CN105556663B - Integrated package design with leads for package on package products - Google Patents

Integrated package design with leads for package on package products Download PDF

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Publication number
CN105556663B
CN105556663B CN201480029748.2A CN201480029748A CN105556663B CN 105556663 B CN105556663 B CN 105556663B CN 201480029748 A CN201480029748 A CN 201480029748A CN 105556663 B CN105556663 B CN 105556663B
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Prior art keywords
die
leads
die pad
land
pad
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Expired - Fee Related
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CN201480029748.2A
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CN105556663A (en
Inventor
孙志勇
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Intel Corp
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Intel Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
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    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

An integrated package design with leads for a package on package product is described. Certain embodiments relate to a stacked package assembly (101) comprising: a first die (120) having a front side and a back side; a die pad (122) attached to a back side of the first die (120); a plurality of leads having one end connected to the front side of the die (120) for connection to an external device; a molding compound (126) encapsulating the first die (120) and at least a portion of the die pad (122); lands (124) cut from the die pads (122) and supported by a molding compound (126); a second plurality of leads (134), one end of the leads (134) being connected to the front side of the first die (120), and the other end of the leads (134) being connected to the land (124); a second die (138) stacked over the die pad (122); and a third plurality of leads (136) connected at one end to the second die (138) and at another end to the lands (124).

Description

Integrated package design with leads for package on package products
Technical Field
The present disclosure relates to the field of stacked package stacks, and in particular, to stacked package stacks with leads.
Background
IC (integrated circuit) dies are typically packaged prior to mounting in order to protect the die from the external environment. The package may be formed from a simple plastic cover, an encapsulating resin, or other material. Some packages provide more functionality, such as power or signal conditioning, and provide for transitioning from a die to a particular type of connection configuration when the package is installed in a device.
As the size of devices and their associated electronics continues to decrease, packages are required to perform more functions and contain more processing power. Some packages contain more than one die, as the packages may be much larger than the die they contain. This may be used to combine a central processor with a graphics processor or communications die. With sufficient components, this type of package may be referred to as a system in package.
Instead of placing multiple dies in a single package, the packages may be stacked. Stacked packages (when properly designed) may allow more processing power or electronic components to be placed in less space. PoP (package on package) is an IC packaging method that vertically assembles discrete component packages. This allows the component to use less space or a smaller footprint on the system board.
One common type of PoP uses two packages, each with a bottom BGA (ball grid array) for connection to external components. An interposer is used between the two packages to interconnect between the two vertically discrete components.
Drawings
Embodiments are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.
Fig. 1 is a cross-sectional side view of a stacked package having lands for connection between dies according to an embodiment.
Fig. 2 is a top view of a bottom package in the stacked package of fig. 1, according to an embodiment.
Fig. 3 is a top view of an alternative bottom package for a stacked package according to an embodiment.
Fig. 4 is a process flow diagram of producing a stacked package according to an embodiment.
Fig. 5-10 are plan views of stages of fabrication of a bottom package according to an embodiment.
Fig. 11 is a block diagram of a computing device incorporating a stacked package stack product according to an embodiment.
Detailed Description
A PoP (package on package) structure may be assembled by integrating a QFP (quad flat package) package and a QFN (quad flat no lead) package using both external leads and connection pads on both sides of the device. The connecting pads create an interconnection between two stacked discrete packages for a PoP stack design.
The pops described herein do not require an interposer between packages. This simplifies assembly of the structure, simplifies the packaging process flow and reduces manufacturing costs. The use of a lead frame package also reduces the overall material cost.
As described herein, QFN and QFP packages are combined to create bond pads with lead interconnections on at least two sides of one of the component packages. A lead may be used to attach another component to the bond pad to form a PoP package.
Fig. 1 shows a PoP assembly 101 having a bottom package 102 and a top package 104 stacked above the bottom package to form a stacked package assembly. The two packages are mounted to a motherboard 106, such as a PCB (printed circuit board). The motherboard may be a motherboard, a system board, or other type of wiring board. The board provides power to two stacked packages in the assembly and provides data input and data output. A motherboard is provided as an example. The stacked package may be coupled to any of a variety of other mounting devices, including a socket. The bottom package is attached using an adhesive or paste 108 or any other desired material.
The bottom package in the illustrated example is shown similar to a conventional QFP (quad flat package). However, the embodiment is not so limited. The package includes an IC die 120 attached on its back side to a die pad 122. The die pad is formed of a material having good thermal conductivity, such as copper, aluminum, or aluminum oxide. The die pad is substantially flat. In the illustrated example, it has a flat bottom side attached to the back side of the die and a flat top side opposite the bottom, and the die pad is much thinner relative to its width or length. The die pad is longer and wider than the die, and is thick enough to provide the mechanical stability desired when attached to the die. The die pad may have a shape, contour, or feature on the top side, bottom side, or both. As an example, the bottom side of the die pad may be shaped to provide a safer or better thermally conductive attachment to the die.
The die pad portion in this package configuration acts in part as a heat sink to conduct heat away from the die. The backside of the die is dielectric or covered with dielectric so that the die does not create any electrical connection to the backside of the die.
As described in more detail below, several different types of wire connections are made to the die and to the pads. After the leads are in place, the die and pads are encapsulated in a molding compound 126, such as a resin. The mold compound is then removed to expose the topside of the die pad. The top side (as shown) is the side of the die pad opposite the die. Exposing the entire die pad is not necessary. Alternatively, only the edges or perimeter may be exposed so that the center of the die pad remains covered by the molding compound.
The exposed die pad is diced near its outer edge to create isolated lands (land pads) 124 outside the die and outside the center of the package. The lands may be cut from the pads using partial ablation, saw sawing, or by using a half-etched lead frame such as that used for DR-QFN (two-row-four-face flat no-lead) packages. As shown in this cross-sectional view, the bond pad is cut on both sides near the edge of the bond pad. The bond pads may be cut at only one end, at both ends, or around the entire perimeter of the bond pad. The cutting is performed near the outer edge of the pad so that the pad serves to support the die, stabilize the die, and not affect the effectiveness of heat dissipation of the die. The pads can be made larger so that when the edges of the pads are cut away, the remaining pads attached to the die are no smaller than the pads used in conventional packages.
Since the pads are typically made of a thermally conductive material, the material of the die may also act as an electrical conductor. Lands 124 cut from the die pad may be used as connection locations for the leads.
The side of the die opposite the pads is covered with a mold compound. This is the front side of the die. The package provides a connection to the front side of the die using leads 112. The leads are connected to the front side of the die and are configured to establish connections to appropriate pads or contacts of the motherboard 106. The type of leads used in conventional QFP packages may be used. The leads may extend from the die directly out of the molding compound to the motherboard on all four sides of the package.
The top side of the bottom package has solder pads 124 similar to QFN, the solder pads 124 being formed, for example, by a partial ablation or half-etching process. The solder pads create a connection between the top package and the bottom package. The top package may be any desired type of leaded package, such as a QFP, QFN TSOP (thin small outline package), or BGA (ball grid array) package. The leads of top package 136 extend from the top package to connect to the top surface of lands 124.
In addition, the leads are used to electrically connect the bottom die to the top die. Connections may be for digital signals, control signals, and power signals, among others. The bottom package has leads 134 from the front side of the bottom die to the underside of the lands 124. The lands establish electrical connections between the leads on their underside to corresponding leads 136 on their top side. This allows the dies to be directly connected together by lands without relying on a motherboard.
Additional leads 132 extend from the lands 124 to the motherboard. These leads allow the die in the top package to be connected to the motherboard. Thus, depending on how the lands are connected, the lands may provide connections for the die 138 in the top package to the die or motherboard in the bottom package.
As mentioned above, the top package may take any of a number of different forms, such as QFN, QFP, TSOP, or BGA. In the illustrated example, top package 104 has a die 138 with a backside attached to a die pad 140. Leads 136 are connected to the front side of the die and extend outward away from the die to connect to lands 124 of the bottom die. The die, pads, and leads are covered in a mold compound 142. The top package is attached to the solder joints on the leads of the bottom package. This may be reinforced with plastic, adhesive, or other suitable material 110. In this example, the front side of the die in the top package faces the bottom package. This allows for shorter wire connections 136 to the lands. Die pads 140 are located on the opposite side or top side of the top package to enhance heat dissipation.
Fig. 2 is a top view of bottom package 102 showing die pad 122 and surrounding mold compound 126. The die pad has been cut, ablated, sawed, or etched to form a kerf 154 that isolates the edge 124 of the die pad from the center of the die pad 122 to form the land 124. The cut may be straight or curved. In this example, four cuts have been made so that the perimeter of the die pad is completely isolated from the major center of the die pad 122. The resulting land 124 circumferentially surrounds the center. Alternatively, one or two cuts may be made to provide smaller lands. Leads 112, 132 extend from the underside of the lands to facilitate motherboard connection. The leads connected to the top side of the lands will come from the top package and are not shown.
The lands are cut from die pads made of a thermally conductive material such as copper, aluminum, or similar alloys. These materials are also electrically conductive. Land 124 has an array 152 of connection points, pads, or strips for top package leads 136. There may also be a similar array of connection points on the underside of the lands for all other leads 112, 132. The connection points may be isolated from each other based on the original lead frame or in any other way, such as partial ablation, depositing a dielectric between the connection points, covering the entire surface with a dielectric and then forming individual connection points over the dielectric by printing, deposition, tape application, etc.
Fig. 3 shows an alternative configuration in which the bottom package body 302 has a die pad 322 attached to a die (not shown). The leads 312 from the die and the leads 332 from the pads extend outward for connection to the motherboard. The die pad has two partially ablated saw kerfs 354 or one cut on each of two opposing sides of a rectangular die pad. This creates two separate lands 324. This configuration allows different connections to be completely isolated, although there is less total surface area for the connections. As an example, the pads on one side may be used for power supply while the pads on the other side may be used for high frequency data signals. In this example, two different types of signals will be better isolated than in the configuration of fig. 2. The die pad may be cut in a variety of different ways to form one or more lands. The die pads may also be made in different shapes, including square and rectangular, depending on the desired shape of the package and lands.
Figure 4 is a process flow diagram of forming a stack of packages as described. The process begins at 402, where a top die pad and a bottom die pad are fabricated. For the bottom pad, the process may include a down-set technique or a half-etch technique for creating electrically separated lands as described above. At 404, the die is completed and diced. The front end of line manufacturing stage is completed. Wires are bonded to the front side of the die and the die is attached to respective pads. Some of the bonded wires from the bottom die are also attached to respective portions in the underside of the bottom die pad.
At 406, the package is encapsulated in a mold compound. Typically, the die is a resin, however, other molding compounds may be used to suit a particular application. As described above, the mold compound covers all of the die, most of the leads, and all or part of the die pad. At 408, the die pad on the bottom package is cut such that the bonding pads are spaced from a main central area of the die pad. As mentioned above, there are different ways to cut the die pad. The die pads are made of metal, ceramic, or other thermally conductive material, and may be sawed, ablated, laser cut, or etched in other techniques.
After the die is attached to the pads, the leads are bonded, and the connecting leads and external leads are formed, and then the die package may be singulated (single). For the top package, the process is similar, but the die pad is not diced. A QFP or TSOP packaging process may be used. Finally, at 412, the die packages are stacked and the wires from the top package are bonded to the solder lands of the bottom package. In the fabrication of the top package, the form factor of the top package and the lead configuration is matched to the land design on the top side of the bottom package.
Fig. 5 to 10 show processing stages of the bottom package as described in fig. 4. Fig. 5 is a bottom plan view of a lead frame 501 with an integrated die pad 504 in the center of the frame and leads 506 from the die pad to the lead frame. Lead frames are typically made of large substrates, and each frame is diced from the larger substrate.
Fig. 6 shows an IC die 508 attached to the bottom of the die pad 504. The die is physically attached to the leads 510, 512 using solder or paste, and the die is electrically attached to the leads 510, 512. A first set of leads 510 is attached to an inner portion of leads 606 of the leadframe and a second set of leads 512 is attached to an outer portion of the leads of the leadframe. Different connections allow the die to be connected to different components and provide more connection flexibility.
In fig. 7, the underside of the lead frame has been encapsulated in a molding compound 514. In the illustrated example, the molding compound covers the pad and the die and a portion of the leads of the leadframe. The molding compound provides a rigid structure to the assembly so that the frame 502 in the lead frame can be subsequently removed.
Fig. 8 is a top plan view of the assembly of fig. 7. In this view, the die pad 504 and the leads 506 extending from the die pad can be clearly seen. The assembly can then be modified by partially ablating, sawing, or etching 516 the edges of the die pads to create lands as described above. The sawing operation creates a kerf 530 around the pad, the kerf 530 isolating the land from the die pad. Isolation may also be achieved by partially etching away the desired portions of the metal leads to form isolated lands. This provides a structure for attaching the leads of the second package (not shown) as described above.
Fig. 9 shows a second sawing operation 518 in which the outer frame 502 of the leadframe is removed. This results in a final finished bottom package 522 as shown in fig. 10. Fig. 10 is a top plan view of a bottom package for a package-on-package assembly. Such a package may be used as a bottom package 102 for a PoP assembly 101 as shown in fig. 1.
Although the embodiments described herein have a single bottom package and a single top package, there may be three or more vertically stacked packages in a single PoP assembly. The leads of the top package allow the top package to be connected to the lands in any manner that may be desired. Further, there may be more than one die in the bottom package or the top package. The dies may be horizontally arranged so that a top die may be connected with two or more bottom dies in the same package. Further, two or more top dies arranged side-by-side may be coupled to the lands of the bottom package.
FIG. 11 illustrates a computing device 100, according to one implementation. The computing device 100 carries a system board 2. The board 2 may include a number of components including, but not limited to, a processor 4 and at least one communication section package 6. The communication section package is coupled to one or more antennas 16. The processor 4 is physically and electrically coupled to the board 2.
Depending on its application, computing device 100 may include other components that may or may not be physically and electrically coupled to board 2. These other components include, but are not limited to, volatile memory (e.g., DRAM)8, non-volatile memory (e.g., ROM)9, flash memory (not shown), graphics processor 12, digital signal processor (not shown), cryptographic co-processor (not shown), chipset 14, antenna 16, display 18 (e.g., touchscreen display), touchscreen controller 20, battery 22, audio codec (not shown), video codec (not shown), power amplifier 24, Global Positioning System (GPS) device 26, compass 28, accelerometer (not shown), gyroscope (not shown), speaker 30, camera 32, and mass storage devices (e.g., hard disk drive 10, Compact Disk (CD) (not shown), Digital Versatile Disk (DVD) (not shown), and so forth). These components may be connected to the system board 2, mounted to the system board, or combined with any of the other components.
The communication section package 6 enables wireless communication and/or wired communication for transmitting data to and from the computing device 100. The term "wireless" and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they may not. The communication section package 6 may implement any of a number of wireless or wired standards or protocols including, but not limited to, Wi-Fi (IEEE 802.11 series), WiMAX (IEEE 802.16 series), IEEE 802.20, Long Term Evolution (LTE), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, GSM, GPRS, CDMA, TDMA, DECT, bluetooth, ethernet, and derivatives thereof, as well as any other wireless and wired protocols named 3G, 4G, 5G, and beyond. The computing device 100 may include a plurality of communication section packages 6. For example, a first communication part package 6 may be dedicated for shorter range wireless communications (e.g., Wi-Fi and bluetooth) and a second communication part package 6 may be dedicated for longer range wireless communications (e.g., GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others).
Any one or more of the chips may be packaged as described herein, or several of the chips may be combined into a single package with lands and leads for connection to a system board as described.
In various implementations, the computing device 100 may be a server, a workstation, a laptop, a netbook, a notebook, an ultrabook, a smartphone, a tablet, a Personal Digital Assistant (PDA), an ultra mobile PC, a mobile phone, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a digital camera, a portable music player, or a digital video recorder or device known as the internet of things (IoT). In further implementations, the computing device 100 may be any other electronic device, such as a pen, a wallet, a watch, or an appliance that processes data.
Embodiments may be implemented as part of one or more memory chips, controllers, CPUs (central processing units), microchips or integrated circuits interconnected using a motherboard, Application Specific Integrated Circuits (ASICs), and/or Field Programmable Gate Arrays (FPGAs).
References to "one embodiment," "an example embodiment," or "various embodiments," etc., indicate that the embodiment(s) in the invention so described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, some embodiments may have some, all, or none of the features described for other embodiments.
In the following description and claims, the term "coupled" and its derivatives may be used. "coupled" is used to indicate that two or more elements co-operate or interact with each other, but they may or may not have physical or electrical components interposed therebetween.
As used in the claims, unless otherwise specified the use of the ordinal adjectives "first", "second", "third", etc., to describe a common element, merely indicate that different instances of like elements are being referred to, and are not intended to imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
The drawings and the foregoing description present examples of embodiments. Those skilled in the art will recognize that one or more of the described elements may be combined well into a single functional element. Alternatively, certain elements may be divided into multiple functional elements. Elements from one embodiment may be added to another embodiment. For example, the order of the processes described herein may be changed and is not limited to the manner described herein. Further, the actions in any flow diagram need not be implemented in the order shown; nor does it necessarily have to perform all actions. Further, those acts that are independent of other acts may be performed in parallel with the other acts. The scope of embodiments is in no way limited by these specific examples. Many variations, whether explicitly given in this specification or not, such as differences in structure, dimension, and use of material, are possible. The scope of the embodiments is at least as broad as given by the claims.
The following examples relate to further embodiments. Various features of the different embodiments can be combined in various combinations with some included and other features not included to suit various applications. Certain embodiments relate to a stacked package assembly, comprising: a first die having a front side and a back side; a die pad attached to the back side of the first die; a plurality of leads having one end connected to the front side of the die for connection to an external device; a molding compound encapsulating at least a portion of the first die and the die pad; lands cut from the die pads and supported by the molding compound; a second plurality of leads having one end connected to the front side of the first die and another end connected to the land; a second die overlying the die pad; and a third plurality of leads having one end connected to the second die and another end connected to the land.
In further embodiments, the die pad and the land are formed of copper, aluminum, or a copper alloy.
In further embodiments, the die pad has a bottom side attached to the back side of the die and a top side that is not covered in molding compound.
In further embodiments, the die pad is wider than the first die, and wherein the land is cut from the width of the first die pad.
In further embodiments, the land is external to the first die.
In further embodiments, the land surrounds an entire perimeter of the die pad.
In a further embodiment, the land has a plurality of bonding pads for connecting to respective other ends of the wires of the second plurality of wires.
In further embodiments, the second plurality of leads and the third plurality of leads connect the first die to the second die through the land without connection to an external device.
In further embodiments, the second die has a front side and a back side, wherein the back side is attached to a second die pad, wherein the second die is encapsulated in a second mold compound and wherein the second mold compound is attached to the first die pad.
Certain embodiments relate to a computing device comprising a system board, a communication section package connected to the system board, and a stacked package assembly connected to the system board, the stacked package assembly having: a first die having a front side and a back side; a die pad attached to the back side of the first die; a plurality of leads connected at one end to the front side of the die and at another end to the system board; a mold compound encapsulating at least a portion of the die and the die pad; lands cut from the die pads and supported by the molding compound; a second plurality of leads having one end connected to the front side of the first die and another end connected to the land; a second die overlying the die pad; and a third plurality of leads having one end connected to the second die and another end connected to the land.
In further embodiments, the die pad has a bottom side attached to the back side of the die and a top side that is not covered in molding compound.
In further embodiments, the die pad is wider than the first die, and wherein the lands are cut from the width of the first die pad so that the lands are outside the first die.
In a further embodiment, the land has a plurality of bonding pads for connecting to respective other ends of the wires of the second plurality of wires.
In further embodiments, the second plurality of leads and the third plurality of leads connect the first die to the second die through the land without connection to an external device.
Certain embodiments relate to a method comprising: attaching a back side of a first die to a die pad, connecting one end of a plurality of leads to a front side of the die for connection to an external device; connecting a second plurality of leads to the front side of the first die at one end and to an edge of the die pad at another end; encapsulating at least a portion of the first die and the die pad in a mold compound; cutting lands from the die pad, wherein edges of the die pad are part of the lands; stacking a second die over the die pad; and connecting one end of a third plurality of leads to the second die and the other end to the land.
In further embodiments, the connecting disc is supported by the molding compound.
In further embodiments, the die pad has a bottom side and a top side, the bottom side being attached to the back side of the die, the method further comprising exposing the top side of the die pad from the mold compound prior to cutting the lands.
In further embodiments, the die pad has a rectangular surface, and wherein cutting the land includes cutting the land on four sides of the pad.
Further embodiments include applying a plurality of bond pads to the land for connection to respective other ends of the leads in the second plurality of leads.
In further embodiments, cutting the land comprises cutting by laser ablation.
In further embodiments, the second die has a front side and a back side, the method further comprising: attaching the backside to a second die pad; encapsulating the second die in a second mold compound; and attaching the second molding compound to the first die pad.

Claims (21)

1. A stacked package assembly comprising:
a first die having a front side and a back side;
a first die pad attached to the back side of the first die;
a plurality of leads having one end connected to the front side of the die for connection to an external device;
a molding compound encapsulating the first die and at least a portion of the first die pad;
a land cut from the first die pad and supported by the mold compound;
a second plurality of leads, one ends of the leads in the second plurality of leads being connected to the front side of the first die and the other ends of the leads in the second plurality of leads being connected to the land,
a second die having a front side and a back side, wherein the second die is stacked over the first die pad;
a third plurality of leads having one end connected to the second die and another end connected to the land; and
a second die pad attached to a back side of the second die, wherein a front side of the second die faces the first die pad, and wherein the second die pad is over the second die.
2. The assembly of claim 1, wherein the first die pad and the land are formed of copper, aluminum, or a copper alloy.
3. The assembly of claim 1, wherein the first die pad has a bottom side attached to the back side of the first die and a top side that is not covered in mold compound.
4. The assembly of claim 1, wherein the first die pad is wider than the first die, and wherein the land is cut along the width of the first die pad.
5. The assembly of claim 1, wherein the land is located external to the first die.
6. The assembly of claim 1, wherein the land surrounds an entire perimeter of the first die pad.
7. The assembly of claim 1, wherein the land has a plurality of bonding pads to connect to respective other ends of the leads in the second plurality of leads.
8. The assembly of claim 1, wherein the second and third plurality of leads connect the first die to the second die through the land without connection to an external device.
9. The assembly of claim 1, wherein the second die is encapsulated in a second mold compound, and wherein the second mold compound is attached to the first die pad.
10. A computing device, comprising:
a system board;
a communication part package connected to the system board; and
a stacked package assembly connected to the system board, the stacked package assembly having:
a first die having a front side and a back side;
a first die pad attached to the back side of the first die;
a plurality of leads having one end connected to the front side of the die and another end connected to the system board;
a molding compound encapsulating the first die and at least a portion of the first die pad;
lands cut from the first die pad and supported by the mold compound;
a second plurality of leads, one ends of the leads in the second plurality of leads connected to the front side of the first die and other ends of the leads in the second plurality of leads connected to the land;
a second die having a front side and a back side, wherein the second die is stacked over the first die pad;
a third plurality of leads having one end connected to the second die and another end connected to the land; and
a second die pad attached to a back side of the second die, wherein a front side of the second die faces the first die pad, and wherein the second die pad is over the second die.
11. The computing device of claim 10, wherein the first die pad has a bottom side attached to the back side of the first die and a top side that is not covered in a mold compound.
12. The computing device of claim 10, wherein the first die pad is wider than the first die, and wherein the land is cut along the width of the first die pad such that the land is located outside of the first die.
13. The computing device of claim 10, wherein the land has a plurality of bonding pads to connect to respective other ends of the wires in the second plurality of wires.
14. The computing device of claim 10, wherein the second plurality of leads and the third plurality of leads connect the first die to the second die through the land without connecting to an external device.
15. A method for manufacturing a stacked package, comprising:
attaching a back side of a first die to a first die pad;
connecting a plurality of leads at one end thereof to the front side of the die for connection to an external device;
connecting a second plurality of leads at one end thereof to the front side of the first die and at another end thereof to an edge of the first die pad;
encapsulating the first die and at least a portion of the first die pad in a mold compound;
cutting a land from the first die pad, wherein an edge of the first die pad is a portion of the land;
stacking a second die over the first die pad, wherein the second die has a front side and a back side;
connecting one end of a third plurality of leads to the second die and the other end of the third plurality of leads to the land; and
attaching a second die pad to a back side of the second die, wherein a front side of the second die faces the first die pad, and wherein the second die pad is over the second die.
16. The method of claim 15, wherein the land is supported by the mold compound.
17. The method of claim 15, wherein the first die pad has a bottom side and a top side, wherein the bottom side is attached to the back side of the first die, the method further comprising exposing the top side of the first die pad from the mold compound prior to cutting the lands.
18. The method of claim 15, wherein the first die pad has a rectangular surface, and wherein cutting the land comprises cutting the land on four sides of the pad.
19. The method of claim 15, further comprising: applying a plurality of bond pads to the bonding pads to connect to respective other ends of the leads in the second plurality of leads.
20. The method of claim 15, wherein cutting the land comprises cutting by laser ablation.
21. The method of claim 15, further comprising encapsulating the second die in a second mold compound, and attaching the second mold compound to the first die pad.
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