CN105514007A - Feeding mechanism of LED die bonder - Google Patents
Feeding mechanism of LED die bonder Download PDFInfo
- Publication number
- CN105514007A CN105514007A CN201510885345.4A CN201510885345A CN105514007A CN 105514007 A CN105514007 A CN 105514007A CN 201510885345 A CN201510885345 A CN 201510885345A CN 105514007 A CN105514007 A CN 105514007A
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- Prior art keywords
- assembly
- conveying assembly
- clamp assemblies
- feed mechanism
- motor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention discloses a feeding mechanism of an LED die bonder. The feeding mechanism comprises a loading assembly, a conveying assembly, a clamping assembly and a material recovering assembly. The clamping assembly is arranged on the conveying assembly. The clamping assembly is capable of conducting the linear reciprocating motion along the conveying assembly. Meanwhile, the clamping assembly is capable of rotating along the vertical direction. The loading assembly and the material recovering assembly are arranged on the same side of the conveying assembly and are respectively arranged at the two ends of the conveying assembly. The feeding mechanism is reasonable in structure, and can be applied to the machining process of a dual-head LED bracket. Meanwhile, the waste is reduced and the feeding mechanism can be arranged additionally on original equipment.
Description
Technical field
The invention belongs to LED apparatus field, more specifically relate to LED bonder feed mechanism.
Background technology
Current domestic LED bonder mainly carries out die bond operation for the LED support of single head, corresponding bonder is not also had to occur on the double end LED support market after improvement, the input of the production equipment before also needing to take into account, preferably can improve in original bonder.
Summary of the invention
In order to solve the problem, the invention provides a kind of rational in infrastructure, can be applicable to the processing of double end LED support, cut the waste, the LED bonder feed mechanism that can be installed on existing equipment.
According to an aspect of the present invention, comprise loading assemblies, conveying assembly, clamp assemblies and rewinding assembly, clamp assemblies is installed on conveying assembly, described clamp assemblies can do straight reciprocating motion along conveying assembly, clamp assemblies can vertically rotate, loading assemblies and rewinding assembly are installed on the same side of conveying assembly, loading assemblies and rewinding assembly apportion conveying assembly two ends, the commutation of double end LED support can be realized by the rotation of clamp assemblies, carry out two ends die bond operation respectively.
In some embodiments, loading assemblies comprises base, material supporting rack, material loading push rod and the first cylinder, and material supporting rack and the first cylinder are all installed on base, and material loading push rod is fixedly connected with the first cylinder, material supporting rack and conveying assembly perpendicular, be convenient to LED support to be pushed on clamp assemblies.
In some embodiments, conveying assembly comprises line rail, screw mandrel, slide, the first motor and feed screw nut's seat, motor is fixedly connected with screw mandrel one end, screw mandrel two ends are provided with screw mandrel mount pad, and feed screw nut's cover for seat is located on screw mandrel, and the sheathed online rail of slide is fixedly connected with feed screw nut's seat, slide is installed with clamp assemblies, be convenient to quick response, precise motion, increase work efficiency.
In some embodiments, clamp assemblies comprises magnetic holding device, the first cylinder and the second motor, the first cylinder is provided with the second motor, and the second motor is fixedly connected with magnetic holding device, is convenient to LED support and adsorbs fixing automatically.
In some embodiments, magnetic holding device can under the second motor effect vertically rotating 360 degrees, be convenient to the commutation realizing double end LED support.
In some embodiments, rewinding assembly comprises mount pad, rewinding bar and electromagnetic adsorption device, and rewinding bar and electromagnetic adsorption device are installed on mount pad, realizes rewinding assembly automatic material receiving when being convenient to machine.
In some embodiments, clamp assemblies can stop at conveying assembly two ends, is convenient to the carrying out of automatic charging and blanking.
In some embodiments, clamp assemblies stops in conveying assembly one end, and material supporting rack is right against clamp assemblies, and clamp assemblies stops at the conveying assembly other end, and rewinding bar, just to clamp assemblies, is convenient to the carrying out of automatic charging and blanking.
The beneficial effect of LED bonder feed mechanism of the present invention is: the present invention is rational in infrastructure, can be applicable to the processing of double end LED support, cut the waste, can be installed on existing equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of LED bonder of the present invention feed mechanism;
Fig. 2 is the feed mechanism structural representation of a kind of LED bonder of the present invention feed mechanism;
Fig. 3 is conveying assembly and the clamp assemblies structural representation of a kind of LED bonder of the present invention feed mechanism.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
As shown in Figure 1, a kind of LED bonder feed mechanism of an execution mode of the present invention comprises loading assemblies 1, conveying assembly 2, clamp assemblies 3 and rewinding assembly 4.Loading assemblies 1 is installed on the side of conveying assembly 2, and perpendicular with conveying assembly 2, and loading assemblies 1 is installed on conveying assembly 2 one end and is not connected with between conveying assembly 2.Rewinding assembly 4 is installed on the side of conveying assembly 2, and with loading assemblies 1 homonymy, be positioned at the other end of the total assembly 2 of Shu, be not connected with between conveying assembly 2.Clamp assemblies 3 is installed on conveying assembly 2, can do straight reciprocating motion along conveying assembly, and can be static at the two ends of conveying assembly 2.
Loading assemblies 1 comprises base 11, material supporting rack 12, material loading push rod 13 and the first cylinder 14, material supporting rack 12 is installed on base 11, material supporting rack 12 is at least provided with 2, material loading push rod 13 is fixedly connected with the first cylinder 14, first cylinder 14 fixedly mounts on the pedestal 11 by screw, material supporting rack 12, through the gap in the middle of LED support, promotes LED support by material loading push rod 13 and moves forward, near clamp assemblies 3.
As shown in Figure 2, conveying mechanism 2 comprises line rail 21, screw mandrel 22, slide 23, first motor 24 and feed screw nut's seat 25, first motor 24 is fixedly connected with screw mandrel 22, feed screw nut's seat 25 is set on screw mandrel 22, and be fixedly connected with slide 23, on the sheathed online rail 21 of slide 23, clamp assemblies 3 is fixedly mounted on slide 23.First motor 24 adopts servomotor, has response quick, mobile accurately a little.First motor 24 rotates, and drives screw mandrel 22 to rotate, thus drives feed screw nut's seat 25 to move, and then the slide 23 fixing with feed screw nut's seat 25 rail 21 along the line does rectilinear motion.Clamp assemblies 3 comprises magnetic holding device 31, second cylinder 32 and the second motor 33, magnetic holding device 31 is fixedly connected on the second motor 33, second motor 33 main shaft can drive magnetic holding device 31 vertically rotating 360 degrees when rotating, in order to realize the commutation of double end LED support, so that the processing of the other end.Second motor 33 is fixedly connected with the second cylinder 32, and when machining, the second cylinder 32 works the second motor 32 and magnetic holding device 31 driven forward, and magnetic holding device 31 is cut off the electricity supply, and packaged LED support is collected by rewinding assembly 4.
Rewinding assembly 4 comprises mount pad 41, rewinding bar 42 and electromagnetic adsorption device, and rewinding bar 42 and electromagnetic adsorption device are installed on mount pad 41.Rewinding bar 42 is provided with many, and optimum is two.
During concrete enforcement, clamp assemblies 3 is still in loading assemblies 1 one end, first double end LED support is positioned on material supporting rack 12, first cylinder 14 drives material loading push rod 13 to move and is pushed away forward by double end LED support, magnetic holding device 31 is energized, adsorb close double end LED support, the clamp assemblies 4 rail 21 king other end along the line moves, go out static being right against rewinding assembly 4, bonder starting point glue, die bond operation, after double end LED support one end all completes die bond operation, second motor 33 main shaft can drive magnetic holding device 31 vertically rotating 360 degrees when rotating, bonder starts the some glue of the double end LED support other end, after die bond operation completes, second cylinder 32 works the second motor 32 and magnetic holding device 31 driven forward, magnetic holding device 31 is cut off the electricity supply, packaged LED support is collected by rewinding assembly 4.
The present invention is rational in infrastructure, can be applicable to the processing of double end LED support, cut the waste, can be installed on existing equipment.
Above-described is only some embodiments of the present invention, it should be pointed out that for the person of ordinary skill of the art, and under the prerequisite not departing from creation design of the present invention, can also make other distortion and improve, these all belong to protection scope of the present invention.
Claims (8)
1.LED bonder feed mechanism, it is characterized in that, comprise loading assemblies (1), conveying assembly (2), clamp assemblies (3) and rewinding assembly (4), described clamp assemblies (3) is installed on conveying assembly (2), described clamp assemblies (3) can do straight reciprocating motion along conveying assembly, described clamp assemblies can vertically rotate, described loading assemblies (1) and rewinding assembly (4) are installed on the same side of conveying assembly (2), described loading assemblies (1) and rewinding assembly (4) apportion conveying assembly (2) two ends.
2. LED bonder feed mechanism according to claim 1, it is characterized in that, described loading assemblies (1) comprises base (11), material supporting rack (12), material loading push rod (13) and the first cylinder (14), described material supporting rack (12) and the first cylinder (14) are all installed on base (11), described material loading push rod (13) is fixedly connected with the first cylinder (14), and described material supporting rack (12) is perpendicular with conveying assembly (2).
3. LED bonder feed mechanism according to claim 2, it is characterized in that, described conveying assembly (2) comprises line rail (21), screw mandrel (22), slide (23), first motor (24) and feed screw nut's seat (26), described motor (24) is fixedly connected with screw mandrel one end, described screw mandrel (22) two ends are provided with screw mandrel mount pad (25), described feed screw nut's seat (26) is set on screw mandrel (22), the sheathed online rail (21) of described slide (23) is gone up and is fixedly connected with feed screw nut's seat (26), described slide (23) is installed with clamp assemblies (3).
4. LED bonder feed mechanism according to claim 3, it is characterized in that, described clamp assemblies (3) comprises, magnetic holding device (31), the second cylinder (32) and the second motor (33), described first cylinder (32) is provided with the second motor (33), and described second motor (33) is fixedly connected with magnetic holding device (31).
5. LED bonder feed mechanism according to claim 4, is characterized in that, described magnetic holding device (31) can under the second motor (33) effect vertically rotating 360 degrees.
6. LED bonder feed mechanism according to claim 1, it is characterized in that, described rewinding assembly (4) comprises mount pad (41), rewinding bar (42) and electromagnetic adsorption device (43), and described rewinding bar (42) and electromagnetic adsorption device (43) are installed on mount pad (41).
7. LED bonder feed mechanism according to claim 5, is characterized in that, described clamp assemblies (3) can stop at conveying assembly (2) two ends.
8. LED bonder feed mechanism according to claim 7, it is characterized in that, described clamp assemblies (3) stops in conveying assembly (2) one end, described material supporting rack (12) is right against clamp assemblies (3), described clamp assemblies (3) stops at conveying assembly (2) other end, and described rewinding bar (42) is just to clamp assemblies (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510885345.4A CN105514007A (en) | 2015-12-04 | 2015-12-04 | Feeding mechanism of LED die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510885345.4A CN105514007A (en) | 2015-12-04 | 2015-12-04 | Feeding mechanism of LED die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105514007A true CN105514007A (en) | 2016-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510885345.4A Pending CN105514007A (en) | 2015-12-04 | 2015-12-04 | Feeding mechanism of LED die bonder |
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| Country | Link |
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| CN (1) | CN105514007A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108100579A (en) * | 2017-12-15 | 2018-06-01 | 董桂芳 | A kind of LED bonders feed mechanism and feeding method |
| CN113207233A (en) * | 2020-02-03 | 2021-08-03 | 睿明科技股份有限公司 | Vertical substrate wet processing device |
| CN117153750A (en) * | 2023-10-30 | 2023-12-01 | 山东誉正自动化科技有限公司 | Double-rail feeding system and method for semiconductor packaging and die bonder of double-rail feeding system and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202292243U (en) * | 2011-07-18 | 2012-07-04 | 广州市精伦机电设备有限公司 | Feeding and discharging device of light-emitting diode (LED) welding wire machine or die bonder |
| CN202758860U (en) * | 2012-07-10 | 2013-02-27 | 深圳市新益昌自动化设备有限公司 | LED support delivery system of LED wire bonding machine |
| CN203367254U (en) * | 2013-07-31 | 2013-12-25 | 瑞安市明光灯饰有限公司 | Direct-insertion type LED lamp bead die-bonder discharging device |
| CN203367256U (en) * | 2013-07-31 | 2013-12-25 | 瑞安市明光灯饰有限公司 | Feeding device for direct insertion type LED lamp bead die bonder |
| US20150270151A1 (en) * | 2014-03-24 | 2015-09-24 | Ebara Corporation | Substrate processing apparatus and substrate tranfser method |
-
2015
- 2015-12-04 CN CN201510885345.4A patent/CN105514007A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202292243U (en) * | 2011-07-18 | 2012-07-04 | 广州市精伦机电设备有限公司 | Feeding and discharging device of light-emitting diode (LED) welding wire machine or die bonder |
| CN202758860U (en) * | 2012-07-10 | 2013-02-27 | 深圳市新益昌自动化设备有限公司 | LED support delivery system of LED wire bonding machine |
| CN203367254U (en) * | 2013-07-31 | 2013-12-25 | 瑞安市明光灯饰有限公司 | Direct-insertion type LED lamp bead die-bonder discharging device |
| CN203367256U (en) * | 2013-07-31 | 2013-12-25 | 瑞安市明光灯饰有限公司 | Feeding device for direct insertion type LED lamp bead die bonder |
| US20150270151A1 (en) * | 2014-03-24 | 2015-09-24 | Ebara Corporation | Substrate processing apparatus and substrate tranfser method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108100579A (en) * | 2017-12-15 | 2018-06-01 | 董桂芳 | A kind of LED bonders feed mechanism and feeding method |
| CN113207233A (en) * | 2020-02-03 | 2021-08-03 | 睿明科技股份有限公司 | Vertical substrate wet processing device |
| CN117153750A (en) * | 2023-10-30 | 2023-12-01 | 山东誉正自动化科技有限公司 | Double-rail feeding system and method for semiconductor packaging and die bonder of double-rail feeding system and method |
| CN117153750B (en) * | 2023-10-30 | 2024-01-30 | 山东誉正自动化科技有限公司 | Double-rail feeding system and method for semiconductor packaging and die bonder of double-rail feeding system and method |
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Application publication date: 20160420 |
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