CN105549248A - Microdisplay dynamic target simulation module - Google Patents
Microdisplay dynamic target simulation module Download PDFInfo
- Publication number
- CN105549248A CN105549248A CN201610072911.4A CN201610072911A CN105549248A CN 105549248 A CN105549248 A CN 105549248A CN 201610072911 A CN201610072911 A CN 201610072911A CN 105549248 A CN105549248 A CN 105549248A
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- China
- Prior art keywords
- micro
- display
- heating plate
- temperature
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133528—Polarisers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Abstract
The invention provides a microdisplay dynamic target simulation module which comprises a microdisplay, a microdisplay circuit driving board, heaters and a temperature controller. The microdisplay is connected with the microdisplay circuit driving board, the heaters are arranged on the back face of the microdisplay and the front face and the back face of the microdisplay circuit driving board respectively, and the temperature controller is connected between the heaters arranged on the front face and the back face of the microdisplay; the temperature controller detects the real-time temperature of the microdisplay, when the temperature is lower than first preset temperature, the temperature controller is switched on, and the heaters start to heat; when the temperature is higher than second preset temperature, the temperature controller is switched off, and the heaters stop heating. By means of the microdisplay dynamic target simulation module, the usage temperature of the microdisplay can be effectively widened, and the microdisplay can normally work in a low-temperature environment to dynamically simulate a target.
Description
Technical field
The present invention relates to micro display technology field, be specifically related to a kind of micro-display dynamic object emulation module, be especially widely used in Dynamic Star simulator.
Background technology
At present using LCOS as the Related product of display device, as spatial light modulator, serviceability temperature is substantially all carry out at normal temperatures, and the serviceability temperature scope that man of LCOS chip factory specifies is usually at 0 DEG C ~ 70 DEG C, therefore at low temperature environment, as under the environment of-40 DEG C ~ 0 DEG C, be generally difficult to ensure normal work, make LCOS chip existing defects at low ambient temperatures itself thus.
In prior art, as the image device of target simulator module, when the request for utilization of-40 DEG C ~ 70 DEG C can not be met, general is all adopt static differentiation plate as image device, it has mainly plated the lighttight metallic film of one deck on the glass of K9, then utilize the method for etching to fall needing the pattern etch of simulation, the pattern etched away becomes the target needing simulation.The shortcoming of this technology is can not dynamically simulated target, can only show statically, therefore there is obvious limitation.
Summary of the invention
In view of this, in order to overcome defect and the problem of prior art, the invention provides a kind of micro-display dynamic object emulation module.
A kind of micro-display dynamic object emulation module, it comprises micro-display, micro-display drives plate, well heater and temperature controller, described micro-display is connected with described micro-display drives plate, described well heater is arranged at the back side of described micro-display and the pros and cons of described micro-display drives plate, described temperature controller is connected between the described well heater of described micro-display drives plate pros and cons, described temperature controller detects the real time temperature of described micro-display, when temperature is lower than the first preset temperature, described temperature controller closes, described well heater starts heating, when temperature is higher than the second preset temperature, described temperature controller disconnects, described well heater stops heating.
In the present invention one better embodiment, also comprise polarization splitting prism, described polarization splitting prism is arranged at the front of described micro-display.
In the present invention one better embodiment, also comprise heat radiator, it is fixed on the back side of described micro-display drives plate.
In the present invention one better embodiment, described well heater comprises the first heating plate parallel with one another and the second heating plate, and described first heating plate is arranged at the back side of described micro-display, and described second heating plate is fixed on the front of described micro-display drives plate.
In the present invention one better embodiment, also comprise the 3rd heating plate, the 4th heating plate and slender acanthopanax backing, described 3rd heating plate and described 4th heating plate are arranged at intervals between described micro-display drives plate and described heat radiator, and described slender acanthopanax backing is arranged at the surface that described heat radiator deviates from described micro-display drives plate.
In the present invention one better embodiment, described first heating plate, described second heating plate, described 3rd heating plate, described 4th heating plate and described slender acanthopanax backing are membrane structure.
In the present invention one better embodiment, described first heating plate, described second heating plate, described 3rd heating plate, described 4th heating plate and described slender acanthopanax backing are parallel with one another.
In the present invention one better embodiment, described first preset temperature is 5 DEG C, and described second preset temperature is 20 DEG C.
In the present invention one better embodiment, also comprise overtemperature protector, it is connected with described temperature controller.
In the present invention one better embodiment, also comprise LED light, it is connected to described well heater.
In the present invention one better embodiment, also comprise for described well heater and described temperature controller provide the power supply of operating voltage.
In the present invention one better embodiment, described micro-display is LCOS chip, LCD chip, OLEDOS chip or dmd chip.
Relative to prior art, micro-display dynamic object emulation module provided by the invention, effectively can widen the serviceability temperature of micro-display, micro-display also can normally be worked at low ambient temperatures, namely the pattern-information needing simulation optionally can be changed in real time in-40 DEG C ~ 70 DEG C temperature ranges, thus can dynamically simulated target.
Micro-display dynamic object emulation module provided by the invention has low-power consumption, high resolving power, able to programme, high-contrast, the advantages such as high optics utilization factor, therefore various optical information processing system is applied to more and more widely, as display application, beam splitter, laser beam reshaping, phase-modulation, optical tweezers, line holographic projections, dynamic object simulation etc., be applicable to following micro-display: DMD (DigitalMicromirrorDevice, data micro-mirror device)/LCOS (silicon based LCD micro-display)/OLEDOS (silica-based OLED micro-display)/LCD (LiquidCrystalDisplay, liquid crystal display)/.TFT-LCD (TFT:ThinFilmTransistor Thin Film Transistor (TFT)) is the one of LCD.
Accompanying drawing explanation
The composition schematic diagram of a kind of micro-display dynamic object emulation module that Fig. 1 provides for a preferred embodiment of the present invention.
The partial structurtes schematic diagram of the heat radiator that Fig. 2 provides for a preferred embodiment of the present invention.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize instructions of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Refer to Fig. 1, a preferred embodiment of the present invention provides a kind of micro-display dynamic object emulation module, it comprises micro-display 10, micro-display drives plate 12, well heater and temperature controller 20, described micro-display 10 is connected with described micro-display drives plate 12, described well heater is arranged at the back side of described micro-display 10 and the pros and cons of described micro-display drives plate 12, described temperature controller 20 is connected between the described well heater of described micro-display drives plate 12 pros and cons, described temperature controller 20 detects the real time temperature of described micro-display 10, when temperature is lower than the first preset temperature, described temperature controller 20 closes, described well heater starts heating, when temperature is higher than the second preset temperature, described temperature controller 20 disconnects, described well heater stops heating.
Further, described micro-display dynamic object emulation module also comprises polarization splitting prism 14, and described polarization splitting prism 14 is arranged at the front of described micro-display 10.
Described micro-display 10 is LCOS chip, LCD chip, OLEDOS chip or dmd chip, and following the present invention is described for LCOS chip, and namely in following examples, LCOS chip 10 i.e. micro-display 10.
Preferably, described first preset temperature is 5 °, and described second preset temperature is 20 °.
In the present embodiment, described polarization splitting prism 14 (i.e. PBS, polarizationbeamsplitter) is for being divided into the vertical linearly polarized light of two bundles by the nonpolarized light of incidence.
Described well heater comprises the first heating plate 16 and the second heating plate 18 parallel with one another, and described first heating plate 16 is arranged at the back side of described LCOS chip 10, and described second heating plate 18 is fixed on the front of described LCOS drives plate 12,
During low temperature environment, described first heating plate 16 is for heating described LCOS chip 10, described second heating plate 18 is for heating described LCOS drives plate 12, can make described LCOS chip 10 thus under the environment of-40 DEG C ~ 70 DEG C, temperature constant around described LCOS chip 10, in the temperature range of 5 ° of C ~ 20 DEG C, makes described LCOS chip 10 normally work.And then realize making described micro-display dynamic object emulation module reach corresponding temperature under certain temperature conditions, in the specific time, guarantee normal work.
In the present embodiment, also comprise heat radiator 22, the 3rd heating plate 24, the 4th heating plate 26 and slender acanthopanax backing 28; Described heat radiator 22 is fixed on the back side of described LCOS drives plate 12;
Refer to Fig. 2, described 3rd heating plate 24 and described 4th heating plate 26 are arranged at intervals between described LCOS drives plate 12 and described heat radiator 22, namely, described 3rd heating plate 24 and described 4th heating plate 26 are arranged at intervals at the surface of described heat radiator 22 towards described LCOS drives plate 12, and are attached at the back side (i.e. reverse side) of described LCOS drives plate 12; Described slender acanthopanax backing 28 is arranged at the surface that described heat radiator 22 deviates from described LCOS drives plate 12.Be understandable that, described heat radiator 22 can while the low-temperature heat of described LCOS drives plate 12, dispel the heat according to actual temperature, avoid heating the problem causing excessive temperature, make described micro-display dynamic object emulation module be in a normal reasonably temperature range all the time.
Preferably, described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26 and described slender acanthopanax backing 28 are membrane structure.
In the present embodiment, described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26 and described slender acanthopanax backing 28 are parallel with one another.
Further, described micro-display dynamic object emulation module also comprises overtemperature protector 30, LED light 32 and power supply 34; Described overtemperature protector 30 is connected with described temperature controller 20; Described LED light 32 is connected to described first heating plate 16; Described power supply 34 is for providing operating voltage for described well heater and described temperature controller 20.Particularly, described power supply 34, described LED light 32, described temperature controller 20 and described overtemperature protector 30 sequential series formation loop successively.Certainly, be not limited thereto, the order of connection and the concrete setting position of described power supply 34, described LED light 32, described temperature controller 20 and described overtemperature protector 30 also can adjust according to actual needs.
In one embodiment of the invention, when connecting described power supply 34, described temperature controller 20 detects the real time temperature of described LCOS drives plate 12, when the described real time temperature detected is lower than 5 DEG C that set before (i.e. the first preset temperature), described temperature controller 20 closes, described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26 and described slender acanthopanax backing 28 are started working, when the real time temperature that described temperature controller 20 detects described LCOS drives plate 12 is higher than 20 ° of C (i.e. the second preset temperature) that set before, described temperature controller 20 disconnects, described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26 and described slender acanthopanax backing 28 stop heating.
Be understandable that, whether described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26 and described slender acanthopanax backing 28 also can control to work as the case may be respectively.
The concrete implementation step of described micro-display dynamic object emulation module comprises:
First, according under different temperatures, confirm to need the time being heated to steady temperature, the time judges the power of described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26 and described slender acanthopanax backing 28 and arranges the particular location of described temperature controller 20 thus.
Secondly, owing to needing be 10 minutes the preheating time under-40 ° of environment before normal work, the internal volume of the dynamic object of micro-display described in this example emulation module is set to 315 cubic centimetres, LY12 elected as by the material of outer structural parts, the coefficient of heat conductivity of this material is: 30W/ (Mk), and the power of described first heating plate 16 is 20W, the power of described second heating plate 18 is 47.5W, the power of described slender acanthopanax backing 28 is 35W, the power of described 3rd heating plate 24 is 24W, the power of described 4th heating plate 26 is 15W.
Then, add described second heating plate 18 at the back side of described LCOS drives plate 12, and fixed with silica gel; Described 3rd heating plate 24 and described 4th heating plate 26 are set in the front of described LCOS drives plate 12, described slender acanthopanax backing 28 is set on the surface deviating from described LCOS drives plate 12 of described heat radiator 22; Described first heating plate 16 is set at the back side of described LCOS chip 10, and guarantees fixed.
At this; described first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26, described slender acanthopanax backing 28, described temperature controller 20, described overtemperature protector 30, described LED light 32 and power supply 34 are connected; the parallel connection of wherein said first heating plate 16, described second heating plate 18, described 3rd heating plate 24, described 4th heating plate 26, described slender acanthopanax backing 28 uses, and described temperature controller 20 and described overtemperature protector 30 are connected and used.
Afterwards, between described heat radiator 22 and described LCOS drives plate 12, coat heat conductive silica gel, guarantee that the heat radiation of described LCOS drives plate 12 when high temperature is normal.
Relative to prior art, micro-display dynamic object emulation module provided by the invention, effectively can widen the serviceability temperature of LCOS chip, LCOS chip also can normally be worked at low ambient temperatures, namely the pattern-information needing simulation optionally can be changed in real time in-40 DEG C ~ 70 DEG C temperature ranges, thus can dynamically simulated target.Obviously, described micro-display dynamic object emulation module is also applicable to LCD chip or dmd chip, and LCD chip or dmd chip also can normally be worked at low ambient temperatures.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a micro-display dynamic object emulation module, it is characterized in that, comprise micro-display, micro-display drives plate, well heater and temperature controller, described micro-display is connected with described micro-display drives plate, described well heater is arranged at the back side of described micro-display and the pros and cons of described micro-display drives plate, described temperature controller is connected between the described well heater of described micro-display drives plate pros and cons, described temperature controller detects the real time temperature of described micro-display, when temperature is lower than the first preset temperature, described temperature controller closes, described well heater starts heating, when temperature is higher than the second preset temperature, described temperature controller disconnects, described well heater stops heating.
2. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, also comprise polarization splitting prism, described polarization splitting prism is arranged at the front of described micro-display.
3. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, also comprise heat radiator, it is fixed on the back side of described micro-display drives plate.
4. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, described well heater comprises the first heating plate parallel with one another and the second heating plate, described first heating plate is arranged at the back side of described micro-display, and described second heating plate is fixed on the front of described micro-display drives plate.
5. micro-display dynamic object emulation module as claimed in claim 3, it is characterized in that, also comprise the 3rd heating plate, the 4th heating plate and slender acanthopanax backing, described 3rd heating plate and described 4th heating plate are arranged at intervals between described micro-display drives plate and described heat radiator, and described slender acanthopanax backing is arranged at the surface that described heat radiator deviates from described micro-display drives plate.
6. micro-display dynamic object emulation module as claimed in claim 5, it is characterized in that, described first heating plate, described second heating plate, described 3rd heating plate, described 4th heating plate and described slender acanthopanax backing are membrane structure.
7. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, described first heating plate, described second heating plate, described 3rd heating plate, described 4th heating plate and described slender acanthopanax backing are parallel with one another.
8. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, also comprise overtemperature protector, it is connected with described temperature controller.
9. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, also comprise LED light, it is connected to described well heater.
10. micro-display dynamic object emulation module as claimed in claim 1, it is characterized in that, described micro-display is LCOS chip, LCD chip, OLEDOS chip or dmd chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072911.4A CN105549248A (en) | 2016-02-02 | 2016-02-02 | Microdisplay dynamic target simulation module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072911.4A CN105549248A (en) | 2016-02-02 | 2016-02-02 | Microdisplay dynamic target simulation module |
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| CN105549248A true CN105549248A (en) | 2016-05-04 |
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| CN201610072911.4A Pending CN105549248A (en) | 2016-02-02 | 2016-02-02 | Microdisplay dynamic target simulation module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106383533A (en) * | 2016-10-25 | 2017-02-08 | 南京中新赛克科技有限责任公司 | Communication equipment low-temperature starting device and application thereof |
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