CN105451473A - Multilayer flexible circuit board and manufacturing method thereof - Google Patents
Multilayer flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105451473A CN105451473A CN201410442125.XA CN201410442125A CN105451473A CN 105451473 A CN105451473 A CN 105451473A CN 201410442125 A CN201410442125 A CN 201410442125A CN 105451473 A CN105451473 A CN 105451473A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- connection gasket
- layer
- conductive
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Multi-layer soft circuit board | 10 |
Flexible copper foil substrate | 11 |
First circuit board | 100 |
First copper foil layer | 101 |
Second copper foil layer | 102 |
First basalis | 110 |
First conductive circuit layer | 111 |
Second conductive circuit layer | 112 |
First through hole | 120 |
First via | 121 |
First connection gasket | 130 |
First conductive paste | 140 |
Second circuit board | 200 |
Second basalis | 210 |
3rd conductive circuit layer | 211 |
4th conductive circuit layer | 212 |
Second through hole | 220 |
Second via | 221 |
Second connection gasket | 230 |
Second conductive paste | 240 |
Glue-line | 300 |
Opening | 320 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410442125.XA CN105451473A (en) | 2014-09-02 | 2014-09-02 | Multilayer flexible circuit board and manufacturing method thereof |
TW103133401A TW201611700A (en) | 2014-09-02 | 2014-09-26 | Multilayer flexible circuit board and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410442125.XA CN105451473A (en) | 2014-09-02 | 2014-09-02 | Multilayer flexible circuit board and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105451473A true CN105451473A (en) | 2016-03-30 |
Family
ID=55561127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410442125.XA Pending CN105451473A (en) | 2014-09-02 | 2014-09-02 | Multilayer flexible circuit board and manufacturing method thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105451473A (en) |
TW (1) | TW201611700A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030174484A1 (en) * | 2002-03-14 | 2003-09-18 | General Dynamics Advanced Information Systems, Inc | Lamination of high-layer-count substrates |
CN101184362A (en) * | 2006-11-14 | 2008-05-21 | 安迪克连接科技公司 | Method of making circuitized substrate with solder paste connections |
CN101336051A (en) * | 2007-01-12 | 2008-12-31 | 安迪克连接科技公司 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
CN101360398A (en) * | 2007-07-31 | 2009-02-04 | 欣兴电子股份有限公司 | Circuit board construction of inner fovea type conductive column and preparation thereof |
CN201888026U (en) * | 2010-11-15 | 2011-06-29 | 华映视讯(吴江)有限公司 | Structure for connecting two assembly substrates |
CN202549828U (en) * | 2012-03-30 | 2012-11-21 | 欣兴电子股份有限公司 | Semiconductor package substrate |
-
2014
- 2014-09-02 CN CN201410442125.XA patent/CN105451473A/en active Pending
- 2014-09-26 TW TW103133401A patent/TW201611700A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030174484A1 (en) * | 2002-03-14 | 2003-09-18 | General Dynamics Advanced Information Systems, Inc | Lamination of high-layer-count substrates |
CN101184362A (en) * | 2006-11-14 | 2008-05-21 | 安迪克连接科技公司 | Method of making circuitized substrate with solder paste connections |
CN101336051A (en) * | 2007-01-12 | 2008-12-31 | 安迪克连接科技公司 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
CN101360398A (en) * | 2007-07-31 | 2009-02-04 | 欣兴电子股份有限公司 | Circuit board construction of inner fovea type conductive column and preparation thereof |
CN201888026U (en) * | 2010-11-15 | 2011-06-29 | 华映视讯(吴江)有限公司 | Structure for connecting two assembly substrates |
CN202549828U (en) * | 2012-03-30 | 2012-11-21 | 欣兴电子股份有限公司 | Semiconductor package substrate |
Also Published As
Publication number | Publication date |
---|---|
TW201611700A (en) | 2016-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170309 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160330 |