CN105486333B - Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation - Google Patents
Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation Download PDFInfo
- Publication number
- CN105486333B CN105486333B CN201510813169.3A CN201510813169A CN105486333B CN 105486333 B CN105486333 B CN 105486333B CN 201510813169 A CN201510813169 A CN 201510813169A CN 105486333 B CN105486333 B CN 105486333B
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- Prior art keywords
- spacing
- joint sheet
- sensor structure
- width
- narrow line
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of sensor structures improving narrow line-spacing joint sheet pressing dislocation to be applied to a flexible printed wiring board, the flexible printed wiring board includes plural first joint sheet, such first joint sheet respectively has one first width, there is one first spacing between such adjacent first joint sheet, the sensor structure of the narrow line-spacing joint sheet pressing dislocation of the improvement includes plural second joint sheet, such second joint sheet respectively has one second width, there is one second spacing between such adjacent second joint sheet, it is characterized in that there is a pressing tolerance between the flexible printed wiring board and the sensor structure of the narrow line-spacing joint sheet pressing dislocation of the improvement.By above-mentioned structure, the present invention can improve narrow line-spacing joint sheet pressing dislocation.
Description
Technical field
The present invention is a kind of sensor structure, especially a kind of specific width and spacing by setting joint sheet, with
Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation.
Background technology
At present there are mainly three types of sensor patterned manners:Yellow light, wire mark and wire mark laser.
To make flexible printed wiring board (Flexible Printed Circuit, FPC) will not be inclined because aligning when pressing
Shifting causes 1 flexible printed wiring board foot position to be pressed onto 2 joint sheets (Bonding Pad), leads to electrical failure (fail) situation.
Way is the distance increased between being engaged with each other pad cabling at this stage, and conventional design its spacing is greater than or equal at present
150 microns ((Micrometre, μm).
It please refers to Fig.1 shown in a and Fig. 1 b, the sensor structure (7) of the prior art is applied to a flexible printed wiring board
(8), which includes plural first joint sheet (80), and such first joint sheet (80) respectively has one the
One width, it includes that plural number second connects to have one first spacing, the sensor structure (7) between such adjacent first joint sheet (80)
Pad (70) is closed, such second joint sheet (70) respectively has one second width, has between such adjacent second joint sheet (70)
One second spacing is 150 microns, to avoid will not be because when the sensor structure (7) and the flexible printed wiring board (8) press
Contraposition offset leads to wherein one first joint sheet (80) while being pressed onto 2 second joint sheets (70), leads to electrical failure.
When line-spacing is less than 150 microns to joint sheet to each other, it is easy when being pressed with flexible printed wiring board because contraposition is public
Difference and occur 1 flexible printed wiring board foot position be pressed onto 2 joint sheet situations, lead to functional fault (function fail).
It please refers to Fig.2 shown in a and Fig. 2 b, the narrow line-spacing sensor structure (7a) of the prior art is applied to a soft printing
Circuit board (8a), the flexible printed wiring board (8a) include plural first joint sheet (80a), and such first joint sheet (80a) is each
From with one first width A, there is one first spacing Z, the sensor structure (7a) between such adjacent first joint sheet (70a)
Including plural second joint sheet (70a), such second joint sheet (70a) respectively has one second width B, and such adjacent second connects
It is 50 microns that closing between padding (70a), which has one second spacing Y,.
There is a pressing tolerance X between the flexible printed wiring board (8a) and the narrow line-spacing sensor structure (7a), it should
It is one of corresponding second engagement of such first joint sheet (70a) wherein one first joint sheet (70a) center line to press tolerance X
Pad the difference of (70a) center line.
However, when the narrow line-spacing sensor structure (7a) and the flexible printed wiring board (8a) press, will be easy because right
Position offset leads to wherein one first joint sheet (80a) while being pressed onto 2 second joint sheets (70a), leads to functional fault
(function fail)。
Therefore, the sensor structure for how designing the narrow line-spacing joint sheet pressing dislocation of an improvement, becomes relevant device
The target that manufacturer and research staff expect jointly.
Invention content
The present inventor is wide in view of the sensor structure joint sheet line-spacing of the prior art, or joint sheet is easy in narrow line-spacing
The missing for pressing dislocation, is actively setting about being developed, to which above-mentioned existing disadvantage can be improved, by constantly testing and
The present invention is developed in effort finally.
The purpose of the present invention provides a kind of sensor structure improving narrow line-spacing joint sheet pressing dislocation.
In order to reach above-mentioned purpose, the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement of the present invention is applied to
One flexible printed wiring board, the flexible printed wiring board include plural first joint sheet, and such first joint sheet respectively has one
First width has one first spacing, the sense of the narrow line-spacing joint sheet pressing dislocation of the improvement between such adjacent first joint sheet
It includes plural second joint sheet to survey device structure, and such second joint sheet respectively has one second width, such adjacent second engagement
There is one second spacing between pad.
It is characterized in that：The flexible printed wiring board and the sensor structure of the narrow line-spacing joint sheet pressing dislocation of the improvement
Between have one pressing tolerance, the pressing tolerance be such first joint sheet wherein one first joint sheet center line it is corresponding it
The difference of one second joint sheet center line, the pressing tolerance are more than second spacing, which is more than first width, should
First spacing is more than second spacing.
By above-mentioned structure, the present invention improves narrow line-spacing joint sheet pressing dislocation, avoids happening for electrical failure.
Description of the drawings
Fig. 1 a are the schematic diagrames before the sensor structure pressing of the prior art；
Fig. 1 b are the schematic diagrames after the sensor structure pressing of the prior art；
Fig. 2 a are the schematic diagrames before the narrow line-spacing sensor structure pressing of the prior art；
Fig. 2 b are the schematic diagrames after the narrow line-spacing sensor structure pressing of the prior art；
Fig. 3 a are the schematic diagrames before the sensor structure pressing of the narrow line-spacing joint sheet pressing dislocation of improvement of the present invention；And
Fig. 3 b are the schematic diagrames after the sensor structure pressing of the narrow line-spacing joint sheet pressing dislocation of improvement of the present invention.
Drawing reference numeral explanation：
(7,7a) sensor structure
(70,70a) second joint sheet
(8,8a) flexible printed wiring board
(80,80a) first joint sheet
The first width of A
The first spacing of Z
The second width of B
The second spacing of Y
X presses tolerance
(1) improve the sensor structure of narrow line-spacing joint sheet pressing dislocation
(10) second joint sheets
(2) flexible printed wiring board
(20) first joint sheets
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
To make to be familiar with the purpose of this those skilled in the art understanding present invention, hereby coordinate schema that the preferred embodiments of the invention is detailed
Carefully it is described as follows.
It please refers to Fig.3 shown in a and Fig. 3 b, the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement of the present invention
(1), it is applied to a flexible printed wiring board (2), which includes plural first joint sheet (20), such
First joint sheet (20) respectively has one first width A, has one first spacing Z between such adjacent first joint sheet (20),
The sensor structure (1) of the narrow line-spacing joint sheet pressing dislocation of the improvement includes plural second joint sheet (10), such second engagement
Padding (10) respectively has one second width B, has one second spacing Y between such adjacent second joint sheet (10).
It is characterized in that：The flexible printed wiring board (2) and the sensor of the narrow line-spacing joint sheet pressing dislocation of the improvement
It is such first joint sheet (20) wherein one first joint sheet to have pressing a tolerance X, pressing tolerance X between structure (1)
(20) difference of one of corresponding second joint sheet (10) center line of center line, pressing tolerance X are more than second spacing Y,
Second spacing Y is more than 0, and it is as follows to be organized into mathematical expression：
0 μm of X ＞ Y ＞, wherein μm be micron.
Second width B is more than first width A, and first spacing Z is more than second spacing Y, is organized into mathematical expression such as
Under：B ＞ A, Z ＞ Y.
In a preferred embodiment of the invention, second spacing Y is less than or equal to 150 microns, is organized into mathematical expression such as
Under：
Y≦150μm。
Second width B subtract first width A difference divided by 2 plus second spacing Y be more than pressing tolerance X, should
It presses tolerance X and is greater than or equal to 0, it is as follows to be organized into mathematical expression：X≤0 [(B-A)/2]+Y ＞.
The difference that first spacing Z subtracts first width A equal to second width B adds second spacing Y, is organized into
Mathematical expression is as follows：Z=B-A+Y.
In a preferred embodiment of the invention, such first width A is equal.
In another preferred embodiment of the present invention, such first spacing Z is equal.
In the another embodiment of the present invention, such second width B is equal.
In another preferred embodiment of the present invention, such second spacing Y is equal.
Through above-mentioned structure, the present invention can improve narrow line-spacing joint sheet pressing dislocation, and the situation of electrical failure is avoided to send out
It is raw.Furthermore structure kenel be not the personage in technical field can think easily and and reach winner, it is real have novelty with
And progressive is undoubtedly.
Through above-mentioned detailed description, you can fully all have the progress of implementation in the purpose and efficacy of the display present invention
Property, the usability value of great industry, and be new invention not seen before on the market at present, patent of invention important document is complied fully with,
It files an application in accordance with the law whence.Only described above is only the preferred embodiments of the invention, when cannot be limiting institute of the present invention
The range of implementation.I.e. all equivalent changes and modifications made according to the scope of the claims of the present invention should all belong to patent of the present invention and cover it
In range, your juror's explicit example for reference is sincerely asked, and pray Hui Zhun, is to praying.
Claims (7)
1. a kind of sensor structure improving narrow line-spacing joint sheet pressing dislocation, is applied to a flexible printed wiring board, this is soft
Printed circuit includes plural first joint sheet, first joint sheet respectively with one first width, adjacent first joint sheet it
Between there is one first spacing, the sensor structure of the improvement narrow line-spacing joint sheet pressing dislocation includes plural second joint sheet, is somebody's turn to do
Second joint sheet respectively has one second width, has one second spacing between adjacent second joint sheet；It is characterized in that：
There is a pressing between the flexible printed wiring board and the sensor structure of the narrow line-spacing joint sheet pressing dislocation of the improvement
Tolerance, the pressing tolerance are one of the corresponding second joint sheet center of first joint sheet wherein one first joint sheet center line
The difference of line, the pressing tolerance are more than second spacing, which is greater than first width, which is more than should
Second spacing, wherein pressing tolerance X, the second spacing Y, the first width A, the second width B, it is [(B-A)/2] to be organized into mathematical expression
+ Y ＞ X.
2. the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement as described in claim 1, which is characterized in that this second
Spacing be more than 0, this second be smaller than or be equal to 150 microns, second width subtract first width difference divided by 2 plus should
Second spacing is more than the pressing tolerance, which is greater than or equal to 0, first spacing equal to second width subtract this
The difference of one width adds second spacing.
3. the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement as described in claim 1, which is characterized in that this first
Width is equal.
4. the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement as claimed in claim 2, which is characterized in that this first
Spacing is equal.
5. the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement as described in claim any one of 1-4, feature exist
In second width is equal.
6. such as the sensor structure of the narrow line-spacing joint sheet pressing dislocation of any one of claim 1-4-improvement, feature
It is, second spacing is equal.
7. the sensor structure of the narrow line-spacing joint sheet pressing dislocation of improvement as claimed in claim 5, wherein the second spacing phase
Deng.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510813169.3A CN105486333B (en) | 2015-11-19 | 2015-11-19 | Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510813169.3A CN105486333B (en) | 2015-11-19 | 2015-11-19 | Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105486333A CN105486333A (en) | 2016-04-13 |
| CN105486333B true CN105486333B (en) | 2018-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510813169.3A Active CN105486333B (en) | 2015-11-19 | 2015-11-19 | Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation |
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| Country | Link |
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| CN (1) | CN105486333B (en) |
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| CN1433073A (en) * | 2002-01-18 | 2003-07-30 | 精工爱普生株式会社 | Semiconductor device and its making process, circuit board and electronic instrument |
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| CN201392897Y (en) * | 2009-02-25 | 2010-01-27 | 深圳华映显示科技有限公司 | Conductivity bonding cushion structure and chip bonding cushion structure |
| CN102024776A (en) * | 2009-09-18 | 2011-04-20 | 台湾积体电路制造股份有限公司 | Flip-chip packaging assembly and integrated circuit device |
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| CN203894726U (en) * | 2014-06-17 | 2014-10-22 | 恒颢科技股份有限公司 | Bonding structure and touch panel |
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| US6897125B2 (en) * | 2003-09-17 | 2005-05-24 | Intel Corporation | Methods of forming backside connections on a wafer stack |
| US7332423B2 (en) * | 2005-06-29 | 2008-02-19 | Intel Corporation | Soldering a die to a substrate |
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|---|---|---|---|---|
| CN1433073A (en) * | 2002-01-18 | 2003-07-30 | 精工爱普生株式会社 | Semiconductor device and its making process, circuit board and electronic instrument |
| CN1435915A (en) * | 2002-01-29 | 2003-08-13 | Fci公司 | Spherical grid array connection device |
| WO2004093252A2 (en) * | 2003-04-11 | 2004-10-28 | Neoconix, Inc. | Electrical connector and method for making |
| JP2005167221A (en) * | 2003-11-06 | 2005-06-23 | Himax Technologies Inc | Semiconductor package |
| CN101447471A (en) * | 2007-11-30 | 2009-06-03 | 海力士半导体有限公司 | Substrate for semiconductor package and semiconductor package having the same |
| CN101539690A (en) * | 2008-03-20 | 2009-09-23 | 矽创电子股份有限公司 | Substrate electrode structure and connected structure using same and drive element |
| CN201392897Y (en) * | 2009-02-25 | 2010-01-27 | 深圳华映显示科技有限公司 | Conductivity bonding cushion structure and chip bonding cushion structure |
| CN102024776A (en) * | 2009-09-18 | 2011-04-20 | 台湾积体电路制造股份有限公司 | Flip-chip packaging assembly and integrated circuit device |
| CN102456587A (en) * | 2010-10-14 | 2012-05-16 | 硅绝缘体技术有限公司 | Process for realising a connecting structure |
| CN203894726U (en) * | 2014-06-17 | 2014-10-22 | 恒颢科技股份有限公司 | Bonding structure and touch panel |
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|---|---|
| CN105486333A (en) | 2016-04-13 |
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