CN105479325A - Partition pressing device and method suitable for large single-face grinding polishing device - Google Patents
Partition pressing device and method suitable for large single-face grinding polishing device Download PDFInfo
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- CN105479325A CN105479325A CN201511011304.9A CN201511011304A CN105479325A CN 105479325 A CN105479325 A CN 105479325A CN 201511011304 A CN201511011304 A CN 201511011304A CN 105479325 A CN105479325 A CN 105479325A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to a partition pressing device and method suitable for a large single-face grinding polishing device. The partition pressing device comprising an outer ring pressing mechanism and an inner ring pressing mechanism is connected with a control mechanism, and the control mechanism is connected with a pneumatic mechanism; the outer ring pressing mechanism comprises an air cylinder connected with the pneumatic mechanism, and the air cylinder is connected with a grinding polishing assembly through a first transmission mechanism; and the inner ring pressing mechanism comprises a rotary connector connected with the pneumatic mechanism, the rotary connector is connected with a second transmission mechanism arranged in the first transmission mechanism, the second transmission mechanism is connected with a center grinding plate, and the center grinding plate can be movably arranged in the center of the bottom of the grinding polishing assembly. According to the partition pressing device and method, the outer ring pressing mechanism conducts overall pressing, and the inner ring pressing mechanism conducts center part pressing, so that the condition that a whole disc of wafers are poor in consistency due to different linear velocities caused by different diameters is avoided; the outer ring finished product wafers and the inner ring finished product wafers on a ceramic disc are high in consistency, the grinding polishing accuracy is high, the production efficiency is greatly improved, and the percent of pass of the finished products is improved.
Description
Technical field
The invention belongs to the technical field for the lathe of grinding or polishing, device or technique, particularly a kind of utilize the pressure of abrasive body diverse location is controlled, realize grinding and polishing by the pressure differential between block after the subregion pressue device being applicable to large-scale one side polishing grinding equipment that thickness is even, uniformity is good of finished workpart and method.
Background technology
One side polishing grinding equipment is high-precision plane machining equipment, it has high-strength mechanical to construct and stable precision, is mainly used as the one side grinding and polishing of quartz crystal slice, silicon, germanium wafer, glass, potsherd, piston ring, valve plate, valve block, bearing, molybdenum sheet, sapphire and various sheet metal and other disk part by performings, non-metal workpiece.
At present, small-sized one side polishing grinding equipment, the single cylinder of general employing controls the rising of grinding polisher head, decline and the pressurization to grinding polisher head, and on ceramic disk due to small-sized polishing grinding equipment, the quantity of wafer often only has 1-2 to enclose, and the diameter of ceramic disk own is less again, so the conformity error produced due to the diameter difference of ceramic disk is negligible.
But in prior art, requirement for one side polishing grinding equipment is more and more higher, demand for product is also very large, this certainly will need the large-scale polishing grinding equipment of application to fulfil assignment, but according to identical Technology application on large-scale polishing grinding equipment, in the course of the work, the grinding and polishing of wafer is realized by the relative motion between grinding and polishing assembly and lower abrasive disk, when the diameter on ceramic disk is different time, linear velocity can increase greatly along with the change of diameter, thus the wafer of final finished can be made to occur, and the wafer being in ceramic disk internal layer is thick, the phenomenon that outer field wafer is thin, have impact on the uniformity of whole dish wafer, the diameter difference of ceramic disk is larger, the conformity error of grinding and polishing will be larger, have a strong impact on grinding and polishing precision, reduce production efficiency, disqualification rate promotes greatly.
Summary of the invention
The technical problem that the present invention solves is, due in prior art, in the process of large-scale polishing grinding equipment work, the grinding and polishing of wafer is realized by the relative motion between grinding and polishing assembly and lower abrasive disk, when the diameter on ceramic disk is different time, linear velocity can increase greatly along with the change of diameter, and the wafer of the final finished caused occurs that the wafer being in ceramic disk internal layer is thick, the phenomenon that outer field wafer is thin, have impact on the uniformity of whole dish wafer, the diameter difference of ceramic disk is larger, the conformity error of grinding and polishing will be larger, have a strong impact on grinding and polishing precision, reduce production efficiency, the problem that disqualification rate promotes greatly, and then provide a kind of the subregion pressue device being applicable to large-scale one side polishing grinding equipment and method of optimization.
The technical solution adopted in the present invention is, a kind of subregion pressue device being applicable to large-scale one side polishing grinding equipment, described polishing grinding equipment comprises the controlling organization be connected with described subregion pressue device, described subregion pressue device comprises outer ring pressing mechanism and inner ring pressing mechanism, and described controlling organization is connected with pneumatic mechanism; Described outer ring pressing mechanism comprises the cylinder be connected with described pneumatic mechanism, and described cylinder is connected with the grinding and polishing assembly of described polishing grinding equipment by the first transmission mechanism; Described inner ring pressing mechanism comprises the swivel joint be connected with described pneumatic mechanism, described swivel joint is connected with the second transmission mechanism being located at described first transmission mechanism inside, described second transmission mechanism is connected to center abrasive sheet, and described center abrasive sheet is movably located at the bottom centre of described grinding and polishing assembly.
Preferably, described first transmission mechanism comprises the Connection Block and splined shaft that are connected in turn with described cylinder, is equipped with spline housing outside described splined shaft, and described spline housing is connected with described grinding and polishing assembly.
Preferably, described second transmission mechanism comprises the central shaft and some guide shafts that are connected in turn with described swivel joint, and described central axis is located in splined shaft, and described guide shaft is connected to center abrasive sheet and is uniformly distributed on the abrasive sheet of center.
Preferably, described Connection Block comprises limited block, and described limited block is located at above described splined shaft.
Preferably, described pneumatic mechanism comprises source of the gas, 1 three position five-way valve be connected with described cylinder and 1 the first pressure-reducing valve be connected with described swivel joint, and described source of the gas is connected with described three position five-way valve and the first pressure-reducing valve respectively by gas circuit.
Preferably, described three position five-way valve comprises decline magnetic valve and rising magnetic valve, described decline magnetic valve and rising magnetic valve are connected to source of the gas respectively by gas circuit, the gas circuit that described decline magnetic valve is connected with source of the gas is also provided with the second pressure-reducing valve, described second pressure-reducing valve is connected with the first proportioning valve, and described first proportioning valve is connected to source of the gas by gas circuit.
Preferably, described decline magnetic valve and rising magnetic valve are connected to noise elimination mechanism.
Preferably, described first pressure-reducing valve is also connected with the second proportioning valve, and described second proportioning valve is connected to source of the gas by gas circuit.
Preferably, described cylinder is provided with some sensors, described sensor is proximity switch.
Employing is applicable to a subregion pressure method for the subregion pressue device of large-scale polishing grinding equipment, said method comprising the steps of:
Step one: now decline magnetic valve and rising magnetic valve are all resting state, three position five-way valve is in balanced mode, and the gas circuit of five mouths is all closed, and gas circuit is not all communicated with source of the gas, cylinder can not be subject to air pressure up or down, and grinding and polishing assembly keeps motionless;
Step 2: rising solenoid valves works, decline magnetic valve is in resting state, three position five-way valve enters rising mode of operation, gas circuit between rising magnetic valve and source of the gas is connected, gas circuit between three position five-way valve and cylinder is connected, decline magnetic valve is connected to the exhaust of noise elimination mechanism, now the air pressure that up pushed up of cylinder and moving upward, and arriving limes superiors home when driving grinding and polishing assembly to reach the limited block of Connection Block stops;
Step 3: after putting into polishing workpiece to be ground, decline solenoid valves works, rising magnetic valve is in resting state, three position five-way valve enters decline mode of operation, gas circuit between decline magnetic valve and source of the gas is connected, gas circuit between three position five-way valve and cylinder is connected, second pressure-reducing valve and the gas circuit between the first proportioning valve and source of the gas are connected and are carried out gas circuit adjustment, rising magnetic valve is connected to the exhaust of noise elimination mechanism, cylinder is subject to air pressure and drives grinding and polishing assembly downward, until grinding and polishing assembly is to certain position, sensor feedback signal is to controlling organization, cylinder stops driving, grinding and polishing assembly stops declining,
Step 4: when sensor detects the down position of grinding and polishing assembly, the gas circuit governor motion of the second pressure-reducing valve and the first proportioning valve composition starts to control gas circuit flow, it is made to reduce gradually, the grinding polisher head lower surface of grinding and polishing assembly slowly drops to and contacts with polishing workpiece to be ground, then enter automatic grind polishing state, in grinding and polishing process, the gas circuit governor motion moment of the second pressure-reducing valve and the first proportioning valve composition controls throughput until complete the processing of polishing workpiece to be ground;
Step 5: when step 4 reaches stable, connect the gas circuit between the adjusting device of the first pressure-reducing valve and the second proportioning valve composition and source of the gas, first pressure-reducing valve directly acts on swivel joint, control gas circuit flow and act on central shaft, be located at the center abrasive sheet pressure increase at grinding and polishing assembly center, pressure grinding polishing is carried out in the center for the treatment of grinding and polishing workpiece;
Step 6: grinding and polishing terminates, rising solenoid valves works, decline magnetic valve is in resting state, three position five-way valve enters rising mode of operation, gas circuit between rising magnetic valve and source of the gas is connected, gas circuit between three position five-way valve and cylinder is connected, decline magnetic valve is connected to the exhaust of noise elimination mechanism, close the gas circuit between the adjusting device of the first pressure-reducing valve and the second proportioning valve composition and source of the gas, the now air pressure that up pushed up of cylinder and moving upward, arrives limes superiors home when driving grinding and polishing assembly to reach the limited block of Connection Block and stops.
The invention provides a kind of the subregion pressue device being applicable to large-scale one side polishing grinding equipment and method of optimization, by subregion pressue device is set to outer ring pressing mechanism and inner ring pressing mechanism, outer ring pressing mechanism drives the first transmission mechanism to move by cylinder and acts on the grinding and polishing assembly of polishing grinding equipment, carry out the pressurization in entire scope, inner ring pressing mechanism is located at the second transmission mechanism of the first transmission mechanism inside by swivel joint drive and is acted on the center abrasive sheet being located at grinding and polishing assembly center, namely the subregional pressurization of central part is completed, the situation of the uniformity difference of the whole dish wafer occurred when the diameter difference avoided on ceramic disk causes linear velocity different, by adjusting the pressure differential of zones of different, the uniformity realizing the finished product wafer of outer ring and inner ring on ceramic disk is high, grinding and polishing precision is high, production efficiency promotes greatly, the qualification rate of finished product increases significantly.
Accompanying drawing explanation
Fig. 1 is the sectional view structural representation of subregion pressue device of the present invention;
Fig. 2 is the gas circuit structure of outer ring of the present invention pressing mechanism, and A position is air inlet position, and B position is order about cylinder gas circuit down, and C position is order about cylinder gas circuit up, and D position is proportioning valve adjustment gas circuit;
Fig. 3 is the gas circuit structure of inner ring pressing mechanism of the present invention, and E position and F position are air inlet position, and G position is the gas outlet of inner ring pressurization.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in further detail, but protection scope of the present invention is not limited to this.
As shown in the figure, the present invention relates to a kind of subregion pressue device being applicable to large-scale one side polishing grinding equipment, described polishing grinding equipment comprises the controlling organization be connected with described subregion pressue device, described subregion pressue device comprises outer ring pressing mechanism and inner ring pressing mechanism, and described controlling organization is connected with pneumatic mechanism; Described outer ring pressing mechanism comprises the cylinder 1 be connected with described pneumatic mechanism, and described cylinder 1 is connected with the grinding and polishing assembly 2 of described polishing grinding equipment by the first transmission mechanism; Described inner ring pressing mechanism comprises the swivel joint 3 be connected with described pneumatic mechanism, described swivel joint 3 is connected with the second transmission mechanism being located at described first transmission mechanism inside, described second transmission mechanism is connected to center abrasive sheet 2-1, and described center abrasive sheet 2-1 is movably located at the bottom centre of described grinding and polishing assembly 2.
In the present invention, polishing grinding equipment comprises the controlling organization be connected with subregion pressue device, subregion pressue device comprises outer ring pressing mechanism and inner ring pressing mechanism, controlling organization is connected with pneumatic mechanism, is namely completed the pressure grinding polishing operation of the workpiece of zones of different in the present invention by controlling organization control pneumatic mechanism manipulation outer ring pressing mechanism and inner ring pressing mechanism.
In the present invention, outer ring pressing mechanism comprises the cylinder 1 be connected with pneumatic mechanism, cylinder 1 is connected with the grinding and polishing assembly 2 of polishing grinding equipment by the first transmission mechanism, inner ring pressing mechanism comprises the swivel joint 3 be connected with pneumatic mechanism, swivel joint 3 is connected with the second transmission mechanism being located at the first transmission mechanism inside, second transmission mechanism is connected to center abrasive sheet 2-1, and center abrasive sheet 2-1 is movably located at the center of grinding and polishing assembly 2; Outer ring pressurization relies on the effect of cylinder 1 to complete, time cylinder 1 moves up and down, first transmission mechanism also moves up and down, thus drive whole grinding and polishing assembly 2 to move up and down, and after grinding and polishing assembly 2 contacts with the lower abrasive disk of equipment, if cylinder 1 continues pressurization, then pressure is delivered to the grinding polisher head 2-2 place of grinding and polishing assembly 2, the scope of pressure is in the outer collar region of whole grinding and polishing assembly 2, thus realizes the outer ring pressurization of grinding and polishing assembly 2; Inner ring is pressurised into that gas in the middle of gas circuit imports, by after swivel joint 3, air pressure is passed to center abrasive sheet 2-1 by the second transmission mechanism, and center abrasive sheet 2-1 increases the pressure in contact area downwards, realizes the inner ring pressurization of grinding and polishing assembly 2.
Described first transmission mechanism comprises the Connection Block 4 and splined shaft 5 that are connected in turn with described cylinder 1, and be equipped with spline housing 6 outside described splined shaft 5, described spline housing 6 is connected with described grinding and polishing assembly 2.
Described second transmission mechanism comprises the central shaft 7 and some guide shafts 8 that are connected in turn with described swivel joint 3, and described central shaft 7 is with being located in splined shaft 5, and described guide shaft 8 is connected to center abrasive sheet 2-1 and is uniformly distributed on the abrasive sheet 2-1 of center.
In the present invention, first transmission mechanism comprises the Connection Block 4 and splined shaft 5 that are connected in turn with cylinder 1, spline housing 6 is equipped with outside splined shaft 5, and spline housing 6 is connected with grinding and polishing assembly 2, namely cylinder 1 acts on splined shaft 5 by Connection Block 4, splined shaft 5, by pressure being acted on spline housing 6 with the mating reaction of spline housing 6, drives grinding and polishing assembly 2 to move up and down and transmission of pressure by spline housing 6.
In the present invention, second transmission mechanism comprises the central shaft 7 and guide shaft 8 that are connected in turn with swivel joint 3, guide shaft 8 is connected to center abrasive sheet 2-1, namely air pressure is passed into by swivel joint 3 and acts on central shaft 7, central shaft 7 acts on guide shaft 8, guide shaft 8 directly acts on center abrasive sheet 2-1, and the polishing workpiece to be ground for lower abrasive disk center carries out pressure grinding polishing.
In the present invention, central shaft 7, with being located in splined shaft 5, ensure that the workpiece of the same area there will not be the irregular problem in grinding and polishing face after completing grinding and polishing.
In the present invention, guide shaft 8 is uniformly distributed on the abrasive sheet 2-1 of center, ensure that the workpiece of the same area there will not be the irregular problem in grinding and polishing face after completing grinding and polishing.
Described Connection Block 4 comprises limited block 9, and described limited block 9 is located at above described splined shaft 5.
In the present invention, Connection Block 4 arranges limited block 9, make splined shaft 5 can be undertaken spacing by limited block 9 in the process risen, arriving limes superiors home when subregion pressue device rises can stop, and ensures that the normal safe of grinding and polishing work carries out.
Described pneumatic mechanism comprises source of the gas, 1 three position five-way valve 10 be connected with described cylinder 1 and 1 the first pressure-reducing valve 11 be connected with described swivel joint 3, and described source of the gas is connected with described three position five-way valve 10 and the first pressure-reducing valve 11 respectively by gas circuit.
In the present invention, pneumatic mechanism comprises source of the gas, three position five-way valve 10 and the first pressure-reducing valve 11, and three position five-way valve 10 is connected with cylinder 1, is mainly used in the normal work controlling outer ring pressing mechanism, first pressure-reducing valve 11 is connected with swivel joint 3, is mainly used in the normal work controlling inner ring pressing mechanism.
Described three position five-way valve 10 comprises decline magnetic valve 12 and rising magnetic valve 13, described decline magnetic valve 12 and rising magnetic valve 13 are connected to source of the gas respectively by gas circuit, the gas circuit that described decline magnetic valve 12 is connected with source of the gas is also provided with the second pressure-reducing valve 14, described second pressure-reducing valve 14 is connected with the first proportioning valve 15, and described first proportioning valve 15 is connected to source of the gas by gas circuit.
In the present invention, three position five-way valve 10 comprises decline magnetic valve 12 and rising magnetic valve 13, be respectively used to the control operation that control cylinder 1 completes the decline of subregion pressue device or rises, wherein, decline magnetic valve 12 is also connected to the second pressure-reducing valve 14, first proportioning valve 15 and source of the gas in turn, second pressure-reducing valve 14 and the first proportioning valve 15 are for regulating gas circuit flow, and timely tonifying Qi or subtract gas, ensure that normally carrying out of pressurized operation.
Described decline magnetic valve 12 and rising magnetic valve 13 are connected to noise elimination mechanism.
In the present invention, auxiliary decline magnetic valve 12 plays in noise elimination mechanism and gas is derived gas circuit and reduces the device of sound of giving vent to anger by rising magnetic valve 13, and generally, noise elimination mechanism can be set to the screen pack at air guide port place.
Described first pressure-reducing valve 11 is also connected with the second proportioning valve 16, and described second proportioning valve 16 is connected to source of the gas by gas circuit.
In the present invention, first pressure-reducing valve 11, second proportioning valve 16 is connected in turn with source of the gas, first pressure-reducing valve 11 and the second proportioning valve 16 increase the pressure of center abrasive sheet 2-1 by controlling gas circuit flow, make the polishing workpiece to be ground being placed in grinding and polishing device inner circle area obtain sufficient grinding and polishing, ensure that the uniformity of grinding and polishing.
Described cylinder 1 is provided with some sensors, and described sensor is proximity switch.
In the present invention, cylinder 1 is generally arranged 3 sensors, sensor generally adopts proximity switch to complete sensing operations.
In the present invention, 2 stroke limit position that 3 proximity switches on cylinder 1 are arranged at cylinder 1 respectively and the middle shift position arranged according to actual conditions by concrete operating personnel.
Below in conjunction with the mode of operation of method subregion pressue device clearly of the present invention further.
Employing is applicable to a subregion pressure method for the subregion pressue device of large-scale polishing grinding equipment, said method comprising the steps of:
Step one: now decline magnetic valve 12 and rising magnetic valve 13 are all resting state, three position five-way valve 10 is in balanced mode, and the gas circuit of five mouths is all closed, and gas circuit is not all communicated with source of the gas, cylinder 1 can not be subject to air pressure up or down, and grinding and polishing assembly 2 keeps motionless;
Step 2: rising magnetic valve 13 is energized work, decline magnetic valve 12 is in resting state, three position five-way valve 10 enters rising mode of operation, gas circuit between rising magnetic valve 13 and source of the gas is connected, gas circuit between three position five-way valve 10 and cylinder 1 is connected, decline magnetic valve 12 is connected to the exhaust of noise elimination mechanism, now the air pressure that up pushed up of cylinder 1 and moving upward, and arriving limes superiors home when driving grinding and polishing assembly 2 to reach the limited block 9 of Connection Block 4 stops;
Step 3: after putting into polishing workpiece to be ground, decline magnetic valve 12 is energized work, rising magnetic valve 13 is in resting state, three position five-way valve 10 enters decline mode of operation, gas circuit between decline magnetic valve 12 and source of the gas is connected, gas circuit between three position five-way valve 10 and cylinder 1 is connected, second pressure-reducing valve 14 and the gas circuit between the first proportioning valve 15 and source of the gas are connected and are carried out gas circuit adjustment, rising magnetic valve 13 is connected to the exhaust of noise elimination mechanism, cylinder 1 is subject to air pressure and drives grinding and polishing assembly 2 downward, until grinding and polishing assembly 2 to certain position, sensor feedback signal is to controlling organization, cylinder 1 stops driving, grinding and polishing assembly 2 stops declining,
Step 4: when sensor detects the down position of grinding and polishing assembly 2, the gas circuit governor motion of the second pressure-reducing valve 14 and the first proportioning valve 11 composition starts to control gas circuit flow, it is made to reduce gradually, the grinding polisher head 2-2 lower surface of grinding and polishing assembly 2 slowly drops to and contacts with polishing workpiece to be ground, then enter automatic grind polishing state, in grinding and polishing process, the gas circuit governor motion moment of the second pressure-reducing valve 14 and the first proportioning valve 15 composition controls throughput until complete the processing of polishing workpiece to be ground;
Step 5: when step 4 reaches stable, connect the gas circuit between the adjusting device of the first pressure-reducing valve 11 and the second proportioning valve 16 composition and source of the gas, first pressure-reducing valve 11 directly acts on swivel joint 3, control gas circuit flow and act on central shaft 7, be located at the center abrasive sheet 2-1 pressure increase at grinding and polishing assembly 2 center, pressure grinding polishing is carried out in the center for the treatment of grinding and polishing workpiece;
Step 6: grinding and polishing terminates, rising magnetic valve 13 is energized work, decline magnetic valve 12 is in resting state, three position five-way valve 10 enters rising mode of operation, gas circuit between rising magnetic valve 13 and source of the gas is connected, gas circuit between three position five-way valve 10 and cylinder 1 is connected, decline magnetic valve 12 is connected to the exhaust of noise elimination mechanism, close the gas circuit between the adjusting device of the first pressure-reducing valve 11 and the second proportioning valve 16 composition and source of the gas, the now air pressure that up pushed up of cylinder 1 and moving upward, arrive limes superiors home when driving grinding and polishing assembly 2 to reach the limited block 9 of Connection Block 4 to stop.
The course of work that in the present invention, above step completes subregion pressue device balance respectively, subregion pressue device rises overally, subregion pressue device entire lowering, the polishing of subregion pressue device integral grinding, subregion pressue device pressurized subregion grinding and polishing and subregion pressue device rise overally.
In the present invention, A position is air inlet position, B position is order about cylinder 1 gas circuit down, C position is order about cylinder 1 gas circuit up, D position is proportioning valve adjustment gas circuit, E position and F position be inner ring pressurization air inlet position, G position be inner ring pressurization gas outlet, according to open and close magnetic valve difference and open and close above-mentioned different position.
The invention solves in prior art, in the process of large-scale polishing grinding equipment work, the grinding and polishing of wafer is realized by the relative motion between grinding and polishing assembly 2 and lower abrasive disk, when the diameter on ceramic disk is different time, linear velocity can increase greatly along with the change of diameter, and the wafer of the final finished caused occurs that the wafer being in ceramic disk internal layer is thick, the phenomenon that outer field wafer is thin, have impact on the uniformity of whole dish wafer, the diameter difference of ceramic disk is larger, the conformity error of grinding and polishing will be larger, have a strong impact on grinding and polishing precision, reduce production efficiency, the problem that disqualification rate promotes greatly, by subregion pressue device is set to outer ring pressing mechanism and inner ring pressing mechanism, outer ring pressing mechanism drives the first transmission mechanism to move by cylinder 1 and acts on the grinding and polishing assembly 2 of polishing grinding equipment, carry out the pressurization in entire scope, inner ring pressing mechanism is located at the second transmission mechanism of the first transmission mechanism inside by swivel joint 3 drive and is acted on the center abrasive sheet 2-1 being located at grinding and polishing assembly 2 center, namely the subregional pressurization of central part is completed, the situation of the uniformity difference of the whole dish wafer occurred when the diameter difference avoided on ceramic disk causes linear velocity different, by adjusting the pressure differential of zones of different, the uniformity realizing the finished product wafer of outer ring and inner ring on ceramic disk is high, grinding and polishing precision is high, production efficiency promotes greatly, the qualification rate of finished product increases significantly.
Claims (10)
1. one kind is applicable to the subregion pressue device of large-scale one side polishing grinding equipment, described polishing grinding equipment comprises the controlling organization be connected with described subregion pressue device, it is characterized in that: described subregion pressue device comprises outer ring pressing mechanism and inner ring pressing mechanism, and described controlling organization is connected with pneumatic mechanism; Described outer ring pressing mechanism comprises the cylinder be connected with described pneumatic mechanism, and described cylinder is connected with the grinding and polishing assembly of described polishing grinding equipment by the first transmission mechanism; Described inner ring pressing mechanism comprises the swivel joint be connected with described pneumatic mechanism, described swivel joint is connected with the second transmission mechanism being located at described first transmission mechanism inside, described second transmission mechanism is connected to center abrasive sheet, and described center abrasive sheet is movably located at the bottom centre of described grinding and polishing assembly.
2. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 1, it is characterized in that: described first transmission mechanism comprises the Connection Block and splined shaft that are connected in turn with described cylinder, be equipped with spline housing outside described splined shaft, described spline housing is connected with described grinding and polishing assembly.
3. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 2, it is characterized in that: described second transmission mechanism comprises the central shaft and some guide shafts that are connected in turn with described swivel joint, described central axis is located in splined shaft, and described guide shaft is connected to center abrasive sheet and is uniformly distributed on the abrasive sheet of center.
4. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 2, it is characterized in that: described Connection Block comprises limited block, described limited block is located at above described splined shaft.
5. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 1, it is characterized in that: described pneumatic mechanism comprises source of the gas, 1 three position five-way valve be connected with described cylinder and 1 the first pressure-reducing valve be connected with described swivel joint, and described source of the gas is connected with described three position five-way valve and the first pressure-reducing valve respectively by gas circuit.
6. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 5, it is characterized in that: described three position five-way valve comprises decline magnetic valve and rising magnetic valve, described decline magnetic valve and rising magnetic valve are connected to source of the gas respectively by gas circuit, the gas circuit that described decline magnetic valve is connected with source of the gas is also provided with the second pressure-reducing valve, described second pressure-reducing valve is connected with the first proportioning valve, and described first proportioning valve is connected to source of the gas by gas circuit.
7. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 6, is characterized in that: described decline magnetic valve and rising magnetic valve are connected to noise elimination mechanism.
8. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 5, it is characterized in that: described first pressure-reducing valve is also connected with the second proportioning valve, described second proportioning valve is connected to source of the gas by gas circuit.
9. a kind of subregion pressue device being applicable to large-scale polishing grinding equipment according to claim 1, it is characterized in that: described cylinder is provided with some sensors, described sensor is proximity switch.
10. adopt the subregion pressure method being applicable to the subregion pressue device of large-scale polishing grinding equipment described in right 1 ~ 9, it is characterized in that: said method comprising the steps of:
Step one: now decline magnetic valve and rising magnetic valve are all resting state, three position five-way valve is in balanced mode, and the gas circuit of five mouths is all closed, and gas circuit is not all communicated with source of the gas, cylinder can not be subject to air pressure up or down, and grinding and polishing assembly keeps motionless;
Step 2: rising solenoid valves works, decline magnetic valve is in resting state, three position five-way valve enters rising mode of operation, gas circuit between rising magnetic valve and source of the gas is connected, gas circuit between three position five-way valve and cylinder is connected, decline magnetic valve is connected to the exhaust of noise elimination mechanism, now the air pressure that up pushed up of cylinder and moving upward, and arriving limes superiors home when driving grinding and polishing assembly to reach the limited block of Connection Block stops;
Step 3: after putting into polishing workpiece to be ground, decline solenoid valves works, rising magnetic valve is in resting state, three position five-way valve enters decline mode of operation, gas circuit between decline magnetic valve and source of the gas is connected, gas circuit between three position five-way valve and cylinder is connected, second pressure-reducing valve and the gas circuit between the first proportioning valve and source of the gas are connected and are carried out gas circuit adjustment, rising magnetic valve is connected to the exhaust of noise elimination mechanism, cylinder is subject to air pressure and drives grinding and polishing assembly downward, until grinding and polishing assembly is to certain position, sensor feedback signal is to controlling organization, cylinder stops driving, grinding and polishing assembly stops declining,
Step 4: when sensor detects the down position of grinding and polishing assembly, the gas circuit governor motion of the second pressure-reducing valve and the first proportioning valve composition starts to control gas circuit flow, it is made to reduce gradually, the grinding polisher head lower surface of grinding and polishing assembly slowly drops to and contacts with polishing workpiece to be ground, then enter automatic grind polishing state, in grinding and polishing process, the gas circuit governor motion moment of the second pressure-reducing valve and the first proportioning valve composition controls throughput until complete the processing of polishing workpiece to be ground;
Step 5: when step 4 reaches stable, connect the gas circuit between the adjusting device of the first pressure-reducing valve and the second proportioning valve composition and source of the gas, first pressure-reducing valve directly acts on swivel joint, control gas circuit flow and act on central shaft, be located at the center abrasive sheet pressure increase at grinding and polishing assembly center, pressure grinding polishing is carried out in the center for the treatment of grinding and polishing workpiece;
Step 6: grinding and polishing terminates, rising solenoid valves works, decline magnetic valve is in resting state, three position five-way valve enters rising mode of operation, gas circuit between rising magnetic valve and source of the gas is connected, gas circuit between three position five-way valve and cylinder is connected, decline magnetic valve is connected to the exhaust of noise elimination mechanism, close the gas circuit between the adjusting device of the first pressure-reducing valve and the second proportioning valve composition and source of the gas, the now air pressure that up pushed up of cylinder and moving upward, arrives limes superiors home when driving grinding and polishing assembly to reach the limited block of Connection Block and stops.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511011304.9A CN105479325B (en) | 2015-12-30 | 2015-12-30 | A kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment |
Applications Claiming Priority (1)
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| CN108700900A (en) * | 2016-02-11 | 2018-10-23 | 贺尔碧格自动化技术控股股份有限公司 | Proportioning valve |
| CN110142681A (en) * | 2019-05-29 | 2019-08-20 | 上海浩曦智能设备有限公司 | Thermal-insulation cup buffing machine fluid dynamic power control device |
| CN110625518A (en) * | 2018-06-20 | 2019-12-31 | 株式会社荏原制作所 | Polishing apparatus, polishing method, and non-transitory computer-readable medium |
| CN111070078A (en) * | 2020-01-08 | 2020-04-28 | 洛阳聚享新科智能科技有限公司 | Multi-stage gas path pressure control system and method for upper disc of double-end-face grinding machine |
| CN113910098A (en) * | 2021-10-19 | 2022-01-11 | 上海汉虹精密机械有限公司 | Accurate pressurization gas circuit control system for grinding and polishing machine |
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| CN111070078A (en) * | 2020-01-08 | 2020-04-28 | 洛阳聚享新科智能科技有限公司 | Multi-stage gas path pressure control system and method for upper disc of double-end-face grinding machine |
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| CN113910098B (en) * | 2021-10-19 | 2023-08-29 | 上海汉虹精密机械有限公司 | Accurate pressurization gas circuit control system for grinding polishing machine |
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