CN105489988A - Half-mode substrate integrated waveguide structure-based dual-passband differential bandpass filter - Google Patents
Half-mode substrate integrated waveguide structure-based dual-passband differential bandpass filter Download PDFInfo
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- CN105489988A CN105489988A CN201410484667.3A CN201410484667A CN105489988A CN 105489988 A CN105489988 A CN 105489988A CN 201410484667 A CN201410484667 A CN 201410484667A CN 105489988 A CN105489988 A CN 105489988A
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Abstract
The invention provides a half-mode substrate integrated waveguide structure-based dual-passband differential bandpass filter, which comprises a dielectric substrate, an upper surface metal layer and a lower surface metal layer, wherein the dielectric substrate is provided with a metalized through hole array which runs through the dielectric substrate; and two half-mode resonant cavities are surrounded by the metalized through hole array, the upper surface metal layer and the lower surface metal layer. Compared with realization of a traditional substrate integrated waveguide filter, the size is reduced by half under the premise of keeping original performance; a transmission zero point is generated by adding an electromagnetic band gap structure; and meanwhile, a stop band is generated in a virtual band pass, so that a dual-passband structure is formed. The frequency of the transmission zero point can be adjusted by changing the size of the electromagnetic band gap structure. According to the half-mode substrate integrated waveguide structure-based dual-passband differential bandpass filter, the size of the filter is effectively reduced; and system integration is facilitated.
Description
Technical field
The present invention relates to dual-passband difference filter, particularly a kind of half module substrate integrated wave guide dual-passband differential bandpass filter
Background technology
Filter is one of important basic element circuit of Circuits System, is widely used in the systems such as microwave communication, radar navigation, electronic countermeasures, satellite communication, trajectory guidance, test instrumentation, is indispensable important devices in microwave and millimeter-wave systems.The quality of its performance often directly affects the performance index of whole communication system.
In practical engineering application, from wave filter technology index given to processed finished products required time by shorter and shorter, design the inexorable trend that high performance microwave filter will be engineering design and market competition fast and accurately, design performance is high, volume is little, cost is low and shorten the filter lead time, is the inevitable requirement of market competition.
Electro-magnetic bandgap (EBG) structure is a kind of novel artificial electromagnetic material, obtains research and apply widely in microwave regime, in order to realize high performance microwave device.
Half module substrate integrated wave guide (HMSIW) technology based on substrate integration wave-guide further reduces the size of filter on the basis of substrate integration wave-guide (SIW) technology; the filter volume of half module substrate integrated wave guide is less, maintains high-performance, high q-factor, low-loss, low cost simultaneously, is easy to integrated advantage.
Based on above background, propose the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure herein, there is better common mode inhibition level.
Summary of the invention
It is little and have the differential bandpass filter of dual-passband that the object invented is to design a size.
Above-mentioned purpose of the present invention is realized by the technical characteristic of independent claims, and dependent claims develops the technical characteristic of independent claims with alternative or favourable mode.
For reaching above-mentioned purpose, the technical solution adopted in the present invention is as follows:
A kind of differential bandpass filter of the dual-passband based on half module substrate integrated wave guide structure; it comprises medium substrate; and be arranged on upper surface metal level and the lower surface metal layer on medium substrate surface; medium substrate has a horizontal axis and vertical axis; vertical axis is identical with the transmission direction of signal, wherein:
Described medium substrate, upper surface metal level and lower surface metal layer are formed with multiple plated-through hole run through, plated-through hole is at upper surface metal level and lower surface metal layer surface composition via-hole array, described via-hole array, upper surface metal level and lower surface metal layer surround two and half mode resonant cavities, be respectively the first half mode resonant cavities and the second half mode resonant cavities, the first half mode resonant cavities and the second half mode resonant cavities symmetrical about horizontal axis, and the first half mode resonant cavities and the second half mode resonant cavity adjoining positions are formed with the first coupling window and the second coupling window;
The edge of described upper surface metal level is formed with the first electro-magnetic bandgap, the second electro-magnetic bandgap about the horizontal symmetrical position of described first coupling window, and is formed with the 3rd electro-magnetic bandgap and the 4th electro-magnetic bandgap about the horizontal symmetrical position of described second coupling window;
The aperture position of described the first half mode resonant cavities and the second half mode resonant cavity both sides arranges four feeder lines, is respectively the first feeder line, the second feeder line, the 3rd feeder line and the 4th feeder line, for Signal transmissions.
Also propose a kind of implementation method of differential bandpass filter of the above-mentioned dual-passband based on half module substrate integrated wave guide structure according to a further aspect in the invention, its manufacturing process comprises the following steps:
Two surfaces of a medium substrate install surface metal-layer and lower surface metal layer respectively, and the vertical axis of aforementioned medium substrate is identical with the transmission direction of signal;
At described medium substrate, upper surface metal level and lower surface metal layer surface form multiple plated-through hole run through, by plated-through hole at upper surface metal level and lower surface metal layer surface composition via-hole array, by described via-hole array, upper surface metal level and lower surface metal layer enclose bag formation two and half mode resonant cavity, be respectively the first half mode resonant cavities and the second half mode resonant cavities, wherein, the first half mode resonant cavities and the second half mode resonant cavities are configured to about horizontal axis symmetrical, and be formed with the first coupling window and the second coupling window at the first half mode resonant cavities and the second half mode resonant cavity adjoining positions,
The edge of described upper surface metal level forms the first electro-magnetic bandgap, the second electro-magnetic bandgap about the horizontal symmetrical position of described first coupling window, and forms the 3rd electro-magnetic bandgap and the 4th electro-magnetic bandgap in the horizontal symmetrical position about the second coupling window;
Four feeder lines are set at the aperture position of described the first half mode resonant cavities and the second half mode resonant cavity both sides, are respectively the first feeder line, the second feeder line, the 3rd feeder line and the 4th feeder line, for Signal transmissions.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment of the present invention based on the differential bandpass filter of the dual-passband of half module substrate integrated wave guide structure.
Fig. 2 is the end view of the differential bandpass filter of the dual-passband based on half module substrate integrated wave guide structure of Fig. 1 embodiment.
Fig. 3 is the example of one of differential bandpass filter band size indication of the dual-passband of the substrate integrated wave guide structure realized according to Fig. 1 execution mode.
Fig. 4 is that transmission zero is with l
2changing trend diagram.
Fig. 5 is the corresponding figure of dual-passband differential bandpass filter differential mode.
Fig. 6 is the corresponding figure of dual-passband differential bandpass filter common mode
Embodiment
In order to more understand technology contents of the present invention, institute's accompanying drawings is coordinated to be described as follows especially exemplified by specific embodiment.
As shown in Figure 1 with Figure 2; according to preferred embodiment of the present invention; a kind of differential bandpass filter based on half module substrate integrated wave guide structure; it comprises medium substrate 6; and be arranged on upper surface metal level 1 and the lower surface metal layer 7 on medium substrate 6 surface; medium substrate 6 has a horizontal axis L1 and vertical axis L2, and vertical axis L2 is identical with the transmission direction of signal.
Described medium substrate 6, upper surface metal level 1 and lower surface metal layer 7 are formed with multiple plated-through hole 2 run through, plated-through hole 2 is at upper surface metal level 1 and lower surface metal layer 7 surface composition via-hole array, described via-hole array, upper surface metal level 1 and lower surface metal layer 7 surround two and half mode resonant cavities, be respectively the first half mode resonant cavities 31 and the second half mode resonant cavities 32, the first half mode resonant cavities 31 and the second half mode resonant cavities 32 symmetrical about horizontal axis L1, and the first half mode resonant cavities 31 and the second half mode resonant cavity 32 adjoining positions are formed with the first coupling window C1 and the second coupling window C2.
As preferably, the diameter of described metal throuth hole 2 is 0.8mm, and two adjacent through-hole spacings are from being 1.2mm.
As preferably, described medium substrate 6 adopts RO5880 model, and dielectric constant is 2.2, and thickness is 0.508mm.
The edge of described upper surface metal level 1 is formed with the first electro-magnetic bandgap 41, second electro-magnetic bandgap 42 about the horizontal symmetrical position of described first coupling window C1, and is formed with the 3rd electro-magnetic bandgap 43 and the 4th electro-magnetic bandgap 44 about the horizontal symmetrical position of described second coupling window C2.
The aperture position of described the first half mode resonant cavities 31 and the second half mode resonant cavity 32 both sides arranges four feeder lines, is respectively the first feeder line 51, second feeder line 52, the 3rd feeder line 53 and the 4th feeder line 54, for Signal transmissions.
Preferably, shown in figure 1, in the present embodiment, described first coupling window C1 is identical with the length of the second coupling window C2.
Preferably, described first coupling window C1 and the second coupling window C2 is configured to about vertical axis L2 symmetrical.
Preferably, described first electro-magnetic bandgap 41, second electro-magnetic bandgap 42, the 3rd electro-magnetic bandgap 43 are identical with the structure of the 4th electro-magnetic bandgap 44.
The disclosure also relates to a kind of manufacture method of differential bandpass filter of aforementioned half module substrate integrated wave guide structure, and its realization comprises the following steps:
Two surfaces of a medium substrate 6 install surface metal-layer 1 and lower surface metal layer 7 respectively, and the vertical axis L2 of aforementioned medium substrate 6 is identical with the transmission direction of signal;
At described medium substrate 6, upper surface metal level 1 and lower surface metal layer 7 surface form multiple plated-through hole 2 run through, by plated-through hole 2 at upper surface metal level 1 and lower surface metal layer 7 surface composition via-hole array, by described via-hole array, upper surface metal level 1 and lower surface metal layer 7 enclose bag formation two and half mode resonant cavity, be respectively the first half mode resonant cavities 31 and the second half mode resonant cavities 32, wherein, the first half mode resonant cavities 31 and the second half mode resonant cavities 32 are configured to about horizontal axis L1 symmetrical, and be formed with the first coupling window C1 and the second coupling window C2 at the first half mode resonant cavities 31 and the second half mode resonant cavity 32 adjoining positions,
The edge of described upper surface metal level 1 forms the first electro-magnetic bandgap 41, second electro-magnetic bandgap 42 about the horizontal symmetrical position of described first coupling window C1, and forms the 3rd electro-magnetic bandgap 43 and the 4th electro-magnetic bandgap 44 in the horizontal symmetrical position about the second coupling window C2;
Four feeder lines are set at the aperture position of described the first half mode resonant cavities 31 and the second half mode resonant cavity 32 both sides, are respectively the first feeder line 51, second feeder line 52, the 3rd feeder line 53 and the 4th feeder line 54, for Signal transmissions.
As previously mentioned, in this manufacture method, described two coupling windows are formed in the following manner:
First coupling window C1 is arranged to identical length with the second coupling window C2, and symmetrical about vertical axis L2.
As previously mentioned, can obtain a transmission zero by adding the first electro-magnetic bandgap 41, second electro-magnetic bandgap 42, the 3rd electro-magnetic bandgap 43 and the 4th electro-magnetic bandgap 44 in virtual passband, in the embodiment of alternative, aforementioned manufacture method is further comprising the steps of:
Regulate the spacing of the size of described four electromagnetic bandgap structures (41,42,43,44) and/or four electromagnetic bandgap structures (41,42,43,44) and half mode resonant cavity, thus the frequency values that adjustment Signal transmissions zero point is corresponding.
With reference to the example of a band size indication of the dual-passband difference filter of the substrate integrated wave guide structure of Fig. 1 execution mode realization shown in figure 3, wherein: two and half mode resonant cavity width are w
1, length is l
1.The width of two and half four coupling windows in mode resonant cavity both sides is g1, and the coupling window width that the first half mode resonant cavities 31 are connected with the second half mode resonant cavities 32 is l
3.The width of four feeder lines is w
3, the metal patch width of feeder line and respective mold half resonant cavity junction is g
2.For realizing the differential bandpass filter based on half module substrate integrated wave guide structure, optimum-size parameter is: l
1=31mm, l
3=6.5mm, w
1=8mm, w
2=8mm, w
3=1.6mm, g
1=3.8mm, g
2=2.5mm, g3=0.6mm, p1=4.7mm, p2=2.5mm, p3=6.5mm.
In order to improve the selectivity of differential bandpass filter, the first electro-magnetic bandgap 41, second electro-magnetic bandgap 42, the 3rd electro-magnetic bandgap 43 and the 4th electro-magnetic bandgap 44 has been etched respectively with the coupling window position that is connected of the second half mode resonant cavities 32 at described dielectric-slab the first half mode resonant cavity 31, wherein the first electro-magnetic bandgap 41, second electro-magnetic bandgap 42, the 3rd electro-magnetic bandgap 43 and the 4th electro-magnetic bandgap 44 length, width are all equal, are respectively l
2and w
2.By adding electro-magnetic bandgap, a transmission zero can be produced in difference passband inside.If Fig. 5 is for increasing the corresponding figure of electro-magnetic bandgap postfilter differential mode, if Fig. 6 is for increasing the corresponding figure of electro-magnetic bandgap postfilter common mode.Secondly, by the size value of the adjustment disturbance line of rabbet joint, transmission zero changes thereupon, as shown in Figure 5.
The centre frequency that the present invention measures gained first difference passband is 7.86GHz, and three dB bandwidth is 370MHz, and its minimum insertion loss is 2.1dB.The centre frequency of the second difference passband is 8.8GHz, and three dB bandwidth is 380MHz, and its minimum insertion loss is 2.5dB.The insertion loss measured mainly produces due to SMA interface and fabrication error.For common-mode response, two passband common mode inhibition are respectively higher than 35dB and 42dB.In 7.1GHz to 10.4GHz frequency band, common mode inhibition is better than 20dB.
Although the present invention with preferred embodiment disclose as above, so itself and be not used to limit the present invention.Persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is when being as the criterion depending on those as defined in claim.
Claims (9)
1. the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure; it is characterized in that; comprise medium substrate (6); and be arranged on upper surface metal level (1) and the lower surface metal layer (7) on medium substrate (6) surface; medium substrate (6) has a horizontal axis (L1) and vertical axis (L2); vertical axis (L2) is identical with the transmission direction of signal, wherein:
Described medium substrate (6), upper surface metal level (1) and lower surface metal layer (7) are formed with multiple plated-through hole (2) run through, plated-through hole (2) is at upper surface metal level (1) and lower surface metal layer (7) surface composition via-hole array, described via-hole array, upper surface metal level (1) and lower surface metal layer (7) surround two and half mode resonant cavities, be respectively the first half mode resonant cavities (31) and the second half mode resonant cavities (32), the first half mode resonant cavities (31) and the second half mode resonant cavities (32) symmetrical about horizontal axis (L1), and the first half mode resonant cavities (31) are formed with the first coupling window (C1) and the second coupling window (C2) with the second half mode resonant cavity (32) adjoining positions,
The edge of described upper surface metal level (1) is formed with the first electro-magnetic bandgap (41), the second electro-magnetic bandgap (42) about the horizontal symmetrical position of described first coupling window (C1), and is formed with the 3rd electro-magnetic bandgap (43) and the 4th electro-magnetic bandgap (44) about the horizontal symmetrical position of described second coupling window (C2);
The aperture position of described the first half mode resonant cavities (31) and the second half mode resonant cavity (32) both sides arranges four feeder lines, be respectively the first feeder line (51), the second feeder line (52), the 3rd feeder line (53) and the 4th feeder line (54), for Signal transmissions.
2. the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 1, is characterized in that, described first coupling window (C1) is identical with the length of the second coupling window (C2).
3. the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 1; it is characterized in that, described first coupling window (C1) and the second coupling window (C2) are configured to about vertical axis (L2) symmetrical.
4. the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 1; it is characterized in that, described first electro-magnetic bandgap (41), the second electro-magnetic bandgap (42), the 3rd electro-magnetic bandgap (43) are identical with the structure of the 4th electro-magnetic bandgap (44).
5. the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 1, is characterized in that, the diameter of described metal throuth hole (2) is 0.8mm, and the distance between two adjacent through-holes is 1.2mm.
6. the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 1, is characterized in that, described medium substrate (6) adopts RO5880 model, and dielectric constant is 2.2, and thickness is 0.508mm.
7., as claimed in claim 1 based on a manufacture method for the dual-passband differential bandpass filter of half module substrate integrated wave guide structure, it is characterized in that, comprise the following steps:
Two surfaces of a medium substrate (6) are installed surface metal-layer (1) and lower surface metal layer (7) respectively, and the vertical axis (L2) of aforementioned medium substrate (6) is identical with the transmission direction of signal;
In described medium substrate (6), upper surface metal level (1) and lower surface metal layer (7) surface form multiple plated-through hole (2) run through, by plated-through hole (2) at upper surface metal level (1) and lower surface metal layer (7) surface composition via-hole array, by described via-hole array, upper surface metal level (1) and lower surface metal layer (7) enclose bag formation two and half mode resonant cavity, be respectively the first half mode resonant cavities (31) and the second half mode resonant cavities (32), wherein, the first half mode resonant cavities (31) and the second half mode resonant cavities (32) are configured to about horizontal axis (L1) symmetrical, and be formed with the first coupling window (C1) and the second coupling window (C2) at the first half mode resonant cavities (31) and the second half mode resonant cavity (32) adjoining positions,
The edge of described upper surface metal level (1) forms the first electro-magnetic bandgap (41), the second electro-magnetic bandgap (42) about the horizontal symmetrical position of described first coupling window (C1), and forms the 3rd electro-magnetic bandgap (43) and the 4th electro-magnetic bandgap (44) in the horizontal symmetrical position about the second coupling window (C2);
At the aperture position of described the first half mode resonant cavities (31) and the second half mode resonant cavity (32) both sides, four feeder lines are set, be respectively the first feeder line (51), the second feeder line (52), the 3rd feeder line (53) and the 4th feeder line (54), for Signal transmissions.
8. the manufacture method of the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 7, is characterized in that, forms described two coupling windows in the following manner:
First coupling window (C1) is arranged to identical length with the second coupling window (C2), and symmetrical about vertical axis (L2).
9. the manufacture method of the dual-passband differential bandpass filter based on half module substrate integrated wave guide structure according to claim 7, is characterized in that, further comprising the steps of:
Regulate the spacing of the size of described four electromagnetic bandgap structures (41,42,43,44) and/or four electromagnetic bandgap structures (41,42,43,44) and half mode resonant cavity, thus the frequency values that adjustment Signal transmissions zero point is corresponding.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107123844A (en) * | 2017-04-06 | 2017-09-01 | 江南大学 | A kind of electric tunable electro-magnetic bandgap wave filter of miniature restructural |
| CN109728390A (en) * | 2018-12-05 | 2019-05-07 | 西安电子科技大学 | A kind of double stacked formula difference microwave band-pass filter |
| WO2021031357A1 (en) * | 2019-08-21 | 2021-02-25 | 南京慧尔视智能科技有限公司 | Traffic radar feed line isolation apparatus |
| CN112736391A (en) * | 2020-12-16 | 2021-04-30 | 中电国基南方集团有限公司 | Defected ground structure type high common mode rejection substrate integrated waveguide differential line |
| CN116073096A (en) * | 2022-11-29 | 2023-05-05 | 西安电子科技大学 | Double-layer substrate integrated waveguide band-pass filter and design method |
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| CN201156573Y (en) * | 2008-01-25 | 2008-11-26 | 南京理工大学 | Integrated wave-guide band filter based on foldable substrate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123844A (en) * | 2017-04-06 | 2017-09-01 | 江南大学 | A kind of electric tunable electro-magnetic bandgap wave filter of miniature restructural |
| CN109728390A (en) * | 2018-12-05 | 2019-05-07 | 西安电子科技大学 | A kind of double stacked formula difference microwave band-pass filter |
| WO2021031357A1 (en) * | 2019-08-21 | 2021-02-25 | 南京慧尔视智能科技有限公司 | Traffic radar feed line isolation apparatus |
| CN112736391A (en) * | 2020-12-16 | 2021-04-30 | 中电国基南方集团有限公司 | Defected ground structure type high common mode rejection substrate integrated waveguide differential line |
| CN116073096A (en) * | 2022-11-29 | 2023-05-05 | 西安电子科技大学 | Double-layer substrate integrated waveguide band-pass filter and design method |
| CN116073096B (en) * | 2022-11-29 | 2024-03-26 | 西安电子科技大学 | Double-layer substrate integrated waveguide band-pass filter and design method |
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