CN105445649A - Equipment and method for detecting circuit board and device on circuit board - Google Patents
Equipment and method for detecting circuit board and device on circuit board Download PDFInfo
- Publication number
- CN105445649A CN105445649A CN201511026596.3A CN201511026596A CN105445649A CN 105445649 A CN105445649 A CN 105445649A CN 201511026596 A CN201511026596 A CN 201511026596A CN 105445649 A CN105445649 A CN 105445649A
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- circuit board
- infrared
- plate
- region
- circuit plate
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 24
- 230000000007 visual effect Effects 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims description 11
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004397 blinking Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0066—Radiation pyrometry, e.g. infrared or optical thermometry for hot spots detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses equipment and a method for detecting a circuit board and a device on the circuit board. The equipment comprises an adjustable rack, a carrier table which is disposed on the adjustable rack and used for placing a detected circuit board, an infrared camera, an infrared lens disposed on the infrared camera, and a main control computer platform with a function of visual analysis. The main control computer platform controls the carrier table to move, and obtains an infrared image of the infrared camera for intelligent recognition and analysis. The equipment and method employ the infrared radiation after the live-line operation of the circuit board. The infrared camera continuously collects dynamic infrared images in a set testing time duration, and detection software with a function of machine vision can track the temperature changes of the circuit board and all devices on the circuit board. Compared with standard sample values, the quality and stability of the devices on the circuit board are judged, thereby providing supporting information for the purchase of elements or the heat-radiation design of the circuit board, and improving the quality of an electronic product.
Description
Technical field
The present invention relates to technical field of circuit board detection, particularly relate to the Apparatus for () and method therefor of device on a kind of circuit board and plate thereof.
Background technology
In each electronic product, the quality of circuit board is the basic guarantee factor of Quality of electronic products.The structure of electronic product densification increasingly now, such as, adopts the micro component such as 01005,0201 in a large number in circuit board of mobile phone.The detection of more and more higher integrated level to product is had higher requirement.At present, in the detection of electronic product and printed circuit board (PCB) thereof, the welding laying particular emphasis on circuit board detects, as methods such as artificial visual detections, automatic optics inspection AOI, automatically X ray detection AXI.After said method is generally used for printed circuit board (PCB) processing, there is good discovery to explicit instant unfavorable condition in Product jointing processing.But interpretation ability is lacked to the bad or unstable properties situation exposed after the bad and long-time burning machine of a lot of implicit expression of the electronic devices and components on circuit board itself.
Publication number is the infrared measurement of temperature detection method that the Chinese invention patent of CN102183545B discloses a kind of testing circuit plate welding spot reliability.The method employing infrared laser sends a branch of infrared laser and gathers on the pad to be detected of circuit board, after continuing 0.1 ~ 1s time, thermal infrared imager is utilized to obtain the temperature dynamic image of this check point, and the temperature dynamic image at this check point pin place, thus obtain the temperature rising curve of this check point and the temperature rising curve at this check point pin place.If these two temperature rising curve distribution trends are identical, maximum temperature point is synchronous, and so this pad is qualified.The method adopts active infrared laser to irradiate, and focuses on the analysis of single solder joint, and circuit board is not in running order.
Publication number is that the Chinese utility model patent of CN204649634U discloses a kind of infrared imaging pick-up unit for surface-mounted devices.This device, except visible detection camera lens, is furnished with infrared light supply and infrared lens simultaneously.When detecting printed circuit board (PCB), gather visible images and infrared image, infrared image is in order to sophisticated image details simultaneously.By the fusion of infrared image and visible images, obtain the image that sharpness is higher.The method also adopts active infrared light source, focuses on that solder joint detects, and circuit board is not in running order.
Above two kinds of methods all lay particular emphasis on the weld defects of testing circuit plate, can not make Efficient Evaluation for the implicit expression shown after electronic product and circuit board long-play thereof is bad with quality defect.
Summary of the invention
The object of the present invention is to provide a kind of Apparatus for () and method therefor of device on testing circuit plate and plate thereof, which solve the technical matters of recessive trait defect that existing circuit board detecting can not produce when effectively testing circuit plate uses.
For achieving the above object, technical scheme proposed by the invention is:
A kind of equipment of device on testing circuit plate and plate thereof, it comprises: an adjustable rack, be located at the objective table for placing detected circuit plate on described adjustable rack, one infrared camera, be installed on the infrared lens on described infrared camera, and there is the main control computer platform of visual analysis function, described main control computer platform courses objective table moves, and the infrared image obtaining described infrared camera carries out Intelligent Recognition and analysis.
Adopt a detection method for the equipment of device on testing circuit plate and plate thereof as above, it comprises the following steps:
The first step, regulates adjustable rack, makes the detected circuit plate be positioned on objective table be placed in the visual field of the infrared lens of checkout equipment;
Second step, allows detected circuit plate power on operation, gathers the Dynamic infrared image of detected circuit plate at interval of certain hour;
3rd step, according to Dynamic infrared image, is set as region-of-interest by the region that some temperature significantly exceed than circuit board ambient temperature;
4th step, the modified-image of region-of-interest described in continuous collecting, judge according to reference value and permission disparity range, allow disparity range if exceed, alarm is abnormal.
Wherein, the region-of-interest in the 3rd described step comprises overlapping region, and described overlapping region is no more than three layers.
Wherein, the feature gathering the image of the Dynamic infrared image of region-of-interest in the 3rd described step comprises temperature variation, area change and region skew.
Wherein, described second step need repeat at least three times to the 4th step.
Wherein, the step generating quality report according to testing result is also comprised after the 4th described step.
The Apparatus for () and method therefor of device on testing circuit plate and plate thereof of the present invention, utilize the charged postrun infrared radiation of circuit board, gather Dynamic infrared image by continuous between infrared camera is in the length of testing speech of setting, the inspection software with machine vision function can the temperature variations of each device on tracking circuit plate and plate.After comparing with the data of master sample value, quality and the stability of device on plate can be judged, thus provide support information for batch buying of components and parts or the heat dissipation design of circuit board, improve the quality of electronic product.
Accompanying drawing explanation
Fig. 1 is the high-level schematic functional block diagram of the present invention's equipment of device on testing circuit plate and plate thereof.
Fig. 2 is the process flow diagram of the method for device on testing circuit plate and plate thereof of the present invention.
Fig. 3 be device on testing circuit plate and plate thereof of the present invention method wherein region-of-interest temperature variation statistics schematic diagram.
Embodiment
Below with reference to accompanying drawing, elaboration is further given to the present invention.
Refer to accompanying drawing 1, in an embodiment, the equipment of this kind device on testing circuit plate and plate thereof, it comprises: an adjustable rack 3, is located at objective table 4, infrared camera 2 for placing detected circuit plate on adjustable rack 3, be installed on the infrared lens 1 on described infrared camera 2, and there is the main control computer platform 5 of visual analysis function, described main control computer platform 5 controls objective table 4 and moves, and the infrared image obtaining described infrared camera 2 carries out Intelligent Recognition and analysis.More specifically, first detected circuit board is positioned on objective table 4, then controlling adjustable rack 3 by main control computer platform 5 makes the detected circuit plate on objective table automatically be positioned at the vision area of infrared lens 1, then, to power on operation to detected circuit plate, then gathered the infrared image of operating detected circuit plate by infrared camera 2 at interval of certain hour.Wherein, main control computer platform 5 is provided with the software of infrared machine vision and intellectual analysis function, monitors the changing features such as the temperature of region-of-interest from motion tracking, after continuing to monitor certain hour, generate quality report.
Refer to accompanying drawing 2, a kind of detection method adopting the equipment of device on testing circuit plate and plate thereof as above, this detection method comprises the following steps:
First step S1, regulates adjustable rack, makes the detected circuit plate be positioned on objective table be placed in the visual field of the infrared lens of checkout equipment; This automatically regulates is automatic control and adjustment based on main control computer platform 5.
Second step S2, allows detected circuit plate power on operation, gathers the Dynamic infrared image of detected circuit plate at interval of certain hour.Detect needs according to reality, setting certain hour interval, then gathers just at the Dynamic infrared image that operating circuit board runs, then image is returned to main control computer platform.
3rd step S3, according to Dynamic infrared image, is set as region-of-interest by the region that some temperature significantly exceed than circuit board ambient temperature.For the image that second step S2 returns, the inspection software of main control computer platform utilizes infrared machine vision algorithm, determines some region-of-interests, and this region-of-interest is the region that temperature significantly exceeds than circuit board ambient temperature.In a region-of-interest, the closed zonule that some temperature that can comprise or partly overlap are higher.Namely can the nested or little high-temperature area that partly overlaps in large regions, be usually nestedly no more than 3 layers.Physically, the corresponding device of a usual region-of-interest or certain combination of devices.
For each region-of-interest, inspection software based on experience value or the reference value of similar master sample provides reference temperature and the disparity range of allowing.Also can manual intervention input reference temperature and acceptable disparity range.
For each region-of-interest, the change of this region of inspection software continual analysis some time sheet in the past, comprises the change of temperature, the change of region area, the skew etc. of regional location.
4th step S4, the modified-image of region-of-interest described in continuous collecting, judge according to reference value and permission disparity range, allow disparity range if exceed, alarm is abnormal.Inspection software upgrades the dynamic statistics report of each region-of-interest simultaneously, upgrades the numerical value of each regional temperature, and after comparing with the disparity range of allowing with the reference value of master sample, draws the quality estimating of the device that each region is corresponding.Between the difference section of allowing as exceeded, be then that device quality corresponding to this region is undesirable.The change exceeding tolerance means and comprises the possible operation irregularity of circuit board: area accelerates suddenly to become large, and temperature raises fast.Inspection software meeting blinking region profile, provides warning.
Specifically, for unusual high temperature, may be short-circuited, warning need be provided immediately or cut off circuit board and power.
Wherein, described second step S2 need repeat at least three times to the 4th step S4.
Wherein, the step generating quality report according to testing result is also comprised after the 4th described step S4.
Refer to accompanying drawing 3, it is the temperature time curve figure made for one of them region-of-interest in the present embodiment, wherein, dotted line A and dotted line D is upper limit curve and the lower limit curve of the permission difference of region-of-interest, and wherein, B is the currency of region-of-interest, C curve is the reference value in this region, that is, change according to circuit board ruuning situation for the change of its temperature value of one of them region-of-interest, therefore it is also gradual change with reference to limit value.This reference value curve C can according to the job specification of different components and parts, and the situation such as the power in some circuit module region is determined.
Foregoing; be only preferred embodiment of the present invention; not for limiting embodiment of the present invention; those of ordinary skill in the art are according to central scope of the present invention and spirit; can carry out corresponding flexible or amendment very easily, therefore protection scope of the present invention should be as the criterion with the protection domain required by claims.
Claims (6)
1. the equipment of a device on testing circuit plate and plate thereof, it is characterized in that, comprise: an adjustable rack, be located at the objective table for placing detected circuit plate on described adjustable rack, one infrared camera, is installed on the infrared lens on described infrared camera, and has the main control computer platform of visual analysis function, described main control computer platform courses objective table moves, and the infrared image obtaining described infrared camera carries out Intelligent Recognition and analysis.
2. adopt a detection method for the equipment of device on testing circuit plate and plate thereof as claimed in claim 1, it is characterized in that, comprise the following steps:
The first step, regulates adjustable rack, makes the detected circuit plate be positioned on objective table be placed in the visual field of the infrared lens of checkout equipment;
Second step, allows detected circuit plate power on operation, gathers the Dynamic infrared image of detected circuit plate at interval of certain hour;
3rd step, according to Dynamic infrared image, is set as region-of-interest by the region that some temperature significantly exceed than circuit board ambient temperature;
4th step, the modified-image of region-of-interest described in continuous collecting, judge according to reference value and permission disparity range, allow disparity range if exceed, alarm is abnormal.
3. the method for device on testing circuit plate and plate thereof as claimed in claim 2, it is characterized in that, the region-of-interest in the 3rd described step comprises overlapping region, and described overlapping region is no more than three layers.
4. the method for device on testing circuit plate and plate thereof as claimed in claim 2, it is characterized in that, the feature gathering the image of the Dynamic infrared image of region-of-interest in the 3rd described step comprises temperature variation, area change and region skew.
5. the method for device on testing circuit plate and plate thereof as claimed in claim 2, it is characterized in that, described second step need repeat at least three times to the 4th step.
6. the method for device on testing circuit plate and plate thereof as claimed in claim 2, is characterized in that, also comprises the step generating quality report according to testing result after the 4th described step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026596.3A CN105445649B (en) | 2015-12-30 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026596.3A CN105445649B (en) | 2015-12-30 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105445649A true CN105445649A (en) | 2016-03-30 |
| CN105445649B CN105445649B (en) | 2019-07-16 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106501708A (en) * | 2016-12-24 | 2017-03-15 | 大连日佳电子有限公司 | On on-line checking circuit board, device leakage is inserted, inserts inclined method |
| CN106979820A (en) * | 2017-03-14 | 2017-07-25 | 西安电子科技大学 | Infrared temperature rise element method for detecting abnormality based on similarity measurement factor |
| CN107894562A (en) * | 2017-12-15 | 2018-04-10 | 北斗航天汽车（北京）有限公司 | Automobile circuit plate and its detecting system |
| CN108693462A (en) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技（深圳）有限公司 | Circuit board detecting method, system, readable storage medium storing program for executing, equipment and circuit board |
| CN108732484A (en) * | 2017-04-20 | 2018-11-02 | 深圳市朗驰欣创科技股份有限公司 | Detection method and detecting system for component positioning |
| CN111458589A (en) * | 2020-04-20 | 2020-07-28 | 西安中科长青医疗科技研究院有限公司 | Electromagnetic compatibility design verification method |
| CN113686601A (en) * | 2021-08-06 | 2021-11-23 | 东莞先导先进科技有限公司 | Analysis system, method and equipment for detecting TEC module performance and storage medium |
| CN114076888A (en) * | 2021-11-17 | 2022-02-22 | 北京芯同汇科技有限公司 | Circuit board radiation field frequency spectrum component measuring device and circuit board operation detection method |
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| US20090102487A1 (en) * | 2007-10-19 | 2009-04-23 | International Business Machines Corporation | Method for Validating Printed Circuit Board Materials for High Speed Applications |
| CN101832950A (en) * | 2010-04-28 | 2010-09-15 | 深圳创维－Rgb电子有限公司 | PCB quality detection method, system and device |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
| CN103675595A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
| CN204649634U (en) * | 2015-03-30 | 2015-09-16 | 华南理工大学 | A kind of infrared imaging pick-up unit for surface-mounted devices |
| CN103399248B (en) * | 2013-07-18 | 2015-09-23 | 江苏物联网研究发展中心 | PCB defect batch inspection system and method |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20090102487A1 (en) * | 2007-10-19 | 2009-04-23 | International Business Machines Corporation | Method for Validating Printed Circuit Board Materials for High Speed Applications |
| CN101832950A (en) * | 2010-04-28 | 2010-09-15 | 深圳创维－Rgb电子有限公司 | PCB quality detection method, system and device |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
| CN103399248B (en) * | 2013-07-18 | 2015-09-23 | 江苏物联网研究发展中心 | PCB defect batch inspection system and method |
| CN103675595A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
| CN204649634U (en) * | 2015-03-30 | 2015-09-16 | 华南理工大学 | A kind of infrared imaging pick-up unit for surface-mounted devices |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106501708A (en) * | 2016-12-24 | 2017-03-15 | 大连日佳电子有限公司 | On on-line checking circuit board, device leakage is inserted, inserts inclined method |
| CN106979820A (en) * | 2017-03-14 | 2017-07-25 | 西安电子科技大学 | Infrared temperature rise element method for detecting abnormality based on similarity measurement factor |
| CN106979820B (en) * | 2017-03-14 | 2019-02-19 | 西安电子科技大学 | Infrared temperature rise element method for detecting abnormality based on similarity measurement factor |
| CN108732484A (en) * | 2017-04-20 | 2018-11-02 | 深圳市朗驰欣创科技股份有限公司 | Detection method and detecting system for component positioning |
| CN107894562A (en) * | 2017-12-15 | 2018-04-10 | 北斗航天汽车（北京）有限公司 | Automobile circuit plate and its detecting system |
| CN108693462A (en) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技（深圳）有限公司 | Circuit board detecting method, system, readable storage medium storing program for executing, equipment and circuit board |
| CN111458589A (en) * | 2020-04-20 | 2020-07-28 | 西安中科长青医疗科技研究院有限公司 | Electromagnetic compatibility design verification method |
| CN113686601A (en) * | 2021-08-06 | 2021-11-23 | 东莞先导先进科技有限公司 | Analysis system, method and equipment for detecting TEC module performance and storage medium |
| CN114076888A (en) * | 2021-11-17 | 2022-02-22 | 北京芯同汇科技有限公司 | Circuit board radiation field frequency spectrum component measuring device and circuit board operation detection method |
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