CN102041891A - Moistureproof mildewproof device for basement - Google Patents
Moistureproof mildewproof device for basement Download PDFInfo
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- CN102041891A CN102041891A CN2009101973820A CN200910197382A CN102041891A CN 102041891 A CN102041891 A CN 102041891A CN 2009101973820 A CN2009101973820 A CN 2009101973820A CN 200910197382 A CN200910197382 A CN 200910197382A CN 102041891 A CN102041891 A CN 102041891A
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- moistureproof
- basement
- controller
- heat preservation
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Abstract
The invention relates to a moistureproof mildewproof device for a basement, which comprises a plurality of floor boards, a heating thermal-insulation wire, an interlayer and a controller, wherein the bottom of the floor boards is provided with two grooves at an interval; the heating thermal-insulation wire is respectively arranged in the two grooves; the interlayer is laid between the ground and the floor boards; both ends of the heating thermal-insulation wire are connected with the controller; the controller comprises a temperature sensor, a humidity sensor, a humidity/temperature controller and a power supply; the temperature sensor, the humidity sensor and the heating thermal-insulation wire are respectively connected with the humidity/temperature controller; and the power supply is respectively connected with the humidity/temperature controller and the heating thermal-insulation wire. The moistureproof mildewproof device has the following advantages: as long as the ground is flat, no treatment for the ground is needed before laying the moistureproof mildewproof device, thus being low in power consumption and energy-saving, and being convenient to lay; the required materials are cheap and the device is convenient to implement, thus having high economy; and the heating thermal-insulation device is arranged in the grooves on the bottom of the floor boards and isolated from the ground by using the interlayer, thus having high operational safety.
Description
Technical field
The present invention relates to a kind of floor apparatus, be specifically related to a kind of basement moistureproof and mildewproof device.
Background technology
The mould suitable growth is at temperature 24-28 ℃, in the environment of relative humidity more than 70%, if continuous such environment more than 1 to 2 day is arranged, mould will be covered with little Mao of suede suede on various article, destroy food, clothes, furniture etc., both influenced people's dwelling environment, also as easy as rolling off a log infection human body, make joint pain, skin disease, cold cough occurred frequently, also can make people's mood gloomy.
The floor of prior art is laid immediately on the concrete floor, and when weather moisturized, rotted easily in the floor, the mildew bacterium.The net floor of another kind of prior art is provided with pillar on four angles on floor, can be with the built on stilts in case tide in floor, but plate temperature beyond control can not effectively prevent fungus growth.
In order to change such environment, make our living environment become happier, need to propose a kind of automatic controller of controlling interior temperature and humidity.In the market, also do not find the indoor humidity and the Automatic Temperature Control of effective, economic power saving, safe handling.
At present, a kind of composite floor for heating of prior art, mainly by deck, compound insulating material layer, concrete leveling layer, pipe line, keel and wood floor bolck etc. form, the burying underground of keel changed existing structure and has been fixed on layout on the concrete leveling layer, but be fixed on the deck, in order to support wood floor bolck.
The negative ion antibiotic mildew-resistant floor of another kind of prior art, it is to paste decorative paper layer, skim antibacterial and mouldproof coating and its surperficial hot pressing one deck wearing layer on substrate layer successively; Another side at substrate layer overlays one deck balance ply of paper.
The integrated wood flooring of damp-proof heat-conducting that also has a kind of prior art, constitute by basic unit, surface layer and bottom, basic unit is formed by stacking by the horizontal vertical wood chip of multi-disc, the grain direction of vertical wood chip is vertical mutually with the grain direction of surface layer, bottom, the upper surface of basic unit, soffit closely contact with surface layer, bottom respectively, and the adjacent both sides of basic unit are provided with the splicing raised line, adjacent both sides on the other side are provided with and the identical groove of raised line.
The shortcoming of the integrated wood flooring of damp-proof heat-conducting of this prior art is:
1, the temperature and humidity on floor can not be responded to and control to the integrated wood flooring of damp-proof heat-conducting of this prior art, and moisture effect is not good.
2, the integrated wood flooring of damp-proof heat-conducting of this prior art is made of basic unit, surface layer and bottom, and volume weighs greatly, lays inconvenient.
3, the integrated wood flooring of damp-proof heat-conducting of this prior art is to the requirement height of flooring material, and cost is big, is not suitable in southern popularization and application.
Summary of the invention
The purpose of this invention is to provide a kind of basement moistureproof and mildewproof device, in the scope that it can be effectively be controlled at setting with indoor floor humidity and temperature, and easy to use, power consumptive province, Environmental Safety.
The purpose of basement moistureproof and mildewproof device of the present invention is achieved through the following technical solutions: a kind of basement moistureproof and mildewproof device is characterized in that: comprise polylith floor, heat preservation line, interlayer and controller.
The bottom on described floor is provided with two grooves at interval, and described heat preservation line is separately positioned in two grooves.
Described interlayer is laid between ground and the floor.
The two ends of described heat preservation line are connected with controller.
Described controller comprises temperature pick up, humidity sensor, damp-warm syndrome degree controller and power supply; Described temperature pick up, humidity sensor and heat preservation line are connected with damp-warm syndrome degree controller respectively, and power supply is connected with damp-warm syndrome degree controller and heat preservation line respectively.
Above-mentioned basement moistureproof and mildewproof device, wherein, described floor is a composite floor board, the thickness on floor is 12mm.
Above-mentioned basement moistureproof and mildewproof device, wherein, described heat preservation line is a heating cable.
Above-mentioned basement moistureproof and mildewproof device, wherein, the wide 1-3mm of the groove of described floor bottoms.
Above-mentioned basement moistureproof and mildewproof device, wherein, described interlayer is a foamed plastics.
Above-mentioned basement moistureproof and mildewproof device, wherein, described controller is placed on the indoor one jiao floor, and temperature pick up and humidity sensor contact with the floor.
Basement moistureproof and mildewproof device of the present invention makes it compared with prior art owing to adopted such scheme, has following advantage and good effect:
1, basement moistureproof and mildewproof device little power consumption of the present invention is saved the energy.
2, basement moistureproof and mildewproof device shop of the present invention is not owing to need in advance any processing to be done on ground, as long as smooth, it is convenient to lay.
3, basement moistureproof and mildewproof device of the present invention is convenient to implement because material requested is cheap, and is economical and practical.
4, basement moistureproof and mildewproof device of the present invention is because during the heat preservation device is arranged in the groove of floor bottoms, and with interlayer it does not contacted with ground, and is safe in utilization.
Description of drawings
Fig. 1 is the floor covering layers schematic diagram of basement moistureproof and mildewproof device of the present invention.
Fig. 2 is the sectional view on the floor of basement moistureproof and mildewproof device of the present invention.
Fig. 3 is the circuit connection diagram of basement moistureproof and mildewproof device of the present invention.
The specific embodiment
See also shown in the accompanying drawing 1, and in conjunction with the accompanying drawings shown in 2, basement moistureproof and mildewproof device of the present invention comprises polylith floor 1, heat preservation line 2, interlayer 3 and controller (not shown); Composite floor board can be adopted in floor 1; the thickness on floor 1 is approximately 12mm; width is approximately 4cm; 1 bottom interval is offered two grooves 11 on the floor; the width of groove 11 is greatly between 1-3mm; heat preservation line 2 just is stuck in the groove 11; between ground and floor 1, lay one deck interlayer 3; to completely cut off ground because of the moist moisture that produces; played insulation effect on the one hand; the effect of protection heat preservation line 2 is also arranged on the other hand; interlayer 3 can adopt the foamed plastics of thin layer; heat preservation line 2 can adopt heating cable; the controller (not shown) is connected by the two ends of lead with heat preservation line 2; the controller (not shown) is placed on the floor 1, and the temperature pick up (not shown) of controller (not shown) and humidity sensor (not shown) contact with floor 1, so that measure the temperature and humidity on the floor 1 more accurately.
See also shown in the accompanying drawing 3, controller 4 comprises temperature pick up 41, humidity sensor 42, damp-warm syndrome degree controller 43 and power supply 44; Temperature pick up 41, humidity sensor 42 and heat preservation line 2 are connected with damp-warm syndrome degree controller 43 respectively, and power supply 44 is connected with damp-warm syndrome degree controller 43 and heat preservation line 2 respectively.
Mould generate to need three conditions, 1, temperature between 24-28 ℃, 2, humidity is more than 70%, 3, more than the continuous 1-2 of time days,, eliminate one of them condition that mould generates as long as temperature and humidity is controlled well, mould also just is difficult for having generated so.
The operating principle of basement moistureproof and mildewproof device of the present invention is, when interior temperature below 20 ℃, and humidity was greater than 70% o'clock, damp-warm syndrome degree controller 43 control heat preservation lines 2 are started working, and promptly this device is started working, and at this moment floor 1 surface temperature promptly begins to have the performance that raises, when the temperature of heat preservation line 2 surpasses 45 ℃, 2 outages of damp-warm syndrome degree controller 43 control heat preservation lines, this device quits work, and following table is the meter of the relation of working time of heat preservation line 2 and floor 1 temperature:
| The heating layer working time (minute) | 2 | 5 | 10 | 30 | 50 |
| The ground plate temperature | 15 | 17 | 19 | 20 | 20 |
The using method of basement moistureproof and mildewproof device of the present invention is; heat preservation line 2 is arranged in the groove 11 of every floor 1 bottom; with interlayer 3 ground and floor 1 are separated; both heat insulation floor 1; simultaneously also protect heat preservation line 2 not to be damaged, and be connected with controller 4 by lead, by the difference of ambient temperature and humidity at the two ends of heat preservation line 2; not grow mold of floor 1 is guaranteed in the work of damp-warm syndrome degree controller 43 control heat preservation lines 2.
In sum, basement moistureproof and mildewproof device little power consumption of the present invention is saved the energy; The present invention shop is not owing to need in advance any processing to be done on ground, as long as smooth, it is convenient to lay; The present invention is convenient to implement because material requested is cheap, and is economical and practical; The present invention is because during the heat preservation device is arranged in the groove of floor bottoms, and with interlayer it does not contacted with ground, and is safe in utilization.
Claims (6)
1. a basement moistureproof and mildewproof device is characterized in that: comprise polylith floor, heat preservation line, interlayer and controller;
The bottom on described floor is provided with two grooves at interval, and described heat preservation line is separately positioned in two grooves;
Described interlayer is laid between ground and the floor;
The two ends of described heat preservation line are connected with controller;
Described controller comprises temperature pick up, humidity sensor, damp-warm syndrome degree controller and power supply; Described temperature pick up, humidity sensor and heat preservation line are connected with damp-warm syndrome degree controller respectively, and power supply is connected with damp-warm syndrome degree controller and heat preservation line respectively.
2. basement moistureproof and mildewproof device according to claim 1, it is characterized in that: described floor is a composite floor board, the ground plate thickness is 12mm.
3. basement moistureproof and mildewproof device according to claim 1 is characterized in that: described heat preservation line is a heating cable.
4. basement moistureproof and mildewproof device according to claim 1 is characterized in that: the wide 1-3mm of the groove of described floor bottoms.
5. basement moistureproof and mildewproof device according to claim 1, it is characterized in that: described interlayer is a foamed plastics.
6. basement moistureproof and mildewproof device according to claim 1 is characterized in that: described controller is placed on the indoor one jiao floor, and temperature pick up and humidity sensor contact with the floor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101973820A CN102041891A (en) | 2009-10-20 | 2009-10-20 | Moistureproof mildewproof device for basement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101973820A CN102041891A (en) | 2009-10-20 | 2009-10-20 | Moistureproof mildewproof device for basement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102041891A true CN102041891A (en) | 2011-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101973820A Pending CN102041891A (en) | 2009-10-20 | 2009-10-20 | Moistureproof mildewproof device for basement |
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| Country | Link |
|---|---|
| CN (1) | CN102041891A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105544930A (en) * | 2016-02-03 | 2016-05-04 | 蒋鹏 | Floor pavement structure of compound sensor array and information transmitting system |
-
2009
- 2009-10-20 CN CN2009101973820A patent/CN102041891A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105544930A (en) * | 2016-02-03 | 2016-05-04 | 蒋鹏 | Floor pavement structure of compound sensor array and information transmitting system |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110504 |