CN105544930A - Floor pavement structure of compound sensor array and information transmitting system - Google Patents

Floor pavement structure of compound sensor array and information transmitting system Download PDF

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Publication number
CN105544930A
CN105544930A CN201610076708.4A CN201610076708A CN105544930A CN 105544930 A CN105544930 A CN 105544930A CN 201610076708 A CN201610076708 A CN 201610076708A CN 105544930 A CN105544930 A CN 105544930A
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Prior art keywords
layer
sensor
sensor array
ground
floor
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CN201610076708.4A
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Chinese (zh)
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蒋鹏
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Individual
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Priority to CN201610076708.4A priority Critical patent/CN105544930A/en
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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Road Paving Structures (AREA)

Abstract

The invention relates to a floor pavement structure of a compound sensor array and an information transmitting system. The floor pavement structure of the compound sensor array comprises a floor pavement layer and a sensor array layer. The sensor array layer is arranged in the floor pavement layer, the floor pavement layer is made of floor materials or non-floor materials, the floor materials are one or more of wood floors, consolidated composite floors, bamboo floors, cork floors, PVC floors, plastic floors and wood-plastic floors, and the non-floor materials are one or more of ceramic tiles, marble, glassed tiles, carpets and plastic ground mats. The sensor array layer comprises multiple sensor sets arranged horizontally in parallel. Each sensor set is composed of multiple evenly-arranged sensors. The information transmitting system comprises an information transmitting device and the floor pavement structure of the compound sensor array. The floor pavement structure of the compound sensor array and the information transmitting system have the advantages of being simple in structure and convenient to use.

Description

A kind of ground pavement structure of compound sensor array and information transmitting system
Technical field
The present invention relates to a kind of ground pavement structure and information transmitting system of compound sensor array.
Background technology
Floor is mainly divided into strengthening composite floor, wooden floor and solid wooden compound floor three major types in the market; Wherein:
Strengthening composite floor is made up of wearing layer, decorative layer, basic unit, balance layer.The advantage of strengthening composite floor has wear-resisting: be about more than 10 ~ 30 times of common paint decorations floor; Attractive in appearance: available computer analog goes out various wood grain and pattern, color; Stable: thoroughly to have broken up the tissue of original timber, destroyed the characteristic of anisotropy and moisture expansion and drying shrinkage, size stabilizer pole, be particularly useful for the room of ground heating system; But strengthening composite floor chance water and being exposed to the sun etc. all may deform;
Wooden floor is the floor decorative material of formation after natural timber drying, processing.Have another name called raw wood floor, be the floor of being directly processed into solid wood, it has the texture of timber self-sow, be the non-conductor of heat, effect cool in summer and warm in winter can be played, comfortable foot feeling, the feature of use safety is the ideal material of the ground surface finishings such as bedroom, parlor, study.The decorated style of solid wood is recovered one's original simplicity, and texture nature, decline in afforestation rate, advocate today of environmental protection energetically, wooden floor is more aobvious preciousness then.Rise according on May 1st, 2002, wooden floor standard GB/T/T15306-2001 implements wooden floor grade to be divided into: this colour table of palette b step high-class product wooden floor.The natural wood texture that it presents and colour image, give nature, soft, the texture that is rich in affinity, become the ideal material of the ground surface finishings such as bedroom, parlor, study simultaneously due to the characteristic that it is cool in summer and warm in winter, sense of touch is good; But though wooden floor is the high-grade product in floor, expensive, trouble be installed, not easily arrange, need regularly wax;
Solid wooden compound floor is formed by the sheet material crosswise lamination of different tree species, and overcome the shortcoming of wooden floor moisture expansion and drying shrinkage to a certain extent, expand with wet and contract with dry rate is little, has good dimensional stability, and remains the natural wood veins of wooden floor and comfortable feel.Solid wooden compound floor has the stability of consolidated floor and the aesthetic property of wooden floor concurrently, and has environment-friendly advantage; The stability of strengthening composite floor and the attractive in appearance of wooden floor and one but although solid wooden compound floor is held concurrently, feel is bad.
Meanwhile, the PVC floor that market occurs uses widely, the various places such as such as indoor family, hospital, school, office building, factory, public place, supermarket, business, stadiums, museum.Particularly in museum; the usual smoother in ground; in each businessman before sales exhibition product; in order to protect the ground of museum; usually PVC floor is layered on museum ground; existing PVC floor is rear on the ground easily skids, and floor easily kicks up by people's walking on floor or when removing thing, thus brings inconvenience.Skid to prevent PVC floor, common way is the coated on bottom side one deck adhesive in PVC floor, floor and ground are bonded and can solve the problem, but after all exhibition terminate rear need by floor remove, so both add the difficulty of dismounting, ground of also having made dirty, and PVC floor makes to seal between floor and ground on the ground afterwards, steam in the lower air of floor easily accumulates, and floor can be caused to stick up, bring constant to the walking of people after accumulation too much.
Along with the raising of people's living standard, Household fit-up and decoration is day by day high-grade, and top-grade furniture, electrical equipment are available in all varieties; On the other hand, the work of people is also increasingly busy, and work overtime, go on business frequently, empty nest phenomenon gets more and more, and to stealer with opportunity, the situation that in family, article are stolen occurs repeatedly, and therefore, increasing customer starts to pay close attention to anti-thefting facility.
It is a kind of mode solved the problem that existing floor is installed burglary-resisting installation, as Chinese invention patent CN2592762Y discloses a kind of Acoustic flooring, it has groove or through hole on floor, arranges actuating type sounding device in groove or through hole, the top wear-resisting layer covering of sounding device.When people trespasses the top of sounding device, the touch switch connected in sounding device can be touched and make it sound, and propagate out through the aperture of speaking that wearing layer is corresponding, thus achieve the sound production prompt function on floor, play the effect of warning.
But, there are the following problems for the Acoustic flooring of said structure: (1) be generally only applicable within doors or near have the situation of people, when within doors or neighbouring no one time, due to stealer, to trample the sound that floor causes sounding device to send limited, cannot play alarm function; (2) because groove or through hole are located at the front on floor, it only relies on one deck wearing layer support, thus the bearing strength on floor is poor, and application life is not long, and therefore practicality is not strong.
To sum up, the most function singleness in above-mentioned floor occurred in the market, and mostly do not possess information transmitting system, there is the defect of usage safety performance difference simultaneously.
Summary of the invention
In view of the above-mentioned problems in the prior art, main purpose of the present invention is to address the deficiencies of the prior art, the invention provides a kind of ground pavement structure and information transmitting system of compound sensor array, the ground pavement structure of this compound sensor array have that structure is simple, diverse in function and feature easy to use.
The invention provides a kind of ground pavement structure of compound sensor array, comprise ground pavement layer and sensor array layer, described sensor array layer is arranged in described ground pavement layer, described ground pavement layer is made up of flooring material or non-flooring material, described flooring material is wood flooring, strengthening composite floor, bamboo flooring, cork flooring, PVC floor, one or more in plastic floor or Wood-plastic floor, described non-flooring material is ceramic tile, marble, vitrified tile, one or more in carpet or plastic floor mat, described sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group is made up of the sensor of multiple even setting, the thickness range of the ground pavement structure of described compound sensor array is 4-25mm.
Optionally, described ground pavement layer comprises mat formation top layer and ground bed course, and described ground bed course refers to the part that paving structure and ground directly contact, described in top layer of mating formation be arranged on above described ground bed course, the thickness on described top layer of mating formation is 3 ~ 20mm, and the thickness range of described ground bed course is 1 ~ 3mm; Described sensor array layer is mated formation between top layer and described ground bed course described in being compounded in by gummed mode, described many group sensor groups arrange according to a determining deviation and are fixedly installed on described sensor display layer, and described sensor array layer is made up of cork, carbon fiber or resin material.
Optionally, described ground pavement layer comprises mat formation top layer and sensor insert material layer, described top layer of mating formation is compounded in above described sensor insert material layer by gummed mode, the mounting groove that many groups are arranged in parallel is provided with in described sensor insert material layer, often organize mounting groove and comprise multiple mounting groove arranged by constant spacing, described many groups are horizontally disposed with and sensor in the sensor group be parallel to each other is separately positioned in corresponding mounting groove.
Optionally, the thickness range of described sensor array layer is 2 ~ 4mm.
Optionally; described ground pavement layer also comprises sensor protection layer; mat formation described in described sensor protection layer is arranged between top layer and described sensor array layer, described sensor protection layer is made up of light honorable material, and the thickness of described sensor protection layer is 1 ~ 2mm.
Optionally, described ground bed course can be cork ground bed course.
Optionally, the thickness of described sensor insert material layer is 4 ~ 8mm.
Optionally, described sensor insert material layer is cork or resin material layer.
The present invention also provides a kind of information transmitting system, comprise information transmitting apparatus, also comprise as aforementioned arbitrary as described in the ground pavement structure of compound sensor array, the ground pavement structure of described compound sensor array comprises ground pavement layer and sensor array layer, described sensor array layer is arranged in described ground pavement layer, described sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group is made up of the sensor of multiple even setting, the described often sensor organized in sensor group is all connected with described information transmitting apparatus by control circuit.
Optionally, described multiple sensor comprises pressure sensor, temperature pick up and humidity sensor.
The present invention has the following advantages and beneficial effect:
The invention provides a kind of ground pavement structure of compound sensor array, the ground pavement structure of this compound sensor array has simple and diverse in function and feature easy to use, the innovation of its structure design, achieves the technological innovation that ground pavement structure combines with Intelligent hardware; Meanwhile, for different pavement material and consumption demand, dissimilar sensor can be selected, realize the diversification of interactive information, help and realize customer personalized and customization demand, wide market.
Accompanying drawing explanation
The cross-sectional view of the ground pavement structure of the compound sensor array that Fig. 1 provides for the embodiment of the present invention 1;
The cross-sectional view of the ground pavement structure of the compound sensor array that Fig. 2 provides for the embodiment of the present invention 2;
The structural representation of the information transmitting system that Fig. 3 provides for the embodiment of the present invention 3.
As follows shown in figure:
100 is top layer of mating formation;
200 is sensor array layer;
201 is sensor;
300 is ground bed course;
400 is sensor protection layer;
500 is sensor insert material layer;
501 is mounting groove;
600 is control circuit;
700 is information transmitting apparatus.
Detailed description of the invention
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.The assembly of the embodiment of the present invention describing and illustrate in usual accompanying drawing herein can be arranged with various different configuration and design.Therefore, below to the detailed description of the embodiments of the invention provided in the accompanying drawings and the claimed scope of the present invention of not intended to be limiting, but selected embodiment of the present invention is only represented.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In describing the invention, it should be noted that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "left", "right", " vertically ", " level ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the present invention for convenience of description and simplified characterization; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " ", " second ", " the 3rd " only for describing object, and can not be interpreted as instruction or hint relative importance.
In describing the invention, also it should be noted that, unless otherwise clearly defined and limited, term " setting ", " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
The present invention is further illustrated with specific embodiment below with reference to accompanying drawings.
Embodiment 1
As shown in Figure 1, for the ground pavement structure of a kind of compound sensor array that the embodiment of the present invention 1 provides, comprise ground pavement layer and sensor array layer 200, sensor array layer 200 is arranged in ground pavement layer, ground pavement layer is made up of flooring material or non-flooring material, flooring material is wood flooring, strengthening composite floor, bamboo flooring, cork flooring, PVC floor, one or more in plastic floor or Wood-plastic floor, non-flooring material is ceramic tile, marble, vitrified tile, one or more in carpet or plastic floor mat, sensor array layer 200 comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group forms by the multiple sensors 201 evenly arranged, two adjacent sensors are connected by wire, the thickness range of the ground pavement structure of this compound sensor array is 4 ~ 25mm, wherein: ground pavement layer comprises mat formation top layer 100 and ground bed course 300, ground bed course refers to the part that paving structure and ground directly contact, mat formation top layer 100 be arranged on ground bed course 300 above, the thickness on top layer 100 of mating formation is 3 ~ 20mm, and the thickness range of ground bed course 300 is 1 ~ 3mm, sensor array layer 200 is compounded in by gummed mode mats formation between top layer 100 and ground bed course 300, many groups sensor group arranges according to a determining deviation and is fixedly installed in sensor display layer, and sensor array layer 200 is made up of cork, carbon fiber or resin material.
As the preferred embodiment of above-described embodiment, the thickness range of the sensor array layer 200 is 2-4mm.
As the preferred embodiment of above-described embodiment, the thickness on above-mentioned top layer 100 of mating formation is about 11mm.
As the preferred embodiment of above-described embodiment, the thickness of above-mentioned ground bed course 300 is about 2mm
As the preferred embodiment of above-described embodiment; above-mentioned ground pavement layer also comprises sensor protection layer 400; this sensor protection layer 400 is arranged on mats formation between top layer 100 and sensor array layer 200; this sensor protection layer 400 is made up of light honorable material, and the thickness of this sensor protection layer is 1 ~ 2mm.
As the preferred embodiment of above-described embodiment, the thickness of the sensor topping 400 is about 1mm.
Embodiment 2
As shown in Figure 2, for the ground pavement structure of a kind of compound sensor array that the embodiment of the present invention 2 provides, comprise ground pavement layer and sensor array layer, sensor array layer is arranged in ground pavement layer, ground pavement layer is made up of flooring material or non-flooring material, flooring material is wood flooring, strengthening composite floor, bamboo flooring, cork flooring, PVC floor, one or more in plastic floor or Wood-plastic floor, non-flooring material is ceramic tile, marble, vitrified tile, one or more in carpet or plastic floor mat, sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group forms by the multiple sensors 201 evenly arranged, two adjacent sensors are connected by wire, the thickness range of the ground pavement structure of this compound sensor array is 4 ~ 25mm, wherein, described ground pavement layer comprises mat formation top layer 100 and sensor insert material layer 500, described top layer 100 of mating formation is compounded in above described sensor insert material layer 500 by gummed mode, the many groups of mounting grooves be parallel to each other are provided with in described sensor insert material layer 500, and often group mounting groove comprises multiple mounting groove arranged by constant spacing, described many groups are horizontally disposed with and sensor 201 in the sensor group be parallel to each other is separately positioned in corresponding mounting groove 501, and then sensor 201 is fixedly installed in corresponding mounting groove 501, play the object of protection sensor 201, thus extend the application life of sensor 201, also waterproofing course or gasket seal can be set on mounting groove 501 simultaneously, make moist with no-sensor, extend the application life of sensor 201 further.
As the preferred embodiment of above-described embodiment, the thickness of sensor insert material layer 500 is 4-8mm.
As the preferred embodiment of above-described embodiment, sensor insert material layer 500 is cork or resin material layer.
Embodiment 3
As shown in Figure 3, for a kind of information transmitting system that the embodiment of the present invention 3 provides, comprise information transmitting apparatus 700, also comprise the ground pavement structure of the arbitrary described compound sensor array of the embodiment of the present invention, the ground pavement structure of described compound sensor array comprises ground pavement layer and sensor array layer, described sensor array layer is arranged in described ground pavement layer, described sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group is made up of the sensor 201 of multiple even setting, the described often sensor 201 organized in sensor group is all connected with information transmitting apparatus 700 by control circuit 600.
As the preferred embodiment of above-described embodiment, multiple sensor comprises pressure sensor, temperature pick up and humidity sensor.Wherein, pressure signal, for gathering pressure signal, is sent to described information transmitting apparatus by control circuit by this pressure sensor simultaneously; This temperature pick up is used for collecting temperature signal, this temperature signal is sent to described information transmitting apparatus by control circuit simultaneously; This moisture signal, for gathering moisture signal, is sent to information transmitting apparatus by control circuit by this humidity sensor simultaneously.
The present invention has the following advantages and beneficial effect:
The invention provides a kind of ground pavement structure of compound sensor array, the ground pavement structure of this compound sensor array has simple and diverse in function and feature easy to use, the innovation of its structure design, achieves the technological innovation that ground pavement structure combines with Intelligent hardware; Meanwhile, for different pavement material and consumption demand, dissimilar sensor can be selected, realize the diversification of interactive information, help and realize customer personalized and customization demand, wide market.
The present invention also provides a kind of information transmitting system, this information transmitting system comprises information transmitting apparatus 700, also comprise the ground pavement structure of the arbitrary compound sensor array of the embodiment of the present invention, the ground pavement structure of compound sensor array comprises ground pavement layer and sensor array layer, sensor array layer is arranged in ground pavement layer, sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group is made up of the sensor 201 of multiple even setting, often the sensor 201 organized in sensor group is all connected with information transmitting apparatus 700 by control circuit 600, and the plurality of sensor comprises pressure sensor, temperature pick up and humidity sensor, wherein, pressure signal, for gathering pressure signal, is sent to described information transmitting apparatus by control circuit by this pressure sensor simultaneously, this temperature pick up is used for collecting temperature signal, this temperature signal is sent to described information transmitting apparatus by control circuit simultaneously, this moisture signal, for gathering moisture signal, is sent to information transmitting apparatus by control circuit by this humidity sensor simultaneously.
Last it is noted that above-described each embodiment is only for illustration of technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in previous embodiment, or to wherein partly or entirely technical characteristic carry out equivalent replacement; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.

Claims (10)

1. the ground pavement structure of a compound sensor array, it is characterized in that: comprise ground pavement layer and sensor array layer, described sensor array layer is arranged in described ground pavement layer, described ground pavement layer is made up of flooring material or non-flooring material, described flooring material is wood flooring, strengthening composite floor, bamboo flooring, cork flooring, PVC floor, one or more in plastic floor or Wood-plastic floor, described non-flooring material is ceramic tile, marble, vitrified tile, one or more in carpet or plastic floor mat, described sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often organize sensor group by the multiple sensor compositions evenly arranged, two adjacent described sensors are connected by wire, the thickness range of the ground pavement structure of described compound sensor array is 4 ~ 25mm.
2. the ground pavement structure of compound sensor array according to claim 1, it is characterized in that, described ground pavement layer comprises mat formation top layer and ground bed course, described ground bed course refers to the part that paving structure and ground directly contact, described top layer of mating formation is arranged on above described ground bed course, the thickness on described top layer of mating formation is 3 ~ 20mm, and the thickness range of described ground bed course is 1 ~ 3mm; Described sensor array layer is mated formation between top layer and described ground bed course described in being compounded in by gummed mode, described many group sensor groups arrange according to a determining deviation and are fixedly installed on described sensor display layer, and described sensor array layer is made up of cork, carbon fiber or resin material.
3. the ground pavement structure of compound sensor array according to claim 1, it is characterized in that, described ground pavement layer comprises mat formation top layer and sensor insert material layer, described top layer of mating formation is compounded in above described sensor insert material layer by gummed mode, the many groups of mounting grooves be parallel to each other are provided with in described sensor insert material layer, often organize mounting groove and comprise multiple mounting groove arranged by constant spacing, described many groups are horizontally disposed with and sensor in the sensor group be parallel to each other is separately positioned in corresponding mounting groove.
4. the ground pavement structure of compound sensor array according to claim 2, is characterized in that, the thickness range of described sensor array layer is 2 ~ 4mm.
5. the ground pavement structure of compound sensor array according to claim 2; it is characterized in that; described ground pavement layer also comprises sensor protection layer; mat formation described in described sensor protection layer is arranged between top layer and described sensor array layer; described sensor protection layer is made up of light honorable material, and the thickness of described sensor protection layer is 1 ~ 2mm.
6. the ground pavement structure of compound sensor array according to claim 2, is characterized in that, described ground bed course can be cork ground bed course.
7. the ground pavement structure of compound sensor array according to claim 3, is characterized in that, the thickness of described sensor insert material layer is 4 ~ 8mm.
8. the ground pavement structure of compound sensor array according to claim 3, is characterized in that, described sensor insert material layer is cork or resin material layer.
9. an information transmitting system, it is characterized in that: comprise information transmitting apparatus, also comprise the ground pavement structure of the compound sensor array according to any one of claim 1 to 8, the ground pavement structure of described compound sensor array comprises ground pavement layer and sensor array layer, described sensor array layer is arranged in described ground pavement layer, described sensor array layer comprises many groups and is horizontally disposed with and the sensor group be parallel to each other, and often group sensor group is made up of the sensor of multiple even setting, the described often sensor organized in sensor group is all connected with described information transmitting apparatus by control circuit.
10. information transmitting system according to claim 9, is characterized in that, described multiple sensor comprises pressure sensor, temperature pick up and humidity sensor.
CN201610076708.4A 2016-02-03 2016-02-03 Floor pavement structure of compound sensor array and information transmitting system Pending CN105544930A (en)

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Application Number Priority Date Filing Date Title
CN201610076708.4A CN105544930A (en) 2016-02-03 2016-02-03 Floor pavement structure of compound sensor array and information transmitting system

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107882291A (en) * 2017-10-10 2018-04-06 江阴市福诺新型装饰材料有限公司 Multi-layer co-extruded surface can the colorful latch floor of color separation
CN109795164A (en) * 2017-11-17 2019-05-24 广州同欣康体设备有限公司 Smart motion ground cushion and preparation method thereof
CN110644702A (en) * 2019-09-29 2020-01-03 龚会萍 Square brick assembly with switchable decorative surface
CN111236704A (en) * 2020-01-22 2020-06-05 哈尔滨工业大学 Panel, panel load real-time test system and panel load safety control system
CN112112390A (en) * 2020-10-21 2020-12-22 大亚(江苏)地板有限公司 Noninductive intelligent healthy wood floor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003239510A (en) * 2002-02-13 2003-08-27 Atelier Yanagisawa Takahiko:Kk Floor part for room of store or the like, method for measuring number of customers by the floor part and method for replacing floor tile of floor part
CN201362938Y (en) * 2009-02-24 2009-12-16 宗剑 Digital control constant temperature thermal insulation electric heating floor
CN201671290U (en) * 2010-05-10 2010-12-15 德尔国际地板有限公司 Floor
CN102041891A (en) * 2009-10-20 2011-05-04 蒋新 Moistureproof mildewproof device for basement
CN102439245A (en) * 2009-04-27 2012-05-02 莫赫地板公司 Flooring systems and methods of making and using same
CN205476295U (en) * 2016-02-03 2016-08-17 蒋鹏 Compound sensor array's construction site layout structure and message routing system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003239510A (en) * 2002-02-13 2003-08-27 Atelier Yanagisawa Takahiko:Kk Floor part for room of store or the like, method for measuring number of customers by the floor part and method for replacing floor tile of floor part
CN201362938Y (en) * 2009-02-24 2009-12-16 宗剑 Digital control constant temperature thermal insulation electric heating floor
CN102439245A (en) * 2009-04-27 2012-05-02 莫赫地板公司 Flooring systems and methods of making and using same
CN102041891A (en) * 2009-10-20 2011-05-04 蒋新 Moistureproof mildewproof device for basement
CN201671290U (en) * 2010-05-10 2010-12-15 德尔国际地板有限公司 Floor
CN205476295U (en) * 2016-02-03 2016-08-17 蒋鹏 Compound sensor array's construction site layout structure and message routing system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107882291A (en) * 2017-10-10 2018-04-06 江阴市福诺新型装饰材料有限公司 Multi-layer co-extruded surface can the colorful latch floor of color separation
CN109795164A (en) * 2017-11-17 2019-05-24 广州同欣康体设备有限公司 Smart motion ground cushion and preparation method thereof
CN110644702A (en) * 2019-09-29 2020-01-03 龚会萍 Square brick assembly with switchable decorative surface
CN111236704A (en) * 2020-01-22 2020-06-05 哈尔滨工业大学 Panel, panel load real-time test system and panel load safety control system
CN111236704B (en) * 2020-01-22 2021-10-22 哈尔滨工业大学 Panel, panel load real-time test system and panel load safety control system
CN112112390A (en) * 2020-10-21 2020-12-22 大亚(江苏)地板有限公司 Noninductive intelligent healthy wood floor

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Application publication date: 20160504