CN105524425A - Heat conduction epoxy resin composite material used for 3D printing, and preparation method thereof - Google Patents
Heat conduction epoxy resin composite material used for 3D printing, and preparation method thereof Download PDFInfo
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- CN105524425A CN105524425A CN201510990872.1A CN201510990872A CN105524425A CN 105524425 A CN105524425 A CN 105524425A CN 201510990872 A CN201510990872 A CN 201510990872A CN 105524425 A CN105524425 A CN 105524425A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/02—Making granules by dividing preformed material
- B29B9/06—Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/16—Auxiliary treatment of granules
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a heat conduction epoxy resin composite material used for 3D printing. The composite material comprises, by weight, 80-85 parts of epoxy resin, 70-80 parts of ethanol, 15-20 parts of beta-silicon carbide, 1.0-1.8 parts of oxidized polyethylene wax, 0.6-0.9 parts of methyl cellulose and 0.15-0.20 parts of a silane coupling agent. Modified beta-silicon carbide is added to the epoxy resin by using the thermoplastic treatment ability of the epoxy resin and the fluidity in a molten state, so the heat conduction performance of the epoxy resin composite material is enhanced, the poor heat conduction performance of a common epoxy resin material is overcome, and more choices are provided for a 3D printing material. The invention also discloses a preparation method of the heat conduction epoxy resin composite material. The preparation method has the advantages of simplicity, low cost, safety, environmental protection and market application prospect.
Description
Technical field
The invention belongs to 3D and print manufacture field, be specifically related to a kind of heat-conduction epoxy resin composite material for 3D printing and preparation method thereof.
Background technology
3D printing technique is that a kind of with traditional material processing method is completely contradicted, based on three-dimensional CAD model data, by increasing the mode that material successively manufactures.It adopts and directly manufactures the manufacture method with the on all four three dimensional physical solid model of corresponding mathematics model.As an emerging technology of manufacture field, 3D printing technique has achieved significant progress, but consumptive material has but become the key factor of current restriction 3D printing technique widespread use.
China Patent Publication No. is that CN103992473A discloses and a kind ofly can be used for sticky nylon powder of heat conduction height that 3D prints and preparation method thereof, the method by amide salt 100 weight part, graphite 1 ~ 50 weight part; Catalyzer 0.02 ~ 0.8 weight part; Molecular weight regulator 5 ~ 30 weight part; Molecular chain stablizer 0.01 ~ 1 weight part; Oxidation inhibitor 0.1-1 weight part, polyreaction obtains the sticky nylon powder of heat conduction height that can be used for 3D and print.Prepared by the method can be used for, and the sticky nylon powder of heat conduction height that 3D prints has product size good stability, thermal conductivity is high, the field such as heat energy utilization and chemical industry heat exchange can be met to high-performance and the demand of baroque heat-conductive composite material, but because its starting material use amide salt material, the mechanical property of amide salt is poor, therefore the mechanical property of goods is poor.
China Patent Publication No. is that CN103980484A discloses a kind of heat-conducting polymer amount nylon powder and preparation method thereof that can be applicable to 3D and print, and the method utilizes lactam monomers to be 100 weight parts; Graphite is 1 ~ 50 weight part; Basic catalyst is 0.005 ~ 1 weight part; Activator is 0.01 ~ 2 weight part; Oxidation inhibitor is 0.1-1 weight part, the heat-conducting polymer amount nylon powder that can be applicable to 3D and print is obtained through polyreaction, what the method obtained can be applicable to, and heat-conducting polymer amount nylon powder that 3D prints has product size good stability, the feature that thermal conductivity is high, but due to the method complicated process of preparation, production cost is higher.
China Patent Publication No. is the preparation method that CN104291338A discloses that a kind of three D print rapid shaping nm-class silicon carbide material, the method has following steps: (1) nanometer silicon carbide pre-treatment: by the APTES of 5% ~ 15% and the nanometer silicon carbide of 85% ~ 95%, grinding at room temperature 2 ~ 6h, obtains pre-treatment nanometer silicon carbide; (2) preparation of rapid shaping nm-class silicon carbide material: by 60% ~ 75% dehydrated alcohol and 20% ~ 35% pre-treatment nanometer silicon carbide, under ice bath, ultrasonic reaction 4-6h, add the diphenylol propane glycidyl ether of 2% ~ 10% again, be uniformly mixed, be placed in 50 ± 3 DEG C of constant temperature, reaction 8 ~ 14h, spraying dry, obtains rapid shaping nm-class silicon carbide material.It is simple that the method has preparation technology, and condition is easy to control, and production cost is low, is easy to the feature of suitability for industrialized production, but the method does not well utilize the heat conductivility of silicon carbide.
And silicon carbide is as one of numerous printed material, it is a kind of water white crystal, because impurities is different, and in pale yellow, green, blue and even black, silicon carbide is divided into six sides or rhombohedral alpha-silicon carbide and cubical silicon B-carbide because crystalline structure is different, alpha-silicon carbide is due to the difference and form different variant of putting in order of carbon atom in its crystalline structure and Siliciumatom; The features such as silicon B-carbide has excellent thermal conductivity, electroconductibility, hardness is high, toughness is strong, wear-resistant and high temperature resistant; In addition, epoxy resin has that mechanical property is excellent, electrical insulation capability is good, chemical stability is good, shrinking percentage is low, forming process is easy and the advantage such as with low cost.Utilize the thermal conductivity of silicon carbide, add in epoxy resin, then can obtain and print for 3D the epoxide resin material possessing thermal conductivity.But silicon carbide is bad dispersibility in the epoxy, not easily mix, therefore, general silicon carbide and epoxy resin composite material cannot directly apply in 3D printing technique, therefore develop a kind of epoxy resin composite material with excellent thermal conductivity newly to make up the deficiency of existing 3D printed material, to promoting that the development of 3D printing technique is significant.
Summary of the invention
The object of the invention: in order to overcome the deficiencies in the prior art, the invention provides a kind of heat-conduction epoxy resin composite material for 3D printing technique and preparation method thereof.
The technical solution used in the present invention: in order to solve the problem, provides a kind of heat-conduction epoxy resin composite material printed for 3D, is made up of the following material comprising silicon B-carbide:
Epoxy resin 80-85
Ethanol 70-80
Silicon B-carbide 15-20
Oxidized polyethlene wax 1.0-1.8
Methylcellulose gum 0.6-0.9
Silane coupling agent 0.15-0.20
Namely be made up of epoxy resin, ethanol, silicon B-carbide, oxidized polyethlene wax, methylcellulose gum, silane coupling agent.Epoxy resin has that mechanical property is excellent, electrical insulation capability is good, chemical stability is good, shrinking percentage is low, forming process is easy and the advantage such as with low cost; Pure silicon carbide is a kind of water white crystal, because impurities is different, and in pale yellow, green, blue and even black, silicon carbide is divided into six sides or rhombohedral alpha-silicon carbide and cubical silicon B-carbide because crystalline structure is different, alpha-silicon carbide is due to the difference and form different variant of putting in order of carbon atom in its crystalline structure and Siliciumatom; The features such as silicon B-carbide has excellent thermal conductivity, electroconductibility, hardness is high, toughness is strong, wear-resistant and high temperature resistant, can transform and alpha-silicon carbide 2100 DEG C time; Utilize the thermal conductivity of silicon B-carbide excellence and good mechanical property, add in epoxy resin, be used for obtaining the epoxy resin composite material possessing excellent heat conductivity printed for 3D, and with low cost, hardness is high, toughness is strong, wear-resistant, mechanical property is excellent, chemical stability is good, be highly suitable in 3D printing technique.
Further, described epoxy resin is phenolic aldehyde multi-epoxy resin.
Further, described silicon B-carbide is staple fibre silicon B-carbide, and length-to-diameter ratio is between 10:1 and 20:1, and particle diameter, between 50 nanometers and 100 nanometers, obtains via containing mix and blend modification in the ethanolic soln of silane coupling agent.
The above-mentioned preparation method printing heat-conduction epoxy resin composite material for 3D, comprises the following steps:
(1) be that the silicon B-carbide of 15-20 adds ethanol that weight part is 70-80 and weight part is in the silane coupling agent mixing solutions of 0.15-0.20 by weight part, mix and blend modification in homogenizer, pH value 4.0-4.5, stirrer rotating speed is 1500-1800rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.0-1.8 by the silicon B-carbide of step (2) gained and weight part, and weight part is that the methylcellulose gum of 0.6-0.9 adds in the epoxy resin of melting, the parts by weight of epoxy resin are 80-85; Mix and blend in adition process, agitator speed is 180-300rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 80-120rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
Principle of the present invention: utilize silane coupling agent to silicon B-carbide modification, solve the feature of silicon B-carbide bad dispersibility in the epoxy, add the epoxy resin mixing extruding pelletization of softening agent methylcellulose gum and lubricant oxidation polyethylene wax and melting again, the feature of the thermal conductivity utilizing silicon B-carbide excellent, makes the 3D printing composite material obtained possess excellent thermal conductivity.Utilize on the other hand the mobility under the thermoplastic processibility of epoxy resin and molten state, make 3D print heat-conduction epoxy resin composite material and possess mobility in a heated state, also can be fast curing-formed under the state of cooling, meet the requirement of fusion sediment and 3D printing completely.When utilizing fusion sediment 3D printing device to print this matrix material, the heating installation being positioned at printhead can make material molten thus possess mobility; After file printing leaves printhead, envrionment temperature declines, and the quick cooling curing of the epoxy resin in material is shaping.
Outstanding feature of the present invention and beneficial effect are:
(1) mainly utilize modified nanometer silicon B-carbide, the heat-conduction epoxy resin composite material being used in 3D printing has excellent thermal conductivity and heating flow, and it is more accurate to make 3D print product size.
(2) fusion sediment 3D printing device can be allowed to make heat-conduction epoxy resin composite material three-dimensional structure product, described heat-conduction epoxy resin composite material for 3D printing and preparation method thereof has enriched 3D printed material kind, has expanded 3D print application field.
(3) production technique of the present invention is simple, and with low cost, safety and environmental protection, has higher market application foreground.
Table one performance heat conductivility contrast of the present invention.
| Kind | Thermal conductivity W/ (mK) |
| Epoxy resin | 0.16-0.22 |
| Heat-conduction epoxy resin composite material | 0.78-1.16 |
Embodiment
Be further described the present invention according to specific embodiment below, the following stated is only the preferred embodiment of the present invention, and under same principle, can make part and improve, these improvement also belong in protection scope of the present invention:
Embodiment 1:
A kind of heat-conduction epoxy resin composite material printed for 3D:
(1) by weight part be 15 silicon B-carbide add weight part be 70 ethanol and weight part be in the silane coupling agent mixing solutions of 0.15, mix and blend modification in homogenizer, pH value 4.0, stirrer rotating speed is 1500rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.0 by the silicon B-carbide of step (2) gained and weight part, and weight part be 0.6 methylcellulose gum add in the o-cresol formaldehyde epoxy resin of melting, the parts by weight of o-cresol formaldehyde epoxy resin are 85; Mix and blend in adition process, agitator speed is 240rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 90rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
Embodiment 2:
A kind of heat-conduction epoxy resin composite material printed for 3D:
(1) by weight part be 20 silicon B-carbide add weight part be 80 ethanol and weight part be in the silane coupling agent mixing solutions of 0.20, mix and blend modification in homogenizer, pH value 4.2, stirrer rotating speed is 1800rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.8 by the silicon B-carbide of step (2) gained and weight part, and weight part be 0.9 methylcellulose gum add in the p-Hydroxybenzaldehyde resol of melting, the parts by weight of p-Hydroxybenzaldehyde resol are 80; Mix and blend in adition process, agitator speed is 240rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 120rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
Embodiment 3:
A kind of heat-conduction epoxy resin composite material printed for 3D:
(1) by weight part be 17 silicon B-carbide add weight part be 78 ethanol and weight part be in the silane coupling agent mixing solutions of 0.16, mix and blend modification in homogenizer, pH value 4.1, stirrer rotating speed is 1800rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.4 by the silicon B-carbide of step (2) gained and weight part, and weight part be 0.8 methylcellulose gum add in the phenyl aldehyde novolac epoxy of melting, the parts by weight of phenyl aldehyde epoxy novolac tree are 83; Mix and blend in adition process, agitator speed is 300rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 80rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
Embodiment 4:
A kind of heat-conduction epoxy resin composite material printed for 3D:
(1) by weight part be 18 silicon B-carbide add weight part be 80 ethanol and weight part be in the silane coupling agent mixing solutions of 0.20, mix and blend modification in homogenizer, pH value 4.5, stirrer rotating speed is 1500rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.8 by the silicon B-carbide of step (2) gained and weight part, and weight part be 0.7 methylcellulose gum add in the o-cresol formaldehyde epoxy resin of melting, the parts by weight of o-cresol formaldehyde epoxy resin are 82; Mix and blend in adition process, agitator speed is 240rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 90rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
Embodiment 5:
A kind of heat-conduction epoxy resin composite material printed for 3D:
(1) by weight part be 16 silicon B-carbide add weight part be 70 ethanol and weight part be in the silane coupling agent mixing solutions of 0.16, mix and blend modification in homogenizer, pH value 4.1, stirrer rotating speed is 1500rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.1 by the silicon B-carbide of step (2) gained and weight part, and weight part be 0.7 methylcellulose gum add in the p-Hydroxybenzaldehyde resol of melting, the parts by weight of p-Hydroxybenzaldehyde resol are 84; Mix and blend in adition process, agitator speed is 240rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 80rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
Claims (4)
1., for the heat-conduction epoxy resin composite material that 3D prints, it is characterized in that: be made up of with weight part the following material comprising silicon B-carbide:
Epoxy resin 80-85
Ethanol 70-80
Silicon B-carbide 15-20
Oxidized polyethlene wax 1.0-1.8
Methylcellulose gum 0.6-0.9
Silane coupling agent 0.15-0.20.
2. the heat-conduction epoxy resin composite material printed for 3D according to claim 1, is characterized in that: described epoxy resin is phenolic aldehyde multi-epoxy resin.
3. the heat-conduction epoxy resin composite material printed for 3D according to claim 1, it is characterized in that: described silicon B-carbide is staple fibre silicon B-carbide, length-to-diameter ratio is between 10:1 and 20:1, and particle diameter is between 50 nanometers and 100 nanometers.
4. the method for the preparation heat-conduction epoxy resin composite material for 3D printing according to claim 1, is characterized in that: comprise the following steps:
(1) be that the silicon B-carbide of 15-20 adds ethanol that weight part is 70-80 and weight part is in the silane coupling agent mixing solutions of 0.15-0.20 by weight part, mix and blend modification in homogenizer, pH value 4.0-4.5, stirrer rotating speed is 1500-1800rpm, whipping temp 80 DEG C, churning time 4 hours;
(2) the silicon B-carbide mixing solutions of step (1) gained is carried out suction filtration, the silicon B-carbide after suction filtration puts into baking oven dry 24 hours;
(3) be the oxidized polyethlene wax of 1.0-1.8 by the silicon B-carbide of step (2) gained and weight part, and weight part is that the methylcellulose gum of 0.6-0.9 adds in the epoxy resin of melting, the parts by weight of epoxy resin are 80-85; Mix and blend in adition process, agitator speed is 180-300rpm, mixing time 30 minutes;
(4) epoxy resin composite material of step (3) gained being sent into length-to-diameter ratio is extruding pelletization in the twin screw extruder of 36:1, forcing machine rotating speed is 80-120rpm, and forcing machine each section of temperature is: feeding section 180-190 DEG C, melt zone 190-200 DEG C, mixing section 195-210 DEG C, exhaust section 195-205 DEG C, homogenizing zone 185-195 DEG C; The obtained required heat-conduction epoxy resin composite material printed for 3D.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105820509A (en) * | 2016-05-09 | 2016-08-03 | 李红玉 | Polymer material used for 3D printing and preparing method thereof |
| CN105924945A (en) * | 2016-05-09 | 2016-09-07 | 李红玉 | Composition for 3D printing and preparing method thereof |
| CN106009351A (en) * | 2016-06-28 | 2016-10-12 | 华蓥市高科德电子科技有限公司 | High-molecular polymer material for 3D printing and preparing method thereof |
| CN106243635A (en) * | 2016-07-29 | 2016-12-21 | 华蓥友达精密模具制造有限公司 | A kind of 3D printed material with anti-mildew antibacterial functions |
| CN107446314A (en) * | 2017-09-07 | 2017-12-08 | 王明江 | A kind of 3D printing material that image souvenir is made for photo studio |
| CN110804309A (en) * | 2019-11-18 | 2020-02-18 | 安徽弘泰精密机械科技有限公司 | 3D printing polymer powder material and preparation method thereof |
| CN115216119A (en) * | 2022-07-05 | 2022-10-21 | 上海冷盟精密电机有限公司 | Epoxy resin composite material and preparation method thereof |
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| CN104291338A (en) * | 2014-09-10 | 2015-01-21 | 济南大学 | Preparation method of rapid-prototyping nano-silicon carbide material for 3D printing |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105820509A (en) * | 2016-05-09 | 2016-08-03 | 李红玉 | Polymer material used for 3D printing and preparing method thereof |
| CN105924945A (en) * | 2016-05-09 | 2016-09-07 | 李红玉 | Composition for 3D printing and preparing method thereof |
| CN106009351A (en) * | 2016-06-28 | 2016-10-12 | 华蓥市高科德电子科技有限公司 | High-molecular polymer material for 3D printing and preparing method thereof |
| CN106243635A (en) * | 2016-07-29 | 2016-12-21 | 华蓥友达精密模具制造有限公司 | A kind of 3D printed material with anti-mildew antibacterial functions |
| CN107446314A (en) * | 2017-09-07 | 2017-12-08 | 王明江 | A kind of 3D printing material that image souvenir is made for photo studio |
| CN110804309A (en) * | 2019-11-18 | 2020-02-18 | 安徽弘泰精密机械科技有限公司 | 3D printing polymer powder material and preparation method thereof |
| CN115216119A (en) * | 2022-07-05 | 2022-10-21 | 上海冷盟精密电机有限公司 | Epoxy resin composite material and preparation method thereof |
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Application publication date: 20160427 |