TW200843588A

TW200843588A - Method for contacting electrical devices

Info

Publication number: TW200843588A
Application number: TW97105981A
Authority: TW
Inventors: Rene Lochtman; Norbert Wagner; Juergen Kaczun; Juergen Pfister; Addamo Antonino Raffaele; Ralf Noerenberg
Original assignee: Basf Se
Priority date: 2007-02-20
Filing date: 2008-02-20
Publication date: 2008-11-01
Also published as: WO2008101884A3; WO2008101884A2

Abstract

A method is provided for electrically contacting electrical devices (122) on a substrate (110), which comprises the following steps: (a) at least one dispersion (116) is applied in at least one region of the substrate (110), the dispersion (116) comprising electrically conductive particles; (b) at least one electrical device (122) is applied onto the dispersion (116); and (c) the dispersion (116) is fully or partially metallized electrolessly and/or electrolytically. An electrical component (134) is furthermore provided, which comprises at least one substrate (110) and at least one electrical device (122). The electrical device (122) is contacted on the substrate (110) by a method according to the invention. A device for carrying out the method according to the invention, as well as a dispersion (116) for use in the method according to the invention and a use of this dispersion (116), are furthermore provided.

Description

200843588 九、發明說明：【發明所屬之技術領域】本發明係關於一種用於在一基板上電接觸電子裝置之方法本發明進一步係關於電子組件，該電子組件包括至少一個藉由本發明方法裝配有—電子裝置之基板。該等方法尤其用於RFID轉發器及印刷電路板生產及電子印刷電路板與RFID轉發器之配件裝置之領域。【先前技術】，自製造電子裝置之領域中可知曉諸多用於將基板裝配有電子裝置之方法。該等電子裝置可例如係需要一電流及/ 電壓之裝置，例如，電晶體、積體電路（ic)或光電管置施加方法料不僅包括以單純機械方式將裝置施加於基板上’亦包括電接觸對應端子且視需要亦包括其他方法步驟。特定而言4 了適合具有一高生產量之大量生產，所使用之裝置％加方法必須滿足諸多要求。除了所使用之方法應較佳地係可自動化之基本要求之外，該方法尤其必須在基板與電子裝置之間的連接點(機械式及電子式二者)品質方表見出回可罪性，且由該方法所生產之基板必須大體上滿足嚴格的機械、電及熱要求。、）技術中已知之裝置施加及接觸方法之重要實例涉及個或多個銲接步驟。於此情形下，一銲接方法意欲指用於適配材料接合之熱方法，其中使用一銲料。熟悉此項技術者已知多種不同之銲接方法，主要對軟鋒接（溫度 128941.doc 200843588 高達約450T：)、硬銲接（溫度高達約9〇〇t )與高溫輝接（溫度高達約900°C )之間加以區別。對於銲接來說，特定而言，可使用含有（特定而言）合金（例如Sn/Ag、、 Sn/Ag/Cu或Sn/Pb)之銲料或銲膏。自電氣工程領域中已知諸多能以-工業規模使用之銲接方法。此處可提及之實例係回流鲜接、熱空氣鮮接或浸入鲜接、及熟悉此項技術者已知之其它銲接技術、以及該等銲接技術與視需要其他連接技術之組合。其中可使用焊接方法之典型尺寸之範圍為自若干公分向下至零點幾毫米。為了達成印刷電路板上之高整合密度，除了習用丁方法 (THT .通孔技術)之外’可使用所謂的表面安裝技術 (SMD ·纟面女裝袈置），其中將諸如電阻或半導體等 <置^•力於基板表面上且與基板表面接觸而通孔不接觸該基板表面。亦已知對應裝置之三維堆叠，且其用以達成高/ 組裝密度°然而’除此之外亦知曉其他連接技術，例如，钳夾技術及其他安裝及/或接觸方法。然而’實際上’已知之銲接技術伴有各種問題及缺點。該等缺點係例如與根據所利用之銲料或所利用之銲膏而必須使用之高處理溫度相關聯。由於該等高銲接温度之緣故，諸多銲膏不能用於所有類型之基板。熱敏感裝置或組件’例如完全或部分由有機導電聚合物組成之裝置，亦不能在此溫度下處理’此尤其係由於所使用之有機材料或所用曰電子材料不具有必需之熱穩定性。諸多在高溫下實施之鲜接過程進—步伴有氧化基板及/或電子裝置表面之風 128941.doc 200843588 險。特定而言，氧化通常發生在其基板之表面上。埂接電子裝置或【發明内容】因此’本發明之目的係提供一種 :單、成本有效且高產率之方法，該方法能= 應用及接觸方法之上述缺點。特定而言， = 大量生產單元且可在低溫下實施之方法。Μ種適合咬^法由-具有獨立請求項i之特徵之方法達成。在盘 5月求項1相關之附屬請求項中提出了有利之改進；該等二求項之特徵可個別實施或者組合實施。明本發明提供一種用於在一基板上電接觸電子裝置之方 2。特定而言，該等電子裝置可係需要供應電流及/或電能及/或產生-電流及/或電能之裝置。另—選擇為或另外地’该等電子裝置可係意欲施加一電壓(例如—預定或變化的電壓）於其上之電子裝置，及/或意欲連接至_電機架或地面之電子裝置。下面給出該等電子裝置之實例。電 "八，八，π里馬用之實例〇該方法涉及以下步驟，該等步驟較佳地但非必須地按照提出之次序實施。以下所提出步驟之某些步驟亦可與其他步驟并行同時實施，或某些步驟或若干步驟可重複地實原則上基板可係任何類型之基板，例如，當前已在電子工業中使用之基板。基板可完全或部分地組態為電絕緣基板，且另一選擇為或另外地，可含有電導體跡線或端子，且同樣另一選擇為或另外地，係已整合為一體或已施加之子裝置。下面給出該等基板之組成及各種應用之實例社七、、t一!~止庄»姑，卜《τ取丄... 128941.doc 200843588 施。該等方法步驟為： (a)在基板之至少一個區域中施加至少一種分散體，該分散體包括導電顆粒； • (b)將至少一個電子裝置施加至該分散體上；及 ' (c)使該分散體全部或部分地以無電方式及/或電解方式金屬化。 f 視需要’可將全部或部分地乾燥及/或固化分散體之步驟***個別方法步驟之後或其中。端視所使用之分散體而定，可使用例如熱固化方法，或另一選擇為或另外地，可使用其他類型之固化方法，例如通過使用uv光輻照固化。該全部或部分地乾燥及/或固化之目的係相應地使該分散體最佳地適合對應的隨後方法步驟及/或終端產品之未來使用。該分散體將在下文中更詳細地加以闡述，其可例如最初在黏度、表面張力或類似參數方面最佳適合施加 I 步驟（a)。然後，特定而言，後續可選乾燥或固化步驟之目的係防止該分散體溢出基板及例如達成施加至該分散體上之電子裝置之最佳黏附。因此，為了能獲得最佳黏附性能，有利的是僅在該階段不完全地實施該乾燥或固化。 • 因此，特定而言，術語電子裝置之施加亦不應受限於施加至（使之接觸）表面上，而是特定而言該術語亦應該包含將電子裝置按壓入分散體中。例如，可在分散體仍柔軟時將電子裝置電觸點按壓入該分散體中。於此情形下，為了優化裝置在分散體中之壓入性能及黏附性能，有利的是可 128941.doc 200843588 使用可選乾燥步驟。相應地，為了為金屬化步驟（c)製備最佳分散體（或藉由先前乾燥或固化步驟改進之分散體），可在方法步驟（b)之後實施乾燥。亦可在步驟（C)中之金屬化之後實施額外固化或乾燥。該分散體包括導電顆粒，且進一步包括將導電顆粒分散於其中之至少一種組分。特定而言，除了至少一種類型之200843588 IX. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to a method for electrically contacting an electronic device on a substrate. The invention further relates to an electronic component comprising at least one method assembled by the method of the invention - a substrate for an electronic device. These methods are particularly useful in the field of RFID transponders and printed circuit board production and accessory devices for electronic printed circuit boards and RFID transponders. [Prior Art] A number of methods for assembling a substrate with an electronic device are known from the field of manufacturing electronic devices. The electronic devices may, for example, be devices that require a current and/or voltage. For example, a transistor, an integrated circuit (ic), or a phototube application method includes not only applying the device to the substrate in a mechanical manner, but also including electrical contact. Corresponding terminals and other method steps are also included as needed. In particular, it is suitable for mass production with a high throughput, and the % addition method used must meet a number of requirements. In addition to the method used, which should preferably be the basic requirement for automation, the method must in particular be sinful in terms of the quality of the connection point between the substrate and the electronic device (both mechanical and electronic). And the substrate produced by the method must generally meet stringent mechanical, electrical, and thermal requirements. Important examples of device application and contact methods known in the art involve one or more soldering steps. In this case, a soldering method is intended to mean a thermal method for adapting the bonding of materials in which a solder is used. A variety of different welding methods are known to those skilled in the art, mainly for soft front connection (temperature 128941.doc 200843588 up to about 450T:), hard soldering (temperature up to about 9〇〇t) and high temperature glow connection (temperature up to about 900) °C) to distinguish between. For soldering, solder or solder paste containing (particularly) an alloy (e.g., Sn/Ag, Sn/Ag/Cu or Sn/Pb) may be used in particular. Many welding methods that can be used on an industrial scale are known from the field of electrical engineering. Examples which may be mentioned herein are reflow fresh, hot air fresh or immersed in fresh joints, and other welding techniques known to those skilled in the art, as well as combinations of such welding techniques and other joining techniques as desired. Typical dimensions in which the welding method can be used range from a few centimeters down to a few tenths of a millimeter. In order to achieve a high integration density on a printed circuit board, in addition to the conventional method (THT. Through Hole Technology), so-called surface mount technology (SMD) can be used, such as resistors or semiconductors. <Setting force on the surface of the substrate and in contact with the surface of the substrate without the through holes contacting the surface of the substrate. Three-dimensional stacking of corresponding devices is also known and is used to achieve high/assembly density. However, other joining techniques are known, such as jawing techniques and other mounting and/or contacting methods. However, the welding technology known in the 'actual' is accompanied by various problems and disadvantages. These disadvantages are associated, for example, with the high processing temperatures that must be used depending on the solder used or the solder paste utilized. Due to the high soldering temperatures, many solder pastes cannot be used for all types of substrates. A heat sensitive device or component', such as a device consisting entirely or partially of an organic conductive polymer, cannot be processed at this temperature' in particular because the organic material used or the germanium electronic material used does not have the requisite thermal stability. Many of the fresh joint processes carried out at high temperatures are accompanied by the wind on the surface of the oxidized substrate and/or electronic device. 128941.doc 200843588 Risk. In particular, oxidation typically occurs on the surface of its substrate.埂电子电子或或因此因此因此因此因此因此因此因此因此因此因此。。。。。。。。。。。。。。。。。。。。。。。。。。 In particular, = a method of mass production units that can be implemented at low temperatures. A suitable method of biting is achieved by a method having the characteristics of an independent request item i. Advantageous improvements are proposed in the sub-requests related to item 1 of May 5; the characteristics of the two items can be implemented individually or in combination. The present invention provides a means for electrically contacting an electronic device on a substrate. In particular, the electronic devices may be devices that require current and/or electrical energy and/or generate current and/or electrical energy. Alternatively, the electronic device may be selected to be an electronic device to which a voltage (e.g., a predetermined or varying voltage) is intended to be applied, and/or an electronic device intended to be coupled to the motor frame or the ground. Examples of such electronic devices are given below. An example of the use of "eight, eight, π ri, 〇. The method involves the following steps, which are preferably, but not necessarily, performed in the order presented. Certain steps of the steps set forth below may also be performed concurrently with other steps, or some steps or steps may be repeated. In principle, the substrate may be any type of substrate, such as substrates currently in use in the electronics industry. The substrate may be configured in whole or in part as an electrically insulating substrate, and alternatively or additionally may comprise electrical conductor traces or terminals, and alternatively another option or otherwise, integrated or applied Device. The following is an example of the composition of the substrates and various applications. VII, t1!~止庄»姑,卜《τ取丄... 128941.doc 200843588 施. The method steps are: (a) applying at least one dispersion in at least one region of the substrate, the dispersion comprising conductive particles; (b) applying at least one electronic device to the dispersion; and 'c) The dispersion is metallized, in whole or in part, in an electroless and/or electrolytic manner. f The step of drying and/or solidifying the dispersion in whole or in part can be inserted after or in the individual method steps as needed. Depending on the dispersion used, for example, a thermal curing process may be used, or alternatively, or alternatively, other types of curing methods may be used, such as by curing with uv light. The purpose of the drying and/or curing in whole or in part is to suitably adapt the dispersion to the subsequent subsequent method steps and/or future use of the end product. This dispersion will be explained in more detail below, which may for example initially be optimally applied in step I (a) in terms of viscosity, surface tension or the like. Then, in particular, the purpose of the subsequent optional drying or curing step prevents the dispersion from spilling over the substrate and, for example, achieving optimal adhesion of the electronic device applied to the dispersion. Therefore, in order to obtain the best adhesion performance, it is advantageous to carry out the drying or curing only completely at this stage. • Therefore, in particular, the application of the term electronic device should not be limited to application to (contact) the surface, but specifically the term should also include pressing the electronic device into the dispersion. For example, the electrical contacts of the electronic device can be pressed into the dispersion while the dispersion is still soft. In this case, in order to optimize the press-in properties and adhesion properties of the device in the dispersion, it is advantageous to use an optional drying step at 128941.doc 200843588. Accordingly, in order to prepare an optimum dispersion for the metallization step (c) (or a dispersion modified by a previous drying or curing step), drying can be carried out after the method step (b). Additional curing or drying may also be carried out after metallization in step (C). The dispersion includes electrically conductive particles and further includes at least one component in which the electrically conductive particles are dispersed. In particular, in addition to at least one type

導電顆粒之外，該分散體可進一步包括至少一種黏合劑及/或至少一種溶劑。該分散體可進一步包括以下組分之至父種·至少一種分散劑；至少一種填充劑；至少一種添加劑。在下文中將以實例方式闡述該等可選組分。導電顆粒形成分散體之關鍵成分。在方法步驟C)中之金屬化過程中，該等導電顆粒形成籽粒，在籽粒上形成金屬化或金屬層。於此情形下’術語"導電"并非必須解釋為意指該等顆粒本身（例如，呈粉末或固體形式）具有導電性能。而是該等導電顆粒應該包括至少一種導電組分，該導電組分隨後在金屬化過程中允許凝m，除此之外，料導電顆粒 ^包括其他組分’例如電絕緣組分，例如呈氧化物層形式。該等額外組分可在步驟⑷中之金屬化之前藉由例如化學手段去除，在下文中將餅、隹―舌一 3 甲將對此進灯更砰細的論述。導電顆粒可係由任何導電材料、不同導電材料之混材化、非^材科之混合物製成之具有狀之顆粒。較佳且洎人Μ^ 1 J fty 適合的導電材料係例如碳(例如碳黑、 128941.doc 200843588 石墨、或碳奈米管）、導電金屬複合物、導電有機化合物或導電聚合物或金屬，較佳係鋅、鎳、銅、錫、鈷、錳、鐵、鎂、鉛、絡、鉍、銀、金、鋁、鈦、鈀、鉑、鈕及其合金、或含有該等金屬中之至少一者之金屬混合物。適合的合金係例如 CuZn、CuSn、CuNi、SnPb、SnBi、SnCo、 NiPb ZnFe、ZnNi、ZnCo 及 ZnMn。铭、鐵、銅、鎳、鋅、錫、銀、碳及其混合物尤其較佳。導電顆粒（較佳係金屬顆粒）較佳地具有一自〇〇〇1至1〇〇 μπι、較佳地自0·005至50 μπι、且尤其佳地自〇〇1至1〇 μιη 之平均顆粒直徑。該平均顆粒直徑可通過雷射繞射量測 (例如使用一 Mlcr〇trac χι〇〇裝置）來確定。顆粒直徑之分布端視其製造方法而定。該直徑分布通常僅包括一個最大值’但複數個最大值亦係可能的。導電顆粒（較佳係金屬顆粒）之表面可至少部分地具有一塗層。合適的塗層在性質上可係無機的（例如Si〇2,磷酸鹽）或有機的。當然導電顆粒亦可塗佈有化物I 一金屬或金屬氧In addition to the conductive particles, the dispersion may further comprise at least one binder and/or at least one solvent. The dispersion may further comprise the following components to the parent species, at least one dispersant, at least one filler, and at least one additive. These optional components are set forth below by way of example. The conductive particles form a key component of the dispersion. During the metallization process in process step C), the electrically conductive particles form kernels which form a metallization or metal layer on the kernels. In this case, the term "conductive" is not necessarily interpreted to mean that the particles themselves (e.g., in powder or solid form) have electrical conductivity. Rather, the electrically conductive particles should comprise at least one electrically conductive component which subsequently permits condensation during the metallization process, in addition to which the electrically conductive particles comprise other components, such as electrically insulating components, for example In the form of an oxide layer. These additional components may be removed by, for example, chemical means prior to metallization in step (4), which will be discussed more hereinafter in the following section. The electrically conductive particles may be granules of any of the electrically conductive materials, the mixture of different electrically conductive materials, and the mixture of non-materials. Preferably, it is suitable for a conductive material such as carbon (for example, carbon black, 128941.doc 200843588 graphite, or carbon nanotube), a conductive metal composite, a conductive organic compound or a conductive polymer or metal. Preferably, it is zinc, nickel, copper, tin, cobalt, manganese, iron, magnesium, lead, lanthanum, cerium, silver, gold, aluminum, titanium, palladium, platinum, a button and an alloy thereof, or at least one of the metals a metal mixture of one. Suitable alloys are, for example, CuZn, CuSn, CuNi, SnPb, SnBi, SnCo, NiPb ZnFe, ZnNi, ZnCo and ZnMn. Ming, iron, copper, nickel, zinc, tin, silver, carbon and mixtures thereof are especially preferred. The electrically conductive particles, preferably metal particles, preferably have an average of from 1 to 1 〇〇μπι, preferably from 0.005 to 50 μπι, and particularly preferably from 〇〇1 to 1〇μιη Particle diameter. The average particle diameter can be determined by laser diffraction measurements (e.g., using a Mlcr〇trac® device). The distribution of the particle diameter depends on the method of manufacture. This diameter distribution usually only includes one maximum value' but a plurality of maximum values are also possible. The surface of the electrically conductive particles, preferably metal particles, can have, at least in part, a coating. Suitable coatings may be inorganic (e.g., Si 〇 2, phosphate) or organic in nature. Of course, the conductive particles may also be coated with a compound I-metal or metal oxygen.

組分或其他組分之一部分。化形Part of a component or other component. Shape

亦可對分散體之性能具有一影響。導電顆粒之形狀在塗佈之後響。就形狀而言，其可為熟 128941.doc 200843588 悉此項技術者已知的多種變型體。導電顆粒之㈣可係例如針形、圓柱形、薄片形或球形。該等顆粒形狀代表理想形狀且實際形狀可因例如製造原因而與此或多或少有很大不同。例如，在本發明範圍内泪珠狀顆粒係實際偏離理想球形之形狀。自理想球形形狀之偏離應該較佳地不大於 20%。具有不同顆粒形狀之導電顆粒市面有售。It can also have an effect on the properties of the dispersion. The shape of the conductive particles rings after coating. In terms of shape, it can be a variety of variants known to those skilled in the art. The (4) conductive particles may be, for example, a needle shape, a cylindrical shape, a flake shape or a spherical shape. These particle shapes represent the ideal shape and the actual shape can be much more or less different from this, for example for manufacturing reasons. For example, within the scope of the invention, the teardrop-like particles actually deviate from the shape of the ideal sphere. The deviation from the ideal spherical shape should preferably be no more than 20%. Conductive particles having different particle shapes are commercially available.

當使用導電顆粒（較佳地金屬顆粒）之混合物時，各混人夥伴亦可具有不同顆粒形狀及/或顆粒大小。亦可使㈣ -種類型之具有不同顆粒大小及/或顆粒形狀之導電顆粒之混合物。對不同顆粒形狀及/或顆粒大小之情形，金屬铭、鐵、銅、錄、鋅、銀以及碳同樣較佳。當使用顆粒形狀之混合物時，球形顆粒與薄片形狀顆粒之混合物較佳。在一實施例中’例如，球形幾基鐵或幾基錄粉末顆粒可與薄片形狀之鐵及/或具有不同幾何形狀之銅顆粒及/或碳顆粒（例如，碳奈米起使用。此混合尤其可提供更均勻且更徹底金屬化之優點，此乃因⑼如卜球形/薄片混合物可形成一改進之滲濾網。、上已提及導電顆粒（較佳地金屬顆粒）可呈粉末形式添加至該分散體中。該等粉末(較佳地金屬粉末)係市售商品或可易於藉由已知方法製造，例如自金屬鹽溶液中電解沈積或化學還原或葬由丘日W :丨L^ _ 了 4精由彳曰助（例如）氫還原氧化粉末、藉由將一金屬溶體噴霧哎露仆女、甘、務及務化尤其至冷却劑（例如氣體或水）中。氣體及水霧化及今屬畜# t , 及金屬虱化物還原較佳。具有較佳顆粒大小之金屬粉末亦可雜由讲偷#, # x J稭由研磨較粗的金屬粉末製造。例如 128941.doc 12 200843588 一球磨機適用於此。除氣體及水霧化之外，對於鐵之情形，用於製造羰基鐵粉末之羰基鐵粉末方法較佳。此可藉由熱分解五羰基鐵來實施。此闡述於（例如）Ullman 之 Encycl〇pedia 〇fWhen a mixture of conductive particles, preferably metal particles, is used, each of the mixing partners may also have a different particle shape and/or particle size. It is also possible to make a mixture of (4) types of conductive particles having different particle sizes and/or particle shapes. Metals, iron, copper, nickel, silver, and carbon are also preferred for different particle shapes and/or particle sizes. When a mixture of particle shapes is used, a mixture of spherical particles and flake-shaped particles is preferred. In one embodiment, for example, a spherical base iron or a plurality of base powder particles may be used in combination with sheet-shaped iron and/or copper particles and/or carbon particles having different geometries (for example, carbon nanotubes. In particular, the advantage of a more uniform and more thorough metallization can be provided, since (9) a spherical/sheet mixture can form an improved percolating screen. It has been mentioned that the electrically conductive particles, preferably metal particles, can be in powder form. Addition to the dispersion. The powders (preferably metal powders) are commercially available or can be readily produced by known methods, such as electrolytic deposition or chemical reduction from metal salt solutions or burial by Qiu W: L^ _ 4 is assisted by, for example, hydrogen-reducing oxidized powder, by spraying a metal solution to expose the servant, Gan, and the chemical, especially to a coolant (such as gas or water). And the water atomization and the current animal #t, and the metal halide reduction is better. The metal powder with better particle size can also be made by the scrap metal #, # x J straw is made of coarsely ground metal powder. For example 128941 .doc 12 200843588 A ball mill is suitable for In addition to gas and water atomization, in the case of iron, a carbonyl iron powder method for producing a carbonyl iron powder is preferred. This can be carried out by thermally decomposing iron pentoxide. This is illustrated, for example, by Ullman. Encycl〇pedia 〇f

Chemistry，第5版，第A14卷，第599頁中。五羰基鐵之分解可（例如）在尚溫及高壓下於一可加熱分解器中實施，該可加熱分解器包括一在一較佳垂直位置上之耐火材料（例如石英玻璃或V2A鋼）管，該管由例如由加熱槽、加熱絲或一加熱介質流過之加熱夾套構成之加熱儀器包圍。亦可根據一類似的方法製造羰基鎳粉末。羰基鐵粉末之平均顆粒直徑可在分解過程中藉由方法參數及反應管理控制在一較寬範圍内，且通常（數量平均）為〇·〇1至100 μιη、較佳地在〇1至5〇 μιη、且尤其佳地自工至 1 0 μιη 〇薄片形狀之導電顆粒（較佳地金屬粉末）可藉由優化製造製程中之條件來控制或隨後藉由機械處理（例如藉由在一攪拌球磨機中處理）獲得。量表示，導電顆粒之重量比例處 >以至少部分經乾燥及/或固化之以已乾燦之塗層之總重在自20%至98%之範圍内塗層之總重量表示，該等導電顆粒之重量比例之較佳範圍在30W之範圍内’且尤其佳地在5(>%與85%之間。適合用作-基質材料者可係例如具有顏料親和錯固基團之黏合劑、天然及合成聚合物及其衍生物、天然樹脂以及合成樹脂及其衍生物、夭麸換Μ 人、 ^天然橡膠、合成橡膠、蛋白質、纖 128941.doc 13 200843588 、隹素:生物、乾燥及不乾燥的油及類似物。該等可以但并非：需用化學或物理方式固化，例如空氣固化、輻射固化或同溫固化。基貝材料較佳地係一聚合物或聚合物摻合物。用作基質材料之較佳聚合物係（例如）ABS(丙烯腈-丁二烯苯乙烯），As A(丙烯腈-苯乙烯丙烯酸酯）；丙烯酸丙烯酉文§曰，醇駄樹脂；烷基乙酸乙烯酯；烷基乙酸乙烯酯共聚物，具體而言甲烯乙酸乙烯酯、乙烯乙酸乙烯酯、丁烯乙酸乙烯酯；烷烯烴氣乙烯共聚物；胺基樹脂；醛及酮樹脂；纖維素及纖維素衍生物，具體而言羥烷基纖維素、纖、准素S曰（例如乙酸纖維素、丙酸纖維素、丁酸纖維素、羧基烧基纖維素、硝酸纖維素）；環氧丙烯酸酯；環氧樹月曰，改性裱氧樹脂，例如雙官能團或多官能團雙酚A或雙酚知、裱氧_酚醛樹脂、溴化環氧樹脂、環脂族環氧樹脂，脂肪族環氧樹脂，縮水甘油醚、乙烯基醚、乙烯-丙烯酸共聚物；烴類樹脂；MABS(透明ABS，亦含有丙烯酸酉曰單元），二聚氰胺樹脂、馬來酸酐共聚物；甲基丙烯酸酯；天然橡膠；合成橡膠；氣橡膠；天然樹脂；松香樹脂；蟲膠；酚系樹脂；聚酯；聚酯樹脂，例如笨基酯樹脂，聚砜；聚醚砜；聚醯胺；聚醯亞胺；聚苯胺丨聚吡咯，聚對笨二甲酸丁二酯（PBT);聚酯丙烯酸酯；聚醚丙烯酸酯；聚乙烯；聚乙烯噻吩；聚丙烯；聚甲基丙烯酸甲酯（PMMA);聚苯醚（PP0);聚苯乙烯（ps)，聚二氟亞乙烯，聚四氟乙烯（PTFE) ·，聚四氫呋喃；聚醚（例如聚乙二 128941.doc •14- 200843588 醇、聚丙二醇）；聚乙烯基化合物，具體而言聚氯乙烯 (PVC)、PVC共聚物、PVdC、聚乙酸乙烯酯及其共聚物、視情況部分水解的聚乙烯醇、聚乙烯醇縮乙醛、聚乙酸乙烯酯、聚乙烯基吡咯啶酮、聚乙烯基醚、呈溶液及作為分散體形式之^^丙晞酸乙浠g旨及聚甲基丙浠酸乙烯醋及其共聚物、聚丙烯酸酯及聚苯乙烯共聚物；聚苯乙烯（改性的或非防震的）；聚胺基甲酸酯（未交聯或與异氰酸酯交聯）；聚胺基甲酸酯丙烯酸酯；苯乙烯丙烯酸共聚物；苯乙烯丁二烯後段共聚物（例如購自BASF AG之Styroflex®或 Styrolux®、購自CPC之K-ResinTM);蛋白質，例如酪蛋白，sis ;三嗪樹脂、雙馬來醯亞胺三嗪樹脂（BT)、氰酸酯樹脂（CE)、烯丙基化聚苯醚（AppE)。兩種或更多種聚合物之混合物亦可形成基質材料。作為一基質材料之尤佳聚合物係丙烯酸酯、丙烯酸樹脂、纖維素衍生物、甲基丙烯酸酯、甲基丙烯酸樹脂、三聚氰胺及胺基樹脂、聚烯烴、聚醯亞胺、環氧樹脂、改性環氧樹脂（例如雙官能團或多官能團雙酚A或雙酚F樹脂、環氧-酚醛樹脂、溴化環氧樹脂、環脂族環氧樹脂）、脂肪族環氧樹脂、縮水甘油醚、乙烯基醚松香樹脂及酚系樹月曰來胺基甲酸酯、聚酯、聚乙烯醇縮乙醛、聚乙酸乙稀酉曰、聚苯乙烯、聚苯乙烯共聚物、聚苯乙烯丙烯酸酯、苯乙烯丁一烯肷段共聚物、烯基乙酸乙烯酯與氯乙烯之共聚物、聚醯胺及其共聚物。作為製造印刷電路板中用於分散體之基質材料，較佳為 128941.doc -15- 200843588 使用熱或輻射固化樹脂，例如改性環氧樹脂（例如雙官能團或多官能團雙紛Α或雙紛F樹脂、環氧_紛醛樹脂，漠: 環氧樹脂、環脂族環氧樹脂）、脂肪族環氧樹脂、縮水甘油醚、氰酸醋、乙烯基醚、酚系樹脂、聚醯亞胺、三聚氰胺樹脂及胺基樹脂、聚胺基甲酸_、聚自旨及纖維素衍生物。Chemistry, 5th edition, Volume A14, page 599. The decomposition of iron pentacarbonyl can be carried out, for example, at a temperature and pressure in a heatable decomposer comprising a refractory material (e.g., quartz glass or V2A steel) in a preferred vertical position. The tube is surrounded by a heating device consisting, for example, of a heating jacket through which a heating bath, a heating wire or a heating medium flows. Nickel carbonyl powder can also be produced according to a similar method. The average particle diameter of the carbonyl iron powder can be controlled within a wide range by the method parameters and reaction management during the decomposition process, and usually (number average) is 〇·〇1 to 100 μηη, preferably 〇1 to 5导电μιη, and particularly preferably self-working to 10 μιη 〇 sheet-shaped conductive particles (preferably metal powder) can be controlled by optimizing the conditions in the manufacturing process or subsequently by mechanical treatment (for example by stirring) Obtained in the ball mill). The amount indicates that the weight ratio of the conductive particles is represented by the total weight of the coating in the range of from 20% to 98%, based on the total weight of the at least partially dried and/or cured coating. The preferred ratio of the weight ratio of the conductive particles is in the range of 30 W' and particularly preferably between 5 (>% and 85%. Suitable for use as a matrix material may be, for example, a bond having a pigment-affinity stabilizing group. Agents, natural and synthetic polymers and their derivatives, natural resins and synthetic resins and their derivatives, bran exchange, natural rubber, synthetic rubber, protein, fiber 128941.doc 13 200843588, alizarin: biological, dry And non-drying oils and the like. These may, but are not, required to be chemically or physically cured, such as air curing, radiation curing or isothermal curing. The base material is preferably a polymer or polymer blend. Preferred polymers for use as a matrix material are, for example, ABS (acrylonitrile-butadiene styrene), As A (acrylonitrile-styrene acrylate); acrylic propylene oxime, oxime resin; Vinyl acetate Ester copolymer, in particular vinyl acetate, ethylene vinyl acetate, butylene vinyl acetate; alkene olefin ethylene copolymer; amine resin; aldehyde and ketone resin; cellulose and cellulose derivatives, specific In terms of hydroxyalkyl cellulose, cellulose, elemental S (such as cellulose acetate, cellulose propionate, cellulose butyrate, carboxyalkyl cellulose, nitrocellulose); epoxy acrylate; epoxy tree month曰, modified oxirane resin, such as bifunctional or polyfunctional bisphenol A or bisphenol, oxime phenolic resin, brominated epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin, glycidyl ether , vinyl ether, ethylene-acrylic acid copolymer; hydrocarbon resin; MABS (transparent ABS, also containing yttrium acrylate unit), melamine resin, maleic anhydride copolymer; methacrylate; natural rubber; ; gas rubber; natural resin; rosin resin; shellac; phenolic resin; polyester; polyester resin, such as stupyl ester resin, polysulfone; polyethersulfone; polyamine; polyimine; polyaniline Pyrrole Butane diester (PBT); polyester acrylate; polyether acrylate; polyethylene; polyethylene thiophene; polypropylene; polymethyl methacrylate (PMMA); polyphenylene ether (PP0); ), polydifluoroethylene, polytetrafluoroethylene (PTFE), polytetrahydrofuran; polyether (eg polyethylene 128941.doc •14-200843588 alcohol, polypropylene glycol); polyvinyl compounds, in particular polychlorinated Ethylene (PVC), PVC copolymer, PVdC, polyvinyl acetate and copolymers thereof, partially hydrolyzed polyvinyl alcohol, polyvinyl acetal, polyvinyl acetate, polyvinyl pyrrolidone, polyethylene Ethyl ether, in solution and in the form of a dispersion of ethyl acetoacetate, polymethyl methacrylate and its copolymer, polyacrylate and polystyrene copolymer; polystyrene Or non-shockproof); polyurethane (uncrosslinked or crosslinked with isocyanate); polyurethane acrylate; styrene acrylic copolymer; styrene butadiene back copolymer (for example, Styroflex® or Styrolux® from BASF AG, K-ResinTM from CPC); Proteins such as casein, sis; triazine resin, bismaleimide triazine resin (BT), cyanate resin (CE), allylated polyphenylene ether (AppE). Mixtures of two or more polymers may also form a matrix material. A preferred polymer as a matrix material is acrylate, acrylic resin, cellulose derivative, methacrylate, methacrylic resin, melamine and amine based resin, polyolefin, polyimine, epoxy resin, modified Epoxy resin (such as bifunctional or polyfunctional bisphenol A or bisphenol F resin, epoxy-phenolic resin, brominated epoxy resin, cycloaliphatic epoxy resin), aliphatic epoxy resin, glycidyl ether, Vinyl ether rosin resin and phenolic erythromylide, polyester, polyvinyl acetal, polyvinyl acetate, polystyrene, polystyrene copolymer, polystyrene acrylate , styrene butadiene oxime copolymer, copolymer of alkenyl vinyl acetate and vinyl chloride, polydecylamine and copolymers thereof. As a matrix material for producing a dispersion in a printed circuit board, it is preferably 128941.doc -15- 200843588 using a heat or radiation curing resin, such as a modified epoxy resin (for example, a bifunctional or polyfunctional group or a double compound) F resin, epoxy resin, epoxy resin, epoxy resin, epoxy resin , melamine resin and amine resin, polyaminocarboxylic acid _, poly free and cellulose derivatives.

Ο 以乾燥塗層之總重量表示，有機黏合劑組分之比例較佳為0.01-60重量％。該比例較佳自〇卜45重量％，更佳自〇 35重量％。 · 為使含有導電顆粒及基質材料之分散體能够施加至基板上’可於該分散體中進-步添加—溶劑或—溶劑混合物以調節該分散體之黏度使其適合相應的施加方法。適合的溶劑係（例如）脂肪族及芳香族烴（例如正辛烷、環己烷、甲笨、二甲苯）、醇（例如曱醇、乙醇、卜丙醇、2_丙醇、I 丁醇、2-丁醇、戊醇）、多元醇（例如丙三醇、乙二醇、兩二醇、新戊二醇）、烷基酯（例如乙酸曱酯、乙酸乙酯、乙酸丙醋、乙酸丁酿、乙酸异丁酿、乙酸异丙醋、弘甲基丁醇）、烷氧基醇(例如’甲氧基丙醇、甲氧基丁醇、乙氧基丙醇）、烷基苯（例如乙苯、异丙笨）、丁二醇、二丁二醇= 烷基二醇乙酸酯（例如丁二醇乙酸酯、二丁二醇乙酸酯卜 —丙酮醇、—甘醇二院基喊、二甘醇單烧基騎、二丙二醇二烧基單絲醚、：甘料基謎乙酸醋、二丙二醇炫基醚乙酸s旨、：氧雜環己烧、：丙三醇及謎、二乙二醇及醚、DBE(二元酯）、醚（例如***、四氫呋喃卜 128941.doc -16- 200843588 氣乙烯、乙二醇、乙二醇乙酸酯、乙二醇二曱酯、甲齡、内酯（例如丁内酯）、酮（例如丙酮、2- 丁酮、環己酮、甲乙酮（MEK)、甲基異丁基酮（MIBK))、二甲二醇、二氯甲烷、亞甲基二醇、亞甲基二醇乙酸酯、甲酚（鄰_、間_、 . 對-甲盼）、^比洛σ定酮（例如N-曱基-2-σ比略咬酮）、丙二醇、碳酸丙二酯、四氯化碳、甲苯、三羥甲基丙烷（ΤΜΡ)、芳族烴及混合物、脂肪族烴及混合物、單鞋烯醇（例如祐品醇）、水及兩種或更多種該等溶劑之混合物。 (、較佳之溶劑係醇（例如乙醇、1 -丙醇、2-丙醇、丁醇）、烧氧基醇（例如甲氧基丙醇、乙氧基丙醇、丁二醇、二丁二醇）、丁内酯、二甘醇二烷基醚、二甘醇單烷基醚、二丙二醇二烷基醚、二丙二醇單烷基醚、酯（例如乙酸乙酯、乙酸丁酯、丁二醇乙酸酯、二丁二醇乙酸酯、二甘醇烧基醚乙酸酯、二丙二醇烧基醚乙酸酯、DBE)、醚（例如四氫呋喃）、多元醇（例如丙三醇、乙二醇、丙二醇、新戊 i 二醇）、酮（例如丙酮、甲乙酮、甲基異丁基酮、環己酮）、烴（例如環己烷、乙苯、甲苯、二甲苯）、N-甲基吡咯啶 _、水及其混合物。對於液體基質材料（例如液體環氧樹脂、丙烯酸酯）之情 ' 形’可經由施加期間之溫度或者經由一溶劑與溫度之組合可選擇地調節相應黏度。该分散體可進一步含有分散劑組分。此由一種或多種分散劑構成。原則上，熟知此項技術者已知之在分散體中應用之所有 128941.doc 200843588 分散劑及先前技術所闡述之分散劑皆適合。較佳的分散劑係表面活性劑或表面活性劑混合物，例如陰離子、陽離子、兩性或非離子表面活性劑。陽離子及陰離子表面活性劑闡述於（例如）”EnCyCl〇pedia of p〇lymer Science and比例 The ratio of the organic binder component is preferably from 0.01 to 60% by weight, based on the total weight of the dry coating. The ratio is preferably from 45% by weight, more preferably from 5% by weight. In order to enable the dispersion containing the conductive particles and the matrix material to be applied to the substrate, a solvent or solvent mixture may be added in the dispersion to adjust the viscosity of the dispersion to suit the corresponding application method. Suitable solvents are, for example, aliphatic and aromatic hydrocarbons (e.g., n-octane, cyclohexane, methyl, xylene), alcohols (e.g., decyl alcohol, ethanol, propanol, 2-propanol, butanol). , 2-butanol, pentanol), polyol (eg glycerol, ethylene glycol, didiol, neopentyl glycol), alkyl esters (eg decyl acetate, ethyl acetate, propylene acetate, acetic acid) Ding, isobutyl acetate, isopropyl acetate, methyl butanol, alkoxy alcohols (eg 'methoxy propanol, methoxybutanol, ethoxypropanol), alkylbenzene ( For example, ethylbenzene, isopropyl bromide, butanediol, dibutyl glycol = alkyl glycol acetate (for example, butanediol acetate, dibutyl glycol acetate, acetone, glycerol) The hospital base shouts, diethylene glycol single-burning base riding, dipropylene glycol dialkyl-based monofilament ether,: glycol base vinegar acetate, dipropylene glycol leucoether acetic acid s,: oxygen heterocyclohexane, glycerol and Enigma, diethylene glycol and ether, DBE (dibasic ester), ether (eg ether, tetrahydrofuran 128994.doc -16- 200843588 gas ethylene, ethylene glycol, ethylene glycol acetate, ethylene glycol diterpenes , age, lactone (eg butyrolactone), ketone (eg acetone, 2-butanone, cyclohexanone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK)), dimethyl glycol, dichloro Methane, methylene glycol, methylene glycol acetate, cresol (o-, m-, .--------), and piroxime- ketone (for example, N-mercapto-2-σ ratio Slightly ketone), propylene glycol, propylene carbonate, carbon tetrachloride, toluene, trimethylolpropane (indene), aromatic hydrocarbons and mixtures, aliphatic hydrocarbons and mixtures, monostilenol (eg, sooth alcohol) And water and a mixture of two or more of these solvents. (A preferred solvent is an alcohol (e.g., ethanol, 1-propanol, 2-propanol, butanol), an alkoxy alcohol (e.g., methoxypropane). Alcohol, ethoxypropanol, butanediol, dibutyl glycol), butyrolactone, diethylene glycol dialkyl ether, diethylene glycol monoalkyl ether, dipropylene glycol dialkyl ether, dipropylene glycol monoalkyl Ethers, esters (eg ethyl acetate, butyl acetate, butanediol acetate, dibutyl glycol acetate, diethylene glycol alkyl ether acetate, dipropylene glycol alkyl ether acetate, DBE), Ether (eg four Furan), polyol (eg glycerol, ethylene glycol, propylene glycol, neopentyl glycol), ketones (eg acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone), hydrocarbons (eg cyclohexane, Ethylbenzene, toluene, xylene), N-methylpyrrolidine, water, and mixtures thereof. For liquid matrix materials (eg, liquid epoxy resins, acrylates), the shape may be via the temperature during application or via a temperature The combination of solvent and temperature optionally adjusts the corresponding viscosity. The dispersion may further comprise a dispersant component. This consists of one or more dispersants. In principle, all of the 128941 known to the skilled artisan for use in dispersions are well known. .doc 200843588 Dispersants and dispersants as described in the prior art are suitable. Preferred dispersants are surfactants or surfactant mixtures such as anionic, cationic, amphoteric or nonionic surfactants. Cationic and anionic surfactants are described, for example, in "EnCyCl〇pedia of p〇lymer Science and

Technology”（J· Wiley & S0ns (1966)，第 5卷第 8ΐ6·8ΐ8 頁）及’’Emulsion Polymerisati〇n and Emulsi〇n （編輯者 Ρ· Lovell及 Μ· E1_Asser、Wiley & 8咖〇997)，第 224-2261 ) t ° 然而亦可使用熟悉此項技術者已知之具有顏料親和錨固基團之聚合物作為分散劑。以分散體之總重量表示，分散劑可在〇〇1_5〇重量％之範圍内使用。該比例較佳地自〇1·5重量％ ,尤佳自H 量 0/〇。 · 本發明分散體可進-步含有—填充劑組分。此可由—種或多種填充劑構成。舉例而言，可金屬化物f之填充劑电 =含有呈纖維、層或顆粒形式之填充劑或其混合物。談等較仫係市售產品，例如礦物填充劑。維鐵）、雲母、石英粉、碳酸鈣、硫酸鋇、石氧化鈦或矽灰、矽及增、染 4夕可使用其他添加劑，例如觸變劑(例如孝Technology" (J. Wiley & S0ns (1966), Vol. 5, pp. 8:6-8) and 'Emulsion Polymerisati〇n and Emulsi〇n (Editor Ρ Lovell and Μ E1_Asser, Wiley & 8 Curry 997), 224-2261) t ° However, a polymer having a pigment affinity anchoring group known to those skilled in the art can also be used as a dispersing agent. The dispersing agent can be expressed in 〇〇1_5〇, based on the total weight of the dispersion. It is used in the range of % by weight. The ratio is preferably from 〇1·5 wt%, particularly preferably from H amount 0/〇. · The dispersion of the invention may further comprise a filler component. A plurality of filler compositions. For example, the filler of the metallizable compound f = contains a filler in the form of fibers, layers or granules or a mixture thereof, etc. Commercially available products such as mineral fillers. , mica, quartz powder, calcium carbonate, barium sulfate, stone titanium oxide or ash, strontium and so on, and other additives, such as thixotropic agents (such as filial piety)

二:例如氧相二氧切或膨潤土 )，或有機觸㈣(例如聚丙烯酸' 聚胺基甲酸酯、水合M 12894I.doc 200843588 料、脂肪酸、脂肪酸醯胺）、增塑劑、、扣、沉十, d >均泡劑、潤μ剑、乾燥劑、交聯劑、光起始劑、鰲合劑、料、導電聚合物顆粒。 θ _ 、顏以乾燥塗層之總重量表示，填充劑組分之比例 0.01-50重量％。進一步較佳為自〇1_3〇重量％ :自自0.3-20重量〇/〇。土為Two: for example, oxygen phase dioxate or bentonite), or organic touch (four) (for example, polyacrylic acid 'polyurethane, hydrated M 12894I.doc 200843588 material, fatty acid, fatty acid decylamine), plasticizer, buckle, Shen 10, d > foaming agent, moisturizing sword, desiccant, crosslinking agent, photoinitiator, chelating agent, material, conductive polymer particles. θ _ , color is expressed as the total weight of the dry coating, and the proportion of the filler component is 0.01-50% by weight. Further preferably, it is from 〇1_3〇% by weight: from 0.3-20 〇/〇. Soil is

此外根據本發明在分散體中可存在處理輔助劑及穆一劑’例如UV穩定劑、潤滑劑、腐蝕抑制劑及阻燃劑:二分散體之總重量表示，其比例通常為自〇〇1_5重量^ 比例較佳為自〇.〇5-3重量％。 μ 各種材料及、组合以及基板幾何形狀及具有各種基板性能之基板亦可用於該基板。因&，特定而言可使㈣性= 性基板，例如印刷電路板或三維塑膠裝置，或諸如（例如）片狀基板或撓性化合物之撓性基板。該基板較佳至少部分 (亦即，在至少一個區域中）不導電。於此上下文中，此意指比電阻率應該大於1 〇9 Ω X cm。適合之基板材料為例如增强或非增强聚合物，例如習用於印刷電路板及/或轉發器之彼等聚合物。適合聚合物係環氧樹脂或改性環氧樹脂（例如雙官能團或多官能團雙酴A 或雙酚F樹脂、環氧-酚醛樹脂、溴化環氧樹脂、芳族聚醯胺增强或玻璃纖維增强或紙增强之環氧樹脂（例如FR4))、玻璃纖維增强塑料、液晶聚合物（LCP)、聚苯硫醚（pps)、聚甲醛（POM)、聚芳醚酮（PAEK)、聚醚醚酮（peek)、聚醯胺（PA)、聚碳酸酯（PC)、聚對苯二甲酸丁二酯（PBT)、聚 128941.doc -19- 200843588 對苯二曱酸乙二酯（PET)、聚醯亞胺（PI)、聚醯亞胺樹脂、氰酸i旨、雙馬來醯亞胺-三嗪樹脂、耐綸、乙烯基酯樹脂、聚酯、聚酯樹脂、聚醯胺、聚苯胺、酚系樹脂、聚吡咯、聚萘二甲酸乙二酯（PEN)、聚甲基丙烯酸甲酯、聚乙，烯二氧嗟吩、經酚系樹脂塗覆的芳族聚醯胺紙、聚四氟乙烯（PTFE)、三聚氰胺樹脂、聚矽氧樹脂、氟樹脂、烯丙基化聚苯醚（APPE)、聚醚醯亞胺（Pei)、聚苯醚（pp〇)、聚丙 ( 烯（PP)、聚乙烯（PE)、聚砜（PSU)、聚醚砜（PES)、聚芳醯胺（PAA)、聚氯乙烯（PVC)、聚苯乙烯（PS)、丙烯腈_ 丁二烯·苯乙烯（ABS)、丙烯腈-苯乙烯丙烯酸酯（ASA)、苯乙烯丙烯腈（SAN)及兩種或更多種上述聚合物之混合物（摻合物），其可以各種形式存在。該等基板可包括熟悉此項技術者已知之添加劑，例如阻燃劑。原則上，亦可使用以下針對基質材料所提及之所有聚合物。其他同樣習用於印刷電路板工業中之基板亦適合。 c, 進一步適合之基板係複合材料、發泡體狀聚合物、Furthermore, according to the invention, there may be a treatment aid and a lubricant in the dispersion, such as a UV stabilizer, a lubricant, a corrosion inhibitor and a flame retardant: the total weight of the two dispersions, the ratio of which is usually from 〇〇1_5 The weight ^ ratio is preferably from 5 to 3% by weight. μ Various materials and combinations, as well as substrate geometries and substrates having various substrate properties, can also be used for the substrate. In particular, it is possible to make a (four) sex substrate, such as a printed circuit board or a three-dimensional plastic device, or a flexible substrate such as, for example, a sheet substrate or a flexible compound. Preferably, the substrate is at least partially (i.e., in at least one region) non-conductive. In this context, this means that the specific resistivity should be greater than 1 〇 9 Ω X cm. Suitable substrate materials are, for example, reinforced or non-reinforced polymers such as those conventionally used in printed circuit boards and/or transponders. Suitable for polymer epoxy resins or modified epoxy resins (eg bifunctional or polyfunctional biguanide A or bisphenol F resins, epoxy-phenolic resins, brominated epoxy resins, aromatic polyamines reinforced or glass fibers) Reinforced or paper reinforced epoxy (eg FR4)), glass reinforced plastic, liquid crystal polymer (LCP), polyphenylene sulfide (pps), polyoxymethylene (POM), polyaryletherketone (PAEK), polyether Ether keke (peek), polydecylamine (PA), polycarbonate (PC), polybutylene terephthalate (PBT), poly 128941.doc -19- 200843588 terephthalic acid ethylene glycol (PET) ), polyimine (PI), polyimide resin, cyanate, bismaleimide-triazine resin, nylon, vinyl ester resin, polyester, polyester resin, polyamine , polyaniline, phenolic resin, polypyrrole, polyethylene naphthalate (PEN), polymethyl methacrylate, polyethylene, enedioxaphene, phenolic resin coated aromatic polyamine Paper, polytetrafluoroethylene (PTFE), melamine resin, polyoxyn epoxide, fluororesin, allylated polyphenylene ether (APPE), polyether quinone imine (Pei), poly Ether (pp〇), polypropylene (ene) (PP), polyethylene (PE), polysulfone (PSU), polyethersulfone (PES), polyarylamine (PAA), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile _ butadiene styrene (ABS), acrylonitrile-styrene acrylate (ASA), styrene acrylonitrile (SAN) and a mixture of two or more of the above polymers (blending The substrate may be present in various forms. The substrates may include additives known to those skilled in the art, such as flame retardants. In principle, all of the polymers mentioned below for the matrix material may also be used. Substrates in the printed circuit board industry are also suitable. c. Further suitable for substrate-based composite materials, foam-like polymers,

Styropor®、Styrodur®、聚胺基甲酸酯（pu)、陶瓷表面、織物、紙漿、板、紙、經聚合物塗佈之紙、木材、礦物材料、碎、玻璃、植物組織及動物組織。 • 因此在方法步驟（a)中將分散體施加至基板上之後，該分散體充分地黏附至該基板上，較佳地，在施加之前對應預處理該基板。為此目的，可使用一熟悉此項技術者已知之適合方法，例如一清潔或粗糙化方法。於此情形下，特定而言可使用乾式、濕式化學及/或機械方法。一適合之濕 128941.doc -20- 200843588 式化予方法係例如’用酸性或鹼性試劑或用適合之溶劑或氧化劑（例如高錳酸鉀）來清洗該基板。特定而言，乾式清潔方法係適用於去除可能影響基板上分散體之黏附之灰塵及其他顆粒及適用於使表面粗糙化。該等係（例如）借助刷子及/或去離子空氣、電暈放電或低壓電漿去除灰塵及借助輥及/或輥筒（該等具有一黏附層）去除顆粒。藉由電暈放電及低壓電漿，可選擇性地增加基板之表面張力，可自基板表面清除掉有機殘餘物，且因此可改良分散體之潤濕及分散體之黏附兩者。為了實施此方法，在方法步驟⑷中將分散體施加至基板上之至y個位置上。该位置可例如係基板之具有導電性能之表面。在此位置處，例如，該基板可包括一個或多個導體跡線、接觸跡線、接觸墊或其他該分散體至少部分施加至其上之導電性元件。於此情形下，該至少一個導體跡線可在隨後之可選電解金屬化（在方法步驟⑷幻過程中盘一外部電壓源電接觸。原則上，在方法步驟⑷中施加分散體可藉由熟悉此項技術者已知之任何塗佈方法來實施且特定而言可適合所兩之 :厚度或結構化條件。此處可提及之實例係分配方法而苴中借助一劑量給予裝置(例如一劑量給予針)將分散體之結構有思地施加至基板上。此外，亦可使加至美拓矣而夕^办彳％網1 >散體施加至基板表面上之較寬區域上之方法。另_、琴、地，有利的是可使用eP刷方法。印刷方法為或另外薄片印刷方法，例如絲網印刷、凹版印’、輥筒或則快乾印刷、活 128941.doc -21 - 200843588 版印刷、移動印刷、噴墨印刷、如在德國專利第100 5 1 850號中所述之Laser-Sonic®方法、或澆版印刷、絲網或模板印刷、以及磁圖形印刷方法（只要分散體之導電顆粒亦有磁性）。然而，亦可使用熟悉此項技術者已知之任何其他印刷方法。亦可藉由另一習用或衆所周知之塗佈方法將分散體施加至基板上。由印刷或塗佈方法所產生的經施加分散體之層厚度較佳Styropor®, Styrodur®, polyurethanes, ceramic surfaces, fabrics, pulp, board, paper, polymer coated paper, wood, mineral materials, crushed, glass, plant tissue and animal tissue. • After the dispersion is applied to the substrate in method step (a), the dispersion is sufficiently adhered to the substrate, preferably the substrate is pre-processed prior to application. For this purpose, a suitable method known to those skilled in the art, such as a cleaning or roughening method, can be used. In this case, dry, wet chemical and/or mechanical methods may be used in particular. A suitable wet process is for example the treatment of the substrate with an acidic or alkaline agent or with a suitable solvent or oxidizing agent (e.g., potassium permanganate). In particular, dry cleaning methods are suitable for removing dust and other particles that may affect the adhesion of the dispersion on the substrate and for roughening the surface. These are used, for example, to remove dust by means of a brush and/or deionized air, corona discharge or a low piezoelectric slurry and to remove particles by means of rollers and/or rollers (these having an adhesive layer). By corona discharge and low-pressure plasma, the surface tension of the substrate can be selectively increased, and organic residues can be removed from the surface of the substrate, and thus both the wetting of the dispersion and the adhesion of the dispersion can be improved. To carry out the process, the dispersion is applied to the y positions on the substrate in method step (4). This location can be, for example, a surface of the substrate that is electrically conductive. At this location, for example, the substrate can include one or more conductor traces, contact traces, contact pads, or other conductive elements to which the dispersion is at least partially applied. In this case, the at least one conductor trace can be subsequently selectively electrometallized (in the process step (4) illusion, an external voltage source is electrically contacted. In principle, the application of the dispersion in method step (4) can be Any coating method known to those skilled in the art can be implemented and in particular can be adapted to both: thickness or structuring conditions. Examples which may be mentioned herein are dispensing methods by means of a dose-administering device (for example a Dose-administering needle) The structure of the dispersion is applied to the substrate in a thoughtful manner. In addition, the method of applying the dispersion to the wider area on the surface of the substrate can be applied to the surface of the substrate. Another _, piano, ground, it is advantageous to use the eP brush method. The printing method is or another sheet printing method, such as screen printing, gravure printing, roller or fast drying printing, live 128941.doc -21 - 200843588 printing, mobile printing, inkjet printing, Laser-Sonic® method as described in German Patent No. 100 5 850, or plate printing, screen or stencil printing, and magnetic graphic printing methods (as long as dispersion body The conductive particles are also magnetic.) However, any other printing method known to those skilled in the art can be used. The dispersion can also be applied to the substrate by another conventional or well known coating method. The layer thickness of the applied dispersion produced by the coating method is preferably

地在0·01與200 μιη之間、更佳地在〇〇5與1〇〇之間且尤佳地在0.1與50 μηΐ2間變化。端視印刷方法而定，可產生不同的精細結構。Α 了在該至少一個位置處達成所需之層厚度垓施加亦可在該至少一個位置上以兩個或多個步驟連續地實施。本’又月進纟提出用於其變型體中之一者以實施所述方法之裝置，該裝置包括至少一個將分散體施加至基板上之 :置，至少一個施加電子裝置之裝置及至少-個用於分散 Γ無電及，或電解金屬化之裝置。為了例如實施以上所述印刷方法中之—老，#壯π ^裝置可包括例如一用於施加分散體之目的之印刷機。缺祕較佳地在一儲力二後將分散體施加至基板上之前， ^ “ ☆中授拌或環繞抽吸分散體。授拌及/ 次抽及阻止分散體中容器中對分散體實施埶：顆拉可…降。此外，在儲存板上達成-改進之印刷即係、同樣有利的。此使得可在基恆定黏度。特定而 ®案’此乃因可藉由熱調節來調整拌器或幫浦之能二’當（例如）錢拌及/❹吸下藉由搜里雨入來加熱分散體並因此改變其黏度 128941.doc -22- 200843588 時，尤其需要熱調節。忒基板可在其一側藉由所述之方法例如塗佈或裝配有裝置。然而，例如當將該基板組態為一具有兩個裝配有裝置之對置表面之印刷電路板時，或組態為一具有一更複雜 (例如三維的）裝置幾何形狀之塑膠裝置（及/或亦一金屬及/ 或陶瓷裝置）時，該基板亦可包括複數個裝配有裝置之表面。於此情形下，可將該基板之複數個或所有表面塗佈或裝配有策置。視需要，塗佈及/或乾燥/固化及/或裝置施加亦可在複數個側完全或部分地同時發生。於此情形下，在將分散體單側施加至一表面上且將至少一個電子裝置施加至分散體或基板上之後，該方法可藉由其他接納分散體之表面（例如基板之下側）及亦將電子裝置施加至該表面上而繼績。尤其與習用方法相比，當如以上所簡述組態該分散體以便該至少一個電子裝置黏附或用螺栓固定於該分散體上時，此情形係顯著有利的。有利地，發生該黏附或黏合以使該電子裝置在其自身重量之作用下不能與該基板分離，且即使移動（例如藉由一對應自動化機器）該基板其在該基板上之指定位置亦不改變。借助於熟悉此項技術者已知之通路接觸一基板之上側及下側之方法，在基板之上側及下側施加有電子裝置之導電表面彼此電連接。該通路接觸可在基板裝配有電子裝置之前及/或同時及/或時間順序上之後實施。對於通路接觸，例如，在基板中之洞或孔之壁具有一導電表面。藉由一足够薄之基板，例如一 PET薄板，在方法步驟（c)中金屬層自 128941.doc -23- 200843588 基板之上側及下側生長於洞令，然後有利地生長在—起，以使基板上側及下側之經結構化導電表面或全面積產生電連接。對於薄基板之情形，可藉由例如㈣、、衝雷射打孔來產生孔或洞。除了以上所提及之方法之外，亦可使用自先前技術中已知用於洞及孔金屬化之其他方法特定而言，本發明-組態之方法可與其他方法組合用於電接觸基板上之電子組件，例如，與銲接方法或打線接合方法組合。以此方式，例如，端視欲接觸之褒置可使用最接觸方法。如以上所述，可用一個或多個乾燥及/或固化步驟來補充本發明之方法。特定而言，為了達成黏附良好之機械穩定之金屬化，較佳使用固化或乾燥步驟。例如，為了在步驟⑷中獲仔分散體之機械穩定位置及視需要在基板上獲得具有導電顆粒之穩定的經施加結構化或全面積結構該分散體在施加後之隨後步驟中可至少部分地乾燥及/或至Z 部分地固化。端視基質材料而定，如以上所述例如藉由熱作用、光（例*，在可見光、紅夕卜線及/或紫外線光譜範圍内）作用或微波作用來實施乾燥及/或固化。亦可設想該等乾燥或固化方法之組合。為引發固化反應，需要添加一適合的活化劑。亦可藉由不同方法之組合(例如藉由uv輻射及加熱之組合）達成固化。該等固化方法可同時或依次組合。例如，該層可首先僅藉由uv輻射部分固化，以使所形成結構不再流動而分開。該層可隨後藉由熱作用進一步固化。在此情況下可在uv@化後及/或無電及/或電解金屬 128941.doc • 24· 200843588 化後直接實施加熱。如以上所述’分散體中之導電顆粒特定而言可包括一導電組分，且除此之外亦包括其他組分例如非導電組分，所有導電顆粒亦可例如至少部分地嵌入基質材料中。於此情形下，藉由一化學、物理或機械方法在至少一個方法步驟中全部或部分地暴露該導電組分被證明是有利的。例如，該暴露可在實施方法步驟⑻之前及/或之後發生。在此過程中，例如，-電絕緣組分，例如氧化物層，可自該導電組分中全部或部分去除。然後’可至少部分地暴露該等導電顆粒，料而言，金屬顆粒及/或碳，以產峰用％ … 乂產生用於方法步驟⑷中之金屬化之額 /子粒。此產生一更均勻且更連續的金屬塗層。且形下，可以極不相同的方式組態導電顆粒之暴露八使：電顆粒之暴露適合顆粒之類型及分散體之其他成 :。可在一相應較寬意義上解釋該術語，且特定而言，該術語可包含以下類型之暴露(個別地或組合地)： ==粒可藉由化學方式（例如使用—高輯卸溶液及/ 通過刷除等）侵韻或機械方式（例如化籽^ ^ 土貝材料來暴露以藉此產生更多"金屬化籽粒。此可達成更伟、® %产類型之異^ 底且更均勾之金屬化。此、1之暴路亦可稱作為，，活化"暴露。亦可直接暴露該等導電顆粒之導電組分，同時 (例如）全部或部分地 — 層、或類似塗声)。若二 (例如氧化物層I02 層）到吏用例如鐵作為一導電組分，則氧 128941 .doc -25- 200843588 化物層可（特定而言）藉由將基板浸入一化學/電解金屬化槽中自動去除。另一適擇為或另外地，可為該暴露安排一單獨暴露步驟。The ground varies between 0·01 and 200 μηη, more preferably between 〇〇5 and 1〇〇, and particularly preferably between 0.1 and 50 μηΐ2. Depending on the printing method, different fine structures can be produced. The application of the desired layer thickness at the at least one location may also be carried out continuously in two or more steps at the at least one location. The present invention proposes a device for carrying out the method for one of its variants, the device comprising at least one device for applying a dispersion to a substrate, at least one device for applying an electronic device and at least - A device for dispersing enthalpy without electricity and or electrolytic metallization. For example, in the printing method described above, the apparatus may include, for example, a printing machine for the purpose of applying a dispersion. The lack of secret is preferably before the application of the dispersion to the substrate after a second charge, ^" ☆ mixing or wrapping the dispersion. Mixing and / pumping and preventing the dispersion from being carried out in the container in the dispersion埶: Pulling can be lowered. In addition, it is also advantageous to achieve the improved printing on the storage board. This makes it possible to maintain a constant viscosity at the base. The device or the pump's energy can't be thermally adjusted, for example, by mixing and sucking the water to heat the dispersion and thus change its viscosity. 128941.doc -22- 200843588. The device may be coated or assembled on one side by, for example, the method described. However, for example, when the substrate is configured as a printed circuit board having two opposing surfaces equipped with the device, or configured as A plastic device (and/or also a metal and/or ceramic device) having a more complex (e.g., three-dimensional) device geometry, the substrate may also include a plurality of surfaces equipped with the device. In this case, Applying multiple or all surfaces of the substrate Or assembly is provided. If desired, coating and/or drying/curing and/or device application may also occur simultaneously or partially simultaneously on a plurality of sides. In this case, applying the dispersion to one surface on one side After applying and applying at least one electronic device to the dispersion or substrate, the method can be followed by other surfaces that receive the dispersion (eg, the underside of the substrate) and also apply electronic devices to the surface. In contrast to conventional methods, this configuration is significantly advantageous when the dispersion is configured as briefly described above such that the at least one electronic device is adhered or bolted to the dispersion. Advantageously, the adhesion or adhesion occurs. The electronic device is not separated from the substrate by its own weight, and the substrate does not change its designated position on the substrate even if moved (for example by a corresponding automated machine). By means of those skilled in the art The known path contacts the upper side and the lower side of a substrate, and the conductive surfaces on which the electronic device is applied on the upper side and the lower side of the substrate are electrically connected to each other. The substrate is implemented before and/or simultaneously and/or chronologically after the electronic device is mounted. For the via contact, for example, the wall of the hole or hole in the substrate has a conductive surface. By a substrate that is sufficiently thin, such as a In the PET sheet, in the method step (c), the metal layer is grown on the upper side and the lower side of the substrate from 128941.doc -23- 200843588, and then advantageously grown to make the upper side and the lower side of the substrate structured. The conductive surface or the full area creates an electrical connection. For the case of a thin substrate, a hole or a hole can be created by, for example, (4), punching a laser hole. In addition to the methods mentioned above, it can also be used from the prior art. Other Methods Known for Hole and Hole Metallization In particular, the inventive-configured method can be used in combination with other methods for electrically contacting electronic components on a substrate, for example, in combination with a soldering method or wire bonding method. In this way, for example, the device that is intended to be in contact can use the most contact method. As described above, the method of the present invention may be supplemented by one or more drying and/or curing steps. In particular, in order to achieve a well-bonded mechanically stable metallization, a curing or drying step is preferably employed. For example, in order to obtain a mechanically stable position of the dispersion in step (4) and to obtain a stabilized applied structured or full-area structure with conductive particles on the substrate as desired, the dispersion may be at least partially in a subsequent step after application. Dry and / or partially cured to Z. Depending on the host material, drying and/or curing is carried out as described above, for example, by thermal action, light (for example, in the visible, red and/or ultraviolet spectral range) or microwave action. Combinations of such drying or curing methods are also contemplated. In order to initiate the curing reaction, it is necessary to add a suitable activator. Curing can also be achieved by a combination of different methods, such as by a combination of uv radiation and heating. These curing methods can be combined simultaneously or sequentially. For example, the layer may first be partially cured by only uv radiation to separate the formed structures from flow. This layer can then be further cured by thermal action. In this case, heating can be carried out directly after uv@化 and/or without electricity and/or electrolysis of metal 128941.doc • 24· 200843588. As described above, the conductive particles in the dispersion may specifically include a conductive component, and in addition to other components such as non-conductive components, all of the conductive particles may also be at least partially embedded in the matrix material, for example. . In this case, it has proven to be advantageous to expose the conductive component in whole or in part in at least one process step by a chemical, physical or mechanical means. For example, the exposure can occur before and/or after performing method step (8). In this process, for example, an electrically insulating component, such as an oxide layer, may be removed from all or part of the electrically conductive component. The conductive particles can then be at least partially exposed, in the case of metal particles and/or carbon, to produce a peak for the metallization in process step (4). This produces a more uniform and more continuous metal coating. In the shape, the exposure of the conductive particles can be configured in a very different manner. The exposure of the electrical particles is suitable for the type of the particles and the other of the dispersions. The term may be interpreted in a correspondingly broad sense, and in particular, the term may include exposure of the following types (individually or in combination): == particles may be chemically (eg, using - high-removing solutions and / by brushing, etc.) invading rhyme or mechanical means (such as chemical seed ^ ^ soil material to expose to thereby produce more " metallized grain. This can achieve a higher, ® % production type of different bottom and more Metallization of the hook. This, 1 storm path can also be called, activation "exposure. It can also directly expose the conductive components of the conductive particles, and at the same time, for example, all or part of the layer, or similar coating sound). If two (for example, oxide layer I02 layer) to iron, for example, iron as a conductive component, the oxygen layer 128941 .doc -25- 200843588 can be (specifically) immersed in a chemical/electrolytic metallization bath Automatically removed. Alternatively or additionally, a separate exposure step can be arranged for the exposure.

對於使用羰基鐵粉之情形（該羰基鐵粉包括具有一薄氧化物層之高純度鐵）’可在例如施加分散體之後實施一乾燥/固化步驟。隨後可實施作為第一部分暴露之高猛酸卸溶液化學”活化”，分散體之基質材料被破壞且因此暴露羰基鐵粉H在該暴露步狀後健存在氧化物層。隨後可以使用酸性硫酸銅槽處理形式（例如，藉由浸沒）實施第二暴露步驟。在該步驟中，可自動去除氧化物層（亦即，暴露導電組分鐵）且并行發生化學金屬化。隨後，可視需要實施金屬化之電解放大。如以上之部分闡述’導電顆粒之暴露可以各種方式實施’且可單獨使用或組合使用該等方式。因此，可引發機械及/或物理及/或化學暴露步驟。例如，機械暴露步驟可包括刷除、研磨、碾磨、喷砂處理或借助超臨界二氧化碳喷射處理。物理步驟可包括加熱、雷射處理、使用⑽光輻照、使用-電暈或電漿放電處理。對於化學暴露之情形，較佳使用-與基質材料相容之化學品或化學品混合物。對於化學暴露之情形，可在表面至少部分地溶解基質材料并藉由（例如）—溶劑沖洗掉，或者可藉由適合的試劑至少部分地破壞基質材料之化學結構以暴露導電顆粒。使基質材料溶脹之試劑亦適合暴露導電顆粒。該溶脹可產生空穴以使欲沈積之金屬離子可自電解質溶液進人其中，因 128941.doc -26- 200843588 此可使大量導電顆粒金屬化。當使用所闡述之暴露步驟時，與先前技術相比，在方法步驟⑷中經無電及/或電解沈積之金屬層或多個金屬層之黏，、均勻性及連續性在實際中被證實為在其性能上得到 • _者改進。由於較大數目之導電顆粒被暴露，故金屬化過 &中之處理速率亦較高，從而可達成額外之成本優勢。若基質材料係（例如）環氧樹月旨、改性環氧樹脂、環氧·盼 Γ 樹脂、聚丙烯酸醋、ABS、苯乙烯-丁二烯共聚物或聚鱗，則導電顆粒之暴露較佳藉由一種氧化劑實施。該氧化劑可破壞基質材料之鍵結，以便可溶解黏合劑且藉此使顆粒暴露。適合之氧化劑係例如，高錳酸鉀、錳酸鉀、高錳酉文鈉、錳酸鈉、過氧化氫及其加成物、過硼酸鹽、過碳酸鹽、過硫酸鹽、過氧二硫酸鹽、次氯酸鈉及高氯酸鹽。為了暴露一基質材料（其含有例如諸如聚酯樹脂、聚酯丙烯酸酯、聚醚丙烯酸酯、聚酯胺基甲酸酯等酯結構）中 I 之導電顆粒’較佳使用（例如）酸性或鹼性化學品及/或化學品混合物。較佳的酸性化學品及/或化學品混合物係（例如）濃酸或稀酸’例如鹽酸、硫酸、磷酸或硝酸。端視基質材料而定’諸如甲酸或乙酸等有機酸亦可適合。適合的鹼性化學品及/或化學品混合物係（例如）驗，例如氫氧化納、氫氧化鉀、氫氧化銨或碳酸鹽（例如碳酸鈉或碳酸鈣）。亦可使用溶劑來暴露基質材料中之導電顆粒。該溶劑必須適合該基質材料，此乃因該基質材料必須溶於該溶劑中或因該溶劑而溶脹。當使用其中溶解有基質材料之溶劑 128941.doc -27- 200843588 時，使基底層與溶劑僅接觸較短時間以使基質材料之上層 /谷劑化且因此溶解。較佳的溶劑係二甲苯、甲苯、鹵代烴、丙酮、甲乙酮（MEK)、甲基異丁基酮（MIBK)、二乙二醇單丁醚。在溶解過程期間可視需要增高溫度以改良溶解性。在该過程期間可視需要增高溫度以改良暴露過程。此外，亦可藉由使用一機械方法暴露導電顆粒。適合的機械方法係（例如）刷除、研磨、用一磨料拋光或用水射流壓力喷射、喷砂或用超臨界二氧化碳噴射。藉由此一機械方法可相應將經固化、印刷結構化基底層之頂層去除。藉此’使含於基質材料中之導電顆粒暴露。若導電顆粒含有一易於被氧化之材料，則在一較佳方法變體中在基底層上形成金屬層之前至少部分地去除氧化物層。例如，在此情況下可以化學及/或機械方式去除氧化物層。可用於處理基底層以自導電顆粒化學去除氧化物層之適合物質係例如諸如濃或稀硫酸或濃或稀鹽酸、擰檬酸、磷酸、胺基石黃酸、甲酸、乙酸等酸。例如，若在步驟（C)中使用一酸性硫酸銅槽，則亦可在沒有一額外步驟之情形下去除氧化物層。在電解質溶液與被氧化顆粒相接觸後’氧化物層就會溶解從而暴露導電顆粒。用於自導電顆粒去除氧化物層之適合機械方法通常與用於暴露該等顆粒之機械方法相同。特定而言，在金屬化步驟⑷中，產生—連續導電表面，可視需要結構化該表面。為此目@，在一方法步驟⑷中， 128941.doc -28- 200843588 較佳地在至少部分乾燥及/或固化分散體之後且視需要在導電顆粒之上述暴露之後施加至少一金屬化。該金屬化或金屬層可在分散體施加之位置上及視需要亦可在基板之其他區域上經由無電及/或電解金屬化來形成。實際上，可藉由此方法施加任何習用金屬塗層，尤其是用於印刷電路板生產中之金屬塗層。對於無電金屬化之情形，金屬化之組成基本上將由用於塗佈之化學品槽或電解質溶液之組成確定。在化學品槽中’金屬尤其沈積於基板表面上之導電位置上，亦即，較佳地在施加分散體之位置上。原則上，所有較分散體中之最低惰性金屬更具惰性或具有同樣惰性的金屬皆可用於無電及/或電解塗佈。可藉由電解塗佈沈積至導電表面上之習用金屬係（例如）金、鎳、鈀、鉑、銀、錫、銅或鉻。亦可沈積多層金屬化層，例如一第一例如銅結合層，後接一例如鎳基底層，且進一步後接一惰性層，例如金層。一個或多個沈積層之厚度較佳處於熟悉此項技術者已知之習用範圍内。熟悉此項技術者可自例如Werner JiUek，Gustl Keller， Handbuch der Leiterplattentechnik [Handbook of printed circuit technology]· Eugen G. Leuze Verlag，2003，第 4 卷’第332-352頁瞭解用於塗佈導電結構之適合電解質溶液。在本發明之一種可能組態中，可藉由一無電金屬化方法額外地施加一個或多個第一金屬層。該金屬層可設計為例 128941.doc -29- 200843588 如一結合層且发其士後用作接觸之^八、定基板上金屬層之黏附，其可隨 4刀以供進一步電解金屬化。在本發明之s _叙, 實靶例中，較佳地當使用一在鹼性或較佳地酸性溶液中A + 素電化學電位序列中具有一較分散體之導電顆粒或該等顆私+、曾+ 員粒之v電組分（例如一金屬）更强之正 =電位之金屬時，首先在沒有一外部電壓源之條件下無For the case of using a carbonyl iron powder (the carbonyl iron powder includes high-purity iron having a thin oxide layer), a drying/curing step can be carried out, for example, after the dispersion is applied. The chemical "activation" of the high-acid acid unloading solution exposed as the first portion can then be carried out, the matrix material of the dispersion being destroyed and thus the exposed carbonyl iron powder H is present in the oxide layer after the exposed step. The second exposure step can then be carried out using an acidic copper sulphate bath treatment (e.g., by immersion). In this step, the oxide layer is automatically removed (i.e., the conductive component iron is exposed) and chemical metallization occurs in parallel. Subsequently, electrolytic amplification of the metallization can be carried out as needed. As explained in the above section, the exposure of the conductive particles can be carried out in various ways and can be used alone or in combination. Thus, mechanical and/or physical and/or chemical exposure steps can be initiated. For example, the mechanical exposure step can include brushing, grinding, milling, grit blasting, or by supercritical carbon dioxide jet treatment. Physical steps may include heating, laser treatment, use of (10) light irradiation, use-corona or plasma discharge treatment. For chemical exposure, it is preferred to use a chemical or chemical mixture that is compatible with the matrix material. In the case of chemical exposure, the matrix material can be at least partially dissolved on the surface and rinsed off, for example, by a solvent, or the conductive structure can be exposed by at least partially destroying the chemical structure of the matrix material by a suitable reagent. The agent that swells the matrix material is also suitable for exposing the conductive particles. The swelling produces voids such that the metal ions to be deposited can be introduced into the electrolyte from the electrolyte solution, which can metallize a large amount of conductive particles as described in 128941.doc -26-200843588. When using the disclosed exposure step, the adhesion, uniformity and continuity of the electrolessly and/or electrolytically deposited metal layer or layers in method step (4) are verified in practice as compared to the prior art. In its performance, it is improved by _. Since a larger number of conductive particles are exposed, the processing rate in metallization & is also higher, thereby achieving an additional cost advantage. If the matrix material is, for example, an epoxy resin, a modified epoxy resin, an epoxy resin, a polyacrylic acid vinegar, an ABS, a styrene-butadiene copolymer or a scale, the exposure of the conductive particles is more Good by an oxidant. The oxidizing agent disrupts the bonding of the matrix material to dissolve the binder and thereby expose the particles. Suitable oxidizing agents are, for example, potassium permanganate, potassium manganate, high manganese strontium sodium, sodium manganate, hydrogen peroxide and its adducts, perborates, percarbonates, persulphates, peroxydisulfuric acid Salt, sodium hypochlorite and perchlorate. In order to expose a conductive material of a matrix material containing, for example, an ester structure such as a polyester resin, a polyester acrylate, a polyether acrylate, a polyester urethane, etc., it is preferred to use, for example, an acid or a base. Sex chemicals and / or chemical mixtures. Preferred acidic chemicals and/or chemical mixtures are, for example, concentrated or dilute acids such as hydrochloric acid, sulfuric acid, phosphoric acid or nitric acid. Depending on the matrix material, organic acids such as formic acid or acetic acid may also be suitable. Suitable alkaline chemicals and/or chemical mixtures are, for example, those such as sodium hydroxide, potassium hydroxide, ammonium hydroxide or carbonates (e.g., sodium carbonate or calcium carbonate). Solvents can also be used to expose conductive particles in the matrix material. The solvent must be suitable for the matrix material because the matrix material must be soluble in or swelled by the solvent. When a solvent in which a matrix material is dissolved, 128941.doc -27- 200843588, is used, the substrate layer is only contacted with the solvent for a short period of time to cause the layer material to be layered/solvent and thus dissolved. Preferred solvents are xylene, toluene, halogenated hydrocarbons, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), and diethylene glycol monobutyl ether. The temperature may be increased during the dissolution process as needed to improve solubility. The temperature may be increased during the process to improve the exposure process. In addition, the conductive particles can also be exposed by using a mechanical method. Suitable mechanical methods are, for example, brushing, grinding, polishing with an abrasive or water jet pressure jet, sand blasting or spraying with supercritical carbon dioxide. The top layer of the cured, printed structured substrate layer can be removed by this mechanical method. Thereby, the conductive particles contained in the matrix material are exposed. If the conductive particles contain a material that is susceptible to oxidation, then in a preferred method variant, the oxide layer is at least partially removed prior to forming a metal layer on the substrate layer. For example, in this case the oxide layer can be removed chemically and/or mechanically. Suitable materials which can be used to treat the substrate layer to chemically remove the oxide layer from the conductive particles are, for example, acids such as concentrated or dilute sulfuric acid or concentrated or dilute hydrochloric acid, citric acid, phosphoric acid, aminole, formic acid, acetic acid and the like. For example, if an acidic copper sulfate bath is used in step (C), the oxide layer can also be removed without an additional step. After the electrolyte solution is in contact with the oxidized particles, the oxide layer dissolves to expose the conductive particles. Suitable mechanical methods for removing the oxide layer from the conductive particles are generally the same as the mechanical methods used to expose the particles. In particular, in the metallization step (4), a continuous conductive surface is produced, which may be structured as desired. To this end, in a method step (4), 128941.doc -28- 200843588 preferably applies at least one metallization after at least partially drying and/or curing the dispersion and optionally after the above exposure of the electrically conductive particles. The metallization or metal layer can be formed via electroless and/or electrolytic metallization at the location where the dispersion is applied and, if desired, on other regions of the substrate. In fact, any conventional metal coating can be applied by this method, especially for metal coatings used in the production of printed circuit boards. In the case of electroless metallization, the composition of the metallization will be substantially determined by the composition of the chemical bath or electrolyte solution used for coating. In the chemical bath, the metal is deposited, in particular, at a conductive location on the surface of the substrate, i.e., preferably at the location where the dispersion is applied. In principle, all metals which are more inert or equally inert than the lowest inert metal in the dispersion can be used for electroless and/or electrolytic coating. Conventional metals such as gold, nickel, palladium, platinum, silver, tin, copper or chromium which can be deposited onto the conductive surface by electrolytic coating. A plurality of metallization layers may also be deposited, such as a first, for example, copper bond layer, followed by a layer of, for example, a nickel substrate, and further followed by an inert layer, such as a gold layer. The thickness of one or more of the deposited layers is preferably within the customary range known to those skilled in the art. Those skilled in the art can learn from, for example, Werner JiUek, Gustl Keller, Handbuch der Leiterplattentechnik [Handbook of printed circuit technology] Eugen G. Leuze Verlag, 2003, Vol. 4, pp. 332-352. Suitable for electrolyte solutions. In one possible configuration of the invention, one or more first metal layers may be additionally applied by an electroless metallization process. The metal layer can be designed as a bonding layer, such as a bonding layer, and is used as a contact for the bonding of the metal layer on the substrate, which can be used for further electrolytic metallization. In the present invention, it is preferred to use a relatively dispersed conductive particle or an individual in an electrochemical potential sequence of an A + in an alkaline or preferably acidic solution. +, when the + electric component of the granules (such as a metal) is stronger than the metal of the potential, first without the external voltage source

:積*屬層。因此，藉由無電過程作業沈積之金屬應較分散體之最低惰性金屬更具惰性。十子於…、電至屬化之情形，可藉由例如一化學品槽或一喷務貝施作業。特定而言，基板可藉由欲沈積金屬之鹽之驗性、中性或較佳地酸性、較佳水性溶液及視需要一種或多種還原劑來處理。此可例如藉由將基板置於或懸浮於化學品槽中或連續地移動該基板使其通過該溶液（此已以一工業規模頻繁地實施）來實施。右而要’可於化學品槽中添加一種或多種還原劑。若例如將銅用作欲沈積之金屬，則例如可使用醛作為還原劑，特定而言還原糖或甲醛。若欲將鎳沈積為金屬^，則例如可添加鹼金屬次磷酸鹽、特定而言NaH2P〇2 χ 2H2〇或硼烷鹽、尤其是NaBH4作為還原劑。亦可聯想還原劑之其他組態’尤其是該等物質之混合物。如以上所述，在無電沈積一個或多個金屬層之後，可額外地以電解方式將另一層沈積至該層上。於此情形下，將使用一外部電壓源以及一電解槽。電解槽可含有至少另一金屬，該金屬在酸性或鹼性溶液中在元素電化學電位序列 128941.doc -30- 200843588 中具有一較導電顆粒或該等顆粒之導電組分更强或更弱之正標準電位。例如，如以上所述，導電顆粒可基於金屬粉末形成’特定而言鎳及/或鐵粉末及/或銅粉末及或碳。於此情形下’鐵及鎳可呈羰基鐵粉或羰基鎳粉之形式使用。该等粉末之混合物亦係可能的，例如羰基鐵粉與羰基鎳粉之混合物及/或至少該等粉末之一與其他粉末之混合物，例如鋼粉末（尤其呈薄片形式）及/或碳粉末。可選擇例如鎳、辞、金、銀、鉑、鈀或（特定而言）銅以及該等金屬及其他金屬之多層系統或合金作為可以電解方式沈積之其他金屬。如以上所述，可將無電及隨後之電解金屬化組合。總之，所生成之金屬化層的厚度範圍較佳地在1〇〇 11瓜與5〇〇 μητ之間、較佳地在！ μm與 200 μηι之間且尤佳地在5 與 5 0 μπι之間。當實施在以上-個變型體中所述之金屬化步驟⑷時，導電顆粒之金屬粉末可特定而言由另一金屬全部或部分地替代。通常，形態因該替代而得到改進，且在方法步驟⑷中所施加之金屬層與分散體之金屬粉末的形態不同。在金屬化步驟（C)結束之後’根據本發明，可獲得其上施加且接觸該至少-個電子裝置之基板或具有該等基板之電子組件 '然後該等所it方法步驟可接著進行其他方法步驟，例如其中亦例如用水沖洗該基板—次或多次及視需^ 藉由熟悉此項技術者已知之其他方、、么祕+ 而他方法後處理該基板之方法步驟。 128941.doc 200843588 在電解塗佈過程令，亦即，用一外部電星源塗佈，首先 ^亥基板上之導電位置（例如，先前在其上已實施益電金通置Γ在該電解質溶液槽中。然後，輸送該基板少一個陰極接觸導電位置。此處，可使用熟心此項技術者已知的任何適構化表面相接觸，則金屬 ^ 〃要该陰極與結則金屬離子即可自電解質溶液沈積以在表面上形成一金屬層。對熟悉此項技術者已知之:有方無:沈積之情形 :2的農置（其中可電解塗佈該經結構化之導電位 - 糟個險極及一個陰極，該槽含有一含至少一種金屬鹽之雷組暂、、六、、右十二冤解貝，合液。來自電解質溶液中之金 2離子係沈積至該基板之導電顆粒/位置上以形成-金屬層。為此，在輸送基板穿過該槽時，使該至少一個陰極與该基板之欲塗佈位置接觸。於此^下’熟悉此項技術者已知的所有電解方法皆適合電解塗佈。該等電解方法係（例如）彼等該陰極係由一個或多個接觸欲塗佈材料之輥筒所形成者。該等陰極亦可設汁成分段輥筒形式’其中至少與欲塗佈基板連通之輥筒段與相應陰極連接。為再次將輕筒上所沈積的金屬去除，在 ^段親筒之情况下’可將不與欲塗佈基板位置接觸之段與陽才"連接以使其上所沈積之金屬沈積回電解質溶液中。亦可經由接觸钳夾來發生該接觸。絕緣結構亦可藉由合適系統接觸。本t月之另Μ施例中，在該基板上使用輔助接觸線 128941 .doc -32- 200843588 以辅助金屬化步驟⑷。在—方法步驟⑷中施加分散體之珂，該等輔助接觸線可能作為例如導體跡線而已存在於基板上另選擇為或另外地，輔助接觸線直到施加分散體時才會產生。然後，與所需結構類似地，在隨後金屬化步驟中進一步處理該等輔助接觸線，亦即，於此情形下較佳地亦發生部分乾燥及/或固化，以及隨後之無電及/或電解金屬化。特定而言，使用該等接觸線以便即使該等接觸線較短，亦能够在方法步驟（c)中之隨後電解金屬化步驟過程中谷易地且均勻地與該基板上之相互絕緣的導電表面接觸。若需要，可在金屬化步驟（c)之後，再藉由例如雷射燒蝕、機械燒蝕或藉由例如沿一有意斷裂位置部分地破壞該基板而至少部分地去掉該等輔助接觸線。為了允許同時塗佈該基板之上側及下側，例如，可相應地使用兩個接觸輥筒作為電極觸點。該等可經布置以使欲金屬化基板（其於此情形下較佳地為一類似於印刷電路板之基板）能被引導通過該等接觸輥筒之間。因此，同時從上面及下面接觸該基板以使金屬能沈積於兩側。當欲塗佈長度超過槽長度之基板時_所謂的環狀基板，首先將其自一捲展開，引導穿過無電及/或電解塗佈裝置且然後再次捲起-可（例如）以z字形狀或以圍繞複數個電解塗佈裝置之婉蜒形式引導該環狀基板穿過該槽，該等電解塗佈裝置然後（例如）亦可彼此叠放或鄰近地排列。該實施例對例如RFID轉發器、扁平電纜或撓性印刷電路板之生產係有利的。 128941.doc •33- 200843588 若需要，無電及/或電解塗佈裝置可裝配有熟悉此項技術者已知的任何輔助裝置。該等輔助裝置係（例如）幫浦、過濾益、化學品供應設備、捲繞、展開設備等。可使用熟習此項技術者已知之處理電解質溶液的所有方法來縮短維修間隔。舉例而言，該等處理方法亦係電解質溶液自我再生之系統。、本發明之裝置亦可使用（例如）自Werner川lek ,: Product * layer. Therefore, the metal deposited by the electroless process should be more inert than the lowest inert metal of the dispersion. Ten cases can be operated by, for example, a chemical tank or a spray. In particular, the substrate can be treated by an assay, neutral or preferably acidic, preferably aqueous solution, and optionally one or more reducing agents, to deposit a salt of the metal. This can be accomplished, for example, by placing or suspending the substrate in a chemical bath or continuously moving the substrate through the solution, which has been frequently performed on an industrial scale. Right, you can add one or more reducing agents to the chemical tank. If, for example, copper is used as the metal to be deposited, for example, an aldehyde can be used as a reducing agent, in particular a reducing sugar or formaldehyde. If nickel is to be deposited as a metal, for example, an alkali metal hypophosphite, in particular NaH2P〇2 χ 2H2 strontium or a borane salt, in particular NaBH4, may be added as a reducing agent. It is also possible to associate other configurations of reducing agents, especially mixtures of such materials. As described above, after electroless deposition of one or more metal layers, another layer may be additionally deposited electrolytically onto the layer. In this case, an external voltage source and an electrolytic cell will be used. The electrolytic cell may contain at least one other metal having a more conductive particle or a conductive component of the particle in the elemental electrochemical potential sequence 128941.doc -30- 200843588 in an acidic or alkaline solution. Positive standard potential. For example, as described above, the conductive particles may be formed based on the metal powder 'specifically, nickel and/or iron powder and/or copper powder and or carbon. In this case, iron and nickel may be used in the form of carbonyl iron powder or nickel carbonyl powder. Mixtures of such powders are also possible, for example mixtures of carbonyl iron powder with nickel carbonyl powder and/or at least mixtures of one of the powders with other powders, such as steel powders (especially in the form of flakes) and/or carbon powders. . A multilayer system or alloy such as nickel, rhodium, gold, silver, platinum, palladium or (particularly) copper and such metals and other metals may be selected as the other metal that can be electrolytically deposited. As described above, electroless and subsequent electrolytic metallization can be combined. In summary, the thickness of the resulting metallization layer is preferably between 1 〇〇 11 瓜 and 5 〇〇 μητ, preferably in! Between μm and 200 μm and particularly preferably between 5 and 50 μm. When the metallization step (4) described in the above variants is carried out, the metal powder of the electrically conductive particles may in particular be replaced in whole or in part by another metal. Generally, the morphology is improved by this substitution, and the metal layer applied in the method step (4) is different from the metal powder of the dispersion. After the metallization step (C) is finished, 'according to the invention, a substrate on which the at least one electronic device is applied and which has an electronic component having the substrates can be obtained' and then the method steps can be followed by other methods The steps, for example, wherein the substrate is also rinsed with water, for example, one or more times, and as needed, by other methods known to those skilled in the art, and the method of post-processing the substrate. 128941.doc 200843588 In the electrolytic coating process, that is, coating with an external electric star source, firstly, the conductive position on the substrate (for example, the power solution has been previously implemented on the electrolyte solution) Then, the substrate is transported with less than one cathode contact conductive position. Here, any conformable surface contact known to the skilled artisan can be used, and the metal and the metal ion of the cathode and the junction are It can be deposited from an electrolyte solution to form a metal layer on the surface. It is known to those skilled in the art: there is no such thing as: deposition: 2 agricultural (where the structured conductive position can be electrolytically coated - worse a dangerous pole and a cathode, the tank containing a Lei group containing at least one metal salt, a sixth, a right twelve-inch shell, a liquid mixture. The gold 2 ions from the electrolyte solution are deposited on the substrate The particles/positions are formed to form a metal layer. To this end, the at least one cathode is brought into contact with the substrate to be coated when the substrate is transported through the groove. [This is known to those skilled in the art. All electrolysis methods Suitable for electrolytic coating, such as those in which the cathode system is formed by one or more rolls contacting the material to be coated. The cathodes may also be provided in the form of a roll of juice. The roller section communicating with the substrate to be coated is connected to the corresponding cathode. In order to remove the metal deposited on the light cylinder again, in the case of the tube, the section which is not in contact with the substrate to be coated may be The connection is such that the deposited metal is deposited back into the electrolyte solution. This contact can also occur via contact jaws. The insulation structure can also be contacted by a suitable system. In another example of this month, Auxiliary contact lines 128941.doc-32-200843588 are used on the substrate to assist in the metallization step (4). After the dispersion is applied in the method step (4), the auxiliary contact lines may be present on the substrate as, for example, conductor traces. Alternatively or additionally, the auxiliary contact line is not generated until the dispersion is applied. Then, similarly to the desired structure, the auxiliary contact lines are further processed in a subsequent metallization step, ie Partial drying and/or curing preferably occurs, as well as subsequent electroless and/or electrolytic metallization. In particular, the contact lines are used in order to be able to be in the method step even if the contact lines are short. During the subsequent electrolytic metallization step, the valleys are easily and uniformly contacted with mutually insulated conductive surfaces on the substrate. If desired, after the metallization step (c), by, for example, laser ablation, mechanical Ablating or at least partially removing the auxiliary contact lines by, for example, partially destroying the substrate along an intentional fracture location. To allow simultaneous coating of the upper and lower sides of the substrate, for example, two contact rolls may be used accordingly The canister serves as an electrode contact. The devices can be arranged such that the substrate to be metallized, which in this case is preferably a substrate similar to a printed circuit board, can be guided between the contact rollers. Therefore, the substrate is simultaneously contacted from above and below to allow metal to be deposited on both sides. When a substrate having a length exceeding the length of the groove is to be coated - a so-called annular substrate, it is first unrolled from a roll, guided through an electroless and/or electrolytic coating device and then rolled up again - for example, in z The annular substrate is shaped to pass through the trough in the form of a crucible surrounding a plurality of electrolytic coating devices, which may then, for example, also be stacked one on top of the other or adjacent to each other. This embodiment is advantageous for the production of, for example, RFID transponders, flat cables or flexible printed circuit boards. 128941.doc •33- 200843588 If required, the electroless and/or electrolytic coating apparatus can be equipped with any auxiliary equipment known to those skilled in the art. Such auxiliary devices are, for example, pumps, filtration benefits, chemical supply equipment, winding, unwinding equipment, and the like. All methods of treating electrolyte solutions known to those skilled in the art can be used to shorten the maintenance interval. For example, such treatments are also systems in which the electrolyte solution self-regenerates. The device of the present invention can also be used, for example, from Wernerchuan lek.

KeUer 之 Handbuch der Leherplattentechnik[handb〇〇k μ printed circuit technology]，Eugen G. Leuze Verlag，^4 卷’第192'26()、349、351、352、359頁中已知之脈衝方法來運作。本發明之用於接觸需要或產生電流之裝置/組件之方法可以連續、半連續或間歇模式運作，僅連續地實施該方法之個別步驟，而間歇地實施其他步驟。此外，本發明亦提供一種分散體，其具有符合以上在一關於組成之變體中之闡述之組成。為了產生本發明之分散體，特定而言可采取一程序以使 •該至少一種類型之導電顆粒、 -該至少一種基質材料、 -該至少一種溶劑、 -視需要該至少一種分散劑及 -視需要該至少-種填充劑及/或該至少—種添加劑可以任何次序混合在'-起。例如’可藉由熟悉此項技術者已知之方法自印刷電路板 128941.doc •34- 200843588 製造產生非導電基板上之導電表面，以便（特定而言）能產生導體跡線。例如’可藉由熟悉此項技術者已知之光阻及 J方法處ί里覆銅基板以便能產生一結構化導電表面，例如，-印刷電路板之外平面。亦可藉由以下所述在非導電基板上產生導電表面： •朝經結構化或全面積基底層施加（較佳地印刷）分散體，該分散體較佳地與上豸分散體㈣或類似， fKeUer's Handbuch der Leherplattentechnik [handb〇〇k μ printed circuit technology], Eugen G. Leuze Verlag, ^4, pp. 192'26(), 349, 351, 352, 359, is known to operate in a pulsed manner. The method of the present invention for contacting a device/assembly requiring or generating an electric current can be operated in a continuous, semi-continuous or intermittent mode, and only the individual steps of the method are carried out continuously, while the other steps are carried out intermittently. Moreover, the present invention also provides a dispersion having a composition consistent with the above-described variations in composition. In order to produce the dispersion of the invention, a procedure may be specifically employed to enable the at least one type of electrically conductive particles, the at least one matrix material, the at least one solvent, the at least one dispersant and the It is desirable that the at least one filler and/or the at least one additive be mixed in any order. For example, a conductive surface on a non-conductive substrate can be fabricated from a printed circuit board 128941.doc • 34- 200843588 by methods known to those skilled in the art to, in particular, produce conductor traces. For example, a copper substrate can be produced by a photoresist and a method known to those skilled in the art to produce a structured conductive surface, for example, a printed circuit board. A conductive surface can also be produced on a non-conductive substrate by: • applying (preferably printing) a dispersion towards a structured or full-area substrate layer, preferably a dispersion of the upper dispersion (four) or the like , f

II·在一個或多個步驟中至少部分地乾燥及/或至少部分地固化所施加之分散體， III·視需要藉由至少部分地化學、物理或機械腐钱該基質來暴露剩餘基底層表面上之導電顆粒， IV·藉由無電及/或電解塗佈在剩餘基底層上形成至少一個金屬層。以此方式，不僅能使用所述及提議之其他分散體來接觸電子裝置’亦可在不必施加電子裝置之情形下，在基板上藉由該分散體產生導體跡線結構。在上述本發明之用於電接觸基板上至少一個電子裝置之方法及先前所述用於藉由所述步驟][•至IV•產生導體跡線結構之方法中，較佳地可使用相同之分散體（以下稱為分散體（1)或分散體（2))。另一選擇為，在步驟I.中所使用之分散體亦可包括不同及/或更多的組分。以此方式，視需要暴露分散體或多種分散體之導電顆粒及隨後無電及/或電解金屬化之相應步驟可分別在施加電子裝置之前及/或之後及在視需要乾燥及/或固化（多種）分散體之後之步驟中實 128941.doc -35- 200843588 施。因此，在_個步驟中，視需要暴露之兩種分散體之導電顆♦及無電及/或電解金屬化可隨後在一個步驟中實施。亦可使用額外暴露步驟及/或具有上述，，活化功能”之暴露步驟，此情形可參考以上闡述及該等實例。在本t明之一個實施例中，在步驟（a)中分別塗佈（例如印刷）有分散體之兩個基板位置屬於該基板導電表面之不同部分。II. at least partially drying and/or at least partially curing the applied dispersion in one or more steps, III. optionally exposing the remaining substrate surface by at least partially chemically, physically or mechanically detoxifying the substrate The conductive particles thereon, IV. form at least one metal layer on the remaining substrate layer by electroless and/or electrolytic coating. In this manner, not only can the described and proposed other dispersions be used to contact the electronic device', but the conductor trace structure can also be produced on the substrate by the dispersion without the need to apply an electronic device. In the above method of the present invention for electrically contacting at least one electronic device on a substrate and the method for generating a conductor trace structure by the steps [• to IV•, the same is preferably used. Dispersion (hereinafter referred to as dispersion (1) or dispersion (2)). Alternatively, the dispersion used in step I. may also comprise different and/or more components. In this manner, the respective steps of exposing the conductive particles of the dispersion or dispersions and subsequent electroless and/or electrolytic metallization, respectively, may be dried and/or cured as needed before and/or after application of the electronic device, respectively. The step after the dispersion is actually 128941.doc -35- 200843588. Thus, in one step, the conductive particles ♦ and the absence of electricity and/or electrolytic metallization of the two dispersions as desired may then be carried out in one step. An additional exposure step and/or an exposure step having the above-described activation function may also be used, which may be referred to the above description and the examples. In one embodiment of the present invention, the coating is separately applied in step (a) ( For example, printing) the two substrate locations with the dispersion belong to different portions of the substrate conductive surface.

在本發明之另一實施例中，在步驟（a)及（I·)中，分散體之導電顆粒或至少兩種導電顆粒之混合物相同。在方法v驟b)中’將該至少—個電子裝置施加至該基板上或將+分散體施加至該基板上。此過程（亦可稱為裝置施加)可藉由使用熟悉此項技術者已知之各種裝置施加技術及衣置施加系統來實施。已知裝置施加方法自印刷電路板製U得4且涉及例如用於所謂表面安裝（表面安裝技術’ SMT)或安裝方法(例如，***方法(通孔技術， THT)、夾鉗技術、Kneipp夾鉗技術或類似技術）之方法。例々可使用自動裝置施加器，例如用於將綱D裝置 (SMD :表面安裝裝置）施加於基板特定位置之自動裝置施加裔。亥等自動裝置施加器將例如該等裝置/組件分別放在所需基板位置處。車乂小之裝置可例如用紙板帶或塑膠帶包裝。該等帶中含有凹穴’褒置/組件就放在該等凹穴中。凹穴之上側由例如一膜密封，該膜能够被揭掉以移除裝置/組件。帶本身纏繞在-輥筒上。輥筒在至少一侧包括呈規則間距之孔， 128941.doc -36- 200843588 通過該等孔，自動萝罢&丄抑、置轭加益能移動該等 (所謂的給送器）之幫助在傳达杈組加器處。該等裝置夢由Ltt 至該自動裳置施入μ之目子或夾切除幻遺後放程才示位置處。較佳地針對所有該等裝置重複該過在方法步驟⑻中被施加或安裝到基板上之電子裝置可包括熟悉此項技術者已知之諸多主動裝置、被動裝置或其他性質之裝置。例如，豸等電子裝置可包括電阻器、電容器、線圈、感測器、電晶體、電壓調節器、積體電路、：片（例如基於矽之晶片或基於導電聚合物之晶片）、二= 體、諸如LED(發光二極體）或〇LED(有機發光二極體）等發光二極體、按鈕、電位言十、光耦合器、太陽能模組、太陽能電池及珀耳貼（Peltier)元件、電阻元件、電容性元件、感應元件、致動器、光學裝置、接收器/傳輸裝置、太陽能電池或其他用於印刷電路板製造中之裝置/組件。本發明進一步提供包括至少一個基板及至少一個電子裝置之電子組件，在該基板上藉由一在所提出之一個實施例中之上述方法電接觸該電子裝置。特定而言，該所述方法可用於以下裝置之生產：經裝配之印刷電路板、轉發器 (例如RFID轉發器）、天線（例如構建於灯山標籤内之轉發器天線）、晶片卡、扁平電纜、座位加熱器、箔導體、顯示元件（例如LCD或電漿螢幕）、顯示面板、光電伏打系統、地燈、壁燈或吊燈或例如在包裝領域中之任何類型之 12894】.doc -37- 200843588 裝飾應用。【實施方式】下文將借助圖不對本發明進行更詳細的闡釋。該等圖分別以μ例之方式僅顯示一個可能之實施例。除了在所提及之實施例中之外’本發明當然亦可在其他實施例中實施或作為该等實施例之組合實施。圖1Α至1〇表不一實施本發明方法之第一實例性實施例。其中不意性地給出了該方法之個別方法步驟、示意性地表不出個別元件且其并未按照真實比例繪製。圖1Α表不一基板110，於此情形下，該基板表示下文所述方法之開始產品。在該實例性實施例及以下實例性實施例中，在不限制其他基板形式之情形下，基板丨丨〇經組態為一印刷電路板，該印刷電路板具有一絕緣基板材料} 12 及施加至該基板材料112上之接觸墊或導體跡線114。導體跡線可係例如如上所述之銅導體跡線，其施加至例如一玻璃纖維增强環氧樹脂基板或一聚醯亞胺或聚酯薄片上。導體跡線114可呈在電子工業中使用之任何幾何形狀，且導體跡線亦可包括至少局部功能元件，例如大面積電接地面及/或例如用於例如RFID轉發器中之天線（例如天線線圈）。參考以上說明可獲得進一步詳細内容及可能性。在圖1B中’將一分散體π 6施加至導體跡線1 14之子區域上，特定而言接觸墊上。圖1B象徵性地表示一分配器 1 1 8 ’該分配器將分散嘗或分散液施加至導體跡線或接觸墊Π 4上。然而，如以上所述，亦可使用其他方法。關於 128941.doc -38- 200843588 該等方法及該分散體之可能組成，同樣參考以上說明及以上提出之替代實施例。可選乾燥及/或固化步在圖1C中，分散體116經受In another embodiment of the invention, in steps (a) and (I), the conductive particles of the dispersion or the mixture of at least two electrically conductive particles are the same. The at least one electronic device is applied to the substrate or the + dispersion is applied to the substrate in method v, step b). This process (also referred to as device application) can be implemented by using various device application techniques and garment application systems known to those skilled in the art. Known device application methods are known from printed circuit boards and relate, for example, to so-called surface mounting (SMT) or mounting methods (eg insertion methods (through hole technology, THT), clamping technology, Kneipp clips). The method of forceps technology or similar technology). For example, an automatic device applicator can be used, such as an automatic device for applying a D device (SMD: surface mount device) to a specific position of a substrate. Automatic device applicators, such as Hai, place, for example, the devices/components at the desired substrate locations, respectively. The device of the rut can be packaged, for example, with a cardboard tape or a plastic tape. The pockets containing the recesses's/components are placed in the pockets. The upper side of the pocket is sealed by, for example, a membrane which can be removed to remove the device/assembly. The belt itself is wound around the - roller. The roller includes holes at regular intervals on at least one side, 128941.doc -36- 200843588 through the holes, the automatic radish &dam; the yoke and the yoke can move the help (so-called feeder) In the communication group. These devices are dreamed from Ltt to the automatic placement of the target or the clip after the illusion is removed. Preferably, the electronic device that is applied or mounted to the substrate in method step (8) is repeated for all of the devices, and may include a plurality of active devices, passive devices, or other devices known to those skilled in the art. For example, electronic devices such as germanium may include resistors, capacitors, coils, sensors, transistors, voltage regulators, integrated circuits,: sheets (eg, wafers based on germanium or wafers based on conductive polymers), two = body Light-emitting diodes such as LEDs (light-emitting diodes) or 〇LEDs (organic light-emitting diodes), buttons, potentials, optical couplers, solar modules, solar cells, and Peltier components, Resistive components, capacitive components, inductive components, actuators, optics, receivers/transmission devices, solar cells, or other devices/components used in the manufacture of printed circuit boards. The invention further provides an electronic component comprising at least one substrate and at least one electronic device on which the electronic device is electrically contacted by a method as described in one of the proposed embodiments. In particular, the method can be used for the production of assembled printed circuit boards, transponders (eg, RFID transponders), antennas (eg, transponder antennas built into the lamp tags), wafer cards, flat Cables, seat heaters, foil conductors, display elements (eg LCD or plasma screens), display panels, photovoltaics, floor lamps, wall lamps or chandeliers or any type of 12894 such as in the field of packaging.]doc -37 - 200843588 Decorative application. [Embodiment] The present invention will not be explained in more detail below with the aid of the drawings. The figures show only one possible embodiment in the form of a μ. The present invention may of course be implemented in other embodiments or as a combination of such embodiments, except in the embodiments described. BRIEF DESCRIPTION OF THE DRAWINGS Figures 1A through 1 show a first exemplary embodiment of a method of the present invention. The individual method steps of the method are not intended to be illustrative, the individual elements are shown schematically and they are not drawn to true scale. Figure 1 shows a substrate 110 in which case the substrate represents the starting product of the method described below. In this exemplary embodiment and the following exemplary embodiments, the substrate is configured as a printed circuit board having an insulating substrate material 12 and applied without limiting other substrate forms. Contact pads or conductor traces 114 onto the substrate material 112. The conductor traces can be, for example, copper conductor traces as described above applied to, for example, a glass fiber reinforced epoxy substrate or a polyimide or polyester sheet. The conductor traces 114 can be of any geometry used in the electronics industry, and the conductor traces can also include at least local functional elements, such as large area electrical ground planes and/or antennas, for example, for use in, for example, RFID transponders (eg, antennas) Coil). Further details and possibilities are available by reference to the above description. In Figure 1B, a dispersion π 6 is applied to the sub-region of conductor traces 14 14 , in particular to the contact pads. Figure 1B symbolically represents a dispenser 1 18 ' that dispenses a dispersion or dispersion onto a conductor trace or contact pad 4 . However, as described above, other methods can also be used. With regard to the methods and possible compositions of the dispersions, reference is made to the above description and the alternative embodiments set forth above. Optional Drying and/or Curing Steps In Figure 1C, the dispersion 116 is subjected to

驟，該至少冑分乾燥及/或固化由圖lc中之參考編號㈣象徵性地表示。如以上所述，亦可使用其他方法例如固化來代替乾燥。不僅可如圖m中所示藉由幸畐照基板11〇之上側來實施乾燥或固化，亦可藉由例如一加熱板或一烘箱自下面加熱基板110。熟悉此項技術者亦知曉其他乾燥技術。在圖1D中，將電子裝置丨22裝配在自圖lc中所示之子步驟獲得之中間產品上。在圖1£)中，將_SMD裝置象徵性地表示為-電子裝置122。然而，#以上所述，亦可使用其他種類之電子裝置’且甚至可混合不同裝置施加技術。除了所提出之SMD技術之外，亦可使用例如通孔插裝技術 (THT)在所知^出之SMD技術中，在實施方法步驟ic之後，分散體11 6仍足够黏以確保將電子裝置丨22黏附到分散體116上。特定而言，此確保電子裝置122不會由於震動或受其自身重量之影響而改變其位置。如以上所述’可提供多種裝置施加技術以將電子裝置 122裝配在基板11〇上。在圖1〇中，由參考編號124象徵性地表不自動裝置施加器。在圖1E中’在圖1D中獲得之中間產品經受一進一步乾炼或固化步驟，該步驟由參考編號丨26象徵性地表示。如以上針對圖1 C所提及，各種乾燥或固化技術皆可用於此。在圖1E之第二乾燥步驟ι26之後，根據圖1ρ，在一化學 128941.doc -39- 200843588 品槽⑽最終無電金屬化其上安裳有電子裝置in之基板 110。该金屬化使用-含有金屬離子之溶液13G，此情形可參考上文關於組成之闡述。此外，间描 c Γ冋樣如以上所提出，此 =液130亦可含有用於以化學方式暴露含於分散體m中之導電顆粒、或該等導電顆粒之導電組分之成分。為此目的，溶液130可係例如一酸性溶馼性/合液，其例如自金屬顆粒上㈣化物層且因此全部或部分地以化學方式暴露屬顆粒。 ^上所述…其中實施”活化”之第—暴露步驟可視需 …圖1F中所示之步驟之前’在圖_示之步驟中， (第二）化學暴露與金屬化同時發 T ^ ^ 然後，在該活化之範圍内，尤其在被暴露表面上可至少立 11/： ^ j^分去除或破壞分散體之基質材料。於此情形下較佳使用第-化學品槽128，其中在第-溶液13〇中存在例如上述氧化劑中之—者⑽如高猛酸鉀)。當將基板110浸入至此溶液13〇中時，則以上所述之活化作為一第一暴露步唆 /生。亦可實施複數個此荨活化步驟（例如在一系列化學 U之靶圍内）且此亦可後接至少一個清洗槽，例如水或過氧化氯溶液。隨後，如以上借助於圖1F所述，然後社具有對應電解質溶液 30之弟二化學品槽128中盘全μ外π n士也 ”金屬化同時實施一第二暴露步驟（例如去掉氧化物層，見上文）。然而如以上所述，可代 :以分別實施金屬化與暴露步驟（例如再次在化學品槽128 ρ ^^說明’熟悉此項技術者可聯想到各種組合併可加以實施。 128941.doc -40- 200843588 由於具有不同的電化學性能，特定而言由於在電化學序列中之位置不同，一對應於含於溶液130中之金屬離子之金屬層在化學品槽128中沈積於金屬化表面上，特定而言沈積於導體跡線114之表面上、分散體ι16之表面上及（至 • 少部分地）沈積至電子裝置122之電觸點132之上。該等電子裝置藉由金屬沈積電連接至對應導體跡線1 14及/或接觸墊。该金屬層之厚度可受化學品槽丨28之條件之影響，特 p 定而言受化學品槽128之溫度、溶液130之濃度及基板110 在溶液130中之停留時間之影響。較佳地，可因此全部或部分記錄及控制或調節該等參數以及其它關鍵參數。在本文中，在圖1F中所示之化學品槽128中之無電金屬化過紅中電子裝置122同樣完全暴露於溶液13〇中。若使用可在此溶液130中受到損壞之電子裝置122，則可額外地對該等電子衷置122實施囊封。另一選擇為或另外地，亦可在化學品槽128中實施金屬化以使電子裝置122不完全暴 <} 路在々液13G中，例如藉由僅不完全地將基板11G浸入溶液中例如，可將s亥浸人實施為僅使電觸點至少部分地）浸沒在溶液130中，而電子裝置122之主體並未浸入該溶液中。 =1F中所示之化學金屬化可視需要接著進行其他金屬 V驟（例如一個或多個電解电鮮I屬化步驟）以增强該金屬化0於此方面，可參考步驟亦是可能的。 M於㈣之注解。其他後處理最後，圖_示一電子組件134，其係在圖以至㈣所 128941.doc 200843588 示子步驟之方法產品。該電子裝置可係例如一用於例如— 電子儀器(例如一電腦、一行動電話或一類似儀器_亦可見上文實例）或一RFID轉發器中之全裝配印刷電路板。因此，在基板110上，電子組件134包括電子裝置122，其電觸點132經由一在圖1F之化學品槽128中施加之金屬化 136及分散體116(其自身可至少部分地具有導電性能）連接至接觸墊或導體跡線114。α此方 <，電子組件134實際上可製成具有任何電路及功能之組件。圖2Α至2Η表示圖1Α至1(}之另一選擇方法，該方法亦可與圖1Α至1G中所示之方法組合。與圖丨八至1G之方法相對比，圖2A至2H之方法之開始產品係一基板11〇，然而，該基板不具有接觸墊或導體跡線丨14(參考圖1A至1⑺。在本實例性實施例中，完全藉由施加分散體丨16及隨後之金屬化產生該等接觸墊或導體跡線丨14。亦可聯想其中僅設置某些導體跡線114之實例性實施例。而圖2A表示藉由一分配器118將分散體116施加至（較佳地絕緣）基板材料112上所採用之方式。而此施加以一結構化方式進行，例如藉由分散體n6將一導體跡線結構同樣印刷至基板材料112上。為了改進在基板材料112上所施加之为散體1 1 6之黏附’在施加分散體11 6之前可藉由熟悉此項技術者已知之方法預處理基板材料1丨2及/或使之具有一額外黏合/黏附層。在圖2B中，與圖1C中所示之方法步驟類似，提供可選擇的第一至少部分乾燥及/或固化12〇。為此目的，可基本 128941.doc -42- 200843588 上參考此圖1 C之以上說明。隨後，根據圖2C，朝基板110裝配電子裝置122。與圖 1D類似，此裝置施加又可藉由一自動裝置施加器124進行’該自動裝置施加器將電子裝置122之電觸點132壓入仍有黏性之分散體1 1 6中。隨後在圖2D中，與圖1E類似，提供可選擇的第二至少部分乾燥126或固化。 , 在圖2E中，與圖卟中所示之方法步驟類似，繪示一在一化學品槽128中使用一溶液130之第一無電金屬化。再一次，分散體116之導電組分之暴露可再用例如包括一酸之溶液130同時發生。隨後將一對應金屬層136沈積於分散體 116上（且通常亦至少部分地沈積於電觸點132上）。在本實施例中，不僅藉由金屬沈積產生導體跡線及/或接觸墊，而且同日守電子裝置亦電連接至產生的各導體跡線及/或接觸墊。詳細内容亦可參考以上圖11?之說明。 • 視需要，如以上借助於圖1F所述，在其中分散體116之導電顆粒較佳地同時至少部分暴露之化學金屬化步驟之前 ***一個或多個進一步暴露步驟，例如一個或多個其中基質材料至少在表面區域被破壞之”活化步驟”。關於該活化之詳細内容可參考以上說明。圖21"繪示一在實施圖2E之子步驟後所獲得之中間產品。能够看出’儘管在分散體n6與基板材料n2之間不存在額外的接觸墊或導體跡線丨i 4，但該中間產品基本上對應於圖1G之電子組件134。於此情形下，金屬層ι36全部地或部 128941.doc -43- 200843588 分地取代導體跡線114。在諸多情形下，使用技術上可行之處理持續時間，在一化學品槽128中之無電金屬化僅會產生不足以在特定應用下携載必須的電流及電流密度及/或電接觸電子裝置的金 >1化層136厚度，或對應之無電金屬化花費太長時間。因此’圖2G緣示其中在施加一第二金屬化138(見圖邱之前進一步放大金屬化136之另—可選擇步驟。為此目的，將，圖1G之中間產品引入一電解槽14〇中。該電解槽14〇再次含有一電解質溶液142，例如再次係一酸性溶液。於此情形下，電解槽140中之基板11〇連接至一外部電流源144。實施此接觸以使金屬化136構成電解布置之陰極^ 而一電解陽極146構成電背電極。端視欲沈積之第二金屬化138選擇該電解陽極146’例如為一銅陽極。以此方式，可藉由以下有意調節第二金屬化138之性質：設置相應溫度，選擇電解布置之幾何形狀，選擇陽極材料、電解質溶液142之濃度及該電解質溶液之温度、電壓及電流密度及在電解槽14〇中之停留時間、以及其他作業參數。特定而言，該等作業參數可由一相應裝置控制或調節及/或監控。與圖1F之闡釋類似，電子裝置122亦在圖2H之方法步驟中暴露於電解質溶液142中。而此亦可藉由相應囊封電子裝置122及/或相應選擇電解槽122(例如，藉由不將電子裝置122完全浸入電解質溶液142中）來完全或部分避免。、在藉由施加第二金屬化138對金屬化136實施該後放大之 128941.doc -44· 200843588 後，最終獲得圖2H中所示之電子組件134。關於此電子組件134之可能用途及性質，可主要參考對圖1G及以上實例性實施例之闡釋。在圖2H中所示之個別層厚度之層厚度未必按真實比例繪製。藉由圖2A至2H中所示之方法及使用對金屬化136、π8之所述後放大，亦可製造電子組件 134 ’其中可在無任何先前所施加之接觸墊或導體跡線Η* 之情形下處理基板110。此尤其具有快速改變基板11〇上之導體跡線結構之優點，此乃因對於此一布局改變來說僅需要改變圖2A方法步驟中之分配器丨18之程式化。因此，在圖2A至2H中所示之方法亦可用於所謂的快速原型設計，其中能藉由一對應於一 CAD設計之預定導體跡線布局快速生產小批量電子組件134。然而，所述之方法亦可同樣用於具有一高生產量之大規模生產過程。【圖式簡單說明】圖1A至1G顯示一用於接觸一電子裝置之本發明方法之第一實例性實施例；且圖2A至2H顯示一本發明方法之第二實例性實施例。【主要元件符號說明】 110 基板材料 112 基板材料 114 接觸墊/導體跡線 116 分散體 118 分散器 120 第一乾燥/固化 128941.doc 200843588 122 電子裝置 124 自動裝置施加器 126 第二乾燥/固化 128 化學品槽 130 電解質及/或氧化劑溶液 132 電觸點 134 電子組件 136 金屬化/金屬層 138 第二金屬化 140 電解槽 142 電解質溶液 144 外部電流源 146 電解陽極 128941.doc -46-The at least minute drying and/or solidification is graphically represented by reference numeral (4) in Figure lc. As described above, other methods such as curing may be used instead of drying. Not only drying or solidification may be carried out by the top side of the substrate 11 as shown in Fig. m, but also by heating the substrate 110 from below by, for example, a heating plate or an oven. Those skilled in the art are also aware of other drying techniques. In Fig. 1D, the electronic device 22 is mounted on an intermediate product obtained from the substeps shown in Fig. 1c. In Fig. 1), the _SMD device is symbolically represented as - electronic device 122. However, as described above, other types of electronic devices can be used' and even different device application techniques can be mixed. In addition to the proposed SMD technology, for example, through-hole insertion technology (THT) can be used. In the known SMD technology, after the method step ic is implemented, the dispersion 11 is still sufficiently viscous to ensure the electronic device. The crucible 22 adheres to the dispersion 116. In particular, this ensures that the electronic device 122 does not change its position due to vibration or its own weight. As described above, a variety of device application techniques can be provided to mount the electronic device 122 on the substrate 11A. In Fig. 1A, the applicator is symbolically represented by reference numeral 124. The intermediate product obtained in Fig. 1D in Fig. 1E is subjected to a further drying or curing step, which is symbolically represented by reference numeral 丨26. As mentioned above for Figure 1 C, various drying or curing techniques can be used herein. After the second drying step ι26 of Fig. 1E, according to Fig. 1p, a chemistry 128941.doc-39-200843588 product tank (10) is finally electrolessly metallized thereon with the substrate 110 of the electronic device in. This metallization uses a solution 13G containing metal ions, in which case reference is made to the above description of the composition. Further, as described above, the liquid 130 may further contain a component for chemically exposing the conductive particles contained in the dispersion m or the conductive components of the conductive particles. For this purpose, the solution 130 may be, for example, an acidic solvating/complexing liquid, for example, from the (tetra) layer of the metal particles and thus chemically exposing the granules in whole or in part. ^上上...where the implementation of the "activation" - the exposure step can be as needed... before the step shown in Figure 1F 'in the figure - shown step, (second) chemical exposure and metallization simultaneously T ^ ^ then Within the scope of this activation, especially on the exposed surface, the matrix material of the dispersion can be removed or destroyed at least 11/:^. In this case, it is preferred to use the first-chemical tank 128 in which, for example, the above-mentioned oxidizing agent (10) such as potassium permanganate is present in the first solution 13?. When the substrate 110 is immersed in the solution 13 ,, the activation described above is used as a first exposure step. A plurality of such activation steps (e.g., within a series of chemical U targets) may also be performed and this may be followed by at least one cleaning tank, such as water or a chlorine peroxide solution. Subsequently, as described above with the aid of FIG. 1F, the second electrode step 128 of the corresponding electrolyte solution 30 is also used to perform metallization while performing a second exposure step (eg, removing the oxide layer). , see above). However, as described above, it can be replaced by: performing metallization and exposure steps separately (for example, again in the chemical tank 128 ρ ^ ^ description 'experienced by the technology can be associated with various combinations and can be implemented 128941.doc -40- 200843588 Due to the different electrochemical properties, in particular due to the different positions in the electrochemical sequence, a metal layer corresponding to the metal ions contained in the solution 130 is deposited in the chemical bath 128. On the metallized surface, in particular deposited on the surface of the conductor trace 114, on the surface of the dispersion ι 16 and (at least partially) deposited onto the electrical contacts 132 of the electronic device 122. Electrically connected to the corresponding conductor traces 14 and/or contact pads by metal deposition. The thickness of the metal layer can be affected by the conditions of the chemical bath 28, which is specifically affected by the temperature of the chemical bath 128. The concentration of 130 and the effect of the residence time of substrate 110 in solution 130. Preferably, such parameters, as well as other key parameters, may be recorded and controlled or adjusted in whole or in part. In this context, the chemistry shown in Figure 1F The electroless metallized red electronic device 122 in the product cell 128 is also completely exposed to the solution 13A. If an electronic device 122 that can be damaged in the solution 130 is used, the electronic device 122 can be additionally implemented. Alternatively, or alternatively, metallization may also be performed in the chemical bath 128 to cause the electronic device 122 to be completely turbulent <} in the sputum 13G, for example by merely incompletely slab 11G Immersion in the solution, for example, can be performed by immersing only the electrical contacts at least partially in solution 130, while the body of electronic device 122 is not immersed in the solution. Chemical metallization as shown in =1F Other metal V steps (eg, one or more electrolytic processes) may be performed as needed to enhance the metallization. In this regard, reference may also be made to the steps. M. (4) Note. Other post-processing Figure _ shows an electronic component 134, which is shown in the method of the above-mentioned (IV) 128941.doc 200843588 sub-step. The electronic device can be used, for example, for an electronic device (such as a computer, a mobile phone or a similar The instrument_see also the above example) or a fully assembled printed circuit board in an RFID transponder. Thus, on the substrate 110, the electronic component 134 includes an electronic device 122 whose electrical contacts 132 pass through a chemical tank in Figure 1F. The metallization 136 and dispersion 116 (which may itself have at least partially conductive properties) applied in 128 are connected to the contact pads or conductor traces 114.此This side <, electronic component 134 can actually be made into a component with any circuit and function. 2A to 2B show another selection method of FIGS. 1A to 1(}, which may also be combined with the method shown in FIGS. 1A to 1G. Compared with the method of FIGS. 8 to 1G, the methods of FIGS. 2A to 2H The starting product is a substrate 11 〇, however, the substrate does not have contact pads or conductor traces 14 (refer to Figures 1A to 1 (7). In the present exemplary embodiment, the dispersion 丨 16 and subsequent metal are completely applied. The contact pads or conductor traces 14 are produced. An exemplary embodiment in which only certain conductor traces 114 are provided may be associated. Figure 2A illustrates the application of dispersion 116 to a dispenser 118 (preferably The grounding is applied to the substrate material 112. The application is performed in a structured manner, such as by printing a conductor trace structure onto the substrate material 112 by dispersion n6. Applying the adhesion of the bulk 1 16 to the substrate material 1 2 can be pretreated and/or provided with an additional adhesion/adhesion layer by methods known to those skilled in the art prior to application of the dispersion 116. In 2B, the method steps shown in Figure 1C Similarly, an optional first at least partially dried and/or cured 12 Å is provided. For this purpose, reference may be made to the above description of Figure 1 C on substantially 128941.doc -42- 200843588. Subsequently, according to Figure 2C, toward the substrate 110 The electronic device 122 is assembled. Similar to FIG. 1D, the device application can be performed by an automatic device applicator 124. The automatic device applicator presses the electrical contacts 132 of the electronic device 122 into the still viscous dispersion 1 1 6. In Figure 2D, similar to Figure 1E, an optional second at least partial drying 126 or curing is provided. In Figure 2E, similar to the method steps shown in Figure ,, a chemical is depicted The first electroless metallization of a solution 130 is used in the product tank 128. Again, the exposure of the conductive component of the dispersion 116 can be repeated simultaneously using, for example, a solution comprising an acid 130. A corresponding metal layer 136 is then deposited on the dispersion. The body 116 is (and usually also at least partially deposited on the electrical contacts 132). In this embodiment, not only the conductor traces and/or the contact pads are produced by metal deposition, but also the electronic devices are electrically connected to the same. Each conductor Wire and/or contact pad. For details, refer to the description of Figure 11 above. • If desired, as described above with reference to Figure 1F, the conductive particles in which the conductive particles of the dispersion 116 are preferably at least partially exposed at the same time One or more further exposure steps are inserted prior to the step of, for example, one or more "activation steps" in which the matrix material is destroyed at least in the surface region. For details of the activation, reference may be made to the above description. Figure 21 " The intermediate product obtained after the sub-step of Figure 2E is implemented. It can be seen that although there is no additional contact pad or conductor trace 丨i 4 between the dispersion n6 and the substrate material n2, the intermediate product substantially corresponds to the figure 1G electronic component 134. In this case, the metal layer ι 36 replaces the conductor traces 114 all or part of 128941.doc -43 - 200843588. In many cases, the use of technically feasible processing durations, electroless metallization in a chemical bath 128 will only produce insufficient current and current density and/or electrical contact electronics for carrying in a particular application. The thickness of the gold <1 layer 136, or the corresponding electroless metallization, takes too long. Thus, Fig. 2G shows an alternative step in which a second metallization 138 is applied (see further enlarging the metallization 136 before seeing Fig. Qiu. For this purpose, the intermediate product of Fig. 1G is introduced into an electrolytic cell 14〇). The electrolytic cell 14 〇 again contains an electrolyte solution 142, for example, an acidic solution again. In this case, the substrate 11 in the electrolytic cell 140 is connected to an external current source 144. This contact is made to make the metallization 136 The cathode of the electrolytic arrangement and the electrolytic anode 146 constitute an electric back electrode. The second metallization 138 to be deposited is selected, for example, as a copper anode. In this way, the second metal can be intentionally adjusted by the following 138 properties: set the corresponding temperature, select the geometry of the electrolytic arrangement, select the anode material, the concentration of the electrolyte solution 142 and the temperature, voltage and current density of the electrolyte solution and the residence time in the electrolytic cell 14 、, and other operations In particular, the operational parameters may be controlled or adjusted and/or monitored by a respective device. Similar to the illustration of FIG. 1F, the electronic device 122 is also The method step 2H is exposed to the electrolyte solution 142. This can also be accomplished by encapsulating the electronic device 122 and/or correspondingly selecting the electrolytic cell 122 (eg, by not completely immersing the electronic device 122 in the electrolyte solution 142). Completely or partially avoided. After performing the post-amplification 128941.doc -44·200843588 on the metallization 136 by applying the second metallization 138, the electronic component 134 shown in FIG. 2H is finally obtained. About the electronic component 134 For possible uses and properties, reference is made primarily to the illustration of Figure 1G and the above exemplary embodiments. The layer thicknesses of the individual layer thicknesses shown in Figure 2H are not necessarily drawn to true scale. By Figures 2A through 2H The method and the use of post-amplification of the metallizations 136, π8 may also produce an electronic component 134' wherein the substrate 110 can be processed without any previously applied contact pads or conductor traces*. The advantage of changing the conductor trace structure on the substrate 11 is that for this layout change it is only necessary to change the stylization of the dispenser 丨 18 in the method steps of Figure 2A. Thus, in Figures 2A through 2H The method shown can also be used in so-called rapid prototyping where a small batch of electronic components 134 can be quickly produced by a predetermined conductor trace layout corresponding to a CAD design. However, the method can also be used to have A high-volume production process of a high throughput. [Fig. 1A to 1G show a first exemplary embodiment of the method of the present invention for contacting an electronic device; and Figs. 2A to 2H show a method of the present invention. Second Exemplary Embodiment. [Main Element Symbol Description] 110 Substrate Material 112 Substrate Material 114 Contact Pad/Conductor Trace 116 Dispersion 118 Disperser 120 First Drying/Curing 128941.doc 200843588 122 Electronic Device 124 Automatic Device Applicator 126 Second Drying/Curing 128 Chemical Tank 130 Electrolyte and/or Oxidant Solution 132 Electrical Contacts 134 Electronic Components 136 Metallization/Metal Layer 138 Second Metallization 140 Electrolyzer 142 Electrolyte Solution 144 External Current Source 146 Electrolytic Anode 128941. Doc -46-

Claims

200843588 十、申請專利範圍： 1· 一種用於在一基板（110)上電接觸電子裝置（122)之方法’其具有以下步驟： (a)在該基板（110)之至少一個區域中施加至少一分散體 (H6)，該分散體（116)包括導電顆粒； ()將至）一個電子裝置（丨22)施加至該分散體（1 16) 上；及200843588 X. Patent Application Range: 1. A method for electrically contacting an electronic device (122) on a substrate (110) having the following steps: (a) applying at least one region of the substrate (110) a dispersion (H6), the dispersion (116) comprising electrically conductive particles; () applying to an electronic device (丨22) to the dispersion (16);

()使忒为散體（Π 6)全部地或部分地無電及/或電解金屬化。 2·如μ求項1之方法，其中在方法步驟⑷之後，使該分散體（u6)全部地或部分地乾燥及/或固化，實施該乾燥及/ 或口化以使該分散體（116)在該乾燥及/或固化之後具有用於4電子裝置（122)之黏附或黏合性能。 3.如請求項1之方法體（11 6)全部地或部 4·如請求項1之方法組分：其中在方法步驟（b)之後，使該分散刀地乾無及/或固化。其中該至少一分散體（116)包括以下 "至少一種類型之導電顆粒； _至少一種基質材料；及 -至少一種黏合劑及/或至少一種溶劑。 5 · 如叫求項4夕古、、i 4+ 、 ’去’其中該分散體（116)進一步包括以下組分中之至少一· ^ · 有·至少一種分散劑；至少一種填充 W ,至少一種添加劑。 6 · 士口言膏工音1 γ 、之方法’其中該等導電顆粒包括以下材料中 128941.doc 200843588 之至少一者或以銀;鋼;碳。下材枓之痛：鐵；錄；鋅；錫； 7. 如請求項6之方法，1 或默基鎳粉末。電顆粒包括《鐵粉末 8. 如明求項1之方法，其中該等導電顆粒包括一導電組分及電、乡巴緣組分，特定而言—種氧化物層。 9·如：求項8之方法，其中在至少一個方法步驟中藉由一() Make the crucible (Π 6) completely or partially uncharged and/or electrolytically metallized. 2. The method of claim 1, wherein after the method step (4), the dispersion (u6) is completely or partially dried and/or cured, and the drying and/or rinsing is carried out to make the dispersion (116). ) has adhesion or adhesion properties for the 4 electronic device (122) after the drying and/or curing. 3. The method of claim 1 (11 6) in whole or in part 4. The method of claim 1 Component: wherein after the method step (b), the dispersing knife is dried and/or cured. Wherein the at least one dispersion (116) comprises the following "at least one type of electrically conductive particles; _ at least one matrix material; and/or at least one binder and/or at least one solvent. 5 · If the claim 4, the i 4+ , 'go', wherein the dispersion (116) further comprises at least one of the following components: at least one dispersant; at least one filler W, at least An additive. 6 · The method of oral vouchers 1 γ , wherein the conductive particles include at least one of 128941.doc 200843588 or silver; steel; carbon. The pain of the underlying material: iron; recorded; zinc; tin; 7. The method of claim 6, 1 or Mercury nickel powder. The electro-particles include the method of claim 1, wherein the electroconductive particles comprise a conductive component and an electrical, rural, and, in particular, an oxide layer. 9. The method of claim 8, wherein in at least one method step

=學、物理或機械方法使該導電組分全部地或部分地暴露0 月长項9之方法，其中在實施方法步驟⑻之前或之後實施該暴露。 11 ·如#求項9或1G之方法，其中在該暴露過程巾將該電絕緣組分自該導電組分去除。 12·如2求項9或1〇之方法，其中使用一酸以用於該暴露，特定而言一酸金屬化槽（128; 140)。 13·如請求項9或1〇之方法，其中在一暴露步驟中，特定而曰在一活化步驟中，進一步全部地或部分地去除該分散體之基質材料。 14·如請求項13之步驟，其中使用以下材料之至少一者作為該基質材料：環氧樹脂、改性環氧樹脂、環氧_酚醛樹月旨、酚系樹脂、聚丙烯酸酯、ABS、苯乙烯-丁二烯共聚物 I喊、聚乙浠縮酸，该專導電顆粒之全部或部分暴露係藉由使用一種氧化劑實施。 15·如請求項14之方法，其中該氧化劑包括以下氧化劑中之 128941.doc 200843588 至少一者：高錳酸鉀、錳酸鉀、高錳酸鈉、錳酸鈉、過氧化氫及/或過氧化氫之加成物、過蝴酸鹽、過碳酸鹽、 k爪s文鹽、過氧一硫酸鹽、次氯酸鈉及高氯酸鹽。 1 6·如明求項i之方法，其中該等導電顆粒具有以下顆粒幾何形狀中之至少一者：一針形幾何形狀；一圓柱形幾何形狀，一球形幾何形狀；一薄片狀幾何形狀；一管狀幾何形狀。 17·如明求項16之方法，其中該等導電顆粒包括具有不同顆粒幾何形狀之顆粒。 18.如請求項17之方法，其中該等導電顆粒包括球形顆粒，特疋而言羰基鐵或羰基鎳顆粒及薄片形狀之金屬顆粒，特定而言鋼顆粒，或碳奈米管。 19·如明求項！之方法，其中該等導電顆粒具有自〇至微米、較佳地自0.005至50微米且尤佳地自〇〇1至1〇微米之粒徑及/或平均粒徑。女明求項1之方法，其中在實施所有該等方法步驟之寺疋而a在K施一乾燥及/或固化步驟之後，該分散體（1 1 6)中之導電顆粒之比例在20重量％至98重量％之間，較佳地在30重量％至95重量％之間且尤佳地在5〇重置0/〇至85重量％之間。 21·如請求項！之方法，其中該電子裝置（122)包括至少一個 SMD裝置。 22·如請求们之方法，其中該電子裝置（叫包括以下元件中之至少一者··電阻器；電容器；感應元件，特定而言 128941.doc 200843588 線圈，感測器，特定而言溫度感測器、光感測器、光電池、塵力感測器或磁性感測器；電晶體，特定而言雙極電晶體或場效應電晶體；積體電路，特定而言基於矽或基於導電聚合物之Ic ;二極體；發光二極體，特定而言無機發光二極體或有機發光二極體；開關；按鈕；電位 5十’光轉合器；太陽能電池；珀爾貼元件；致動器，特疋而s電磁致動器；傳輸裝置，特定而言用於發射在紅外線光譜範圍内或在射頻範圍内之電磁輻射之傳輸裝置，接收裝置，特定而言用於接收在紅外線光譜範圍内或在射頻範圍内之電磁輻射之接收裝置。 23·如請求項1之方法，其中在方法步驟（b)中使用一自動裝置施加器（124)。 24·如凊求項！之方法，其中該電子裝置功包括至少一個電端子觸點（132)，該電端子觸點（132)在方法步驟⑼中被i入孩分散體（116)中及/或被施加至該分散體（ία) 25. 26. 如叫求項1之方法’其中在方法步驟⑷中藉由使用一夕部電壓源實施至少一個無電濕式化學金屬化步驟。士叫求項25之方法’其中沈積至少一種金屬（136)，該i 屬在元素之電化學電位序列中具有一較 =驟中之該分散體⑽)之該等導電顆粒更强之正副 =位特定而言較該等導電顆粒之金屬組分更强之正相 27·如請求項1之方法其中在該無電金屬化步驟中沈積一 128941.doc 200843588 個或多個金屬層（136)之後，藉由一外部電壓源（144)實施至少一個電解金屬化步驟，沈積至少另一金屬層 (138) ’該金屬層（138)在元素之電化學電位序列中具有一較該分散體（116)之該等導電顆粒更强或更弱之正標準電位，特定而言較該等導電顆粒之金屬組分更强或更弱之正標準電位。 Γ 28. 如請求項丨之方法，其中使用一至少部分地具有電絕緣性能之基板（110)。 29. 如請求項丨之方法，其中使用一包括以下材料中之至少一者之基板⑴2)··撓性或剛性聚合物；加强或未加_ 脂；玻璃；陶竟；織物材料，特定而言纖維或非織造材料；半導體材料，特定而言矽；經塗佈或未塗佈紙。 30. 如請求項29之方法，其中使用一包括以下材料中之至少 -者之基板⑴0):加强或未加强環氧樹脂或紛系樹脂^ 特定而言玻璃纖維或芳族聚醯胺纖維加强之環氧樹脂或 I系樹脂；聚醯亞胺；聚對苯二甲酸乙二賴；聚謎酮；聚合物塗佈紙；玻璃；石夕。 31·如請求項1之方法，其中使用以乃成甲之至少一者在方法步驟（a)中施加該分散體（116): ’ P刷方法，特定而言絲網印刷方法、凹版印刷方法、六礼印刷方法、移動印刷方法、喷墨印刷方法、Las 4 # niC万去、澆版印刷方法或模板印刷方法；磁圖形印刷方法· ^、主方法。 ’〜貝方法；分配 3 2 ·如請求項1之方法其中在方法步驟（a)中將一導體跡 128941.doc 200843588 線圖案施加至該基板（i 1 〇)上。 33·如請求項丨之方法，其中該基板（11〇)包括至少一個導體跡線，在方法步驟（a)中將該分散體（116)至少部分地施加至一導體跡線（114)上。 3 4·如明求項3 3之方法，其中在方法步驟（c)中實施至少一個電解金屬化步驟，該至少一個導體跡線（1 14)係藉由外部電壓源（144)電接觸。 35·如請求項34之方法，其中直接及/或在額外輔助接觸線之輔助下實施對該等導體跡線（114)之該電接觸。 36·如請求項1之方法，其中使用至少一第二方法在該基板 (11〇)上電接觸一電子裝置（122)，特定而言一銲接方法或一打線接合方法。 37·如睛求項1之方法，其中該基板（no)包括一薄片狀基板 (110) ’特定而言一印刷電路板或薄片材料，在該薄片狀基板（110)之兩側實施至少方法步驟&)及且較佳地亦實施方法步驟（b)。 3 8·如睛求項i之方法，其中該分散體係經組態以使該電子裝置（122)在步驟（b)中之該施加之後黏附至該基板 (110)上。 3 9.如请求項38之方法，其中該黏附係經組態以使該電子裝置（122)在其自身重量作用下不與該基板（11〇)分離。 40· —種電子組件（134)，其包括至少一個基板（丨1〇)及至少一個電子裝置（122)，其中在該基板（no)上藉由如請求項1之方法接觸該電子裝置（122)。 128941.doc 200843588 41·如請求項40之電子組件（134)，其中該電子組件包括以下組件中之至少一者：印刷電路板；轉發器，特定而言 RFID轉發器；天線，特定而言在轉發器中使用之天線；晶片板；扁平電纜；座位加熱器；箔導體；顯示元件，特定而言液晶螢幕、電漿螢幕；光電伏打系統；或作用裝飾應用。 42. -種實施如請求項}之方法之裝置，丨包括1少一個將分散體（116)施加至基板（11〇)上之裝置（118)，至少一個施加電子裝置（122)之裝置（124)及至少一個用於該分散體（116)之無電或電解金屬化之裝置（128; 14〇)。 43·如請求項42之裝置，其進一步包括以下元件中之至少一者·· • 一用於乾燥及/或固化該分散體（116)之裝置； -一用於暴露導電顆粒之裝置。 44. 種用於基板⑴〇)上電接觸電子裝置（m)之分散體 (116)其中°亥分散體（116)包括如請求項4中所界定之組分。 45. 種用於在基板⑴〇)上產生一導體跡線結構之方法，其中該方法使用如請求項44之分散體⑴6)，其中在基板 ⑴0)之至少-個區域中施加該分散體⑴6)且其中使該刀放體（116)王4地或部分地無電及/或電解金屬化。 128941.docThe method of learning, physically or mechanically exposing the conductive component, in whole or in part, to the term 0 of the month, wherein the exposure is carried out before or after the method step (8) is carried out. 11. A method according to #9 or 1G, wherein the electrically insulating component is removed from the electrically conductive component during the exposure process. 12. The method of claim 9 or 1 wherein a single acid is used for the exposure, in particular an acid metallization bath (128; 140). 13. The method of claim 9 or 1 wherein, in an exposure step, the matrix material of the dispersion is further removed, in whole or in part, in a particular activation step. 14. The method of claim 13, wherein at least one of the following materials is used as the matrix material: epoxy resin, modified epoxy resin, epoxy-phenolic resin, phenolic resin, polyacrylate, ABS, The styrene-butadiene copolymer I is called polyacrylic acid, and all or part of the exposure of the specific conductive particles is carried out by using an oxidizing agent. The method of claim 14, wherein the oxidizing agent comprises 128941.doc 200843588 of at least one of: potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, and/or An adduct of hydrogen peroxide, a performate, a percarbonate, a k-claw salt, a peroxymonosulfate, a sodium hypochlorite, and a perchlorate. The method of claim i, wherein the electrically conductive particles have at least one of the following particle geometries: a needle geometry; a cylindrical geometry, a spherical geometry; a flaky geometry; A tubular geometry. The method of claim 16, wherein the electrically conductive particles comprise particles having different particle geometries. 18. The method of claim 17, wherein the electrically conductive particles comprise spherical particles, in particular carbonyl iron or nickel carbonyl particles and metal particles in the form of flakes, in particular steel particles, or carbon nanotubes. 19·If you ask for help! The method wherein the electrically conductive particles have a particle size and/or an average particle diameter from 〇 to micrometers, preferably from 0.005 to 50 μm, and more preferably from 1 to 1 μm. The method of claim 1, wherein the ratio of the conductive particles in the dispersion (1 16) is 20 weights after performing all of the method steps and after a drying and/or curing step. Between % and 98% by weight, preferably between 30% and 95% by weight and particularly preferably between 0/〇 and 85% by weight at 5〇. 21·If requested! The method wherein the electronic device (122) includes at least one SMD device. 22. The method of claimant, wherein the electronic device (called at least one of the following components: a resistor; a capacitor; an inductive component, specifically 128941.doc 200843588 coil, sensor, specifically temperature sense a detector, a photosensor, a photocell, a dust sensor or a magnetic sensor; a transistor, in particular a bipolar transistor or a field effect transistor; an integrated circuit, in particular based on germanium or based on conductive polymerization Ic; diode; light-emitting diode, in particular inorganic light-emitting diode or organic light-emitting diode; switch; button; potential 5 ten light coupler; solar cell; Actuator, particularly an electromagnetic actuator; a transmission device, in particular a transmission device for emitting electromagnetic radiation in the infrared spectral range or in the radio frequency range, a receiving device, in particular for receiving in the infrared spectrum A receiving device for electromagnetic radiation in the range or in the radio frequency range. The method of claim 1, wherein an automatic device applicator (124) is used in method step (b). The method wherein the electronic device work comprises at least one electrical terminal contact (132) that is incorporated into the dispersion (116) and/or applied to the dispersion in method step (9) (ία) 25. 26. The method of claim 1, wherein in the method step (4), at least one electroless wet chemical metallization step is performed by using an evening voltage source. At least one metal (136) which has a stronger intermediate in the electrochemical potential sequence of the element than the dispersion (10), wherein the conductive particles are stronger than the conductive particles. A stronger positive phase of the metal component. 27. The method of claim 1 wherein after depositing a 128941.doc 200843588 or more metal layers (136) in the electroless metallization step, an external voltage source (144) is used. Performing at least one electrolytic metallization step of depositing at least another metal layer (138) 'the metal layer (138) having a stronger or more of the conductive particles in the electrochemical potential sequence of the element than the dispersion (116) Weak positive standard potential For these conductive particles than the metal component of the positive standard potential of stronger or weaker. Γ 28. The method of claim </ RTI> wherein a substrate (110) having at least partially electrically insulating properties is used. 29. A method as claimed in claim 1, wherein a substrate comprising at least one of the following materials (1) 2) a flexible or rigid polymer; reinforced or unsaturated; glass; ceramic; fabric material, specified Fiber or nonwoven material; semiconductor material, specifically 矽; coated or uncoated paper. 30. The method of claim 29, wherein a substrate comprising at least one of the following materials (1) 0) is used: a reinforced or unreinforced epoxy resin or a variegated resin ^ in particular a glass fiber or an aromatic polyamide fiber reinforced Epoxy resin or I-based resin; polyimine; polyethylene terephthalate; polymyster; polymer coated paper; glass; 31. The method of claim 1, wherein the dispersion (116) is applied in method step (a) using at least one of: a P brush method, in particular a screen printing method, a gravure printing method , six ritual printing method, mobile printing method, inkjet printing method, Las 4 # niC million, stencil printing method or stencil printing method; magnetic graphic printing method · ^, main method. The method of claim 1 wherein a conductor trace 128941.doc 200843588 line pattern is applied to the substrate (i 1 〇) in method step (a). 33. The method of claim 1, wherein the substrate (11A) comprises at least one conductor trace, the dispersion (116) being at least partially applied to a conductor trace (114) in method step (a) . The method of claim 3, wherein at least one electrolytic metallization step is performed in method step (c), the at least one conductor trace (14) being electrically contacted by an external voltage source (144). 35. The method of claim 34, wherein the electrical contact of the conductor traces (114) is performed directly and/or with the aid of additional auxiliary contact lines. 36. The method of claim 1, wherein the substrate (11) is electrically contacted with an electronic device (122) using at least a second method, in particular a soldering method or a wire bonding method. 37. The method of claim 1, wherein the substrate comprises a sheet-like substrate (110), in particular a printed circuit board or sheet material, and at least a method is implemented on both sides of the sheet-like substrate (110). Step &) and preferably method step (b) is also carried out. 3 8. The method of claim i, wherein the dispersion is configured to adhere the electronic device (122) to the substrate (110) after the applying in step (b). The method of claim 38, wherein the adhesion is configured such that the electronic device (122) is not separated from the substrate (11〇) by its own weight. 40. An electronic component (134) comprising at least one substrate and at least one electronic device (122), wherein the electronic device is contacted on the substrate (no) by the method of claim 1 ( 122). 128941.doc 200843588 41. The electronic component (134) of claim 40, wherein the electronic component comprises at least one of: a printed circuit board; a repeater, in particular an RFID transponder; an antenna, in particular An antenna used in a transponder; a wafer board; a flat cable; a seat heater; a foil conductor; a display element, specifically a liquid crystal screen, a plasma screen; a photovoltaic system; or a decorative application. 42. A device for carrying out the method of claim 1, comprising a device (118) for applying a dispersion (116) to a substrate (11), at least one device for applying an electronic device (122) ( 124) and at least one device (128; 14) for the electroless or electrolytic metallization of the dispersion (116). 43. The device of claim 42, further comprising at least one of the following: a device for drying and/or curing the dispersion (116); - a device for exposing the conductive particles. 44. A dispersion (116) for electrically contacting a substrate (1) for contacting a substrate (1) wherein the dispersion (116) comprises a component as defined in claim 4. 45. A method for producing a conductor trace structure on a substrate (1), wherein the method uses a dispersion (1) 6) as claimed in claim 44, wherein the dispersion (1) 6 is applied in at least one region of the substrate (1) 0) And wherein the knife body (116) is partially or partially electrically and/or electrolytically metallized. 128941.doc