CN105449082A - 一种360°发光led光源的制备方法 - Google Patents

一种360°发光led光源的制备方法 Download PDF

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CN105449082A
CN105449082A CN201510792103.0A CN201510792103A CN105449082A CN 105449082 A CN105449082 A CN 105449082A CN 201510792103 A CN201510792103 A CN 201510792103A CN 105449082 A CN105449082 A CN 105449082A
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transparency carrier
phosphor
led light
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谭少伟
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SHENZHEN HONGZHAO INDUSTRY DEVELOP Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开一种360°发光LED光源的制备方法，包括在透明基板上烧结一层荧光粉层，然后将LED芯片直接固定在荧光粉上，固晶焊线后只需在芯片上方和其他四面布上荧光粉胶，无需在透明基板的下端涂布荧光粉胶，即实现360°发光的LED光源，省时、省料且省成本；透明基板底部没被荧光粉胶体包裹,散热效果好、光源光衰低、使用寿命长;荧光粉层分布均匀,可耐高温,与基板的粘结力牢固,与固晶胶和封装胶结合力好,耐老化。

Description

一种360°发光LED光源的制备方法
技术领域
本发明涉及LED灯具领域,尤其涉及一种360°发光LED光源的制备方法。
背景技术
LED是一种能够将电能转化为可见光的半导体。LED照明是最近几年发展起来的新兴产业近些年来,随着制造成本的下降和发光效率、光衰等技术瓶颈的突破,我国的LED照明产业进入了迅速发展阶段,应用市场快速增长。
现有的LED灯根据光照要求，需要进行360°照射,而现有的具备360°照射的LED灯具均采用的是六面发光的LED芯片将其封装于透明基板上使之六面发光。参考附图1,现有灯具中，需要芯片1六面均匀发射白光时，需将固定芯片1的透明基板（底部未制荧光粉）2和芯片1本身四周同时涂布荧光粉胶3（配有荧光粉的胶水）。这样制备由两大缺陷：一是四周发光不均，芯片底部的荧光粉与芯片隔有基板，激发效果不同；二是胶体导热系数极低，芯片热量很难导出，所以只能小电流、小功率使用，灯具成本高。
现有技术中还存在采用如下方式实施：用胶水配荧光粉烤制在透明基板上，但由于芯片在上面焊线时需加热150℃以上，胶水无法耐受。即使选用冷焊方法焊线成功，也由于芯片发光时产生的热量，使底部胶水容易老化发黑，无法上市销售。
发明内容
本发明要解决的技术问题是针对现有技术中的缺陷提供一种360°发光LED光源的制备方法,采用该方法制备的基板或光源使LED芯片360°均匀发光，杜绝蓝光泄漏，并且导热效果好，可提高电流使用，增加光通量，降低整灯成本。
为解决上述问题,本发明采用的技术方案如下:一种360°发光LED光源的制备方法,该LED光源包括透明基板和固定在该透明基板上的若干LED芯片，其具体包括以下步骤：
步骤A:透明基板制备,选用玻璃、陶瓷及蓝宝石之一作为基板材料,对其上表面进行清洗；
步骤B:焊盘制备,在烘干后的透明基板上预设若干焊盘位，在与焊盘位相匹配的位置上印刷导体浆料,再进行烘干、烧结，制备成所述焊盘;
步骤C:荧光粉层制备,选用荧光粉和玻璃浆料按质量配比调配荧光粉层原料,采用丝网印刷的方式将该荧光粉层原料印刷在透明基板上表面上，并烘干；
步骤D:荧光粉层的烧结,将印刷的了荧光粉层原料的透明基板置于高温炉中高温烧制若干长时间；
步骤E:在完成荧光粉层烧制的透明基板上固定LED芯片,并将各LED芯片通过金线与焊盘连接；
步骤F:固定部制备,在LED芯片除底面的其他五面上涂布荧光粉胶、制备成荧光胶罩,分布于基板上的所有荧光胶罩构成固定部;
步骤G:检验,检测固定部与透明基板粘结是否牢固及LED灯发光效果。
作为对上述技术方案的进一步阐释：
在上述技术方案中,步骤C中荧光粉和玻璃浆料的质量配比范围为0.2:1-3:1。
在上述技术方案中,步骤D中高温炉中高温烧结的温度范围为400℃~900℃，高温烧制时间为10min-20min。
本发明的有益效果在于:
一是,本发明的方法制备的LED光源将LED芯片直接固定在荧光粉上，固晶焊线后只需在芯片上方和其他四面布上荧光粉胶，无需在透明基板的下端涂布荧光粉胶，即实现360°发光的LED光源，省时、省料且省成本;
二是,由于透明基板底部没被荧光粉胶体包裹，散热效果好、光源光衰低、使用寿命长;
三是,本发明方法制备的360°发光的LED光源其烧制的荧光粉层分布均匀，与基板的粘结力牢固，与固晶胶和封装胶结合力好;
四是,本发明烧制的荧光粉层可耐高温，焊线时加温150℃以上无影响，耐老化，比荧光胶体更好。
附图说明
图1是现有技术中六面反光的LED封装结构示意图;
图2是本发明LED光源制备的流程示意图;
图3是利用本发明制备方法制备的单体LED封装结构示意图。
图中,1.LED芯片,2.透明基板,3.荧光胶罩,4.焊盘,5.金线,6.荧光粉层。
具体实施方式
下面结合附图对本发明作进一步详细的说明。
实施例1，附图2实例了本发明的具体实施例,本发明的360°发光LED光源的制备方法包括如下步骤：
步骤A:透明基板制备,选用玻璃、陶瓷及蓝宝石之一作为基板材料,对其上表面进行清洗；
步骤B:光源将LED芯片直接固定在荧光粉上，固晶焊线后只需在芯片上方和其他四面布上荧光粉胶，无需在透明基板的下端涂布荧光粉胶，即实现360°发光的LED光源，省时、省料且省成本;
二是,由于透明基板底部没被荧光粉胶体包裹，散热效果好、光源光衰低、使用寿命长;
三是,本发明方法制备的360°发光的LED光源其烧制的荧光粉层分布均匀，与基板的粘结力牢固，与固晶胶和封装胶结合力好;
四是,本发明烧制的荧光粉层可耐高温，焊线时加温150℃以上无影响，耐老化，比荧光胶体更好。
具体实施方式
下面结合附图对本发明作进一步详细的说明。
实施例1，附图2实例了本发明的具体实施例,本发明的360°发光LED光源的制备方法包括如下步骤：
步骤A:透明基板制备,选用玻璃、陶瓷及蓝宝石之一作为基板材料,对其上表面进行清洗；
步骤B:上对应LED芯片1的区间上还布置有一荧光粉层6,LED芯片1固定于该荧光粉层6上;而一块透明基板2上会设置多个焊盘4,每一颗LED芯片1通过金线5与焊盘4电连接,使LED芯片1焊接于透明基板2并形成一发光电路。而固定部及荧光胶罩3为由荧光粉与胶混合物浇注而成的固定部，且固定部由多个荧光胶罩3单体连接或一体成型构成,而荧光粉层6则是通过烧结的方式固接于透明基板2上的。需要说明的是,附图3给出的是单体立体光源,而实际使用中,可采用的方式有多个单体立体光源组合连接形成360°发光的LED光源、透明基板上固晶多片LED芯片再一体成型固定部而形成360°发光的LED光源。
本发明的方法制备的LED光源将LED芯片直接固定在荧光粉上,固晶焊线后只需在芯片上方和其他四面布上荧光粉胶,无需在透明基板的下端涂布荧光粉胶,即实现360°发光的LED光源,省时、省料且省成本;由于透明基板底部没被荧光粉胶体包裹,散热效果好、光源光衰低、使用寿命长;本发明的制备封装结构其烧制的荧光粉层分布均匀,与基板的粘结力牢固,与固晶胶和封装胶结合力好；本发明烧制的荧光粉层可耐高温,焊线时加温150℃以上无影响，耐老化,比荧光胶体更好。
以上所述并非对本发明的技术范围作任何限制,凡依据本发明技术实质对以上的实施例所作的任何修改、等同变化与修饰,均仍属于本发明技术方案的范围内。

Claims (3)

1.一种360°发光LED光源的制备方法,该LED光源包括透明基板和固定在该透明基板上的若干LED芯片，其特征在于，具体包括以下步骤：
步骤A:透明基板制备,选用玻璃、陶瓷及蓝宝石之一作为基板材料,对其上表面进行清洗；
步骤B:焊盘制备,在烘干后的透明基板上预设若干焊盘位，在与焊盘位相匹配的位置上印刷导体浆料,再进行烘干、烧结，制备成所述焊盘;
步骤C:荧光粉层制备,选用荧光粉和玻璃浆料按质量配比调配荧光粉层原料,采用丝网印刷的方式将该荧光粉层原料印刷在透明基板上表面上，并烘干；
步骤D:荧光粉层的烧结,将印刷的了荧光粉层原料的透明基板置于高温炉中高温烧制若干长时间；
步骤E:在完成荧光粉层烧制的透明基板上固定LED芯片,并将各LED芯片通过金线与焊盘连接；
步骤F:固定部制备,在LED芯片除底面的其他五面上涂布荧光粉胶、制备成荧光胶罩,分布于基板上的所有荧光胶罩构成固定部;
步骤G:检验,检测固定部与透明基板粘结是否牢固及LED灯发光效果。
2.根据权利要求1所述的一种360°发光LED光源的制备方法,其特征在于:步骤C中荧光粉和玻璃浆料的质量配比范围为0.2:1-3:1。
3.根据权利要求1所述的一种360°发光LED光源的制备方法,其特征在于:步骤D中高温炉中高温烧结的温度范围为400℃~900℃,高温烧制时间为10min-20min。
CN201510792103.0A 2015-11-18 2015-11-18 一种360°发光led光源的制备方法 Pending CN105449082A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108735882A (zh) * 2017-04-20 2018-11-02 蔡凯雄 发光二极管装置及其封装方法

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