CN103391694A - Manufacturing method for flexible printed circuit board - Google Patents
Manufacturing method for flexible printed circuit board Download PDFInfo
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- CN103391694A CN103391694A CN2012101434418A CN201210143441A CN103391694A CN 103391694 A CN103391694 A CN 103391694A CN 2012101434418 A CN2012101434418 A CN 2012101434418A CN 201210143441 A CN201210143441 A CN 201210143441A CN 103391694 A CN103391694 A CN 103391694A
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- heating
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- circuit board
- blind slot
- articulamentum
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Abstract
A manufacturing method for a flexible printed circuit board comprises the following steps: providing a bearing device, wherein the bearing device comprises a bearing board, a resin connecting layer and an adhering layer arranged between the bearing board and the resin connecting layer; providing a substrate of the flexible printed circuit board, wherein the substrate of the flexible printed circuit board comprises a basal layer, a conducting circuit layer and a solder mask layer, and is provided with a product area and a waste material area around the product area; forming a heating blind slot in the waste material area, wherein the basal layer is exposed out of the basal layer; heating and softening the basal layer of the corresponding heating blind slot and the connecting layer to be fused, and bonding the basal layer and the connecting layer; printing a solder paste; pasting an electronic element on the solder paste; fusing and solidifying the solder paste through a reflow oven; removing the waste material area to obtain the flexible printed circuit board.
Description
Technical field
The present invention relates to circuit board technology, particularly the manufacture method of flexible PCB.
Background technology
extensive use along with flexible materials such as polyimide films in electronics industry (sees also Sugimoto, E. in 1989 " the Applications of polyimide films to the electrical and electronic industries in Japan " that are published in the 5th the 1st phase of volume of IEEE Electrical Insulation Magazine), flexible PCB (Flexible Printed Circuit Board, FPCB) bent because having, lightweight, take up room little, but the advantages such as three-dimensional wiring, in notebook, liquid crystal display, digital camera, the consumption electronic products aspects such as mobile phone are widely used.
In the production process of existing flexible PCB, when print solder paste, usually carry out on a loading plate, the flexible PCB that is printed with tin cream carries out mounting of electronic component through chip mounter subsequently, make afterwards flexible PCB through Overwelding and rewelding furnace, cooling again after tin cream is melted, and then electronic component firmly is incorporated on flexible PCB.The mounting and in the step of Overwelding and rewelding furnace, all need flexible PCB entirely to be attached on loading plate of described paste solder printing, electronic component, existing loading plate adopts intermediate plate etc. to carry out clamping to flexible PCB usually.Yet intermediate plate there will be loosening after using for a long time or repeatedly, make the flexible PCB that is held owing to edge warping can't clampedly occurring, and then the quality of flexible PCB is reduced.
Summary of the invention
In view of this, be necessary to provide a kind of flexible circuit board manufacturing method that can effectively avoid the flexible PCB edge warping.
A kind of manufacture method of flexible PCB, comprise step: provide a bogey, it comprises a loading plate, an adhesion layer and a resin articulamentum that sets gradually, and this adhesion layer is attached to the surface of this loading plate, and this resin articulamentum is bonded to this adhesion layer surface; One flexible circuit board substrate is provided, this flexible circuit board substrate comprises dielectric base layer, conducting wire layer and the welding resisting layer that sets gradually, this conducting wire layer has the splicing ear that exposes from this welding resisting layer, and this flexible circuit board substrate comprises that product zone reaches the garbage area around this product zone; Form at least one heating blind slot in the garbage area of this flexible circuit board substrate, this heating blind slot only runs through this welding resisting layer and this conducting wire layer, so that this basalis of part is exposed in this heating blind slot; Using at least one heating element to insert in this at least one heating blind slot heats, so that this part is exposed to that basalis in this heating blind slot is heated to soften and the part articulamentum corresponding with it is bonding, this at least one heating element is symmetrical with respect to this product zone; Remove this at least one heating element from this at least one heating blind slot; In the splicing ear print solder paste of this conducting wire layer, and place electronic component on this tin cream; Make this electronic component fixedly be mounted on the splicing ear of this flexible circuit board after making tin cream heating and melting and cooling curing by reflow; And along the border of product zone and garbage area, cut this prefabricated circuit board, this articulamentum and this adhesion layer, thus remove this garbage area, obtain the product zone of with articulamentum, separating.
In the flexible circuit board manufacturing method of the present embodiment, in the step of print solder paste, paster and logical Overwelding and rewelding furnace, the basalis of this flexible circuit board substrate and the articulamentum of brace are adhesively fixed mutually, and brace adheres to this loading plate by adhesion layer, therefore can prevent that edge warping from appearring in this flexible circuit board substrate in above-mentioned steps, thereby improve the quality of this flexible PCB.
Description of drawings
Fig. 1 is the schematic diagram of the bogey that provides of the embodiment of the present invention.
Fig. 2 is the schematic diagram of the flexible circuit board substrate that provides of the embodiment of the present invention.
Fig. 3 is the schematic diagram after flexible circuit board substrate shown in Figure 2 forms the heating blind slot.
Fig. 4 is positioned over flexible circuit board substrate shown in Figure 3 on bogey shown in Figure 2 and through the schematic diagram of heating rod heating.
Fig. 5 is with the schematic diagram after the flexible circuit board substrate print solder paste in Fig. 4.
Fig. 6 is with the schematic diagram after the flexible circuit board substrate mounted with electronic components in Fig. 5.
Fig. 7 is that flexible PCB and the bogey in Fig. 6 forms the schematic diagram of the flexible PCB of moulding after cutting.
Fig. 8 is the schematic diagram that the flexible PCB in Fig. 7 and this bogey are separated.
The main element symbol description
| Circuit |
10 |
| Loading |
12 |
| |
14 |
| |
142 |
| |
144 |
| Flexible |
20 |
| Basalis | 22 |
| The conducting |
24 |
| |
26 |
| |
202 |
| |
204 |
| |
28 |
| |
206 |
| The heating blind slot | 208 |
| |
30 |
| |
40 |
| |
50 |
| |
60 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1 to Fig. 8, the embodiment of the present invention provides a kind of manufacture method of flexible PCB, and the manufacture method of this flexible PCB comprises the following steps.
The first step, as shown in Figure 1, provide a circuit board bearing device 10, and this circuit board bearing device 10 comprises that a loading plate 12 and is attached to the brace 14 of this loading plate 12.
This loading plate 12 is the rectangular plate shape body of aluminum, is used for supporting fixing this brace 14, and this loading plate 12 is smooth surface adjacent to the surface of this brace 14.This brace 14 comprises an articulamentum 142 and an adhesion layer 144, this adhesion layer 144 is arranged between this loading plate 12 and this articulamentum 142, this adhesion layer 144 is of similar shape and area with this articulamentum 142, in the present embodiment, this adhesion layer 144 and this articulamentum 142 be shaped as rectangle, and the area of this adhesion layer 144 and this articulamentum 142 is less than the area of this loading plate 12.In the present embodiment, this articulamentum 142 is resin material, it is optional from polyimides (Polyimide, PI), PETG (Polyethylene Terephtalate, PET) or PEN (Polythylene Naphthalate, PEN).This adhesion layer 144 is PET, and a surface of this adhesion layer 144 attaches and is fixed in this articulamentum 142 surfaces by viscose glue, and another surface of this adhesion layer 144 is attached at the surface of this loading plate 12 by the mode of Electrostatic Absorption.
Be appreciated that this adhesion layer 144 also can be the peelable type double coated film, this moment, two relative surfaces of this adhesion layer 144 were fixed with the surface of this articulamentum 142 and the surface adhesion of this loading plate 12 respectively.
Second step, as shown in Figure 2, provide a flexible circuit board substrate 20, this flexible circuit board substrate 20 comprise an insulation basalis 22, be formed at the conducting wire layer 24 on these basalis 22 surfaces and be formed at the welding resisting layer 26 on these conducting wire layer 24 surfaces.This conducting wire layer 24 has the splicing ear 28 that exposes from this welding resisting layer 26, is used in the successive process print solder paste thereon.Described splicing ear 28 refers to pad, the first-class terminal contact of edge joint.
The material of this basalis 22 can be selected from PI, PET or PEN, and preferably, this basalis 22 is identical with the material of this articulamentum 142.
This conducting wire layer 24 can form by the following method: at first, in basalis 22 surface pressure combined pressures, prolong Copper Foil, then, by image transferring process and etch process, rolled copper foil is made this conducting wire layer 24.Certainly, this conducting wire layer 24 also can be formed by other method,, as electroplating process or ink jet printing processing procedure etc., is not limited to the present embodiment.In the present embodiment, this welding resisting layer 26 is formed at anti-solder ink on the surface of this conducting wire layer 24 by the method for screen painting.
This flexible circuit board substrate 20 comprises the garbage area 204 that product zone 202 reaches around this product zone 202.Product zone 202 is follow-up zone of making circuit board product.This garbage area 204 is to need the zone of removing after follow-up formation flexible PCB completes, and this garbage area 204 is formed at the surrounding of this product zone 202, and around this product zone 202, forms closed forms.In the present embodiment, has border 206 between this product zone 202 and this garbage area 204.
The 3rd step, see also Fig. 3, in the interior formation one heating blind slot 208 of this garbage area 204, this heating blind slot 208 penetrates this welding resisting layer 26 and conducting wire layer 24, and keep heating this basalis 22 of blind slot 208 parts, this basalis 22 is exposed in this heating blind slot 208.
Preferably, heating blind slot 208 is offered along the border 206 between this product zone 202 and this garbage area 204.In the present embodiment, this heating blind slot 208 is the 206 closed hoop blind slots of offering along border, is appreciated that this heating blind slot 208 also can be the 206 a plurality of grooves that form and around this product zone 202, be interrupted arrangements along border.This heating blind slot 208 can form by image transferring process and etch process, also can form by the method for laser drill.
In the 4th step, see also Fig. 4, and this flexible circuit board substrate 20 that will be formed with heating blind slot 208 is positioned on this circuit board bearing device 10, and this basalis 22 is contacted with the articulamentum 142 of this brace.
The 5th step, a plurality of heating rods 30 are inserted in this heating blind slot 208 and are pressed on this basalis 22, the temperature of this heating rod 30 is greater than the glass transition temperature of this basalis 22 and articulamentum 142, make the basalis 22 in corresponding heating blind slot 208 zones are connected with articulamentum melting and mutually adhesion connect, then remove this a plurality of heating rods 30 and cooling this basalis 22 and articulamentum 142, make the basalis 22 in corresponding heating blind slot 208 zones mutually bonding with articulamentum 142.
The mode of heating of these a plurality of heating rods 30 can be Electromagnetic Heating, and this heating rod 30 can be cylindric or polygon prism shape etc.These a plurality of heating rods 30 are symmetrical with respect to this product zone 202, and preferably, this heating rod 30 heats the interior equidistant arrangement of blind slot 208 at this, and is covered with the cephalocaudal whole zone of this heating blind slot 208.In the present embodiment, this basalis 22 is identical with the material of articulamentum 142, and its glass transition temperature is 260 ℃, and the heating-up temperature of this heating rod 30 is 300 ℃, and so heating rod 30 can heat this basalis 22 and articulamentum 142 and is molten condition and adhesion mutually.Preferably, these a plurality of heating rods 30 before inserting this heating blind slot 208 its temperature greater than the glass transition temperature of this basalis 22 and articulamentum 142, when the moment of heating rod 30 these basalises 22 of contact, this basalis 22 and articulamentum 142 are melting and mutually bonding, can remove immediately this a plurality of heating rods 30 this moment, makes this basalis 22 and articulamentum 142 cooling as early as possible.Therefore, heating rod 30 is shorter with the time of contact of basalis 22, be preferably and be less than or equal to 0.5 second, basalis 22 and articulamentum 142 were adhesively fixed, also can avoid basalis 22 and articulamentum 142 heating of 30 pairs of product zone 202 of heating rod, and cause the bonding of the interior basalis 22 of product zone 202 and articulamentum 142.
Be appreciated that also replaceable heating element for other of these a plurality of heating rods 30, closed hoop heating plate as corresponding in the extension shape with this heating blind slot, utilize the end of ring-type heating plate to contact with this basalis 22.Be appreciated that equally this heating blind slot 208 also can comprise each other equidistantly distribution and a plurality of grooves symmetrical with respect to product zone, this heating rod 30 is corresponding one by one with a plurality of grooves, and while heating, each heating rod 30 inserts in a groove.
, through the 5th step, mutually be adhesively fixed corresponding to the basalis 22 and the articulamentum 142 that heat blind slot 208 zones, though and the basalis 22 in product zone 202 and articulamentum 142 are adjacent to the structure for being separated from each other mutually.
In the 6th step, see also Fig. 5, at the splicing ear 28 print solder paste layers 40 of this conducting wire layer 24.
In this step, tin paste layer 40 forms by the mode of screen painting, and is specific as follows: a steel plate (scheming not method) with through hole of predetermined pattern is provided, and the position of the through hole of this predetermined pattern is corresponding with shape and the size of this splicing ear 28; Steel plate is positioned on this flexible circuit board substrate 20, and the through hole that makes predetermined pattern is over against this splicing ear 28; The tin cream material is arranged at this surface of steel plate, and utilizes scraper that tin cream is squeezed on splicing ear 28 from the through hole of predetermined pattern, form this tin paste layer 40.
In the 7th step, see also Fig. 6, utilizes chip mounter that electronic component 50 is placed on this tin paste layer 40.
This electronic component 50 can be any elements that need Placement such as resistance, electric capacity, chip, this chip mounter is generally the electrical integrated chip mounter of Full-automatic machine, be mounted on tin paste layer 40 draw the material of electronic component 50 by suction nozzle after, this chip mounter can be middling speed chip mounter, high speed placement system, ultrahigh speed chip mounter etc.
The 8th step, to mount the flexible circuit board substrate 20 of electronic component 50 by a reflow stove (not shown), heat to making tin paste layer 40 fusings more than the fusion temperature of tin paste layer 40 with hot blast or infrared ray, be cooled to again afterwards below tin paste layer 40 fusion temperatures tin paste layer 40 is solidified, thereby electronic component 50 adhesions are fixed on this tin paste layer 40.
The 9th step, see also Fig. 7 and Fig. 8, flexible circuit board substrate 20 and the brace 14 of electronic component 50 have been fixed along the border 206 cutting adhesions between this product zone 202 and this garbage area 204, this garbage area 204 and the brace 14 corresponding with this garbage area 204 come off and remove after cutting, so can obtain the product zone 202 of with brace 14, separating, that is, obtain the flexible PCB 60 of moulding.
Cutting this flexible circuit board substrate 20 and this brace 14 can adopt the method for laser cutting or machine cuts to carry out.Owing to being the structure that is separated from each other between this product zone 202 and corresponding this brace 14, so this flexible PCB 60 can easily be taken away from these brace 14 surfaces.This flexible PCB 60 of moulding comprises basalis 22, is formed at the conducting wire layer 24 on basalis 22 surfaces, the electronic component 50 that is formed at the welding resisting layer 26 on conducting wire layer 24 surface and adheres to the splicing ear 28 of conducting wire layer 24.In addition, because brace 14 is that Electrostatic Absorption and loading plate 12 by 22 of articulamentum 142 and basalises is adjacent to mutually, so brace 14 can be removed from this loading plate 12 at an easy rate.
Be appreciated that this flexible circuit board substrate 20 can also be for having the multi-layer sheet of multilayer conductive circuit layer 24, as long as a wherein outermost layer of this flexible circuit board substrate 20 is basalis 22.
In the present embodiment, in the step of print solder paste, paster and logical Overwelding and rewelding furnace, the surrounding part of the basalis 22 of this flexible circuit board substrate 20 is adhesively fixed mutually with the articulamentum 142 of brace, and brace tightly attaches by adhesion layer 144 and this loading plate 12, therefore can prevent that edge warping from appearring in this flexible circuit board substrate 20 in above-mentioned steps, thereby improve the quality of this flexible PCB 60.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (10)
1. the manufacture method of a flexible PCB comprises step:
One bogey is provided, and it comprises a loading plate, an adhesion layer and a resin articulamentum that sets gradually, and this adhesion layer is attached to the surface of this loading plate, and this resin articulamentum is bonded to this adhesion layer surface;
One flexible circuit board substrate is provided, this flexible circuit board substrate comprises dielectric base layer, conducting wire layer and the welding resisting layer that sets gradually, this conducting wire layer has the splicing ear that exposes from this welding resisting layer, and this flexible circuit board substrate comprises that product zone reaches the garbage area around this product zone;
Form at least one heating blind slot in the garbage area of this flexible circuit board substrate, this heating blind slot only runs through this welding resisting layer and this conducting wire layer, so that this basalis of part is exposed in this heating blind slot;
Using at least one heating element to insert in this at least one heating blind slot heats, so that this part is exposed to that basalis in this heating blind slot is heated to soften and the part articulamentum corresponding with it is bonding, this at least one heating element is symmetrical with respect to this product zone;
Remove this at least one heating element from this at least one heating blind slot;
In the splicing ear print solder paste of this conducting wire layer, and place electronic component on this tin cream;
Make this electronic component fixedly be mounted on the splicing ear of this flexible circuit board after making tin cream heating and melting and cooling curing by reflow; And
Along border cutting this prefabricated circuit board, this articulamentum and this adhesion layer of product zone and garbage area, thereby remove this garbage area, obtain the product zone of with articulamentum, separating.
2. the manufacture method of flexible PCB as claimed in claim 1, it is characterized in that, the material of this adhesion layer is polyethylene terephthalate, and this loading plate is smooth surface near the material of this adhesion layer, and this adhesion layer is by the surface of Electrostatic Absorption in this loading plate.
3. the manufacture method of flexible PCB as claimed in claim 1, is characterized in that, this adhesion layer is the peelable type double coated film.
4. the manufacture method of flexible PCB as claimed in claim 1, it is characterized in that, the material of this articulamentum is polyimides, PETG or PEN, and the material of this basalis is polyimides, PETG or PEN.
5. the manufacture method of flexible PCB as claimed in claim 4, is characterized in that, this basalis is identical with this articulamentum material.
6. the manufacture method of flexible PCB as claimed in claim 1, is characterized in that, this at least one heating blind slot is the closed annular groove around this product zone, and this at least one heating blind slot is offered along the border of product zone and garbage area.
7. the manufacture method of flexible PCB as claimed in claim 6, is characterized in that, this heating element is the closed hoop plate corresponding with the extension shape of this heating blind slot.
8. the manufacture method of flexible PCB as claimed in claim 6, is characterized in that, this heating element comprises a plurality of column heating rods, and while heating, these a plurality of column heating rods equidistantly distribute in this heating blind slot.
9. the manufacture method of flexible PCB as claimed in claim 1, is characterized in that, this at least one heating blind slot comprises each other equidistantly distribution and a plurality of grooves symmetrical with respect to product zone, and each groove is all offered along the border of product zone and garbage area.
10. the manufacture method of flexible PCB as claimed in claim 9, is characterized in that, this at least one heating element comprises and a plurality of grooves a plurality of heating rods one to one, and while heating, each heating rod inserts in a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101434418A CN103391694A (en) | 2012-05-10 | 2012-05-10 | Manufacturing method for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101434418A CN103391694A (en) | 2012-05-10 | 2012-05-10 | Manufacturing method for flexible printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN103391694A true CN103391694A (en) | 2013-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101434418A Pending CN103391694A (en) | 2012-05-10 | 2012-05-10 | Manufacturing method for flexible printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681486A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
| CN104460095A (en) * | 2015-01-05 | 2015-03-25 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof |
| CN104760277A (en) * | 2015-03-17 | 2015-07-08 | 中国航空工业集团公司航空动力控制***研究所 | Electronic-industry-use bonding process between PCB and thermal conductive plate |
| CN105305008A (en) * | 2015-09-11 | 2016-02-03 | 安徽协创物联网技术有限公司 | Antenna installation structure for laptop |
| CN107681097A (en) * | 2017-09-30 | 2018-02-09 | 胜蓝科技股份有限公司 | All-in-one car battery sampling wire harness and its manufacture method |
| CN108346612A (en) * | 2017-01-25 | 2018-07-31 | 元太科技工业股份有限公司 | The manufacturing method of flexible electronic device |
| CN111435725A (en) * | 2019-12-24 | 2020-07-21 | 蜂巢能源科技有限公司 | Power battery, bus bar assembly of power battery and processing method of bus bar assembly |
| CN112867281A (en) * | 2021-01-04 | 2021-05-28 | 深圳市景旺电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
-
2012
- 2012-05-10 CN CN2012101434418A patent/CN103391694A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681486A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
| CN104460095A (en) * | 2015-01-05 | 2015-03-25 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof |
| CN104460095B (en) * | 2015-01-05 | 2018-05-08 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof |
| CN104760277A (en) * | 2015-03-17 | 2015-07-08 | 中国航空工业集团公司航空动力控制***研究所 | Electronic-industry-use bonding process between PCB and thermal conductive plate |
| CN105305008A (en) * | 2015-09-11 | 2016-02-03 | 安徽协创物联网技术有限公司 | Antenna installation structure for laptop |
| CN108346612A (en) * | 2017-01-25 | 2018-07-31 | 元太科技工业股份有限公司 | The manufacturing method of flexible electronic device |
| US11191166B2 (en) | 2017-01-25 | 2021-11-30 | E Ink Holdings Inc. | Fabrication method of flexible electronic device |
| CN107681097A (en) * | 2017-09-30 | 2018-02-09 | 胜蓝科技股份有限公司 | All-in-one car battery sampling wire harness and its manufacture method |
| CN111435725A (en) * | 2019-12-24 | 2020-07-21 | 蜂巢能源科技有限公司 | Power battery, bus bar assembly of power battery and processing method of bus bar assembly |
| CN112867281A (en) * | 2021-01-04 | 2021-05-28 | 深圳市景旺电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
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Application publication date: 20131113 |