CN105568333A - Local silvering device for copper conductive fin - Google Patents

Local silvering device for copper conductive fin Download PDF

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Publication number
CN105568333A
CN105568333A CN201511035192.0A CN201511035192A CN105568333A CN 105568333 A CN105568333 A CN 105568333A CN 201511035192 A CN201511035192 A CN 201511035192A CN 105568333 A CN105568333 A CN 105568333A
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CN
China
Prior art keywords
fixed seat
silver
conduction fin
copper
copper conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201511035192.0A
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Chinese (zh)
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CN105568333B (en
Inventor
罗萍
郝永辉
范梅梅
焦萌
罗广求
王志飞
李成章
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CETC 18 Research Institute
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CETC 18 Research Institute
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Priority to CN201511035192.0A priority Critical patent/CN105568333B/en
Publication of CN105568333A publication Critical patent/CN105568333A/en
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Abstract

The invention provides a local silvering device for a copper conductive fin and belongs to the technical field of lithium ion batteries for electrochemical power sources. The local silvering device for the copper conductive fin comprises a lower fixing base and an upper fixing base, wherein the lower fixing base is used for covering a lower non-silvering area of the copper conductive pin, and the upper fixing base is used for covering an upper non-silvering area of the copper conductive fin. A positioning groove used for containing a positioning sleeve of the copper conductive fin is formed in the lower fixing base. A fixing rod is arranged on the fixing base. The diameter of the fixing rod is smaller than that of a through hole of the copper conductive fin. A fixing hole matched with the fixing rod is formed in the lower fixing base. The upper fixing base and the lower fixing base cover the non-silvering areas of the copper conductive fin through the cooperation of the fixing rod and the fixing hole. By the adoption of the local silvering device, local silvering of the copper conductive fin is achieved, the situation that a paint film is used for protection is avoided, the production efficiency is greatly improved, the silvering cost is reduced by 50% or over, and meanwhile pollution caused by paint film coating is avoided.

Description

A kind of copper conduction fin local silver-plating device
Technical field
The present invention relates to chemical power source lithium-ions battery technical field, particularly relate to a kind of copper conduction fin local silver-plating device.
Background technology
Cell uses a kind of part being called copper conduction fin, and for improving the conductive capability of the external output interface of cell, copper conduction fin needs local silver-plating.The usual way of local silver-plating is that part is all applied protective paint, then will silver-plated position paint film be needed to remove, and the position that paint film exposes after removing is carried out silver-plated, is removed by the paint film on part after silver-plated end again.Due to higher sticking power and the insulating effect of paint film, can ensure that the non-silver-plated district of part and silver plating solution are isolated.But this process application is when copper conduction fin, because copper conduction fin has a lot of dead angle, and paint film adhesion is large, toughness is high, paint film not easy to clean during post-processed, at substantial manpower and materials.
Therefore design a kind of detachable mechanism, make the non-silver-plated district of copper conduction fin and silver plating solution isolate thus avoid the coating of paint film necessary with removal.
Summary of the invention
The problem to be solved in the present invention is that in the silver plating process of existing copper conduction fin, paint film is not easily removed, labor intensive material resources.
For solving the problems of the technologies described above, the technical solution used in the present invention is: provide the upper fixed seat that a kind of copper conducts electricity fin local silver-plating device, the lower fixed seat comprising the lower non-silver-plated district hiding copper conduction fin and the upper non-silver-plated district hiding copper conduction fin.Described lower fixed seat has the locating slot of the locating sleeve holding copper conduction fin.Fixed seat is provided with fixed link, and the diameter of described fixed link is less than the diameter of the through hole of copper conduction fin, lower fixed seat has the fixed orifices matched with fixed link.Upper fixed seat and lower fixed seat are coordinated by fixed link and fixed orifices, cover the non-silver-plated district of copper conduction fin.
Preferably, described fixed link and fixed orifices are spirally connected, and fixed link has outside screw, have the internal thread matched with described outside screw in fixed orifices.
Further, the device of the application also comprises the lower seal that sealed copper conduction fin is connected with lower fixed seat, described lower fixed seat has the lower holding tank of accommodation lower seal, and lower seal and copper conduct electricity the lower non-silver-plated district of fin and matches.
Preferably, described lower seal is O type circle.
Further, the device in the application also comprises the upper sealing-ring that is connected with upper fixed seat of sealed copper conduction fin, fixed seat has the upper holding tank that sealing-ring is gone up in accommodation, and upper sealing-ring and copper conduct electricity the upper non-silver-plated district of fin and matches.
Preferably, described upper sealing-ring is O type circle.
Further, one end that described fixed link is connected with upper fixed seat is also provided with positioning boss; The diameter of described positioning boss and copper conduct electricity the diameter compatible of through hole of fin and close.
Preferably, fixed seat is also provided with the upper fixed handle of easy handling upper fixed seat away from the side of lower fixed seat.
Preferably, described lower fixed seat is also provided with the lower fixed handle of easy handling lower fixed seat away from the side of upper fixed seat.
The advantage that the present invention has and positively effect are: (1) this application provides a kind of device with sealing function, realize the isolation of the copper conduction non-silver-plated district of fin and silver plating solution, prevent non-silver-plated district silver-plated, all the other parts exposed can realize silver-plated object.(2) the application achieves the local silver-plating of copper conduction fin, avoids using paint film to protect, and substantially increases production efficiency, silver-plated cost savings more than 50%, avoids the pollution that coating paint film brings simultaneously.(3) device that the application provides can be recycled, be provided with upper fixed seat and lower fixed seat, use dismounting convenient, be provided with sealing-ring further, make upper fixed seat and lower fixed seat and copper conduct electricity the connection local flavor of fin tight, avoid the contact of non-silver-plated district and silver plating solution.
Accompanying drawing explanation
Fig. 1 is the schematic front view of copper conduction fin.
Fig. 2 is the schematic top plan view of copper conduction fin.
Fig. 3 is that looking up of fin of copper conduction looks schematic diagram.
Fig. 4 is the using state schematic diagram of the application.
Fig. 5 is the front view of upper fixed seat in the application.
Fig. 6 is the left view of upper fixed seat in the application.
Fig. 7 is the front view of lower fixed seat in the application.
Fig. 8 is the left view of lower fixed seat in the application.
In figure: 1-copper conduction fin, 101-through hole, 102-locating sleeve, the upper silver-plated district of 103-, the upper non-silver-plated district of 104-, silver-plated district under 105-, non-silver-plated district under 106-, 2-lower fixed seat, 201-lower base, 202-fixed orifices, 203-internal thread, 204-locating slot, holding tank under 205-, fixed handle under 206-, 3-upper fixed seat, 301-upper pedestal, 302-fixed link, 303-outside screw, 304-positioning boss, the upper holding tank of 305-, the upper fixed handle of 306-, 4-lower seal, the upper sealing-ring of 5-.
Embodiment
For a better understanding of the present invention, below in conjunction with specific embodiments and the drawings, the present invention is conducted further description.
As Figure 1-3, the upper surface of copper conduction fin 1 has through hole 101, and lower surface is provided with locating sleeve 102.The upper surface of copper conduction fin 1 is divided into silver-plated district 103 and upper non-silver-plated district 104, and lower surface is divided into lower silver-plated district 105 and lower non-silver-plated district 106.
Copper conduction fin local silver-plating device in the application, copper being conducted electricity the upper non-silver-plated district 104 of fin 1 and lower non-silver-plated district 106 hides, and is appeared in upper silver-plated district 103 and lower silver-plated district 105, is convenient to copper conduction fin local silver-plating.
Copper conduction fin local silver-plating device in the application, comprises the lower fixed seat 2 in the lower non-silver-plated district 103 of covering copper conduction fin 1, the upper fixed seat 3 hiding the upper non-silver-plated district 104 of copper conduction fin 1 and lower seal 4 and upper sealing-ring 5.
On lower fixed seat, 2 comprise lower base 201 and arrange the lower fixed handle 206 of lower base 201 side.Lower base 201 has the locating slot 204 of the locating sleeve 102 holding copper conduction fin 1 away from the side of lower fixed handle 206.Upper fixed seat 3 comprises upper pedestal 301, and the both sides of upper pedestal 301 are fixed with fixed link 302 and upper fixed handle 306 respectively.One end that fixed link 302 is connected with upper pedestal 301 is also provided with positioning boss 304.The diameter of positioning boss 304 and copper conduct electricity the diameter compatible of through hole 101 of fin 1 and close, and the diameter of fixed link 302 is less than the diameter of the through hole 101 of copper conduction fin 1.Lower fixed seat 2 has the fixed orifices 202 matched with fixed link 302.
Fixed link 302 coordinates with fixed orifices 202 through through hole 101, and upper fixed seat 3 and lower fixed seat 2 cover the upper non-silver-plated district 104 of copper conduction fin 1 and lower non-silver-plated district 106 respectively by fixed link 302.
As a kind of embodiment, fixed link 302 and fixed orifices 202 are spirally connected, and fixed link 302 have outside screw 303, have the internal thread 202 matched with outside screw 303 in fixed orifices 202, make upper fixed seat 3 and lower fixed seat 2 be easy to dismounting.
The lower seal 4 sealed copper conduction lower surface of fin 1 and the connection of lower fixed seat 2.The lower base 201 of lower fixed seat 2 has and holds the lower holding tank 205 of lower seal 4, lower seal 4 and copper conduct electricity the lower non-silver-plated district 106 of fin 1 and match.When lower seal 4 is set in lower holding tank 205, lower holding tank 205 is stretched out in upper end.As preferably, lower seal 4 and lower holding tank 205 shrink-fit, lower seal 4 is O type circle, and its material can be the corrosion resistant elastic materials such as rubber.
The connection of upper sealing-ring 5 sealed copper conduction fin 1 and upper fixed seat 3.Upper fixed seat 3 has the upper holding tank 305 holding upper sealing-ring 5, upper sealing-ring 5 and copper conduct electricity the upper non-silver-plated district 104 of fin 1 and match.When upper sealing-ring 5 is set in holding tank 305, holding tank 305 is stretched out in lower end.As preferably, upper sealing-ring 5 and upper holding tank 305 shrink-fit, upper sealing-ring 5 is O type circle, and its material can be the corrosion resistant elastic materials such as rubber.
During use: lower seal 4 be arranged in the lower holding tank 205 of lower fixed seat 2, the locating sleeve 102 of fin 1 of being conducted electricity by copper inserts in the lower locating slot 204 of lower fixed seat 2, until lower seal 4 contacts the lower surface of copper conduction fin 1.To sealing-ring 5 be brought to be arranged in the upper holding tank 305 of upper fixed seat 3 afterwards, the through hole 101 of fixed link 302 through copper conduction fin 1 is screwed in the fixed orifices 202 of lower fixed seat 2.Internal thread 203 and outside screw 303 coordinate by upper fixed seat 3 and lower fixed seat 2 and base fastening, until two sealing-rings have certain distortion.Can the copper conduction fin 1 installing local silver-plating device be put in solution silver-plated afterwards, after silver-plated end, upper fixed seat 3 and lower fixed seat 2 be unscrewed the part removed and can obtain needing.
The application utilizes upper fixed seat 3 and lower fixed seat 2 to coordinate, and covers the non-silver-plated district of copper conduction fin 1.Utilize the flexibility of sealing-ring further, make the contact surface formation trim of upper fixed seat 3, copper conduction fin 1, lower fixed seat 2, make copper conduct electricity the non-silver-plated district of fin 1 to be in an airtight cavity, isolate non-silver-plated district and silver plating solution, be beneficial to the use of copper conduction fin local silver-plating.
Above embodiments of the invention have been described in detail, but described content being only preferred embodiment of the present invention, can not being considered to for limiting practical range of the present invention.All equalizations done according to the scope of the invention change and improve, and all should still belong within this patent covering scope.

Claims (9)

1. a copper conduction fin local silver-plating device, is characterized in that: the upper fixed seat in the lower fixed seat comprising the lower non-silver-plated district hiding copper conduction fin and the upper non-silver-plated district hiding copper conduction fin;
Described lower fixed seat has the locating slot of the locating sleeve holding copper conduction fin,
Fixed seat is provided with fixed link, and the diameter of described fixed link is less than the diameter of the through hole of copper conduction fin, lower fixed seat has the fixed orifices matched with fixed link;
Upper fixed seat and lower fixed seat are coordinated by fixed link and fixed orifices, cover the non-silver-plated district of copper conduction fin.
2. copper conduction fin local silver-plating device according to claim 1, is characterized in that: described fixed link and fixed orifices are spirally connected, and fixed link has outside screw, has the internal thread matched with described outside screw in fixed orifices.
3. copper conduction fin local silver-plating device according to claim 1, it is characterized in that: also comprise the lower seal that sealed copper conduction fin is connected with lower fixed seat, described lower fixed seat has and holds the lower holding tank of lower seal, lower seal and copper conduct electricity the lower non-silver-plated district of fin and match.
4. copper conduction fin local silver-plating device according to claim 3, is characterized in that: described lower seal is O type circle.
5. according to claim 1-4 arbitrary described copper conduction fin local silver-plating device, it is characterized in that: also comprise the upper sealing-ring that sealed copper conduction fin is connected with upper fixed seat, fixed seat has the upper holding tank holding upper sealing-ring, upper sealing-ring and copper conduct electricity the upper non-silver-plated district of fin and match.
6. copper conduction fin local silver-plating device according to claim 5, is characterized in that: described upper sealing-ring is O type circle.
7. copper conduction fin local silver-plating device according to claim 1, is characterized in that: one end that described fixed link is connected with upper fixed seat is also provided with positioning boss; The diameter of described positioning boss and copper conduct electricity the diameter compatible of through hole of fin and close.
8. the copper conduction fin local silver-plating device according to claim 1 or 7, is characterized in that: fixed seat is also provided with the upper fixed handle of easy handling upper fixed seat away from the side of lower fixed seat.
9. the copper conduction fin local silver-plating device according to claim 1 or 7, is characterized in that: described lower fixed seat is also provided with the lower fixed handle of easy handling lower fixed seat away from the side of upper fixed seat.
CN201511035192.0A 2015-12-31 2015-12-31 A kind of copper conduction fin local silver-plating device Active CN105568333B (en)

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CN105568333A true CN105568333A (en) 2016-05-11
CN105568333B CN105568333B (en) 2018-10-16

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524940A (en) * 1978-08-10 1980-02-22 Kawaguchiko Seimitsu Kk Manufacture of dial plate for time piece
US4389278A (en) * 1981-07-25 1983-06-21 Kazuo Kai Method for manufacturing circuit board with through hole
CN1609282A (en) * 2003-09-17 2005-04-27 日本普莱泰克株式会社 Partial plating method and its apparatus
CN103074663A (en) * 2013-02-05 2013-05-01 中核(天津)科技发展有限公司 Spring steel sheet mark-free electrophoresis apparatus
CN203569226U (en) * 2013-09-02 2014-04-30 山东泰开高压开关有限公司 Local silver plating tool for conductive contact piece
CN203741443U (en) * 2014-01-10 2014-07-30 河南航天精工制造有限公司 Tool for locally electroplating sleeve parts
CN204080141U (en) * 2014-08-25 2015-01-07 北京实验工厂 The silver-plated special-shaped site protection device of rotor local

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524940A (en) * 1978-08-10 1980-02-22 Kawaguchiko Seimitsu Kk Manufacture of dial plate for time piece
US4389278A (en) * 1981-07-25 1983-06-21 Kazuo Kai Method for manufacturing circuit board with through hole
CN1609282A (en) * 2003-09-17 2005-04-27 日本普莱泰克株式会社 Partial plating method and its apparatus
CN103074663A (en) * 2013-02-05 2013-05-01 中核(天津)科技发展有限公司 Spring steel sheet mark-free electrophoresis apparatus
CN203569226U (en) * 2013-09-02 2014-04-30 山东泰开高压开关有限公司 Local silver plating tool for conductive contact piece
CN203741443U (en) * 2014-01-10 2014-07-30 河南航天精工制造有限公司 Tool for locally electroplating sleeve parts
CN204080141U (en) * 2014-08-25 2015-01-07 北京实验工厂 The silver-plated special-shaped site protection device of rotor local

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