CN105472889A - Method for forming metal patterns on polymer substrate - Google Patents
Method for forming metal patterns on polymer substrate Download PDFInfo
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- CN105472889A CN105472889A CN201410457678.2A CN201410457678A CN105472889A CN 105472889 A CN105472889 A CN 105472889A CN 201410457678 A CN201410457678 A CN 201410457678A CN 105472889 A CN105472889 A CN 105472889A
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Abstract
The invention provides a method for forming metal patterns on a polymer substrate. The method comprises the steps that the polymer substrate is provided; a mixture layer is formed on the surface of the polymer substrate, and the mixture layer includes an active carrier medium and nanoparticles which are scattered in the active carrier medium; a part of the mixture layer is processed by performing the laser step so that active crystal seed residues are formed on the surface of the polymer substrate; cleaning processing is performed so that the part of the mixture layer which is not processed is removed and the surface of the polymer substrate is exposed, and the active crystal seed residues are left on the surface of the polymer substrate; and electroless plating processing is performed on the active crystal seed residues left on the polymer substrate so that the metal patterns are formed on the active crystal seed residues. With application of the manufacturing method, manufacturing cost is relatively low and processing flexibility is higher.
Description
Technical field
The present invention relates generally to a kind of method forming metal pattern on substrate, in particular, relates to a kind of method forming metal pattern on polymeric substrates.
Background technology
Along with scientific and technological progress, portable electron device is intelligent mobile phone, flat computer, notebook computer etc. such as, becomes more light and handy and is easy to carry about with one.In order to small and exquisite and efficiency that is microminiaturized and device, the antenna that portable electron device comprises complicated circuit more and formed by laser direct forming (laserdirectstructuring, LDS) technology.But it is quite a lot of that the special LDS material needed for LDS technology and specific instrument can cause production cost to improve.
Therefore, need to provide a kind of method forming metal pattern on polymeric substrates to solve the problems referred to above.
Summary of the invention
Therefore, the present invention relates to a kind of method manufacturing metal pattern above polymeric substrates, described method can provide the product of high-quality with lower manufacturing cost.
The invention provides a kind of method forming metal pattern on polymeric substrates.After polymeric substrates is provided, the surface of described polymeric substrates forms mixture layer.Described mixture layer comprises active carrier medium and is scattered in the nano particle in described active carrier medium.Carry out laser step with mixture layer described in processing section, to form active seed residue on the described surface of polymeric substrates.Carry out clean to remove the part without laser treatment of described mixture layer to expose the described surface of described polymeric substrates, and retain described active seed residue and stay on the described surface of described polymeric substrates.Then, electroless-plating process (process) is carried out to the described active seed residue stayed on described polymeric substrates, so that the described active seed residue on described polymeric substrates to form described metal pattern.
The present invention also provides a kind of method forming metal pattern on polymeric substrates, and described method comprises: provide polymeric substrates; The surface of described polymeric substrates forms mixture layer, and wherein said mixture layer comprises active carrier medium and is scattered in the nano particle in described active carrier medium; Carry out laser step to process a part for described mixture layer, to form active seed residue on the described surface of described polymeric substrates; Carry out clean to remove the untreated part of described mixture layer to expose the described surface of described polymeric substrates, and described active seed residue is stayed on the described surface of described polymeric substrates; And electroless-plating process is carried out to form described metal pattern on described active seed residue to the described active seed residue stayed on described polymeric substrates.
According to embodiments of the invention, the material of described polymeric substrates comprises nylon, Merlon (PC), acrylonitrile-butadiene-styrene (ABS) (ABS), PC/ABS, polyethylene terephthalate (PET), polyether-ether-ketone (PEEK) or liquid crystal polymer (LCP).
According to embodiments of the invention, the material of described nano particle comprises cupric oxide, copper, silver or golden.
According to embodiments of the invention, the material of described nano particle comprises cupric oxide.Described laser step be by use power to be 0.2 ~ 0.4W and there is 80% laser spots coverage rate, ultraviolet (UV) laser that wavelength is 355 nanometers carries out, and described laser step is laser ablation and activation step.Described active seed residue is copper residue.Or comprise the nano particle of silver.Described laser step uses the green laser of wavelength 532 nanometer or infrared ray (IR) laser of wavelength 1064 nanometer to carry out.
According to embodiments of the invention, described electroless-plating pack processing is containing electroless-plating Copper treatment, and described metal pattern comprises copper pattern.
According to embodiments of the invention, described nano particle has the average grain diameter being less than 100 nanometers.
According to embodiments of the invention, with the total weight of described mixture layer, the scope of the content of the described nano particle in described mixture layer is 10 % by weight to 20 % by weight.
According to embodiments of the invention, the material of described active carrier medium comprises PVP (PVP) or polyethylene oxide (PEO).
According to embodiments of the invention, the method forming mixture layer comprises by spray coating (spray), rotary coating, dip-coating (dipcoating), silk screen printing (screenprinting), bat printing (padprinting) or smears (smearing) and form mixture layer.
According to embodiments of the invention, the position of the distribution of described active seed residue corresponds to the position of described metal pattern.
By use manufacture method of the present invention, manufacturing cost can be less, and with regard to the comparatively more options of baseplate material, the flexibility of process uprises.And by providing the high pattern fidelity of substrate and less color dependence to product, can manufacture the product of high-quality.
For allowing above-mentioned and other target of the present invention, feature & benefits become apparent, some preferred embodiments cited below particularly, and coordinate appended accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Accompanying drawing is contained in herein so that understand the present invention further, and to be incorporated in this specification and to form the part of this specification.Accompanying drawing illustrates embodiments of the invention, and together with the description in order to explain principle of the present invention.
Fig. 1 to Fig. 5 schematically illustrates the method forming metal pattern according to embodiments of the invention on polymeric substrates.
Primary clustering symbol description:
30 laser step 124 active carrier media
40 clean 126 active seed residues
Part handled by 110 polymeric substrates 127
110a surface 128 untreated parts
120 mixture layer 150 metal patterns
122 nano particles
Embodiment
Following with reference to preferred embodiment of the present invention, the practical illustration of preferred embodiment can with reference to accompanying drawing.Same components symbol can be used to represent same or similar part at accompanying drawing and in describing.In embodiment hereafter, the circuit lead parts of portable electronic apparatus are described as an example so that explanation.But the present invention is not for limiting described manufacture method or modular construction with exemplary embodiments as herein described.
Fig. 1 to Fig. 5 schematically illustrates the method forming metal pattern according to an embodiment of the invention on polymeric substrates.See Fig. 1, provide polymeric substrates 110.Polymeric substrates 110 can be polymer film, housing and even circuit board, and can make with polymeric material by injection molding technology.Polymeric material can be nylon, Merlon, acrylonitrile-butadiene-styrene (ABS), PC/ABS, polyethylene terephthalate, polyether-ether-ketone, liquid crystal polymer or any suitable plastic material.Polymeric substrates 110 does not need to be made up of LDS particular polymers (that is, aim at the polymeric material of laser direct forming Treatment Design).Polymeric substrates 110 can be one or more parts of electronic installation, and electronic installation can be such as smart phone or Tablet PC, and metal pattern can be and is incorporated into antenna element in electronic installation or three-dimensional circuit.
Subsequently, see Fig. 2, such as, by spray coating, rotary coating, dip coated, silk screen printing, bat printing or smear and form mixture layer 120 on the surperficial 110a of polymeric substrates 110.Mixture layer 120 comprises at least nano particle 122 and active carrier medium 124.Nano particle 122 can be such as the metal nanoparticle be made up of cupric oxide or the metal nanoparticle be made up of copper, silver or gold.Preferably, nano particle 122 can be such as copper oxide nano particle.Nano particle can such as have the average grain diameter being less than 100 nanometers.With the total weight of mixture layer 120, the content of the nano particle 122 of mixture layer 120 can be 10 % by weight to 20 % by weight.The material of active carrier medium 124 can be PVP, polyethylene oxide and fellow thereof.Generally speaking, such as active carrier medium 124 can be removed by solvent wash and laser treatment in subsequent treatment.
See Fig. 3, carry out laser step 30 to process a part for mixture layer 120 to form active seed residue 126.Active seed residue 126 can be conduction or non-conductive residue.In principle, active seed residue 126 is distributed in the overlying regions of the handled part 127 of mixture layer 120 almost evenly.The distribution of active seed residue 126 (that is, the position of handled part 127) is corresponding to the position of the metal pattern treating to be formed in subsequent treatment.The type of the laser used in laser step depends on type and the particle diameter of the nano particle 122 in mixture layer 120.In order to process copper oxide nano particle, the laser used in laser step 30 can be such as: the ultraviolet laser with 355nm, uses 0.2W to 0.4W and Duplication 80% (overlappingoflaserspot).Or, use the infrared laser of wavelength 1064nm, power 3W and Duplication 75%.In order to Processing Ag nano particle, the laser used in laser step 30 can be such as the green laser of wavelength 532nm or the IR laser of wavelength 1064nm.Substantially, due to nano particle high surface with and absorbed by surface plasma resonant effect, the intensity of laser can be relatively low.For example, laser step 30 is laser ablation and activation step.
After laser irradiates, nano particle (especially metal nanoparticle or metallic nanotubes particle) produces heat (releasing heat) efficiently and the heat discharged is passed on to surrounding medium or matrix from nano particle.Under surface plasma resonant effect or when laser frequency conforms to the overall resonance of nano particle, the heating effect of nano particle significantly strengthens.
The heating effect strengthened under utilizing surface plasma resonant effect, nano particle 122 in the handled part of mixture layer 120 merges and changes active seed residue 126 into during laser step 30, and active seed residue 126 close attachment is in surperficial 110a.Because the content of nano particle 122 is only about 10 % by weight to 20 % by weight and nano particle 122 is not scattered in mixture layer 120 thick and fast, the active seed residue 126 obtained is not formed thick and fast together.To use the nano particle be made up of cupric oxide, active seed residue 126 can be the discontinuous copper residue of the overlying regions being distributed in handled part 127.The active seed residue 126 be distributed in pattern can serve as the crystal seed pattern of follow-up electroless-plating process.Because the formation of active seed residue 126 is by laser activation, so position and the shape of pattern accurately can be controlled.
See Fig. 4, after laser step 30, carry out clean 40 exposes polymeric substrates 110 surperficial 110a with the untreated part 128 (see Fig. 3) removing mixture layer 120, and active seed residue 126 remaines on the surperficial 110a of polymeric substrates 110.The solvent used in clean can be such as water, acetone or suitable alcohol.
See Fig. 5, process polymeric substrates 110 further with electroless-plating process and remain in the active seed residue 126 on the surperficial 110a of polymeric substrates 110, to form metal pattern 150.Because active seed residue 126 serves as the crystal seed pattern of electroless-plating, metal pattern 150 is formed on the distributed areas of active seed residue 126 exactly.The distribution density of active seed residue 126 can be controlled by the content of the nano particle in adjustment mixture layer.Generally speaking, active seed residue 126 distribution density can enough closely consolidation to form thin layer as metal pattern.But active seed residue 126 need not form overall thin layer, as long as active seed residue 126 keeps close proximity and maintain pattern for follow-up electroless-plating process.Metal pattern 150 can such as have the thickness being no more than 20 microns.For the polymer surfaces 110a of the exposure corresponding to untreated part 128, there is not electroless-plating.Active seed residue 126 can easily be incorporated in metal pattern 150 during electroless-plating process, and active seed residue 126 and both metal patterns 150 can be regarded as an entirety (integralbody).For example, active seed residue 126 can be copper residue, and electroless-plating process can be electroless-plating Copper treatment, and metal pattern 150 can be copper pattern.Metal pattern 150 can be made up of continuous pattern or discontinuous pattern.Further, because accurately can control distributing position and the shape of active seed residue 126, the pattern fidelity of metal pattern 150 is high.By use laser, the metal pattern obtained can have split-hair pattern contour.And due to laser scanning can in response in the profile of substrate or structure, so metal pattern can be formed on flat surfaces exactly or above non-flat forms object.
Polymeric substrates 110 can be one or more parts of electronic installation (such as, smart phone or Tablet PC), and metal pattern 150 can be and is incorporated into antenna element in electronic installation or three-dimensional circuit.Polymeric substrates and the metal pattern be formed on described polymeric substrates can such as having the injection molding thermoplastic component of long-pending body electronic circuit wire.Manufacture method of the present invention can be applicable to manufacture molded interconnect device (moldedinterconnectdevice in the field making consumer electronic device, telecommunications, automobile and/or Medical Instruments, or the parts of electronic product (such as, antenna for mobile phone or stereo circuit loop) MID).
Compared with prior laser straight forming technology, manufacture method of the present invention can be applicable to any suitable polymeric substrates to form metal pattern, and does not need to use LDS particular polymers material, and LDS particular polymers material costly and have high color dependence.By use manufacture method of the present invention, the nano particle (such as, copper oxide nano particle) of lower cost can be used, and the amount forming the nano particle needed for metal pattern of minimum thickness is less.By use laser, the metal pattern obtained can have split-hair pattern layout, and can be formed on flat surfaces or above non-flat forms profile.
By use manufacture method of the present invention, manufacturing cost can be less, and with regard to the comparatively more options of baseplate material, the flexibility of process uprises.And by providing the high pattern fidelity of substrate and less color dependence to product, can manufacture the product of high-quality.
Manufacture method described in embodiment suitably can be applied to the circuit, distribution or the metal parts that form portable electronic apparatus.
It will be apparent to those skilled in the art that and can carry out various modifications and changes to structure of the present invention, and do not depart from category of the present invention or spirit.In view of foregoing teachings, wish that amendment of the present invention and change are contained in the present invention, its restrictive condition is that these amendments and change fall in the category of appending claims and equivalent thereof.
Claims (14)
1. on polymeric substrates, form a method for metal pattern, described method comprises:
Polymeric substrates is provided;
The surface of described polymeric substrates forms mixture layer, and wherein said mixture layer comprises active carrier medium and is scattered in the nano particle in described active carrier medium;
Carry out laser step to process a part for described mixture layer, to form active seed residue on the described surface of described polymeric substrates;
Carry out clean to remove the untreated part of described mixture layer to expose the described surface of described polymeric substrates, and described active seed residue is stayed on the described surface of described polymeric substrates; And
Electroless-plating process is carried out to form described metal pattern on described active seed residue to the described active seed residue stayed on described polymeric substrates.
2. the method for claim 1, the material of wherein said polymeric substrates comprises nylon, Merlon, acrylonitrile-butadiene-styrene (ABS), PC/ABS, polyethylene terephthalate, polyether-ether-ketone or liquid crystal polymer.
3. the method for claim 1, the material of wherein said nano particle comprises cupric oxide, copper, silver or golden.
4. the method for claim 1, the material of wherein said nano particle comprises cupric oxide.
5. method as claimed in claim 4, wherein said laser step is the ultraviolet laser by using wavelength 355nm, and power is 0.2W to 0.4W and the laser of Duplication 80% carries out, and described laser step is laser ablation and activation step.
6. method as claimed in claim 5, wherein said active seed residue is copper residue.
7. method as claimed in claim 4, wherein said electroless-plating process comprises electroless-plating Copper treatment, and described metal pattern comprises copper pattern.
8. the method for claim 1, the material of wherein said nano particle comprises silver.
9. method as claimed in claim 8, wherein said laser step is undertaken by the green laser of use wavelength 532nm or the IR laser of wavelength 1064nm, and described laser step is laser ablation and activation step.
10. the method for claim 1, wherein said nano particle has the average grain diameter being less than 100 nanometers.
11. the method for claim 1, wherein with the total weight of described mixture layer, the scope of the content of the described nano particle in described mixture layer is 10 % by weight to 20 % by weight.
12. the method for claim 1, the material of wherein said active carrier medium comprises PVP or polyethylene oxide.
13. the method for claim 1, wherein form described mixture layer and comprise by spray coating, rotary coating, dip coated, silk screen printing, bat printing or smear and form described mixture layer.
14. the method for claim 1, the position of the distribution of wherein said active seed residue corresponds to the position of described metal pattern.
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| CN201410457678.2A CN105472889A (en) | 2014-09-10 | 2014-09-10 | Method for forming metal patterns on polymer substrate |
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| CN201410457678.2A CN105472889A (en) | 2014-09-10 | 2014-09-10 | Method for forming metal patterns on polymer substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820367A (en) * | 2017-09-12 | 2018-03-20 | 东莞市仕研电子通讯有限公司 | The preparation method of metallic pattern |
| CN107814970A (en) * | 2016-09-13 | 2018-03-20 | 罗门哈斯电子材料有限责任公司 | Curtain coating for selective metallization |
| CN108574141A (en) * | 2017-03-16 | 2018-09-25 | 富士康(昆山)电脑接插件有限公司 | Electronic equipment and its substrate with LDS antennas and method for preparing substrate |
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| US20090291230A1 (en) * | 2008-05-26 | 2009-11-26 | Fukui Precision Component (Shenzhen) Co., Ltd. | Ink and method of forming electrical traces using the same |
| CN102421256A (en) * | 2010-09-24 | 2012-04-18 | 光宏精密股份有限公司 | Manufacturing method for forming circuit structure on non-conductive carrier |
| TW201416490A (en) * | 2012-07-12 | 2014-05-01 | Intrinsiq Materials Ltd | Composition for forming a seed layer |
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2014
- 2014-09-10 CN CN201410457678.2A patent/CN105472889A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090291230A1 (en) * | 2008-05-26 | 2009-11-26 | Fukui Precision Component (Shenzhen) Co., Ltd. | Ink and method of forming electrical traces using the same |
| CN102421256A (en) * | 2010-09-24 | 2012-04-18 | 光宏精密股份有限公司 | Manufacturing method for forming circuit structure on non-conductive carrier |
| TW201416490A (en) * | 2012-07-12 | 2014-05-01 | Intrinsiq Materials Ltd | Composition for forming a seed layer |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107814970A (en) * | 2016-09-13 | 2018-03-20 | 罗门哈斯电子材料有限责任公司 | Curtain coating for selective metallization |
| CN108574141A (en) * | 2017-03-16 | 2018-09-25 | 富士康(昆山)电脑接插件有限公司 | Electronic equipment and its substrate with LDS antennas and method for preparing substrate |
| US10581149B2 (en) | 2017-03-16 | 2020-03-03 | Foxconn Interconnect Technology Limited | Electronic device and substrate with LDS antennas and manufacturing method thereof |
| CN107820367A (en) * | 2017-09-12 | 2018-03-20 | 东莞市仕研电子通讯有限公司 | The preparation method of metallic pattern |
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