claim 1, it is characterised in that：The fixed link and mounting hole
It is spirally connected, external screw thread is provided in fixed link, be provided in mounting hole and the matched internal thread of the external screw thread.
3. copper conduction fin local silver-plating device according to claim 1, it is characterised in that：The lower seal is O-shaped
Circle.
4. according to any copper conduction fin local silver-plating devices of claim 1-3, it is characterised in that：Further include sealing copper
The upper sealing ring that conductive fin is connect with upper fixed seat is provided with the upper holding tank for accommodating upper sealing ring on fixed seat, on
The upper non-silver-plated area of sealing ring and copper conduction fin matches.
5. copper conduction fin local silver-plating device according to claim 4, it is characterised in that：The upper sealing ring is O-shaped
Circle.
6. copper conduction fin local silver-plating device according to claim 1, it is characterised in that：The fixed link and upper fixation
The connected one end of seat is additionally provided with positioning convex platform；The diameter of the positioning convex platform is matched with the diameter of the through-hole of copper conduction fin.
7. copper conduction fin local silver-plating device according to claim 1 or 6, it is characterised in that：Fixed seat is remote
From the upper fixed handle that the side of lower fixed seat is additionally provided with easily operated upper fixed seat.
8. copper conduction fin local silver-plating device according to claim 1 or 6, it is characterised in that：The lower fixed seat is remote
From the lower fixed handle that the side of upper fixed seat is additionally provided with easily operated lower fixed seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511035192.0A CN105568333B (en) | 2015-12-31 | 2015-12-31 | A kind of copper conduction fin local silver-plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511035192.0A CN105568333B (en) | 2015-12-31 | 2015-12-31 | A kind of copper conduction fin local silver-plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105568333A CN105568333A (en) | 2016-05-11 |
| CN105568333B true CN105568333B (en) | 2018-10-16 |
Family
ID=55878939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511035192.0A Active CN105568333B (en) | 2015-12-31 | 2015-12-31 | A kind of copper conduction fin local silver-plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105568333B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524940A (en) * | 1978-08-10 | 1980-02-22 | Kawaguchiko Seimitsu Kk | Manufacture of dial plate for time piece |
| JPS5932915B2 (en) * | 1981-07-25 | 1984-08-11 | 「弐」夫 甲斐 | Method for manufacturing wiring board with through holes |
| US7402231B2 (en) * | 2003-09-17 | 2008-07-22 | Nippon Platec Co., Ltd. | Method and apparatus for partially plating work surfaces |
| CN103074663B (en) * | 2013-02-05 | 2015-03-18 | 中核(天津)科技发展有限公司 | Spring steel sheet mark-free electrophoresis apparatus |
| CN203569226U (en) * | 2013-09-02 | 2014-04-30 | 山东泰开高压开关有限公司 | Local silver plating tool for conductive contact piece |
| CN203741443U (en) * | 2014-01-10 | 2014-07-30 | 河南航天精工制造有限公司 | Tool for locally electroplating sleeve parts |
| CN204080141U (en) * | 2014-08-25 | 2015-01-07 | 北京实验工厂 | The silver-plated special-shaped site protection device of rotor local |
-
2015
- 2015-12-31 CN CN201511035192.0A patent/CN105568333B/en active Active
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| Publication number | Publication date |
|---|---|
| CN105568333A (en) | 2016-05-11 |
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