CN105451529A - Electromagnetic shielding film, flexible printed wiring board and manufacturing methods thereof - Google Patents
Electromagnetic shielding film, flexible printed wiring board and manufacturing methods thereof Download PDFInfo
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- CN105451529A CN105451529A CN201510557049.1A CN201510557049A CN105451529A CN 105451529 A CN105451529 A CN 105451529A CN 201510557049 A CN201510557049 A CN 201510557049A CN 105451529 A CN105451529 A CN 105451529A
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Abstract
The invention relates an electromagnetic shielding film, a flexible printed wiring board and manufacturing methods thereof. Concretely, the invention provides an electromagnetic shielding film which has high bonding performance between a metal film layer and a conductive bonding agent layer, a flexible printed wiring board provided with the electromagnetic shielding film, and electrically connecting the metal film layer and a printed circuit, and manufacturing methods thereof. An electromagnetic shielding film (10) successively comprises an insulating protective layer (12), a metal film layer (14), a prime coat (15), and a conductive bonding agent layer (16); the flexible printed wiring board with the electromagnetic shielding film comprises a flexible printed wiring board, an insulating film and the electromagnetic shielding film (10).
Description
Technical field
The present invention relates to electromagnetic shielding film, be provided with flexible printing wiring board and the manufacture method thereof of described electromagnetic shielding film.
Background technology
In order to shield from the electromagnetic wave noise of flexible printing wiring board generation or the electromagnetic wave noise from outside, electromagnetic shielding film (for example, referring to patent documentation 1) is set on the surface of flexible printing wiring board sometimes.
Fig. 7 is the sectional view of an example of the manufacturing process that the existing flexible printing wiring board with electromagnetic shielding film is shown.
The electromagnetic shielding film 110 that flexible printing wiring board 101 with electromagnetic shielding film possesses flexible printing wiring board 130, dielectric film 140 and peels off after release film 118.
Flexible printing wiring board 130 is provided with printed circuit 134 at the one side of basilar memebrane 132.
Dielectric film 140 is located at the surface being provided with printed circuit 134 side of flexible printing wiring board 130.
Electromagnetic shielding film 110 has: the release film 118 (carrier film) of the conductive adhesive layer 116 on insulating properties protective layer 112, the metal film layer 114 of first surface covering insulating properties protective layer 112, the surface of covering metal film layer 114, the second surface of covering insulating properties protective layer 112.
The conductive adhesive layer 116 of electromagnetic shielding film 110 bonds to the surface of dielectric film 140 and hardens.In addition, conductive adhesive layer 116 is electrically connected with printed circuit 134 by the through hole 142 formed in dielectric film 140.
With electromagnetic shielding film flexible printing wiring board 101 such as shown in Figure 7, through following operation manufacture.
I (), on the surface being provided with printed circuit 134 side of flexible printing wiring board 130, is arranged on the dielectric film 140 that the position corresponding with the ground connection of printed circuit 134 defines through hole 142.
(ii) to make the conductive adhesive layer 116 of electromagnetic shielding film 110 electromagnetic shielding film 110 overlapping with the mode of the surface contact of dielectric film 140, and hot pressing is carried out to it, thus conductive adhesive layer 116 is bonded on the surface of dielectric film 140, and conductive adhesive layer 116 is electrically connected with the ground connection of printed circuit 134 by through hole 142.
(iii) after hot-pressing, peel off from insulating properties protective layer 112 and remove the release film 118 finished as the task of carrier film, obtaining the flexible printing wiring board 101 with electromagnetic shielding film.
[prior art document]
[patent documentation]
[patent documentation 1] patent No. 4201548 publication
Summary of the invention
The problem that invention will solve
But, in the part of the through hole 142 of the flexible printing wiring board 101 with electromagnetic shielding film, be easily peeling between metal film layer 114 and conductive adhesive layer 116.To be peeling between metal film layer 114 and conductive adhesive layer 116 and after forming space 14, metal film layer 114 and printed circuit 134 can not be electrically connected.Consideration is because following reason is peeling between metal film layer 114 and conductive adhesive layer 116.
In the part at the interface of metal film layer 114 and conductive adhesive layer 116, metal film layer 114 and the electroconductive particle in conductive adhesive layer 116 are only simple contacting, therefore the cementability of metal film layer 114 and conductive adhesive layer 116 is insufficient.And the diastrophic insulating properties of the shape along through hole 142 protective layer 112 will return to original even shape during because of strain, the insulating properties protective layer 112 that metal film layer 114 also follows strain returns to original even shape.Consequently, be peeling between metal film layer 114 and conductive adhesive layer 116.
The invention provides the high electromagnetic shielding film of cementability between metal film layer and conductive adhesive layer, metal film layer and printed circuit by the flexible printing wiring board with electromagnetic shielding film that is reliably electrically connected and their manufacture method.
Solve the means of problem
The present invention has following mode.
(1) electromagnetic shielding film, has successively: insulating properties protective layer, metal film layer, prime coat and conductive adhesive layer.
(2) in the electromagnetic shielding film of (1), described prime coat is by the layer formed containing carboxylic elastomeric priming paint.
(3) in the electromagnetic shielding film of (1) or (2), the thickness of described prime coat is more than 0.05 μm less than 1 μm.
(4) in (1) electromagnetic shielding film to any one in (3), described conductive adhesive layer is anisotropic conductive adhesive layer.
(5) in (1) electromagnetic shielding film to any one in (4), also there is first release film on the surface being located at described insulating properties protective layer.
(6) in the electromagnetic shielding film of (5), also there is second release film on the surface being located at described conductive adhesive layer.
(7) manufacture method for electromagnetic shielding film, the electromagnetic shielding film of its manufacture aforementioned (6), has following operation (a) to (e):
A () forms insulating properties protective layer at the one side of the first release film;
B () forms metal film layer on the surface of described insulating properties protective layer;
C () is had the first cascade body of the first release film, insulating properties protective layer, metal film layer and prime coat successively by forming prime coat on the surface of described metal film layer;
D () is had the second duplexer of the second release film and conductive adhesive layer successively by forming conductive adhesive layer at the one side of the second release film;
E () described first cascade body of fitting makes described prime coat contact with described conductive adhesive layer with described second duplexer.
(8) with a flexible printing wiring board for electromagnetic shielding film, have: the flexible printing wiring board being provided with printed circuit at least one side of basilar memebrane; Be located at the dielectric film being provided with the surface of described printed circuit side of described flexible printing wiring board; And described conductive adhesive layer is bonded in (1) on the surface of described dielectric film to the electromagnetic shielding film described in any one in (4); Wherein, described conductive adhesive layer is electrically connected with described printed circuit by the through hole formed in described dielectric film.
(9) with a manufacture method for the flexible printing wiring board of electromagnetic shielding film, there is following operation (f) to (h):
F () is that at least one side of basilar memebrane has the surface being provided with described printed circuit side of the flexible printing wiring board of printed circuit, be arranged on the dielectric film that the position corresponding with described printed circuit is formed with through hole, obtain the flexible printing wiring board with dielectric film;
G () is after operation (f), with make described conductive adhesive layer overlapping with the mode of the surface contact of described dielectric film described in the flexible printing wiring board of dielectric film and (1) to the electromagnetic shielding film of any one in (5), and hot pressing is carried out to it, thus described conductive adhesive layer is bonded in the surface of described dielectric film, and described conductive adhesive layer is electrically connected with described printed circuit by described through hole; And
H (), when described electromagnetic shielding film has the first release film, after operation (g), peels off described first release film.
The effect of invention
In electromagnetic shielding film of the present invention, the cementability between metal film layer and conductive adhesive layer is high.
According to the manufacture method of electromagnetic shielding film of the present invention, the electromagnetic shielding film that cementability between metal film layer and conductive adhesive layer is high can be manufactured.
Of the present invention with in the flexible printing wiring board of electromagnetic shielding film, metal film layer and printed circuit are reliably electrically connected.
According to the manufacture method of the flexible printing wiring board with electromagnetic shielding film of the present invention, the flexible printing wiring board with electromagnetic shielding film that metal film layer and printed circuit are reliably electrically connected can be manufactured.
Accompanying drawing explanation
Fig. 1 is the sectional view of the example that electromagnetic shielding film of the present invention is shown.
Fig. 2 is the sectional view of an example of operation (a) ~ (c) illustrated in the manufacture method of electromagnetic shielding film of the present invention.
Fig. 3 is the sectional view of an example of the operation (d) illustrated in the manufacture method of electromagnetic shielding film of the present invention.
Fig. 4 is the sectional view of an example of the operation (e) illustrated in the manufacture method of electromagnetic shielding film of the present invention.
Fig. 5 is the sectional view of the example that the flexible printing wiring board with electromagnetic shielding film of the present invention is shown.
Fig. 6 is the sectional view of an example of operation (f) ~ (h) illustrated in the manufacture method of the flexible printing wiring board with electromagnetic shielding film of the present invention.
Fig. 7 is the sectional view of an example of the manufacturing process that the existing flexible printing wiring board with electromagnetic shielding film is shown.
Embodiment
The definition of following term is applicable to this specification and claims book.
The average grain diameter of electroconductive particle is the value obtained as follows: from electron microscope image Stochastic choice 30 electroconductive particles of electroconductive particle, minimum diameter and maximum gauge are measured to each electroconductive particle, using the particle diameter of the median of minimum diameter and maximum gauge as a particle, arithmetic average is carried out to the particle diameter of 30 electroconductive particles measured.
The specific area of electroconductive particle is that the particle etc. after degassed is impregnated into liquid nitrogen and measures the nitrogen quantity of absorption, from the value that this value calculates.
The thickness of film (release film, dielectric film etc.), film (insulating properties protective layer, conductive adhesive layer etc.), metal film layer etc. be use transmission electron microscope Observe and measure object cross section, measure 5 positions thickness and the value be averaged.
Storage elasticity rate uses and calculates and the Measurement of Dynamic Viscoelasticity device exported as temperature or the function of time according to the stress giving determination object and the strain detected, is determined as one of viscoelastic property.
Sheet resistance is interelectrode resistance, measure as follows: be used in that gold evaporation on quartz glass is formed, 2 thin-film metal electrodes (length 10mm, width 5mm, interelectrode distance 10mm), place determinand on this electrode, with the region of the 10mm × 20mm of the loading of 0.049N pressing determinand above determinand, and measure under the mensuration electric current of below 1mA.
< electromagnetic shielding film >
Fig. 1 is the sectional view of the example that electromagnetic shielding film of the present invention is shown.
Electromagnetic shielding film 10 has: second release film 20 on the surface of the prime coat 15 on insulating properties protective layer 12, the metal film layer 14 of first surface covering insulating properties protective layer 12, the surface of covering metal film layer 14, the conductive adhesive layer 16 covering the surface of prime coat 15, the first release film 18 covering the second surface of insulating properties protective layer 12 and covering conductive adhesive layer 16.
(insulating properties protective layer)
Insulating properties protective layer 12 is the substrates (basis) when forming metal film layer 14, behind the surface of dielectric film electromagnetic shielding film 10 being attached to the surface being located at flexible printing wiring board, and protection metal film layer 14.
The sheet resistance of insulating properties protective layer 12 from the viewpoint of electrical insulating property, preferably 1 × 10
6more than Ω.The sheet resistance of insulating properties protective layer 12 from reality uses, preferably 1 × 10
19below Ω.
As insulating properties protective layer 12, can exemplify coating comprise thermosetting resin and curing agent coating and sclerosis and formed film, coating comprise thermoplastic resin coating and formed film, by the layer etc. making the film of thermoplastic resin melt-shaping form.From thermal endurance angle when carrying out welding etc., preferred coated comprises the coating of thermosetting resin and curing agent and sclerosis and the film that formed.
As thermosetting resin, amide resin, epoxy resin, phenolic resins, amino resins, alkyd resins, polyurethane resin, synthetic rubber, UV curing acrylate resin etc. can be exemplified, from the angle of excellent heat resistance, preferred amide resin, epoxy resin.
Insulating properties protective layer 12 is preferably 5 × 10 the storage elasticity rate of 160 DEG C
6more than Pa 1 × 10
8below Pa, is more preferably 8 × 10
6more than Pa 2 × 10
7below Pa.Usually, the hardening thing of thermosetting resin is comparatively hard, therefore the film formed thus lacks flexibility, especially when making thinner, being highly brittle, not having the intensity of the degree that can exist as independent film.At the temperature of insulating properties protective layer 12 preferably when stripping the first release film 18 (making the temperature that conductive adhesive hardens, the temperature of usual more than 150 DEG C less than 200 DEG C), there is sufficient intensity.If insulating properties protective layer 12 is 5 × 10 the storage elasticity rate of 160 DEG C
6more than Pa, then insulating properties protective layer 12 can not soften.If insulating properties protective layer 12 the storage elasticity rate of 160 DEG C 1 × 10
8below Pa, then flexibility, intensity are abundant.Consequently, when stripping the first release film 18, insulating properties protective layer 12 makes electromagnetic shielding film 10 phase more not easily break than ever.
Insulating properties protective layer 12, in order to give design sense to the flexible printing wiring board with electromagnetic shielding film, also can carry out painted.
Insulating properties protective layer 12 can be made up of the layer of more than two kinds that characteristic, the materials etc. such as storage elasticity rate are different.
The thickness of insulating properties protective layer 12 is preferably more than 1 μm less than 10 μm, more preferably more than 1 μm less than 5 μm.If the thickness of insulating properties protective layer 12 is more than 1 μm, then thermal endurance is good.If the thickness of insulating properties protective layer 12 is less than 10 μm, then electromagnetic shielding film 10 can be made thinning.
(metal film layer)
Metal film layer 14 is the layers be made up of the film of metal.Metal film layer 14 is formed with extending along direction, face, therefore has conductivity on direction, face, works as electromagnetic wave shielding etc.
As metal film layer 14, the metallic film, metal forming etc. that are formed with physical vapor deposition (vacuum evaporation, sputtering, ion beam evaporation, electron beam evaporation plating etc.), CVD, plating etc. can be exemplified, from making thinner and namely making thinner conductivity in direction, face also excellent, the angle that simply can be formed with dry process, preferably adopt the metallic film (vapor-deposited film) of physical vapor deposition.
As the metallic film material forming metal film layer 14, aluminium, silver, copper, gold, conductive ceramic etc. can be exemplified.From the angle of conductivity, preferably copper, the angle of stability chemically, preferred conductive ceramic.
The thickness of metal film layer 14 is preferably more than 0.01 μm less than 1 μm, more preferably more than 0.05 μm less than 1 μm.If the thickness of metal film layer 14 more than 0.01 μm, then the conductivity in direction, face is better.If the thickness of metal film layer 14 is more than 0.05 μm, then the shield effectiveness of electromagnetic wave noise is better.If the thickness of metal film layer 14 is below 1 μm, then electromagnetic shielding film 10 can be made thinning.In addition, the productivity ratio of electromagnetic shielding film 10, pliability improve.
The sheet resistance of metal film layer 14 is preferably 0.001 more than Ω 1 below Ω, is more preferably 0.001 more than Ω 0.1 below Ω.The sheet resistance of metal film layer 14 is 0.001 more than Ω, then metal film layer 14 can be made thinning fully.The sheet resistance of metal film layer 14 is 1 below Ω, then can work fully as electromagnetic wave shielding.
(prime coat)
Prime coat 15 is by the layer formed with metal film layer 14 and any one material all with cementability of conductive adhesive layer 16.
As prime coat 15, can exemplify by containing the layer formed containing the elastomeric priming paint of carboxyl.Carboxylic elastomeric carboxyl at least partially with the material of metal film layer 14 and/or material electronics, the chemistry of conductive adhesive layer 16 or be mechanically combined.
The cementability of metal film layer 14 is not enough, therefore in order to improve with the contact of the electroconductive particle 22 of conductive adhesive 16 and obtain stable conductivity, priming paint preferably comprises the carboxylic synthetic rubber good with the cementability of metal film layer 14.
As carboxylic synthetic rubber, the end of the acrylonitrile-butadiene copolymer rubber of acrylonitrile and butadiene copolymerization can be exemplified by carboxylated rubber.
Specifically, comprise Hycar (Ha イ カ ー) CTBN, HycarCTBNX, Hycar1072 that Goodrich company (グ ッ De リ ッ チ society) manufactures, the NIPOL (ニ ポ ー Le that Nippon Zeon (ゼ オ Application society) manufactures) 1072J, NIPOL1072, NIPOLDN612, NIPOLDN631, NIPOLDN601 etc.
In addition, as carboxylic synthetic rubber, the acrylic rubber as (methyl) acrylate such as carboxylic unsaturated monomer and ethyl acrylate, butyl acrylate, the methoxy acrylate containing (methyl) acrylic acid, (methyl) acrylic acid 4-carboxyl butyl ester ((メ タ) ア Network リ Le acid 4-カ Le ボ キ シ Block チ Le), maleic acid etc. or the copolymer containing (methyl) acrylate of glycidyl, hydroxyl, amino can be exemplified.Specifically, ACTFLOW (ア Network ト Off ロ ー) CB-3060, ACTFLOWCB-3098, ACTFLOWCBB-3098 etc. that Vamac-G, Vamac-GLS, Vamac-HVG, Zong Yan chemical company (Gross grinds chemical society) that E.I.Du Pont Company (デ ュ ポン society) manufactures manufactures.
Carboxylic synthetic rubber can be used alone a kind, also can mix two or more and use.The containing ratio of carboxyl is preferably below more than 2 quality % 8 quality % in carboxylic synthetic rubber (100 quality %).
From the angle improving cementability, preferred priming paint also comprises adhesion promoters.As adhesion promoters, silane coupler, titanate coupling agent, nonionic class surfactant, polar resin oligomer etc. can be exemplified.
From easily forming the angle of prime coat 15 and the angle all excellent with the cementability of any one of metal film layer 14 and conductive adhesive layer 16, preferred priming paint also comprises silane coupler.
As silane coupler, can exemplified by vinyl trimethoxy silane, vinyltriethoxysilane, 3-epoxypropoxy triethoxysilane, 3-methacryloxypropyl trimethoxy silane, 3-methacryloyloxypropyl methyl diethoxy silane, 3-acryloxypropyl trimethoxy silane, 3-TSL 8330, APTES, 3-triethoxy-silicane-N-(1, 3-dimethyl-butylidene) propylamine, three-(trimethoxy-silylpropyl) isocyanuric acid esters, 3-uride (ウ レ イ De) propyl trialkoxy silane, 3-mercaptopropyi methyl dimethoxysilane, 3-mercaptopropyi trimethoxy silane, two (triethoxysilylpropyltetrasulfide) tetrasulfide, 3-isocyanates propyl-triethoxysilicane etc.
Priming paint can comprise the curing agent etc. that priming paint is hardened as required.Preferably until conductive adhesive layer 16 is by hot pressing, priming paint does not carry out hardening but having sufficient flow properties, makes the electrical connection of the electroconductive particle 22 that can not hinder in metal film layer 14 and conductive adhesive layer 16.Therefore, the speed sclerosis of priming paint needs the setting rate being equal to or less than conductive adhesive layer 16.Therefore, preferred latency curing agent is as curing agent.
The thickness of prime coat 15 is preferably more than 0.05 μm less than 1 μm, is more preferably more than 0.05 μm less than 0.5 μm, more preferably more than 0.1 μm less than 0.3 μm.If the thickness of prime coat 15 is more than 0.05 μm, then good with the cementability of metal film layer 14 and conductive adhesive layer 16.If the thickness of prime coat 15 is below 1 μm, then the conductivity between metal film layer 14 and conductive adhesive layer 16 declines.
(conductive adhesive layer)
Conductive adhesive layer 16 at least has conductivity at thickness direction and has cementability.
As conductive adhesive layer 16, can exemplify and there is conductivity at thickness direction, not there is in direction, face the anisotropic conductive adhesive layer of conductivity, there is at thickness direction and direction, face the isotropic conductivity bond layer of conductivity.As conductive adhesive layer 16, conductive adhesive layer 16 can be made thinning, and the quantitative change of electroconductive particle 22 is few, consequently, from making the angle that electromagnetic shielding film 10 is thinning, the pliability of electromagnetic shielding film 10 improves, preferred anisotropic conductive adhesive layer.As conductive adhesive layer 16, from the angle that can work fully as electromagnetic wave shielding, preferred isotropic conductivity bond layer.
As conductive adhesive layer 16, the angle of thermal endurance can be played after sclerosis, preferred thermosetting conductive adhesive layer.
Thermosetting conductive adhesive layer 16 such as can comprise thermosetting bonding agent and electroconductive particle 22.Conductive adhesive layer 16 can be unhardened state, also can be the state of B-stage (B ス テ ー ジization).
As thermosetting bonding agent, epoxy resin, phenolic resins, amino resins, alkyd resins, polyurethane resin, synthetic rubber, UV curing acrylate resin etc. can be exemplified.From the angle of excellent heat resistance, preferred epoxy.Epoxy resin can comprise for giving flexual rubber constituent (carboxy-modified acrylonitrile-butadiene rubber, acrylic rubber etc.), adhesion imparting agent etc.
In order to improve intensity, the raising Blanking Properties of conductive adhesive layer 16, thermosetting bonding agent can comprise celluosic resin, microfibre (glass fibre etc.).
As electroconductive particle 22, graphite powder can be exemplified, burn till carbon particle, metal (silver, platinum, gold, copper, nickel, palladium, aluminium, scolding tin etc.) particle, plating burn till carbon particle etc.From the angle of the mobility of conductive adhesive layer 16, preferably hardly spherical burn till carbon particle.
When conductive adhesive layer 16 is anisotropic conductive adhesive layers, the average grain diameter of electroconductive particle 22 is preferably more than 2 μm less than 26 μm, is more preferably more than 4 μm less than 16 μm.If the average grain diameter of electroconductive particle 22 is more than 2 μm, then by making the Thickness Ratio 2 μm of conductive adhesive thick, the thickness of conductive adhesive 16 can be guaranteed, can sufficient adhesive strength be obtained.If the average grain diameter of electroconductive particle 22 is less than 26 μm, then can guarantee the mobility (dielectric film is to the tracing ability of the shape of through hole) of conductive adhesive layer 16, can with in the through hole of the abundant filling insulation film of conductive adhesive.
When conductive adhesive layer 16 is isotropic conductivity bond layers, the average grain diameter of electroconductive particle 22 is preferably more than 0.1 μm less than 10 μm, is more preferably more than 0.2 μm less than 1 μm.If the average grain diameter of electroconductive particle 22 is more than 0.1 μm, then the contact number of electroconductive particle 22 increases, and stably can improve the conduction in 3 dimension directions.If the average grain diameter of electroconductive particle 22 is below 10 μm, then can guarantee the mobility (dielectric film is to the tracing ability of the shape of through hole) of conductive adhesive layer 16, can with in the through hole of conductive adhesive filling insulation film fully.
The specific area of electroconductive particle 22 is preferably 2m
2/ more than g 50m
2/ below g, is more preferably 2m
2/ more than g 20m
2/ below g.If the specific area of electroconductive particle 22 is at 2m
2/ more than g, then easily obtain electroconductive particle 22.If the specific area of electroconductive particle 22 is at 50m
2/ below g, then the oil absorption of electroconductive particle 22 can not become excessive, and consequently, the viscosity of conductive adhesive can not become too high, and screening characteristics improves further.In addition, the mobility (dielectric film is to the tracing ability of the shape of through hole) of conductive adhesive layer 16 can be guaranteed further.
When conductive adhesive layer 16 is anisotropic conductive adhesive layers, the ratio of electroconductive particle 22 is preferably in 100 volume % of conductive adhesive layer 16,1 more than volume % 30 volume below %, is more preferably 2 more than volume % 10 volume below %.If the ratio of electroconductive particle 22 is 1 more than volume %, then the conductivity of conductive adhesive layer 16 improves.If the ratio of electroconductive particle 22 is at 30 below volume %, then the cementability of conductive adhesive layer 16, mobility (dielectric film is to the tracing ability of the shape of through hole) improve.In addition, the pliability of electromagnetic shielding film 10 improves.
When conductive adhesive layer 16 is isotropic conductivity bond layers, the ratio of electroconductive particle 22 is preferably in 100 volume % of conductive adhesive layer 16,50 more than volume % 80 volume below %, is more preferably 60 more than volume % 70 volume below %.If the ratio of electroconductive particle 22 is 50 more than volume %, then the conductivity of conductive adhesive layer 16 improves.If the ratio of electroconductive particle 22 is 80 below volume %, then the cementability of conductive adhesive layer 16, mobility (dielectric film is to the tracing ability of the shape of through hole) improve.In addition, the pliability of electromagnetic shielding film 10 improves.
When conductive adhesive layer 16 is anisotropic conductive adhesive layers, the thickness of conductive adhesive layer 16 is preferably more than 3 μm less than 25 μm, is more preferably more than 5 μm less than 15 μm.If the thickness of conductive adhesive layer 16 is more than 3 μm, then can guarantee the mobility (dielectric film is to the tracing ability of the shape of through hole) of conductive adhesive layer 16, can with in the through hole of conductive adhesive filling insulation film fully.If the thickness of conductive adhesive layer 16 is less than 25 μm, then electromagnetic shielding film 10 can be made thinning.In addition, the pliability of electromagnetic shielding film 10 improves.
When conductive adhesive layer 16 is isotropic conductivity bond layers, the thickness of conductive adhesive layer 16 is preferably more than 5 μm less than 20 μm, is more preferably more than 7 μm less than 17 μm.If the thickness of conductive adhesive layer 16 is more than 5 μm, then the conductivity of conductive adhesive layer 16 improves, and can work fully as electromagnetic wave shielding.In addition, the mobility (dielectric film is to the tracing ability of the shape of through hole) of conductive adhesive layer 16 can be guaranteed, with in the through hole of conductive adhesive filling insulation film fully, can guarantee folding resistance, even if alternating bending, conductive adhesive layer 16 also can not rupture.If the thickness of conductive adhesive layer 16 is less than 20 μm, electromagnetic shielding film 10 can be made thinning.In addition, the pliability of electromagnetic shielding film 10 improves.
When conductive adhesive layer 16 is anisotropic conductive adhesive layer, the sheet resistance of conductive adhesive layer 16 is preferably 1 × 10
4more than Ω 1 × 10
16below Ω, is more preferably 1 × 10
6more than Ω 1 × 10
14below Ω.If the sheet resistance of conductive adhesive layer 16 is 1 × 10
4more than Ω, then can suppress the amount of electroconductive particle 22 for lower.If the sheet resistance of conductive adhesive layer 16 is 1 × 10
16below Ω, then, in actual use, anisotropy aspect is no problem.
When conductive adhesive layer 16 is isotropic conductivity bond layers, the sheet resistance of conductive adhesive layer 16 is preferably 0.05 more than Ω 2.0 below Ω, is more preferably 0.1 more than Ω 1.0 below Ω.If the sheet resistance of conductive adhesive layer 16 is 0.05 more than Ω, then the amount of electroconductive particle 22 suppresses for lower, and the viscosity of conductive adhesive can not become too high, and screening characteristics improves further.In addition, the mobility (dielectric film is to the tracing ability of the shape of through hole) of conductive adhesive layer 16 can be guaranteed further.If the sheet resistance of conductive adhesive layer 16 is 2.0 below Ω, then the whole mask of conductive adhesive layer 16 has uniform conductivity.
(the first release film)
First release film 18 is carrier film when forming insulating properties protective layer 12, metal film layer 14, and the operability of electromagnetic shielding film 10 is improved.First release film 18, after electromagnetic shielding film 10 being attached to flexible printing wiring board etc., is peeled off from insulating properties protective layer 12.
As the resin material of the first release film 18, PETG, PEN, polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly-acetic acid esters, Merlon, polyphenylene sulfide, polyamide, vinyl-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer etc. can be exemplified, from the thermal endurance (dimensional stability) when manufacturing electromagnetic shielding film 10 and the angle of cost, preferred PETG.
First release film 18 is preferably 0.8 × 10 the storage elasticity rate of 160 DEG C
8more than Pa 4 × 10
8below Pa, is more preferably 0.8 × 10
8more than Pa 3 × 10
8below Pa.If the first release film 18 is 0.8 × 10 the storage elasticity rate of 160 DEG C
8more than Pa, then the operability of electromagnetic shielding film 10 improves.If the first release film 18 is 4 × 10 the storage elasticity rate of 160 DEG C
8below Pa, then the flexibility of the first release film 18 improves.
The thickness of the first release film 18 is preferably more than 5 μm less than 500 μm, is more preferably more than 10 μm less than 150 μm, more preferably more than 25 μm less than 100 μm.If the thickness of the first release film 18 is more than 5 μm, then the operability of electromagnetic shielding film 10 improves.In addition, first release film 18 is as gasket material action fully, when the conductive adhesive layer 16 of electromagnetic shielding film 10 is pasted by hot pressing in the surface of dielectric film on the surface being located at flexible printing wiring board, conductive adhesive layer 16 easily follows the concaveconvex shape on the surface of dielectric film.If the thickness of the first release film 18 is less than 500 μm, then easily conduct heat to conductivity bond layer 16 when the conductive adhesive layer 16 of the surface heat pressure electromagnetic shielding film 10 of dielectric film.
(parting agent layer)
Implement on the surface of insulating properties protective layer 12 side of release film main body 18a to adopt mould release (From type drug) release process, form parting agent layer 18b.By the first release film 18, there is parting agent layer 18b; when peeling off the first release film 18 from insulating properties protective layer 12 in operation (h) described later; first release film 18 is easily peeled off, and insulating properties protective layer 12 and the conductive adhesive layer 16 after hardening are not easy to break.
Known mould release can be used as mould release.
The thickness of parting agent layer 18b is preferably more than 0.05 μm less than 2.0 μm, is more preferably more than 0.1 μm less than 1.5 μm.If the thickness of parting agent layer 18b is in described scope, then in operation (h) described later, the first release film 18 becomes and is more prone to peel off.
(the second release film)
Second release film 20 protects conductive adhesive layer 16, and the operability of electromagnetic shielding film 10 is improved.Second release film 20, before electromagnetic shielding film 10 being pasted flexible printing wiring board etc., is peeled off from conductive adhesive layer 16.
As the resin material of the second release film 20, the resin material same with the resin material of the first release film 18 can be exemplified.
The thickness of the second release film 20 is preferably more than 5 μm less than 500 μm, is more preferably more than 10 μm less than 150 μm, more preferably more than 25 μm less than 100 μm.
(parting agent layer)
Implement on the surface of conductive adhesive layer 16 side of release film main body 20a the release process adopting mould release, form parting agent layer 20b.Have parting agent layer 20b by the second release film 20, in operation (h) described later, when peeling off the second release film 20 from conductive adhesive layer 16, the second release film 20 is easily peeled off, and conductive adhesive layer 16 is not easy to break.
Known mould release can be used as mould release.
The thickness of parting agent layer 20b is preferably more than 0.05 μm less than 2.0 μm, is more preferably more than 0.1 μm less than 1.5 μm.If the thickness of parting agent layer 20b is in described scope, then in operation (h) described later, the second release film 20 becomes and is more prone to peel off.
(thickness of electromagnetic shielding film)
The thickness (except release film) of electromagnetic shielding film 10 is preferably more than 10 μm less than 45 μm, is more preferably more than 10 μm less than 30 μm.If the thickness of electromagnetic shielding film 10 (except release film) is more than 10 μm, be then not easy to break when stripping the first release film 18.If the thickness of electromagnetic shielding film 10 (except release film) is below 45 μm, then the flexible printing wiring board with electromagnetic shielding film can be made thinning.
(manufacture method of electromagnetic shielding film)
Electromagnetic shielding film of the present invention manufactures by the method such as with following operation (a) ~ (e).
A () forms insulating properties protective layer at the one side of the first release film.
B () forms metal film layer on the surface of insulating properties protective layer.
C (), by forming prime coat on the surface of metal film layer, is had the first cascade body of the first release film, insulating properties protective layer, metal film layer and prime coat successively.
D () forms conductive adhesive layer by the one side at the second release film, had the second duplexer of the second release film, conductive adhesive layer successively.
E () laminating first cascade body makes prime coat contact with conductive adhesive layer with the second duplexer.
Below, the method for the electromagnetic shielding film 10 shown in shop drawings 1 is described with reference to Fig. 2 ~ Fig. 4.
(operation (a))
As shown in Figure 2, insulating properties protective layer 12 is formed on the surface of the parting agent layer 18b of the first release film 18.
As the formation method of insulating properties protective layer 12, can exemplify coating and comprise the coating of thermosetting resin and curing agent and the method for sclerosis, coating comprises the method for the coating of thermoplastic resin, attaches the method etc. making the film of thermoplastic resin melt-shaping.From the angle of thermal endurance during welding etc., preferred coated comprises the coating of thermosetting resin and curing agent and the method for sclerosis.
The coating comprising thermosetting resin and curing agent can comprise solvent, other compositions as required.
When the coating by coating forms insulating properties protective layer 12, insulating properties protective layer 12 can be made thinner.In addition, the hardening thing of thermosetting resin is comparatively hard, and when making insulating properties protective layer 12 thinner, intensity becomes insufficient.As mentioned above, by making insulating properties protective layer 12 the storage elasticity rate of 160 DEG C 5 × 10
6more than Pa 1 × 10
8the scope of below Pa, flexibility, balance between intensity and thermal endurance improve.
The control of the storage elasticity rate of insulating properties protective layer 12; from the angle of the obdurability obtained by crosslink density and cross-linked structure, preferably by selecting the kind of thermosetting resin, curing agent etc. and composition and the storage elasticity rate adjusting the hardening thing of thermosetting resin is carried out.
In addition, the curing condition such as temperature, time when storage elasticity rate makes thermosetting resin harden by adjustment or assign to adjust as not having thermosetting one-tenth by adding the thermoplastic resin such as thermoplastic elastomer (TPE).
(operation (b))
As shown in Figure 2, metal film layer 14 is formed on the surface of insulating properties protective layer 12.
As the formation method of metal film layer 14, the method being formed metallic film by physical vapor deposition, CVD, plating etc. can be exemplified, paste the method etc. of metal forming.From the angle of metal film layer 14 of excellent electric conductivity that can be formed in direction, face, the method of metallic film is formed preferably by physical vapor deposition, CVD, plating etc., from the lower thickness of metal film layer 14 can be made and can form the also excellent metal film layer 14 of the conductivity that namely makes thinner in direction, face, can form the angle of metal film layer 14 with dry process easily, more preferably adopt the method for physical vapor deposition.
(operation (c))
As shown in Figure 2, form prime coat 15 on the surface of metal film layer 14, obtain first cascade body 10a.
As the formation method of prime coat 15, coating can be exemplified and comprise carboxylic elastomeric priming paint and the method making its drying as required.
Priming paint can comprise solvent, other compositions (adhesion promoters, curing agent, hardening accelerator, identification colouring agent etc.) as required.
The viscosity of priming paint is preferably more than 1mPas below 100mPas, is more preferably more than 5mPas below 50mPas.If the viscosity of priming paint is more than 1mPas, then easily form prime coat 15.If the viscosity of priming paint is at below 100mPas, then priming paint soaks into and absorbs metal film layer 14, and consequently, cementability and the conductivity of metal film layer 14 and conductive adhesive layer 16 improve.
(operation (d))
As shown in Figure 3, form conductive adhesive layer 16 on the surface of the parting agent layer 20b of the second release film 20, obtain the second duplexer 10b.
As the formation method of conductive adhesive layer 16, the method for coating electrically conductive adhesive composite can be exemplified.
As conductive adhesive composition, use and comprise above-mentioned thermosetting bonding agent and the composition of electroconductive particle 22.
(operation (e))
As shown in Figure 4, laminating first cascade body 10a and the second duplexer 10b, makes prime coat 15 contact with conductive adhesive layer 16.
The laminating of first cascade body 10a and the second duplexer 10b is undertaken by such as adopting the hot pressing of forcing press (diagram is omitted) etc.By hot pressing, the carboxylic elastomeric carboxyl contained by prime coat 15 at least partially with the material of metal film layer 14 and/or material electronics, the chemistry of conductive adhesive layer 16 or be mechanically combined.
(action effect)
In electromagnetic shielding film 10 described above, between metal film layer 14 and conductive adhesive layer 16, there is prime coat 15, therefore cementability between metal film layer 14 and conductive adhesive layer 16 is high.
(other execution modes)
As long as electromagnetic shielding film of the present invention has insulating properties protective layer, metal film layer, prime coat and conductive adhesive layer successively, be not limited to the execution mode of Fig. 1.
Such as, in the adherence (タ ッ Network) hour on the surface of conductive adhesive layer 16, the second release film 20 can be omitted.
When insulating properties protective layer 12 has sufficient flexibility and intensity, the first release film 18 can be omitted.
Release film, when only release film main body just has sufficient release (release property), also can not have parting agent layer.
< is with the flexible printing wiring board > of electromagnetic shielding film
Fig. 5 is the sectional view of the example that the flexible printing wiring board with electromagnetic shielding film of the present invention is shown.
Flexible printing wiring board 1 with electromagnetic shielding film has flexible printing wiring board 30, dielectric film 40 and has peeled off the electromagnetic shielding film 10 of release film.
Flexible printing wiring board 30 arranges printed circuit 34 at least one side of basilar memebrane 32.
Dielectric film 40 is located at the surface being provided with printed circuit 34 side of flexible printing wiring board 30.
The conductive adhesive layer 16 of electromagnetic shielding film 10 is bonding with the surface of dielectric film 40 and harden.In addition, conductive adhesive layer 16 is electrically connected with printed circuit 34 by the through hole (diagram is omitted) formed at dielectric film 40.
Apart near the printed circuit 34 (signal circuit, earthed circuit, ground plane etc.) outside the part of through hole, metal film layer 14 subtend configuration across dielectric film 40 and conductive adhesive layer 16 of electromagnetic shielding film 10.
Summation apart from the thickness of the printed circuit 34 outside the part of through hole and the spacing distance of metal film layer 14 and the thickness of dielectric film 40 and conductive adhesive layer 16 is roughly equal.Spacing distance is preferably more than 30 μm less than 200 μm, is more preferably more than 60 μm less than 200 μm.Spacing distance is less than 30 μm, then the impedance step-down of signal circuit, in order to have the characteristic impedance of 100 Ω etc., must reduce the live width of signal circuit, the deviation of live width becomes the deviation of characteristic impedance, and the reflection resonance noise that the mismatch because of impedance causes easily enters in the signal of telecommunication.When spacing distance is larger than 200 μm, the flexible printing wiring board 1 with electromagnetic shielding film is thickening, and pliability is not enough.
When spacing distance is more than 30 μm, the impedance of signal circuit uprises, characteristic impedance zero deflection, and the reflection resonance noise that the mismatch because of impedance causes is difficult to enter the signal of telecommunication.When spacing distance is below 200 μm, the flexible printing wiring board 1 with electromagnetic shielding film can not be thickening, and pliability is excellent.
(flexible printing wiring board)
Flexible printing wiring board 30 utilizes known etching method the Copper Foil of copper clad laminate is processed as the pattern of expectation and forms printed circuit 34 (power circuit, earthed circuit, ground plane etc.).
As copper clad laminate, one or two sides at basilar memebrane 32 can be exemplified across the plate of bond layer (diagram omit) copper foil; To cast on the surface of Copper Foil (キ ャ ス ト) plate etc. for the formation of the resin solution etc. of basilar memebrane 32.
As the material of bond layer, epoxy resin, polyester, polyimides, polyamide-imides, polyamide, phenolic resins, polyurethane, acrylic resin, melmac etc. can be exemplified.
The thickness of bond layer is preferably more than 0.5 μm less than 30 μm.
(basilar memebrane)
As basilar memebrane 32, preferably there is the film of thermal endurance, more preferably polyimide film, liquid crystalline polymer film, further preferred polyimide film.
From the angle of electrical insulating property, the sheet resistance of basilar memebrane 32 is preferably 1 × 10
6more than Ω.Angle from reality use, the sheet resistance of basilar memebrane 32 is preferably 1 × 10
19below Ω.
The thickness of basilar memebrane 32 is preferably more than 5 μm less than 200 μm, from the angle of bendability, is more preferably more than 6 μm less than 25 μm, more preferably more than 10 μm less than 25 μm.
(printed circuit)
As the Copper Foil forming printed circuit 34 (signal circuit, earthed circuit, ground plane etc.), rolled copper foil, electrolytic copper foil etc. can be exemplified, from the angle of bendability, preferred rolled copper foil.
The thickness of Copper Foil is preferably more than 1 μm less than 50 μm, more preferably more than 18 μm less than 35 μm.
The end (terminal) of the length direction of printed circuit 34 is not covered by dielectric film 40 and electromagnetic shielding film 10 because of scolding tin connection, connector connection, component mounting etc.
(dielectric film)
Dielectric film 40 forms bond layer (diagram is omitted) at the one side of matrix material film (diagram is omitted) by the coating of bonding agent, the stickup of bonding agent sheet etc.
From the angle of electrical insulating property, the sheet resistance of matrix material film is preferably 1 × 10
6more than Ω.Angle from reality use, the sheet resistance of matrix material film is preferably 1 × 10
19below Ω.
As matrix material film, preferably there is the film of thermal endurance, more preferably polyimide film, liquid crystalline polymer film, further preferred polyimide film.
The thickness of matrix material film is preferably more than 1 μm less than 100 μm, from flexual angle, and more preferably more than 3 μm less than 25 μm.
As the material of bond layer, epoxy resin, polyester, polyimides, polyamide-imides, polyamide, phenolic resins, polyurethane, acrylic resin, melmac, polystyrene, polyolefin etc. can be exemplified.Epoxy resin also can comprise gives flexual rubber constituent (carboxy-modified acrylonitrile-butadiene rubber etc.).
The thickness of bond layer is preferably more than 1 μm less than 100 μm, more preferably more than 1.5 μm less than 60 μm.
The shape of the peristome of through hole is not particularly limited.As the shape of the peristome of through hole, such as circle, ellipse, quadrangle etc. can be exemplified.
(manufacture method with the flexible printing wiring board of electromagnetic shielding film)
Flexible printing wiring board with electromagnetic shielding film of the present invention such as can manufacture by the method with following operation (f) ~ (h).
F () is that at least one side of basilar memebrane has the surface being provided with printed circuit side of the flexible printing wiring board of printed circuit, be arranged on the dielectric film that the position corresponding with printed circuit is formed with through hole, obtain the flexible printing wiring board with dielectric film.
G () is after operation (f), to make conductive adhesive layer flexible printing wiring board with dielectric film overlapping with the mode of the surface contact of dielectric film and electromagnetic shielding film of the present invention, by carrying out hot pressing to it, thus bonding conductive adhesive layer and conductive adhesive layer are electrically connected with printed circuit by through hole on the surface of velum.
H (), after operation (g), peels off the flexible printing wiring board that the first release film obtains with electromagnetic shielding film.
Below, the method manufactured with the flexible printing wiring board of electromagnetic shielding film is described with reference to Fig. 6.
(operation (f))
As shown in Figure 6, flexible printing wiring board 30 overlaps the dielectric film 40 that the position corresponding with printed circuit 34 is formed with through hole 42, the bond layer (diagram is omitted) of bonding dielectric film 40 on the surface of flexible printing wiring board 30, bond layer is hardened, obtains the flexible printing wiring board 2 with dielectric film.Also can, at the bond layer of the surperficial temporary bond dielectric film 40 of flexible printing wiring board 30, in operation (g), bond layer be made to harden completely.
Bonding and the sclerosis of bond layer is undertaken by such as adopting the hot pressing of forcing press (diagram is omitted) etc.
(operation (g))
As shown in Figure 6, the electromagnetic shielding film 10 of the second release film 20 is being peeled off with overlap on the flexible printing wiring board 2 of dielectric film, by hot pressing, obtain the bonding conductive adhesive layer 16 on the surface of dielectric film 40 and the presoma 3 of the flexible printing wiring board with electromagnetic shielding film that is electrically connected with printed circuit 34 by through hole 42 of conductive adhesive layer 16.
Bonding and the sclerosis of conductive adhesive layer 16 is undertaken by such as adopting the hot pressing of forcing press (diagram is omitted) etc.
The time of hot pressing is 20 seconds ~ 60 minutes, preferably 30 seconds ~ 30 minutes further.If the time of hot pressing is more than 20 seconds, then conductive adhesive layer 16 is bonded in the surface of dielectric film 40.If the time of hot pressing is below 60 minutes, then can shorten the manufacturing time of the flexible printing wiring board 1 with electromagnetic shielding film.
The temperature (temperature of the pressing plate of forcing press) of hot pressing is preferably more than 140 DEG C less than 190 DEG C, is more preferably more than 150 DEG C less than 175 DEG C.If the temperature of hot pressing is more than 140 DEG C, then conductive adhesive layer 16 is bonded in the surface of dielectric film 40.In addition, the time of hot pressing can be shortened.If the temperature of hot pressing is less than 190 DEG C, then can suppress the deterioration etc. of electromagnetic shielding film 10, flexible printing wiring board 30 etc.
The pressure of hot pressing is preferably more than 10MPa below 20MPa, is more preferably more than 10MPa below 16MPa.If the pressure of hot pressing is more than 10MPa, conductive adhesive layer 16 is bonded in the surface of dielectric film 40.In addition, the time of hot pressing can be shortened.If the pressure of hot pressing is below 20MPa, the breakage etc. of electromagnetic shielding film 10, flexible printing wiring board 30 etc. can be suppressed.
(operation (h))
As shown in Figure 6, peel off the first release film 18 from insulating properties protective layer 12, obtain the flexible printing wiring board 1 with electromagnetic shielding film.
When hot pressing time in operation (g) is the short period of 20 seconds ~ 10 minutes, preferably before stripping first release film 18 or after peeling off, carry out the sclerosis completely of conductive adhesive layer 16.
Hardening completely of conductive adhesive layer 16 such as uses the heater of baking oven etc. to carry out.
Be preferably heating time between 15 ~ 120 minutes, more preferably between 30 ~ 60 minutes.If heating time is more than 15 minutes, then can harden conductive adhesive layer 16 fully.If heating time is less than 120 minutes, then can shorten the manufacturing time of the flexible printing wiring board 1 with electromagnetic shielding film.
Heating-up temperature (atmosphere temperature in baking oven) is preferably more than 120 DEG C less than 180 DEG C, more preferably more than 120 DEG C less than 150 DEG C.If heating-up temperature is more than 120 DEG C, then heating time can be shortened.If heating-up temperature is less than 180 DEG C, then can suppress the deterioration etc. of electromagnetic shielding film 10, flexible printing wiring board 30 etc.
From the angle that can not use special device, preferably do not heat with pressurizeing.
(action effect)
Described above with in the flexible printing wiring board 1 of electromagnetic shielding film, electromagnetic shielding film 10 has the prime coat 15 between metal film layer 14 and conductive adhesive layer 16, inhibit the stripping between metal film layer 14 and conductive adhesive layer 16, be reliably electrically connected metal film layer 14 and printed circuit 34 by conductive adhesive layer 16.
In addition, prime coat 15 is insulating properties, is considered to hinder the electrical connection between metal film layer 14 and conductive adhesive layer 16.But because prime coat 15 is thin layers, the part of prime coat 15 to be impregnated in metal film layer 14 and to be absorbed, and historical facts or anecdotes border primer 15 not too can hinder the electrical connection between metal film layer 14 and conductive adhesive layer 16.On the contrary, suppress the stripping between metal film layer 14 and conductive adhesive layer 16 as a result, compared with when not having a prime coat 15, the conductivity between metal film layer 14 and printed circuit 34 improves.
(other execution modes)
Flexible printing wiring board with electromagnetic shielding film of the present invention has flexible printing wiring board, dielectric film and electromagnetic shielding film of the present invention, is not limited to the execution mode of illustrated example.
Such as, flexible printing wiring board can have ground plane in side overleaf.In addition, flexible printing wiring board can have printed circuit in two sides, also can be the plate pasting dielectric film and electromagnetic shielding film on two sides.
[embodiment]
Below, embodiment is shown.In addition, the present invention is not limited to embodiment.
(storage elasticity rate)
Storage elasticity rate uses Measurement of Dynamic Viscoelasticity device (RheometricScientific, Inc. manufacture, RSAII) to measure.
(viscosity)
The viscosity of priming paint uses Brookfield viscometer (model LVT) to measure with the condition of rotary speed 3 to 60rpm in room temperature (25 DEG C).
(peel test)
To electromagnetic shielding film, (Jin Tian manufacturing company (modern field System Zuo Suo society) manufactures working strength experimental machine, SV-55C-20H), under the condition of 180 DEG C of direction of delaminate, draw speed 50mm/ minute, carry out peel test, confirm the interface that there occurs stripping.
(presence or absence of the carbon atom of metal film layer)
To the cross section of the metal film layer of electromagnetic shielding film, probe-microanalyser (NEC Inc. (Japanese Electricity society) makes, JXA-8100) is used to confirm the presence or absence of carbon atom.
(embodiment 1)
As the first release film 18 and the second release film 20, prepare PETG film (Lintec company (the リ ンテック society) manufacture having carried out the release process of one side with non-silicone-based mould release, T157, thickness: 50 μm, the storage elasticity rate at 160 DEG C: 6 × 10
8pa).
Operation (a):
On the surface of the parting agent layer 18b of the first release film 18; apply (T & K Dong Hua company (society of the テ ィ ー ア Application De ケ イ East China) manufacture of solvent solubility amide resin; TPAE-617C) and curing agent (toluene di-isocyanate(TDI)) be dissolved in N; the coating of dinethylformamide; heat 0.4 hour at 150 DEG C and amide resin is hardened; form insulating properties protective layer 12 (thickness: 5 μm, the storage elasticity rate at 160 DEG C: 8 × 10
6pa, sheet resistance: 8 × 10
12Ω).
Operation (b):
On the surface of insulating properties protective layer 12, with e-beam evaporation physically copper steam-plating, form the vapor-deposited film (metal film layer 14) of thickness 0.07 μm, sheet resistance 0.3 Ω.
Operation (c):
On the surface of metal film layer 14, coating will as carboxylic elastomeric acrylonitrile-butadiene copolymer rubber (Nippon Zeon's system, NIPOL1072J), epoxy resin and imidazole hardeners are dissolved in the priming paint (viscosity: 26mPas) of solvent (methyl ethyl ketone), at 100 DEG C of heating 5 minutes, form prime coat 15 (thickness: 0.2 μm), obtain first cascade body 10a.
Operation (d):
On the surface of the parting agent layer 20b of the second release film 20, use the coating of film coating machine using epoxy resin (DIC company (DIC society) manufacture as hardening epoxy resin of hiding, EXA-4816) (aginomoto fine techniques company (monosodium glutamate Off ァ イ Application テ Network ノ society) manufactures with curing agent, PN-23) mixture and as electroconductive particle 22 burn till carbon particle (AirWaterBellPearl company (エ ア ウ ォ ー タ ー ベ ル パ ー Le society) manufacture, CR1-2000, average grain diameter: 9 μm, specific area: 5m
2/ g, real density: 1.5g/cm
3) on implement 1 μm of thick silver-plated and the substance dissolves obtained or the conductive adhesive composition be distributed in solvent (methyl ethyl ketone), make solvent evaporates and carry out B-stage, thus form the conductive adhesive layer 16 (thickness: 10 μm of anisotropic conductive, silver-platedly burn till carbon particle: 5 volume %, sheet resistance: 5 × 10
8Ω), the second duplexer 10b is obtained.
Operation (e):
Overlapping first cascade body 10a and the second duplexer 10b, prime coat 15 is contacted with conductive adhesive layer 16, (Zhe Yuan manufacturing company (rolling over former System Zuo Suo society) manufactures to use hot-press arrangement, G-12), in temperature: 60 DEG C, pressure: 2MPa carries out hot pressing in 1 minute, obtains electromagnetic shielding film 10.
Operation (f):
In the polyimide film (sheet resistance: 1 × 10 of thickness 25 μm
17Ω) the insulating properties adhesive composite of the surface application acrylonitrile butadiene rubber modified epoxy resin formation of (matrix material film), makes dry film thickness be 25 μm, forms bond layer, obtain dielectric film 40 (thickness: 50 μm).
Prepare the polyimide film (sheet resistance: 1 × 10 thickness 12 μm
17Ω) surface of (basilar memebrane 32) is formed with the flexible printing wiring board 30 of printed circuit 34.
By hot pressing, dielectric film 40 is attached on flexible printing wiring board 30, obtains the flexible printing wiring board 2 with dielectric film.
Operation (g):
The overlapping electromagnetic shielding film 10 having peeled off the second release film 20 on flexible printing wiring board 30, (VIGOR company (VIGOR society) makes to use hot-press arrangement, VFPC-05R), hot pressing in 30 seconds is carried out with the pressure of the degree of 170 DEG C, 15MPa, the bonding conductive adhesive layer 16 on the surface of dielectric film 40, obtains the presoma 3 with the flexible printing wiring board of electromagnetic shielding film.
(nanmu originally changes into company's (nanmu originally changes into society) and manufactures to use pyrostal, HT210) heat 30 minutes at the presoma 3 of temperature to the flexible printing wiring board with electromagnetic shielding film of 170 DEG C, thus conductive adhesive layer 16 is hardened completely.
Operation (h):
Peel off the first release film 18 from insulating properties protective layer 12, obtain the flexible printing wiring board 1 with electromagnetic shielding film.
Peel test is carried out to electromagnetic shielding film 10.Peel off at the enhancing reinforcement plate of working sample and the interface of insulating properties protective layer 12, do not peel off between metal film layer 14 and conductive adhesive layer 16.In addition, to the presence or absence of the cross-section determination carbon atom of metal film layer 14, confirm there is carbon atom, and the part confirming priming paint is impregnated into metal film layer 14 and is absorbed.
(comparative example 1)
Except prime coat is not set, obtain electromagnetic shielding film similarly to Example 1.
Peel test is carried out to electromagnetic shielding film 10.Peel off at the interface of metal film layer 14 and conductive adhesive layer 16.In addition, to the presence or absence of the cross-section determination carbon atom of metal film layer 14, confirm there is no carbon atom.
Industry utilizes possibility
Electromagnetic shielding film of the present invention is used as electromagnetic wave shielding parts in the flexible printing wiring board of the electronic equipments such as smart phone, portable phone, optical module, digital camera, game machine, notebook computer, medical apparatus.
[symbol description]
1 with the flexible printing wiring board of electromagnetic shielding film
2 with the flexible printing wiring board of dielectric film
3 with the presoma of the flexible printing wiring board of electromagnetic shielding film
10 electromagnetic shielding films
10a first cascade body
10b second duplexer
12 insulating properties protective layers
14 metal film layers
15 prime coats
16 conductive adhesive layers
18 first release films
18a release film main body
18b parting agent layer
20 second release films
20a release film main body
20b parting agent layer
22 electroconductive particles
30 flexible printing wiring boards
32 basilar memebranes
34 printed circuits
40 dielectric films
42 through holes
101 with the flexible printing wiring board of electromagnetic shielding film
110 electromagnetic shielding films
112 insulating properties protective layers
114 metal film layers
116 conductive adhesive layers
118 release films
130 flexible printing wiring boards
132 basilar memebranes
134 printed circuits
140 dielectric films
142 through holes
144 spaces
Claims (9)
1. an electromagnetic shielding film, has successively:
Insulating properties protective layer, metal film layer, prime coat and conductive adhesive layer.
2. electromagnetic shielding film according to claim 1,
Described prime coat is by the layer formed containing carboxylic elastomeric priming paint.
3. electromagnetic shielding film according to claim 1 and 2,
The thickness of described prime coat is more than 0.05 μm less than 1 μm.
4. the electromagnetic shielding film according to any one in claims 1 to 3,
Described conductive adhesive layer is anisotropic conductive adhesive layer.
5. the electromagnetic shielding film according to any one in Claims 1-4,
Also there is first release film on the surface being located at described insulating properties protective layer.
6. electromagnetic shielding film according to claim 5,
Also there is second release film on the surface being located at described conductive adhesive layer.
7. a manufacture method for electromagnetic shielding film, it manufactures electromagnetic shielding film according to claim 6, has following operation (a) to (e):
A () forms insulating properties protective layer at the one side of the first release film;
B () forms metal film layer on the surface of described insulating properties protective layer;
C () is had the first cascade body of the first release film, insulating properties protective layer, metal film layer and prime coat successively by forming prime coat on the surface of described metal film layer;
D () is had the second duplexer of the second release film and conductive adhesive layer successively by forming conductive adhesive layer at the one side of the second release film;
E () described first cascade body of fitting makes described prime coat contact with described conductive adhesive layer with described second duplexer.
8., with a flexible printing wiring board for electromagnetic shielding film, have:
The flexible printing wiring board of printed circuit is provided with at least one side of basilar memebrane;
Be located at the dielectric film being provided with the surface of described printed circuit side of described flexible printing wiring board; And
Described conductive adhesive layer is bonded in the electromagnetic shielding film according to any one in Claims 1-4 on the surface of described dielectric film,
Wherein, described conductive adhesive layer is electrically connected with described printed circuit by the through hole formed in described dielectric film.
9., with a manufacture method for the flexible printing wiring board of electromagnetic shielding film, there is following operation (f) to (h):
F () is that at least one side of basilar memebrane has the surface being provided with described printed circuit side of the flexible printing wiring board of printed circuit, be arranged on the dielectric film that the position corresponding with described printed circuit is formed with through hole, obtain the flexible printing wiring board with dielectric film;
G () is after operation (f), with make described conductive adhesive layer overlapping with the mode of the surface contact of described dielectric film described in the flexible printing wiring board of dielectric film and the electromagnetic shielding film according to any one in claim 1 to 5, and hot pressing is carried out to it, thus described conductive adhesive layer is bonded in the surface of described dielectric film, and described conductive adhesive layer is electrically connected with described printed circuit by described through hole; And
H (), when described electromagnetic shielding film has the first release film, after operation (g), peels off described first release film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014191004A JP6435540B2 (en) | 2014-09-19 | 2014-09-19 | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof |
| JP2014-191004 | 2014-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105451529A true CN105451529A (en) | 2016-03-30 |
| CN105451529B CN105451529B (en) | 2018-07-10 |
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ID=55561173
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510557049.1A Active CN105451529B (en) | 2014-09-19 | 2015-09-02 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP6435540B2 (en) |
| CN (1) | CN105451529B (en) |
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| CN110027268B (en) * | 2018-01-12 | 2022-02-01 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
| CN110062522A (en) * | 2018-01-18 | 2019-07-26 | 施赖纳集团两合公司 | Flexible circuit with the connection between the conductive structural detail of energy |
| CN113853839A (en) * | 2019-05-29 | 2021-12-28 | 拓自达电线株式会社 | Electromagnetic wave shielding film and shielded printed wiring board |
| CN113853839B (en) * | 2019-05-29 | 2022-09-30 | 拓自达电线株式会社 | Electromagnetic wave shielding film and shielding printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105451529B (en) | 2018-07-10 |
| JP6435540B2 (en) | 2018-12-12 |
| JP2016063117A (en) | 2016-04-25 |
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