CN105451448B - Production method, wiring board and the drill point of wiring board - Google Patents
Production method, wiring board and the drill point of wiring board Download PDFInfo
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- CN105451448B CN105451448B CN201510854171.5A CN201510854171A CN105451448B CN 105451448 B CN105451448 B CN 105451448B CN 201510854171 A CN201510854171 A CN 201510854171A CN 105451448 B CN105451448 B CN 105451448B
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- hydrophobic membrane
- drill point
- wall section
- hole
- production method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to a kind of production method of wiring board, wiring board and drill point, specifically included in method：Through-hole is drilled out in circuit base plate using the drill point for being coated with hydrophobic membrane, the inner wall of the through-hole includes the first inner wall section and the second inner wall section that are connected with each other；The hydrophobic membrane remains to form hydrophobic membrane residual layer in first inner wall section；Plating metal processing is carried out, to form conductive layer in the second inner wall section of the through-hole.The above process does not need to the diameter design of drill point being more than through-hole diameter+0.2mm, saves the occupied space of drill point in manufacturing process, and then increase the intensive designed capacity of wiring board；And it can ensure the service life of drill point, and reduce production cost.
Description
Technical field
The present invention relates to wiring board technology fields, and in particular to a kind of production method of wiring board, wiring board and drill point.
Background technology
In the manufacturing process of pcb board (Printed Circuit Board, printed wiring board), need to set through-hole
Realize the connection between each internal layer circuit, and through-hole also needs to, by processing such as heavy copper, plating, form conductive layer in through-holes,
So as to fulfill the connection between each sandwich circuit.However, the through-hole of some pcb boards only needs partially ON, and pass through heavy copper, plating
Treated, and through-hole all turns on, and thus will appear through-hole end connectivity problem, so as to lead to turning back for signal, makes
Into phenomena such as the reflection of signal transmission, scattering, delay, " distortion " problem is brought to signal.
In order to avoid the generation of above-mentioned phenomenon, it is necessary to back drill processing is carried out to through-hole, by the hole of through-hole non-signal layer
Wall copper control deep drilling is gone.Traditional back drill technique generally includes following steps：First, through-hole is drilled out in circuit base plate 1 ' using drill point
2′；Then, metal layer is plated on the inner walls of the via；Secondly, back drill is carried out compared with the drill point of through-hole bigger by using diameter to obtain
To back drill hole 3 ', the purpose is to which the metal layer on the through-hole wall of non-signal layer is removed, and using residual metallic layer as conduction
Layer 4 ', the structure of the wiring board finally obtained is as shown in Figure 1.
However, there are following defects for traditional back drill technique：(1) back drill drill point diameter is than through-hole drill point diameter bigger,
Back drill needle diameter >=through-hole needle diameter+0.2mm, i.e. back drill technique can occupy at least space of 0.2mm under normal circumstances, so as to meeting
Influence the intensive design of circuit；(2) since back drill technique is using being first electroplated post-processing, and be electroplated the hardness for obtaining hole wall metal and
Toughness is bigger than drill point, so as to which the service life of drill point can be caused to reduce the functional lability with drilling device, final influence back drill
Quality qualification rate.
Invention content
Therefore, the technical problem to be solved in the present invention be to overcome in the prior art back drill technique can influence the service life of drill point
And back drill quality qualification rate the defects of.
To solve the above-mentioned problems, the present invention provides a kind of production method of wiring board, include the following steps：
Through-hole is drilled out in circuit base plate using the drill point for being coated with hydrophobic membrane, the inner wall of the through-hole includes being connected with each other
The first inner wall section and the second inner wall section；
The hydrophobic membrane remains to form hydrophobic membrane residual layer in first inner wall section；
Plating metal processing is carried out, to form conductive layer in the second inner wall section of the through-hole.
Preferably, the material of the hydrophobic membrane is grease, polytetrafluoroethylene (PTFE), polypropylene or Kynoar.
Preferably, the thickness of the hydrophobic membrane is 10-50 μm.
Preferably, the hydrophobic membrane is coated on the outer wall above the tip of the drill point, the hydrophobic membrane is close to institute
State the height that the height between the end face at drill point tip and the drill point tip is more than second inner wall section, the hydrophobic membrane
Height be more than first inner wall section height.
Preferably, it further includes：Drill out through-hole in circuit base plate using the drill point for being coated with hydrophobic membrane the step of it
Before, form hydrophobic membrane on the drill point.
Preferably, the specific steps that hydrophobic membrane is formed on the drill point include：
Preferably, hydrophobic material is coated or impregnated on the outer wall of the drill point；
Preferably, the hydrophobic material is solidificated on the outer wall of the drill point, to form the hydrophobic membrane.
Preferably, described carry out plating metal processing, to form conductive layer in the second inner wall section of the through-hole
Specific steps include：
Plating metal processing for the first time is carried out, to form initial metal layer in the second inner wall section of the through-hole；
Second of plating metal processing is carried out, to form base metal layer, the original metal in the initial metal layer
Layer and the base metal layer form the conductive layer.
Preferably, the thickness of the initial metal layer is 1-10 μm, the thickness of the base metal layer is 30-50 μm.
Preferably, it further includes：Plating metal processing is carried out described, to be formed in the second inner wall section of the through-hole
After the step of conductive layer, the hydrophobic membrane residual layer is removed.
The present invention provides a kind of wiring board, is made using production method described in any one of the above embodiments.
The present invention provides a kind of wiring board, and including circuit base plate, through-hole is provided on the circuit base plate, the through-hole
Conductive layer is provided on the inner wall of side.
The present invention provides a kind of drill point, and including drill point ontology, the drill point ontology has tip, further includes described in being coated on
Hydrophobic membrane on the outer wall at the separate tip of drill point ontology.
Preferably, the material of the hydrophobic membrane is grease, polytetrafluoroethylene (PTFE), polypropylene or Kynoar.
Preferably, the thickness of the hydrophobic membrane is 10-50 μm.
The technical solution of the embodiment of the present invention, has the following advantages that：
The production method of wiring board provided in an embodiment of the present invention, first with being coated with the drill point of hydrophobic membrane in circuit base plate
In drill out through-hole, the inner wall of the through-hole includes the first inner wall section and the second inner wall section that are connected with each other, due to drilling
Friction is generated between first inner wall section of hydrophobic membrane and through-hole in journey on drill point, is dredged so as to be formed in the first inner wall section
Moisture film residual layer；Then carry out plating metal processing, should during in hydrophobic membrane residual layer hydrophobic grouping (such as alkyl, ester group,
Nitro etc.) repulsive force is generated to liquid medicine, so as to which liquid medicine be prevented to make with being combined by the first inner wall section that hydrophobic membrane residual layer covers
Metal will not be plated by obtaining the first inner wall section, and metal is plated in the second inner wall section, form conductive layer.
The above process is not needed to as first all plated metal as back drill technique of the prior art on the inner walls of the via,
Naturally do not need to that the metal of formation is electroplated using on drill point removal throughhole portions inner wall, so as to which, drill point is in design, do not need to by
The diameter design of drill point is more than through-hole diameter+0.2mm, saves the occupied space of drill point in manufacturing process, and then increase
The intensive designed capacity of wiring board.
Also, due to not needing to using the metal that formation is electroplated on drill point removal throughhole portions inner wall, it is ensured that drill point
Service life, and reduce production cost.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the structure diagram using the prepared wiring board of existing method；
The structure of drill point used in the production method of wiring board that Fig. 2 is provided for a kind of specific embodiment of the present invention
Schematic diagram；
Fig. 3 is the status diagram using drill point shown in Fig. 2 holes drilled through in circuit base plate；
Fig. 4 is the structure diagram of the circuit base plate after taking-up drill point from structure shown in Fig. 3；
Fig. 5 is the structure diagram that circuit base plate after plating metal is handled is carried out to circuit base plate shown in Fig. 4；
The circuit that Fig. 6 is prepared for the production method of wiring board that is provided using a kind of specific embodiment of the present invention
The structure diagram of plate.
Reference sign：
1 '-circuit base plate；2 '-through-hole；3 '-back drill hole；
4 '-conductive layer；1- drill points；2- hydrophobic membranes；
3- through-holes；4- hydrophobic membrane residual layers；5- conductive layers；
6- circuit base plates.
Specific embodiment
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's all other embodiments obtained without making creative work, shall fall within the protection scope of the present invention.
In addition, technical characteristic involved in invention described below different embodiments is as long as they do not conflict with each other
It can be combined with each other.
Embodiment 1
Fig. 2 to Fig. 6 shows the specific of the production method of wiring board that a kind of specific embodiment of the present invention is provided
Process.The production method that wiring board is elaborated below in conjunction with Fig. 2 to Fig. 6.
A kind of production method of wiring board, specifically includes：
S1：Hydrophobic membrane 2 is formed on the outer wall position above the tip of drill point 1, as shown in Figure 2；
S2：Using the drill point 1 for being coated with hydrophobic membrane 2 holes drilled through in circuit base plate 6 shown in Fig. 2, as shown in figure 3, boring
The inner wall of the through-hole 3 gone out includes the first inner wall section and the second inner wall section that are connected with each other, and the hydrophobic membrane 2 is described
First inner wall section remains to form hydrophobic membrane residual layer 4, as shown in Figure 4；Hydrophobic membrane 2 refers to the membrane material containing hydrophobic grouping, because
This hydrophobic membrane 2 has preferable hydrophobic function；
S3：Plating metal processing is carried out, to form conductive layer 5 in the second inner wall section of the through-hole 3, as shown in Figure 5；
S4：It removes hydrophobic membrane residual layer 4 and forms wiring board, as shown in Figure 6.
In above-mentioned production method, since the hydrophobic membrane 2 in boring procedure on drill point 1 and the first inner wall part of through-hole 3 divide it
Between generate friction, so as to form hydrophobic membrane residual layer 4 in the first inner wall section；Then plating metal processing is carried out, during being somebody's turn to do
Hydrophobic grouping (such as alkyl, ester group, nitro etc.) in hydrophobic membrane residual layer 4 generates repulsive force to liquid medicine, so as to prevent liquid medicine
It being combined with by the first inner wall section that hydrophobic membrane residual layer 4 covers so that the first inner wall section will not plate metal, and second
Metal is plated in inner wall section, forms conductive layer 5.
The above process is not needed to as first all plated metal as back drill technique of the prior art on the inner walls of the via,
Naturally it does not need to using the metal that formation is electroplated on drill point removal 3 internal partial wall of through-hole, so as to which drill point is not needed in design
By the occupied space for being more than through-hole diameter+0.2mm, saving drill point in manufacturing process of the diameter design of drill point, and then increase
The intensive designed capacity of wiring board.
The above process, due to not needing to using the metal that formation is electroplated on drill point removal 3 internal partial wall of through-hole, it is ensured that
The service life of drill point, and reduce production cost.
As preferred embodiment, in S1 steps, the material of the hydrophobic membrane 2 is hydrophobicity material commonly used in the art
Material, such as：Any one in grease, polytetrafluoroethylene (PTFE), polypropylene or Kynoar.
As preferred embodiment, in S1 steps, the forming method of hydrophobic membrane 2 specifically includes：First in the outer wall of drill point 1
On be coated or impregnated with any one above-mentioned hydrophobic material, then carry out curing drying so as to form hydrophobic membrane 2, it is specific
Technological parameter is referred to the prior art；The hydrophobic membrane 2 can also use generation type other well known in the prior art,
This is repeated no more.
Of course, it is possible to above-mentioned S1 steps are omitted, at this time, it is only necessary to carry out using the drill point 1 for being coated with hydrophobic membrane 2 of finished product
Processing.
In order to obtain the hydrophobic membrane residual layer 4 of adequate thickness, it is preferable that the thickness of the hydrophobic membrane 2 formed in S1 steps
Degree or the thickness of the hydrophobic membrane 2 of drill point 1 used in S2 steps in the case where omitting S1 steps are 10-50 μm, such as：
10 μm, 20 μm, 50 μm etc., the thickness of the hydrophobic membrane 2 can within the above range be selected according to actual demand.
As preferred embodiment, 1 a diameter of 0.1-0.8mm of drill point is used, such as：0.1mm、0.5mm、0.8mm
Etc., 1 diameter of drill point can be selected according to the size for being subsequently formed through-hole.
As preferred embodiment, the hydrophobic membrane 2 that is formed in S1 steps or in the case where omitting S1 steps
The hydrophobic membrane 2 of the drill point 1 used in S2 steps is coated on the outer wall above the tip of the drill point 1, the hydrophobic membrane 2
Highly more than the height of the first inner wall section of the through-hole 3, the hydrophobic membrane 2 is close to the end face at 1 tip of drill point and institute
The height that the height between 1 tip of drill point is more than the second inner wall section of the through-hole 3 is stated, consequently facilitating being obtained in subsequent step
The hydrophobic membrane residual layer 4 of adequate thickness.
As preferred embodiment, the plating metal processing is led with being formed in the second inner wall section of the through-hole 3
5 specific steps of electric layer include：Plating metal processing for the first time is carried out, to form original metal on the exposed inner wall of the through-hole 3
Layer；Second of plating metal processing is carried out, to form base metal layer, the initial metal layer and institute in the initial metal layer
It states base metal layer and forms the conductive layer 5.
Wherein, that plates metal processing for the first time act as the plating thin gold of last layer in the second inner wall section of the through-hole 3
Belong to, so that subsequent process smoothly plates metal (playing the role of bottoming).The effect of second of plating metal processing is to thicken
Initial metal layer makes the shown conductive layer 5 finally obtained have semi-glossy, ductility, pull resistance.The initial metal layer and
The thickness of the base metal layer can be selected according to actual demand, it is preferable that the thickness of the initial metal layer is 1-
10 μm, the thickness of the base metal layer is 30-50 μm.
The technique of plating metal processing for the first time and second of plating metal processing can be plating or chemical plating etc., plate metal
Can be copper or gold etc..Wherein, plating is to do anode using coated metal or other insoluble materials, is done using workpiece to be plated
Cathode cooks electroplate liquid using the solution of the cation containing coated metal, and the cation of coated metal is made to be gone back in workpiece surface to be plated
Original shape is into coating.Chemical plating refers under conditions of no impressed current, utilizes the metal salt in same solution and reduction
Agent carries out the principle of autocatalyzed oxidation reduction reaction on the matrix surface with catalytic activity, and being formed in matrix surface has one
Determine a kind of process for treating surface of thickness and the metal of function.
The specific embodiment and technological parameter of plating metal processing for the first time and second of plating metal processing are referred to existing
There is technology.By taking electroless copper as an example, generally made using the copper sulphate of 2.5~5g/L as main salt using formaldehyde or hypophosphites
For reducing agent, copper-plated heavy copper speed is 1.0-2.5 μm/h for the first time, and copper-plated heavy copper speed is 6-9 μm/h for the first time.Specifically
Details are not described herein for technical process.
As preferred embodiment, S4 steps, that is, heat may be used in the specific method for removing the hydrophobic membrane residual layer 4
The methods of decomposition, specific process parameter are related to material used by the hydrophobic membrane residual layer 4.Those skilled in the art can be with
Introduction according to the present invention is chosen to remove the method and technological parameter of the hydrophobic membrane residual layer 4 with reference to the prior art.
Certainly, when the hydrophobic membrane residual layer 4 will not impact the performance of formed wiring board, can also retain
The hydrophobic membrane residual layer 4, that is, omitting above-mentioned S4 steps.
Embodiment 2
As shown in fig. 6, the present embodiment provides a kind of wiring board, it is logical including circuit base plate, in the circuit base plate
Hole 3 and the conductive layer 5 on the 3 side inner wall of through-hole.
It should be noted that this kind of wiring board may be used any one embodiment described in embodiment 1 prepare and
Into can also be prepared using other preparation methods.When being prepared using any one embodiment described in embodiment 1
Cheng Shi has the various advantages described in embodiment 1.
Embodiment 3
As shown in Fig. 2, the present embodiment provides a kind of drill point, including drill point ontology, the drill point ontology has tip, also wraps
Include the hydrophobic membrane 2 on the outer wall at the separate tip for being coated on the drill point ontology.
As preferred embodiment, the material of the hydrophobic membrane 2 is grease, polytetrafluoroethylene (PTFE), polypropylene or gathers inclined fluorine
Ethylene.
As preferred embodiment, the thickness of the hydrophobic membrane 2 is 10-50 μm, such as：10 μm, 20 μm, 50 μm etc.
Deng the thickness of the hydrophobic membrane 2 can within the above range be selected according to actual demand.
As preferred embodiment, 1 a diameter of 0.1-0.8mm of drill point, such as：0.1mm, 0.5mm, 0.8mm etc.
Deng 1 diameter of drill point can be selected according to the size for being subsequently formed through-hole.
Above-mentioned drill point 1 can be used in the production method of the wiring board described in embodiment 1, can be used for other similar
In the production method of plate body.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (13)
1. a kind of production method of wiring board, which is characterized in that include the following steps：
Through-hole (3), the inner wall of the through-hole (3) are drilled out in circuit base plate (6) using the drill point (1) for being coated with hydrophobic membrane (2)
The first inner wall section and the second inner wall section including interconnection；
The hydrophobic membrane (2) remains to form hydrophobic membrane residual layer (4) in first inner wall section；
Plating metal processing is carried out, to form conductive layer (5) in the second inner wall section of the through-hole (3).
2. production method according to claim 1, which is characterized in that the material of the hydrophobic membrane (2) is grease, polytetrafluoro
Ethylene, polypropylene or Kynoar.
3. production method according to claim 1, which is characterized in that the thickness of the hydrophobic membrane (2) is 10-50 μm.
4. production method according to claim 1, which is characterized in that the hydrophobic membrane (2) is coated on the drill point (1)
On outer wall above tip, the hydrophobic membrane (2) is close between the end face at the drill point (1) tip and the drill point (1) tip
Height be more than the height of second inner wall section, the height of the hydrophobic membrane (2) is more than the height of first inner wall section
Degree.
5. production method according to any one of claim 1 to 4, which is characterized in that it is described to carry out plating metal processing, with
The specific steps that conductive layer (5) is formed in the second inner wall section of the through-hole (3) include：
Plating metal processing for the first time is carried out, to form initial metal layer in the second inner wall section of the through-hole (3)；
Carry out second plating metal processing, to form base metal layer in the initial metal layer, the initial metal layer and
The base metal layer forms the conductive layer (5).
6. production method according to claim 5, which is characterized in that the thickness of the initial metal layer is 1-10 μm, institute
The thickness for stating base metal layer is 30-50 μm.
7. production method according to any one of claim 1 to 4, which is characterized in that further include：It is gold-plated in the progress
Category processing, after the step of conductive layer (5) are formed in the second inner wall section of the through-hole (3), to remove the hydrophobic membrane
Residual layer (4).
8. production method according to claim 5, which is characterized in that further include：It is described carry out plating metal processing, with
After the step of conductive layer (5) are formed in second inner wall section of the through-hole (3), the hydrophobic membrane residual layer (4) is removed.
9. production method according to claim 6, which is characterized in that further include：It is described carry out plating metal processing, with
After the step of conductive layer (5) are formed in second inner wall section of the through-hole (3), the hydrophobic membrane residual layer (4) is removed.
10. a kind of wiring board, which is characterized in that be made using the production method described in any one of claim 1-9.
11. a kind of drill point, including drill point ontology, the drill point ontology has tip, which is characterized in that further includes described in being coated on
Hydrophobic membrane (2) on the outer wall at the separate tip of drill point ontology, outer wall not coated by hydrophobic film (2) at tip.
12. drill point according to claim 11, which is characterized in that the material of the hydrophobic membrane (2) is grease, polytetrafluoroethyl-ne
Alkene, polypropylene or Kynoar.
13. the drill point according to claim 11 or 12, which is characterized in that the thickness of the hydrophobic membrane (2) is 10-50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854171.5A CN105451448B (en) | 2015-11-30 | 2015-11-30 | Production method, wiring board and the drill point of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854171.5A CN105451448B (en) | 2015-11-30 | 2015-11-30 | Production method, wiring board and the drill point of wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105451448A CN105451448A (en) | 2016-03-30 |
| CN105451448B true CN105451448B (en) | 2018-06-26 |
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| CN201510854171.5A Active CN105451448B (en) | 2015-11-30 | 2015-11-30 | Production method, wiring board and the drill point of wiring board |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188886B (en) * | 2011-12-31 | 2016-02-03 | 北大方正集团有限公司 | A kind of printed circuit board and preparation method thereof |
-
2015
- 2015-11-30 CN CN201510854171.5A patent/CN105451448B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
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| Publication number | Publication date |
|---|---|
| CN105451448A (en) | 2016-03-30 |
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Effective date of registration: 20220622 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |