CN105430893A - Substrate, mesh plate, radio frequency payment module and wearable equipment - Google Patents
Substrate, mesh plate, radio frequency payment module and wearable equipment Download PDFInfo
- Publication number
- CN105430893A CN105430893A CN201510971511.2A CN201510971511A CN105430893A CN 105430893 A CN105430893 A CN 105430893A CN 201510971511 A CN201510971511 A CN 201510971511A CN 105430893 A CN105430893 A CN 105430893A
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- CN
- China
- Prior art keywords
- pad
- substrate
- welding disking
- disking area
- radio frequency
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a substrate, a mesh plate, a radio frequency payment module and wearable equipment, and belongs to the field of a printed circuit board. A first bonding pad (20) is arranged in a bonding pad region (10) of the substrate; the first bonding pad (20) is an inner windowing bonding pad; the region, except the first bonding pad (20), in the bonding pad region (10) is covered with solder resist; and the inner windowing bonding pad refers to that the size of the first bonding pad (20) is smaller than that of the bonding pad region (10). By adoption of the substrate provided by the invention, the problem that the radio frequency payment module falls off after the radio frequency payment module is welded can be effectively solved, and the successful rate of the radio frequency payment module is improved; the mesh plate is adopted for welding the bonding pad of the radio frequency payment module with the bonding pad of carrier equipment of the radio frequency payment module on the PCB, and the problem of voids in the interior of soldering tin can be effectively solved; and the promotion of equipment with built-in radio frequency payment modules can be facilitated.
Description
Technical field
The present invention relates to art of printed circuit boards, be specifically related to a kind of substrate, web plate, radio frequency payment module and the wearable device that solve Pad off on printed circuit board (PCB).
Background technology
Along with the wearable device of small amount payment is widelyd popularize, people to performance, the outward appearance of wearable device, cost needs can be more and more higher, the demand being placed in wearable device radio frequency payment module becomes increasingly conspicuous progressively strengthening the price competition each other of wearable device manufacturer.
At present, when radio frequency payment module is placed in wearable device, its structure and manufacture craft as shown in Figure 1, there is shown printed circuit board (PCB) and the pcb board 4 of plastic packaging layer 1, the substrate 2 of radio frequency payment module, tin cream 3 and wearable device.The pad 5 of radio frequency payment module adopts swinging-out casement window mode, the substrate of radio frequency payment module (LGA encapsulation) and the pad of pcb board in the same size, in welding, upper and lower pad overlaps.And there is following problem in this structure and manufacture craft:
One: the pad 6 three opening size about 1.1mm*0.6mm of the pad 5 of radio frequency payment module, steel mesh 3 and wearable device, easily produces bubble in welding; Its two: the wearable device of inserting radio frequency payment module adopts negative and positive plates welding manner, in addition radio frequency payment module pad thickness is less than wearable device PCB pad thickness about 3 times, thus at the pad of welding process radio frequency payment module with wearable device PCB pad at tin solidification process phase repulsive interaction, the repulsive force intensity produced is different, thus causes radio frequency payment module pad to depart from; Its three: radio frequency payment module pad adopts swinging-out casement window mode (welding disking area reserved on substrate is identical with the actual occupied area of pad), pad adopts glue bonding way, make pad be in substrate surface, radio frequency payment module is crossed in stove and squeegee is heated cause pad to depart from.Above 3 points, cause the pad of radio frequency payment module easily to depart from, and can cause the bad finished product of 20%, limit wideling popularize of radio frequency payment module.
Summary of the invention
For the defect existed in prior art, the object of the present invention is to provide the substrate of Pad off on a kind of substrate that effectively can prevent radio frequency payment module, web plate, radio-frequency module and wearable device.
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of substrate, offer the first pad in the welding disking area of described substrate, described first pad is inwardly opened window pad, and the region in welding disking area outside the first pad is covered by solder resist; Inwardly opened window pad refers to that the first pad size is less than the size of welding disking area.
Further, a kind of substrate as above, described welding disking area is rectangle, circle or square; The shape of described first pad is identical with the shape of welding disking area, and the described edge of the first pad flushes with the edge of welding disking area.
Further, a kind of substrate as above, the center superposition of described first pad center and welding disking area; Or,
When described welding disking area is square, if described welding disking area is at substrate edges, first pad and welding disking area be positioned at substrate edges while overlap, first pad is symmetrical arranged along the perpendicular bisector on this limit, if described welding disking area is not at substrate edges, the center superposition of described first pad center and welding disking area.
Further, a kind of substrate as above, the width of the neighboring area covered by solder resist in welding disking area is not less than setting width.
Further, a kind of substrate as above, when described welding disking area is rectangle, welding disking area is of a size of 1.4mm*0.8mm, and the first pad is of a size of 1.2mm*0.6mm.
Additionally provide a kind of web plate corresponding with aforesaid substrate in the embodiment of the present invention, the position of the network interface of web plate and the position one_to_one corresponding of described first pad, the size of network interface is not more than the size of the first pad.
Further, a kind of web plate as above, described network interface comprises along symmetrically arranged four rims of the mouth of network interface central cross line, and the outward flange in four rims of the mouth flushes with the edge of the first pad.
Further, a kind of web plate as above, described first pad is rectangle, and the first pad is of a size of 1.2mm*0.6mm, and described network interface is of a size of 0.9mm*0.4mm.
Additionally provide a kind of radio frequency payment module in the embodiment of the present invention, described radio frequency payment module comprises substrate as above.
Additionally provide a kind of wearable device in the embodiment of the present invention, described wearable device comprises above-mentioned radio frequency payment module and equipment pcb board, and the size of the second pad docked with the first pad on described equipment pcb board is not more than the size of the first pad.
Beneficial effect of the present invention is: the radio frequency payment module adopting substrate provided by the present invention, effectively can solve the problem of radio frequency payment module Pad off after welding, improve the success rate of radio frequency payment module, adopt the pad solder that web plate provided by the present invention carries out on the pcb board of the pad of radio frequency payment module and the vehicle equipment of radio frequency payment module, effectively can solve the empty problem of scolding tin inside, be conducive to the popularization of the equipment of built-in radio frequency payment module.
Accompanying drawing explanation
Fig. 1 be the existing pad of radio frequency payment module with the pad of the pcb board of wearable device weld schematic diagram;
A kind of structural representation of substrate of Fig. 2 for providing in the specific embodiment of the invention;
Fig. 3 is the schematic diagram of the welding disking area of substrate shown in Fig. 2;
The schematic diagram of the first pad in the welding disking area that Fig. 4 is substrate shown in Fig. 2;
A kind of structural representation of web plate of Fig. 5 for providing in the specific embodiment of the invention;
Fig. 6 is the schematic diagram of the pad structure on a kind of pcb board of wearable device that provides in the specific embodiment of the invention;
Fig. 7 is the schematic diagram of the pad of substrate in embodiment and the pad solder assembling of pcb board.
Embodiment
Below in conjunction with Figure of description and embodiment, the present invention is described in further detail.
Fig. 2 shows the structural representation of a kind of substrate provided in the specific embodiment of the invention, the first pad 20 is offered in the welding disking area 10 of described substrate, described first pad 20 is inwardly opened window pad, and the region in welding disking area 10 outside first pad 20 is covered by solder resist; Inwardly opened window pad refers to that the first pad 20 size is less than the size of welding disking area 10.
In present embodiment, described welding disking area 10 refer on substrate the design welding disking area reserved by pad, the region of region shared by first pad 20 for applying in the welding disking area reserved, that is, the pad that expose of the first pad 20 for seeing after completing, the difference section of welding disking area 10 and the first pad 20 is covered by solder resist.Namely solder resist covers that layer film be furnished with on circuit boards above copper cash, includes but not limited to the solder resist of existing green or other color.
In actual design, the shape of described welding disking area 10 can be designed to the various shapes such as square (rectangle or square) or circle as required.First pad 20 also can be designed to different shapes, and preferably, the shape of described first pad 20 is identical with the shape of welding disking area 10, and the edge of described first pad 20 flushes with the edge of welding disking area 10.
First position of pad 20 in welding disking area 10, can arrange according to actual conditions, the center of described first pad 20 can be directly the center superposition with welding disking area 20, or, when welding disking area is square, if welding disking area 10 is at substrate edges, the first pad 20 is positioned at overlapping of substrate edges with welding disking area 10, first pad 20 is symmetrical arranged along the perpendicular bisector on this limit, as shown in Figure 2; When described welding disking area 10 is not at substrate edges, the described center of the first pad 20 and the center superposition of welding disking area 10.Certainly, in actual design, welding disking area 10 when substrate edges, the first pad 20 center also can with the center superposition of welding disking area 10, but adopt the mode shown in Fig. 2 more conserve space.
In order to the more effective disengaging preventing pad, improve the peel strength of pad, in present embodiment, the width of the neighboring area covered by solder resist in described welding disking area 10 is not less than setting width.
Fig. 3 and Fig. 4 to respectively illustrate in present embodiment shown in Fig. 2 to substrate on welding disking area 10 and the schematic diagram of the first pad 20, in present embodiment, welding disking area 10 and the first pad 20 are rectangle structure, welding disking area 10 is of a size of 1.4mm*0.8mm, and the first pad 20 is of a size of 1.2mm*0.6mm.
The aforesaid substrate provided in present embodiment and printed circuit board (PCB), the pad on it adopts inwardly opened window mode, and the region in welding disking area outside pad is covered by solder resist, adopts which effectively to prevent pad from coming off from substrate.
Additionally provide a kind of web plate corresponding with the substrate shown in Fig. 2 in present embodiment, as shown in Figure 5, the position of the network interface 30 of web plate and the position one_to_one corresponding of described first pad 20, the size of network interface 30 is not more than the size of the first pad 20.
The shape of the network interface 30 of web plate can be adopt existing network interface form.
In order to when being conducive to welding, the air of tin cream inside is discharged, improve welding quality, in present embodiment, described network interface 30 comprises along symmetrically arranged four rims of the mouth 31 of network interface central cross line, when adopting this web plate to be tin cream on the first pad 20, the outward flange in four rims of the mouth 31 flushes with the edge of the first pad 20, as shown in Figure 5, on the first pad 20, during tin cream, tin cream can be divided into four parts by this network interface automatically, tin cream from four rims of the mouth 31 of network interface 30 by falling.In present embodiment, the gap between four rims of the mouth 31 is 0.1mm.
In actual design, the size of network interface 30 can be processed according to the size of the first pad 20, as long as ensure that the size of network interface 30 is not more than the size of the first pad 20, preferably, the global shape of network interface 30 is identical with the shape of the first pad 20, for the first pad 20 shown in Fig. 4, first pad 20 is rectangle, first pad 20 is of a size of 1.2mm*0.6mm, now, network interface 30 also can be designed to rectangle, as shown in Figure 5, in present embodiment, network interface 30 is of a size of 0.9mm*0.4mm.
A kind of radio frequency payment module is additionally provided, the substrate of substrate for providing in present embodiment of this radio frequency payment module in present embodiment.
A kind of wearable device is additionally provided in present embodiment, this wearable device comprises the printed circuit board (PCB) of equipment and equipment pcb board and above-mentioned radio frequency payment module, wherein, the size of the second pad 40 docked with the first pad on described equipment pcb board is not more than the size of the first pad 20, as shown in Figure 6.
In actual applications, the size of described second pad 40 also can take into account the network interface size of web plate, and the size of the second pad 40 is not less than the network interface size of web plate.In present embodiment, described first pad 20 is rectangle, and it is of a size of 1.2mm*0.6mm, and the network interface of web plate is of a size of 0.9mm*0.4mm, and the second pad 30 is of a size of 1mm*0.4mm, as shown in Figure 6.Fig. 7 shows the structural representation the first pad 20 on the substrate of radio frequency payment module and the second pad 30 of the pcb board of wearable device being carried out welding assembly, and when assembling, what position, four rims of the mouth 31 was corresponding is tin cream, further comprises plastic packaging layer 50 in figure.
The radio frequency payment module provided in present embodiment is provided, when radio frequency payment module is placed in wearable device, pad solder on the pcb board of the pad on the substrate of radio frequency payment module, tin cream, Wearable together time, the pad that can effectively solve on the substrate of radio frequency payment module departs from and tin cream air bubble problem, improves rate of finished products.
Needs illustrate, the substrate provided in present embodiment, except the radio frequency payment module be applied in present embodiment, are suitable for equally and need two substrates to carry out the situation of pad solder in other electronic device module.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technology thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a substrate, it is characterized in that: in the welding disking area (10) of described substrate, offer the first pad (20), described first pad (20) is inwardly opened window pad, and the region in welding disking area (10) outside the first pad (20) is covered by solder resist; Inwardly opened window pad refers to that the first pad (20) size is less than the size of welding disking area (10).
2. a kind of substrate according to claim 1, is characterized in that: described welding disking area (10) is for square or circular; The edge of described first pad (20) flushes with the edge of welding disking area (10).
3. a kind of substrate according to claim 2, is characterized in that: the center superposition of described first pad (20) center and welding disking area (10); Or,
When described welding disking area (10) is for time square, if described welding disking area (10) is at substrate edges, first pad (20) and welding disking area (10) be positioned at substrate edges while overlap, first pad (20) is symmetrical arranged along the perpendicular bisector on this limit, if described welding disking area (10) is not at substrate edges, the center superposition of described first pad (20) center and welding disking area (10).
4. according to a kind of substrate one of claims 1 to 3 Suo Shu, it is characterized in that: the width of the neighboring area covered by solder resist in welding disking area (10) is not less than setting width.
5. according to a kind of substrate one of claim 2 to 4 Suo Shu, it is characterized in that: when described welding disking area (10) and the first pad (20) are for rectangle, welding disking area (10) is of a size of 1.4mm*0.8mm, and the first pad (20) is of a size of 1.2mm*0.6mm.
6. based on a kind of web plate of substrate described in claim 1, it is characterized in that: the position of the network interface (30) of web plate and the position one_to_one corresponding of described first pad (20), the size of network interface (30) is not more than the size of the first pad (20).
7. a kind of web plate according to claim 6, it is characterized in that: described network interface (30) comprises along symmetrically arranged four rims of the mouth (31) of network interface central cross line, and the outward flange of four rims of the mouth (31) flushes with the edge of the first pad (20).
8. a kind of web plate according to claim 6 or 7, it is characterized in that: described first pad (20) is rectangle, first pad (20) is of a size of 1.2mm*0.6mm, and described network interface (30) is of a size of 0.9mm*0.4mm.
9. a radio frequency payment module, is characterized in that: described radio frequency payment module comprises the described substrate of one of claim 1 to 5.
10. a wearable device, it is characterized in that: described wearable device comprises the radio frequency payment module described in claim 9 and equipment pcb board, the size of the second pad (40) docked with the first pad (20) on described equipment pcb board is not more than the size of the first pad (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510971511.2A CN105430893A (en) | 2015-12-22 | 2015-12-22 | Substrate, mesh plate, radio frequency payment module and wearable equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510971511.2A CN105430893A (en) | 2015-12-22 | 2015-12-22 | Substrate, mesh plate, radio frequency payment module and wearable equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430893A true CN105430893A (en) | 2016-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510971511.2A Pending CN105430893A (en) | 2015-12-22 | 2015-12-22 | Substrate, mesh plate, radio frequency payment module and wearable equipment |
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| CN (1) | CN105430893A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318230A (en) * | 2017-06-29 | 2017-11-03 | 广东美芝制冷设备有限公司 | Make the tool and method, converter circuit plate and frequency converter of converter circuit plate |
| CN107872928A (en) * | 2017-11-30 | 2018-04-03 | 厦门强力巨彩光电科技有限公司 | A kind of LED module copper post, copper post pad, the welding method of web plate and copper post |
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|---|---|---|---|---|
| JP2006147723A (en) * | 2004-11-17 | 2006-06-08 | Sharp Corp | Electric circuit board for semiconductor element |
| CN102098871A (en) * | 2009-12-09 | 2011-06-15 | 上海广电住金微电子有限公司 | Anti-stripping soldering-pan for printed circuit board |
| CN203983260U (en) * | 2014-07-09 | 2014-12-03 | 上海卓悠网络科技有限公司 | A kind of project organization of the IC device based on QFN, QFP or SOP encapsulation technology |
| CN104470248A (en) * | 2014-12-12 | 2015-03-25 | 上海斐讯数据通信技术有限公司 | Steel mesh optimizing method |
| CN205356805U (en) * | 2015-12-22 | 2016-06-29 | 北京握奇智能科技有限公司 | Base plate, otter board, radio frequency payment module and wearable equipment |
-
2015
- 2015-12-22 CN CN201510971511.2A patent/CN105430893A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147723A (en) * | 2004-11-17 | 2006-06-08 | Sharp Corp | Electric circuit board for semiconductor element |
| CN102098871A (en) * | 2009-12-09 | 2011-06-15 | 上海广电住金微电子有限公司 | Anti-stripping soldering-pan for printed circuit board |
| CN203983260U (en) * | 2014-07-09 | 2014-12-03 | 上海卓悠网络科技有限公司 | A kind of project organization of the IC device based on QFN, QFP or SOP encapsulation technology |
| CN104470248A (en) * | 2014-12-12 | 2015-03-25 | 上海斐讯数据通信技术有限公司 | Steel mesh optimizing method |
| CN205356805U (en) * | 2015-12-22 | 2016-06-29 | 北京握奇智能科技有限公司 | Base plate, otter board, radio frequency payment module and wearable equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318230A (en) * | 2017-06-29 | 2017-11-03 | 广东美芝制冷设备有限公司 | Make the tool and method, converter circuit plate and frequency converter of converter circuit plate |
| CN107872928A (en) * | 2017-11-30 | 2018-04-03 | 厦门强力巨彩光电科技有限公司 | A kind of LED module copper post, copper post pad, the welding method of web plate and copper post |
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Application publication date: 20160323 |