CN105510338A - Solder paste and red glue detection method - Google Patents
Solder paste and red glue detection method Download PDFInfo
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- CN105510338A CN105510338A CN201610006205.XA CN201610006205A CN105510338A CN 105510338 A CN105510338 A CN 105510338A CN 201610006205 A CN201610006205 A CN 201610006205A CN 105510338 A CN105510338 A CN 105510338A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/845—Objects on a conveyor
- G01N2021/8455—Objects on a conveyor and using position detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8861—Determining coordinates of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
- G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a solder paste and red glue detection method. The method is mainly related to an image acquisition module, an image processing module, a comparison image storing module and a display module, wherein the image acquisition module is used for acquiring the image of a circuit board to be detected, the image processing module is used for analyzing and processing the acquired image so as to judge whether the circuit board is qualified, and the display module is used for displaying the result of analyzing and processing of the acquired image. The amount of solder paste and red glue and the offset degree of red glue can be automatically judged, and the result can be displayed through the display module; meanwhile, a coordinate analyzing and marking module is additionally arranged, and the coordinates and image of a defective area can be displayed in the display module at the same time when a defective product is found through detection, so that workers can find the defective area on the circuit board quickly and then conduct subsequent reprocessing; in this way, detection efficiency is improved, and the time for workers to find the defective area on the defective product is shortened.
Description
Technical field
The present invention relates to the detection of tin cream on pcb board and red glue, particularly tin cream, red glue detection method.
Background technology
Along with surface mounting technology (SurfaceMountedTechnology, SMT) development, in circuit board (PrintedCircuitBoard), the element of assembling is more and more less, element packaging density is increasing, solder joint becomes more and more less, at circuit board in manufacturing process, usually print solder paste and red glue is needed, but tin cream, it has been a undisputable fact that red glue printing-flow can produce a lot of defect, therefore, judge tin cream, the number of red glue is the important indicator judging quality of welding spot and reliability thereof with the drift rate of red glue, but, manual detection is the high and inefficiency of error rate not only, therefore, need to provide a kind of method can to tin cream, the number of red glue detects automatically with the drift rate of red glue.
Summary of the invention
The technical matters that the present invention solves is to provide a kind of tin cream, the red glue detection method that automatically detect tin cream and red glue.
The technical solution adopted for the present invention to solve the technical problems is: tin cream, red glue detection method, comprise frame, machine frame inside is provided with worktable, described worktable is provided with transmitting device, described transmitting device arranges supporting plate, described supporting plate is connected with cylinder, supporting plate can slide on transmitting device, connection platform is provided with above supporting plate, transmission guide rail is provided with between supporting plate and connection platform, described transmission guide rail direction of motion is vertical with transmitting device direction of motion, connection platform side is connected with cylinder, connection platform can be moved by supporting plate relatively, described connection platform comprises being provided with adjusts wide motor, motor is connected with Width adjusting device, Width adjusting device is provided with belt travelling belt, the width of described Width adjusting device in order to regulate belt to transmit, belt travelling belt is connected with transmission motor, transmission motor is in order to control the motion of belt travelling belt, belt travelling belt front end is provided with front end photoelectric sensor, belt travelling belt rear end is provided with rear end photoelectric sensor, belt travelling belt side is also provided with feeding pressure mechanism, feeding pressure mechanism can be fixed the product on belt travelling belt, also comprise camera fixed head, described camera fixed head is arranged on machine frame inside and is in above worktable, camera fixed head is provided with CCD camera, the camera lens of described CCD camera is towards worktable, camera fixed head is also provided with the detection photoelectric sensor that puts in place, also comprise disposal system, described disposal system is connected with CCD camera, frame is also provided with display screen, described display screen is connected with disposal system, described disposal system comprises image capture module, image processing module, contrast images memory module, display module, described image capture module is connected with CCD camera, image capture module described in described display module is in order to gather the image of circuit board under test, described image processing module is in order to carry out analyzing and processing to the image collected, judge whether circuit board under test is non-defective unit, described display module carries out the result after analyzing and processing in order to display to the image collected, display module is connected with display screen.
Further: also comprise coordinate analysis and delimit module, described coordinate analysis delimit module, described coordinate delimit analysis module in order to carry out coordinate delimitation to the image of the circuit board under test collected.
Further: CCD camera lens direction is provided with light source fixed head, light source is provided with in light source fixed head.
Further: described CCD camera has two.
Further: frame is also provided with warning system, described warning system is connected with disposal system.
The invention has the beneficial effects as follows: this method can automatic decision tin cream, the number of red glue and the drift rate of red glue, and result is shown by display module, turn increase coordinate analysis simultaneously and delimit module, when detecting defective products, the coordinate of defective region and picture can be shown in display module simultaneously, facilitate workman that the defective region on circuit board can be found fast to carry out follow-up reprocessing, the method improves detection efficiency, also shortens the time that workman looks for defective region on defective products simultaneously.
Accompanying drawing explanation
Fig. 1 is tin cream, red glue detection method schematic diagram.
Fig. 2 is tin cream, red glue checkout equipment schematic diagram.
Fig. 3 is tin cream, red glue checkout equipment schematic diagram.
Fig. 4 is connection platform side view.
Fig. 5 is connection platform top view.
Be labeled as in figure: frame 1, CCD camera 2, transmitting device 3, connection platform 4, light source fixed head 5, warning system 6, feeding pressure mechanism 7, Width adjusting device 8, belt travelling belt 9, front end photoelectric sensor 10, rear end photoelectric sensor 11.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
Tin cream as illustrated in the drawing, red glue detection method, its equipment comprises frame 1, frame 1 inside is provided with worktable, described worktable is provided with transmitting device 3, described transmitting device 3 arranges supporting plate, described supporting plate is connected with cylinder, supporting plate can slide on transmitting device, connection platform is provided with above supporting plate, transmission guide rail is provided with between supporting plate and connection platform, described transmission guide rail direction of motion is vertical with transmitting device direction of motion, connection platform side is connected with cylinder, connection platform can be moved by supporting plate relatively, described connection platform comprises being provided with adjusts wide motor, motor is connected with Width adjusting device 8, Width adjusting device 8 is provided with belt travelling belt 9, described Width adjusting device 8 is in order to regulate the width of belt travelling belt 9, belt travelling belt 9 is connected with transmission motor, transmission motor is in order to control the motion of belt travelling belt 9, belt travelling belt 9 front end is provided with front end photoelectric sensor 10, belt travelling belt 9 rear end is provided with rear end photoelectric sensor 11, belt travelling belt 9 side is also provided with feeding pressure mechanism 7, feeding pressure mechanism 7 can be fixed the product on belt travelling belt 9, also comprise camera fixed head, described camera fixed head is arranged on frame 1 inside and is in above worktable, camera fixed head is provided with CCD camera 2, the camera lens of described CCD camera 2 is towards worktable, camera fixed head is also provided with the detection photoelectric sensor that puts in place, also comprise disposal system, described disposal system is connected with CCD camera 2, frame is also provided with display screen, described display screen is connected with disposal system, the English full name of described CCD is Charge-coupledDevice, Chinese full name: charge coupled cell, ccd image sensor can be called, also image controller is, CCD is a kind of semiconductor devices, optical image can be converted into digital signal.Before work, control to adjust wide motor to control Width adjusting device 8, belt travelling belt 9 is made to be adjusted to the width adapting to current pcb board, when operating, pcb board is conveyed into belt travelling belt 9, signal is conveyed into disposal system when pcb board being detected by front end photoelectric sensor 10, disposal system controls transfer motor makes belt travelling belt 9 setting in motion, when moving to photoelectric sensor 11 place, rear end, rear end photoelectric sensor 11 detects that signal transmits signals to processor, make belt travelling belt 9 stop motion, feeding pressure mechanism 7 presses down simultaneously, pcb board is formed fixing, now, processor control cylinder, make the relative supporting plate motion of connection platform, supporting plate relative transport device moves, when pcb board moves to below CCD camera, putting in place on camera fixed head is detected after photoelectric sensor detects pcb board and is transmitted signals to disposal system, disposal system control cylinder makes pcb board no longer move, CCD camera can be taken a picture to it, and image is sent to disposal system, disposal system described above comprises image capture module, image processing module, contrast images memory module, display module, described image capture module is in order to gather the image of circuit board under test, described image capture module is connected with CCD camera, described image processing module is in order to carry out analyzing and processing to the image collected, display module is connected with display screen, judge whether circuit board under test is non-defective unit, shown display module carries out the result after analyzing and processing in order to display to the image collected, when before detection, first gather and be printed with different tin cream amount, the polylith circuit board image of red glue amount is stored in contrast images memory module, require that selected wherein a few sub-picture is non-defective unit image according to circuit board, during work, image capture module is first used to carry out image acquisition to circuit board under test and import the image collected into image processing module, image in the image of the circuit board under test collected and contrast images memory module contrasts by image processing module, whether the content and the red glue that detect its tin cream and red glue have position to depart from, after detection completes, its result is shown in display module, this method can automatic decision tin cream, the number of red glue and the drift rate of red glue, and result is shown by display module.
In addition, also comprise coordinate analysis and delimit module, described coordinate analysis delimit module, described coordinate delimit analysis module in order to carry out coordinate delimitation to the image of the circuit board under test collected, when detecting that unacceptable product shows in display module, the coordinate of defective region can being shown simultaneously, making workman can find defective region fast according to coordinate when again judging, decrease the time that workman finds defective region.
In addition, CCD camera 2 lens direction is provided with light source fixed head 5, light source is provided with in light source fixed head 5, when pcb board moves to below CCD camera lens, light source can be radiated on pcb board, increase the brightness of pcb board, CCD camera is taken a picture more clear, strengthen the detection degree of accuracy of tin cream, red glue checkout equipment.
And, described CCD camera 2 has two, and first two CCD camera can ensure that all corners of PCBA board are all photographed, if secondly one of them CCD camera is damaged, another still can normally work, and prevents CCD camera once damage causes whole equipment normally to work.
Furthermore, frame 1 is also provided with warning system, described warning system is connected with disposal system, when detecting pcb board and detecting unacceptable product, warning system can be glimmered and sound and be reminded workman to note there is unacceptable product, carrying out artificial judgement again, constantly dig-inning disposal system after having installed warning system without the need to workman when taking out pcb board, only after hearing sound or seeing warning system flicker, casing need be noted a little to pcb board, decrease the workload of workman.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. tin cream, red glue detection method, it is characterized in that: comprise frame (1), frame (1) inside is provided with worktable, described worktable is provided with transmitting device (3), (3) arrange supporting plate with described transmitting device, described supporting plate is connected with cylinder, supporting plate can slide on transmitting device, connection platform is provided with above supporting plate, transmission guide rail is provided with between supporting plate and connection platform, described transmission guide rail direction of motion is vertical with transmitting device direction of motion, connection platform side is connected with cylinder, connection platform can be moved by supporting plate relatively, described connection platform comprises being provided with adjusts wide motor, motor is connected with Width adjusting device (8), Width adjusting device (8) is provided with belt travelling belt (9), described Width adjusting device (8) is in order to regulate the width of belt travelling belt (9), belt travelling belt (9) is connected with transmission motor, transmission motor is in order to control the motion of belt travelling belt (9), belt travelling belt (9) front end is provided with front end photoelectric sensor (10), belt travelling belt (9) rear end is provided with rear end photoelectric sensor (11), belt travelling belt (9) side is also provided with feeding pressure mechanism (7), feeding pressure mechanism (7) can be fixed the product on belt travelling belt (9), also comprise camera fixed head, described camera fixed head is arranged on frame (1) inside and is in above worktable, camera fixed head is provided with CCD camera (2), the camera lens of described CCD camera (2) is towards worktable, camera fixed head is also provided with the detection photoelectric sensor that puts in place, also comprise disposal system, described disposal system is connected with CCD camera (2), frame is also provided with display screen, described display screen is connected with disposal system, described disposal system comprises image capture module, image processing module, contrast images memory module, display module, described image capture module is connected with CCD camera, image capture module described in described display module is in order to gather the image of circuit board under test, described image processing module is in order to carry out analyzing and processing to the image collected, judge whether circuit board under test is non-defective unit, described display module is connected with display screen the result display module after the image collected carries out analyzing and processing in order to display.
2. tin cream, red glue detection method as claimed in claim 1, is characterized in that: also comprise coordinate analysis and delimit module, described coordinate analysis delimit module, and described coordinate delimit analysis module in order to carry out coordinate delimitation to the image of the circuit board under test collected.
3. tin cream, red glue detection method as claimed in claim 1, it is characterized in that: CCD camera (2) lens direction is provided with light source fixed head (5), light source fixed head is provided with light source in (5).
4. tin cream, red glue detection method as claimed in claim 1, is characterized in that: described CCD camera (2) has two.
5. tin cream, red glue detection method as claimed in claim 1, is characterized in that: frame is also provided with warning system (6), described warning system is connected with disposal system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610006205.XA CN105510338A (en) | 2016-01-07 | 2016-01-07 | Solder paste and red glue detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610006205.XA CN105510338A (en) | 2016-01-07 | 2016-01-07 | Solder paste and red glue detection method |
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| CN105510338A true CN105510338A (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610006205.XA Pending CN105510338A (en) | 2016-01-07 | 2016-01-07 | Solder paste and red glue detection method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953743A (en) * | 2016-06-29 | 2016-09-21 | 厦门思泰克智能科技股份有限公司 | Three-dimensional detection device capable of being switched for detecting solder paste and red gum |
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN107521225A (en) * | 2017-10-13 | 2017-12-29 | 伟创力电子技术(苏州)有限公司 | A kind of connection platform with tin cream detection means |
| CN108355921A (en) * | 2018-05-19 | 2018-08-03 | 东莞市合易自动化科技有限公司 | A kind of dispensing detection all-in-one machine and its dispensing detection method |
| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
| CN110927183A (en) * | 2019-11-12 | 2020-03-27 | 东莞市庆颖智能自动化科技有限公司 | Stokehole detection equipment and method for detecting IC parts by using same |
| CN111307812A (en) * | 2019-03-05 | 2020-06-19 | 南昌工程学院 | Welding spot appearance detection method based on machine vision |
| CN111665256A (en) * | 2019-03-08 | 2020-09-15 | 苏州元承科技有限公司 | Surface defect detection equipment based on machine vision |
| CN111982934A (en) * | 2020-08-10 | 2020-11-24 | 广州瑞松北斗汽车装备有限公司 | Car frame number lettering defect detection device |
| CN114054889A (en) * | 2021-11-05 | 2022-02-18 | 江苏三沃电子科技有限公司 | Welding auxiliary device for detecting welding auxiliary agent |
| CN115052433A (en) * | 2022-07-14 | 2022-09-13 | 苏州朋协智控科技有限公司 | Novel SMT (surface mount technology) chip mounting process for circuit board |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953743B (en) * | 2016-06-29 | 2018-07-06 | 厦门思泰克智能科技股份有限公司 | A kind of changeable three-dimensional detection device surveyed tin cream and survey red glue |
| CN105953743A (en) * | 2016-06-29 | 2016-09-21 | 厦门思泰克智能科技股份有限公司 | Three-dimensional detection device capable of being switched for detecting solder paste and red gum |
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN107521225A (en) * | 2017-10-13 | 2017-12-29 | 伟创力电子技术(苏州)有限公司 | A kind of connection platform with tin cream detection means |
| CN108355921A (en) * | 2018-05-19 | 2018-08-03 | 东莞市合易自动化科技有限公司 | A kind of dispensing detection all-in-one machine and its dispensing detection method |
| CN109317369B (en) * | 2018-11-23 | 2023-05-23 | 东莞市奥海科技股份有限公司 | Coating machine for coating red glue on circuit board and coating method thereof |
| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
| CN111307812A (en) * | 2019-03-05 | 2020-06-19 | 南昌工程学院 | Welding spot appearance detection method based on machine vision |
| CN111665256A (en) * | 2019-03-08 | 2020-09-15 | 苏州元承科技有限公司 | Surface defect detection equipment based on machine vision |
| CN110927183A (en) * | 2019-11-12 | 2020-03-27 | 东莞市庆颖智能自动化科技有限公司 | Stokehole detection equipment and method for detecting IC parts by using same |
| CN110927183B (en) * | 2019-11-12 | 2023-04-21 | 东莞市华盛鑫恒通实业有限公司 | Stokehold detection equipment and method for detecting IC parts by using equipment |
| CN111982934A (en) * | 2020-08-10 | 2020-11-24 | 广州瑞松北斗汽车装备有限公司 | Car frame number lettering defect detection device |
| CN114054889A (en) * | 2021-11-05 | 2022-02-18 | 江苏三沃电子科技有限公司 | Welding auxiliary device for detecting welding auxiliary agent |
| CN115052433A (en) * | 2022-07-14 | 2022-09-13 | 苏州朋协智控科技有限公司 | Novel SMT (surface mount technology) chip mounting process for circuit board |
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Application publication date: 20160420 |