CN105514554A - Inverted microstrip line structure suitable for high power transmission - Google Patents
Inverted microstrip line structure suitable for high power transmission Download PDFInfo
- Publication number
- CN105514554A CN105514554A CN201610005604.4A CN201610005604A CN105514554A CN 105514554 A CN105514554 A CN 105514554A CN 201610005604 A CN201610005604 A CN 201610005604A CN 105514554 A CN105514554 A CN 105514554A
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- China
- Prior art keywords
- microstrip line
- conductor
- power transmission
- high power
- line structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/082—Multilayer dielectric
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- Waveguide Aerials (AREA)
- Waveguides (AREA)
Abstract
Provided is an inverted microstrip line structure suitable for high power transmission, relating to the radio frequency transmission technical field, and comprising an insulating medium 1 and a grounding conductor 4 vertically spaced; the lower surface of the insulating medium 1 is provided with a conductor 2. The lower surface of the conductor 2 is provided with a high radiant ratio coating 3; the upper surface of the grounding conductor 4 is provided with a high absorptivity coating 5. Compared with the prior art, the inverted microstrip line structure can reduce microstrip line loss, and meanwhile effectively improve a heat dissipation capability, possesses the characteristic of low cost and simple structure, and is suitable for high power transmission.
Description
Technical field
The present invention relates to radio frequency transmission technical field, be particularly applicable to the inversion microstrip line construction of high power transmission.
Background technology
In broadcast with in the system such as to communicate, the transmission of radio-frequency power is the problem of a core.RF power adopts radio-frequency transmission line usually, and now widely used radio frequency transmission line structure has coaxial line, microstrip line, strip line etc., and wherein coaxial line is not planar structure transmission line, is generally used for the transmission of machine external power.In the transmission of machine internal power, conventional transmission line is the microstrip line as Fig. 1 and the strip line as Fig. 2.
Microstrip line and strip line respectively have quality.Microstrip line construction is simple, easy to make, size is little lightweight, and ripe PCB technology can be used to manufacture, and therefore precision is higher, cost is very low, but can only bear small power transmission, and loss is also larger.Strip line is then on the contrary, and can bear high power transmission, loss is very little, but complex structure, making difficulty, size and weight are very large, manufacturing cost is very high.As a whole, for cost size and considering of being easy to produce in batches, the application of present microstrip line is more and more extensive, but is still confined to low-power applications, and power bearing ability is confined to below 200W mostly.Have to use strip lines configuration in middle high-power applications, considerably increase cost.
The main cause that microstrip line loss is larger is dielectric loss and the conductor losses that the existence of dielectric adds transmission line.In prior art, improving in order to the one reducing microstrip line loss is adopt to be inverted microstrip line construction, as shown in Figure 3.In inversion microstrip structure, most of electric field exists with air layer, therefore greatly reduces loss.But the conductor belt line being inverted microstrip structure is covered by dielectric 1 and earthing conductor 4, dispels the heat more difficult.Therefore, be inverted microstrip structure and can not significantly promote high power transmission ability.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the object of this invention is to provide a kind of inversion microstrip line construction being applicable to high power transmission.It effectively can improve heat-sinking capability while the loss of reduction microstrip line, has the simple feature of the low structure of cost, is applicable to high power transmission.
In order to reach foregoing invention object, technical scheme of the present invention realizes as follows:
Be applicable to an inversion microstrip line construction for high power transmission, it comprises the dielectric 1 and earthing conductor 4 that are spaced apart up and down, and dielectric 1 lower surface is equipped with conductor 2.Its design feature is, described conductor 2 lower surface is equipped with high emissivity coatings 3, and earthing conductor 4 upper surface is equipped with high-absorbility coating 5.
The present invention, owing to adopting said structure, adds the face coat of high radiant rate, high-absorbility, high surface resistance, utilizes heat loss through radiation principle, effectively improves the radiating condition being inverted microstrip line.Power capacity is large, temperature rise is low, the simple advantage of structure to use the microstrip transmission line of structure of the present invention to have, and can be widely used in the high-power RF application such as TV and radio emission machine, communication base station, radar.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Accompanying drawing explanation
Fig. 1 is the structural representation of microstrip line in prior art;
Fig. 2 is the structural representation of strip line in prior art;
Fig. 3 is the structural representation being inverted microstrip line in prior art;
Fig. 4 is structural representation of the present invention.
Embodiment
Referring to Fig. 4, the present invention is applicable to the inversion microstrip line construction of high power transmission, and it comprises the dielectric 1 and earthing conductor 4 that are spaced apart up and down, and dielectric 1 lower surface is equipped with conductor 2.Conductor 2 lower surface is equipped with high emissivity coatings 3, and earthing conductor 4 upper surface is equipped with high-absorbility coating 5.
In structure of the present invention, be inverted due to the heat that loss produces on microstrip line conductor 2, radiate by high emissivity coatings 3, the high-absorbility coating 5 being grounded conductor 4 surface absorbed, and realizes good heat radiation.
The present invention is through actual measurement, and during transmission 3KW radio-frequency power, the surface temperature of being inverted microstrip line drops to 90 degree by 150 degree, can meet the requirement of long-time steady operation completely.
Heat loss through radiation structure of the present invention both may be used for uniform transmission line, also can be applied in the radio-frequency (RF) component such as distributor, synthesizer, filter.
Claims (1)
1. one kind is applicable to the inversion microstrip line construction of high power transmission, it comprises the dielectric (1) and earthing conductor (4) that are spaced apart up and down, dielectric (1) lower surface is equipped with conductor (2), it is characterized in that, described conductor (2) lower surface is equipped with high emissivity coatings (3), and earthing conductor (4) upper surface is equipped with high-absorbility coating (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610005604.4A CN105514554A (en) | 2016-01-07 | 2016-01-07 | Inverted microstrip line structure suitable for high power transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610005604.4A CN105514554A (en) | 2016-01-07 | 2016-01-07 | Inverted microstrip line structure suitable for high power transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105514554A true CN105514554A (en) | 2016-04-20 |
Family
ID=55722353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610005604.4A Pending CN105514554A (en) | 2016-01-07 | 2016-01-07 | Inverted microstrip line structure suitable for high power transmission |
Country Status (1)
| Country | Link |
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| CN (1) | CN105514554A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112803132A (en) * | 2019-11-14 | 2021-05-14 | 中国科学院上海微***与信息技术研究所 | Transmission line structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11302545A (en) * | 1998-02-18 | 1999-11-02 | Nippon Mitsubishi Oil Corp | Silicone rubber composite |
| CN1192452C (en) * | 1999-03-31 | 2005-03-09 | 诺基亚网络公司 | Inverted microstrip transmission line integrated in a multilayers structure |
| CN201490315U (en) * | 2009-09-01 | 2010-05-26 | 鞍山市嘉惠广播电子技术有限公司 | Overhang micro-band structure |
| CN103081582A (en) * | 2010-08-31 | 2013-05-01 | 日东电工株式会社 | Heat-dissipating case and lithium battery pack using same, and semi-conducting tape for heat dissipation |
| CN204069617U (en) * | 2014-09-23 | 2014-12-31 | 常州信息职业技术学院 | A kind of electronic installation possessing heat-conducting piece |
| CN205319279U (en) * | 2016-01-07 | 2016-06-15 | 北京同方吉兆科技有限公司 | Invert microstrip line structure suitable for high -power transmission |
-
2016
- 2016-01-07 CN CN201610005604.4A patent/CN105514554A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11302545A (en) * | 1998-02-18 | 1999-11-02 | Nippon Mitsubishi Oil Corp | Silicone rubber composite |
| CN1192452C (en) * | 1999-03-31 | 2005-03-09 | 诺基亚网络公司 | Inverted microstrip transmission line integrated in a multilayers structure |
| CN201490315U (en) * | 2009-09-01 | 2010-05-26 | 鞍山市嘉惠广播电子技术有限公司 | Overhang micro-band structure |
| CN103081582A (en) * | 2010-08-31 | 2013-05-01 | 日东电工株式会社 | Heat-dissipating case and lithium battery pack using same, and semi-conducting tape for heat dissipation |
| CN204069617U (en) * | 2014-09-23 | 2014-12-31 | 常州信息职业技术学院 | A kind of electronic installation possessing heat-conducting piece |
| CN205319279U (en) * | 2016-01-07 | 2016-06-15 | 北京同方吉兆科技有限公司 | Invert microstrip line structure suitable for high -power transmission |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112803132A (en) * | 2019-11-14 | 2021-05-14 | 中国科学院上海微***与信息技术研究所 | Transmission line structure |
| CN112803132B (en) * | 2019-11-14 | 2023-04-25 | 中国科学院上海微***与信息技术研究所 | Transmission line structure |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160420 |