CN105366953A - Spraying device - Google Patents

Spraying device Download PDF

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Publication number
CN105366953A
CN105366953A CN201510866640.5A CN201510866640A CN105366953A CN 105366953 A CN105366953 A CN 105366953A CN 201510866640 A CN201510866640 A CN 201510866640A CN 105366953 A CN105366953 A CN 105366953A
Authority
CN
China
Prior art keywords
spray
equipment
spray equipment
spraying
several
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510866640.5A
Other languages
Chinese (zh)
Inventor
叶江波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to CN201510866640.5A priority Critical patent/CN105366953A/en
Publication of CN105366953A publication Critical patent/CN105366953A/en
Pending legal-status Critical Current

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  • Weting (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention provides a spraying device. The spraying device comprises a plurality of spraying units (1), wherein each of the spraying units (1) comprises a plurality of spraying pipes (11) and a plurality of nozzles (12) which are correspondingly mounted on the outer surfaces of the spraying pipes (11). The spraying flow amounts and the spraying pressures of the multiple spraying units (1) are independently controlled; and the spraying angle of each of the nozzles (12) in the spraying device also can be independently controlled. Therefore, the multiple spraying units (1) can be independently controlled, so that the spraying uniformity of a large-size substrate in a spraying process can be ensured.

Description

Spray equipment
Technical field
The present invention relates to wet etching equipment, particularly relate to a kind of for the spray equipment in wet etching equipment.
Background technology
Spray-type etching machine is mainly used in TFT-LCD (ThinFilmTransistor-LiquidCrystalDisplay, Thin Film Transistor (TFT)-panel of LCD) thinning, by reducing thickness of glass, thus reach and make that the finished product are lighter and thinner, display color dazzles beautiful, that touch control operation is sensitiveer effect more, thus spray-type etching machine is one of key equipment of TFT-LCD panel manufacturing process.
Along with the intensification of electron trade and the increase of the current both at home and abroad output of the electronic product such as mobile phone, panel computer, photographic camera, pick up camera, market increases severely to the demand of TFT-LCD panel and day, the demand of TFT-LCD panel manufacturing concern to liquid crystal panel thinning processing apparatus will get more and more, therefore, the market outlook of liquid crystal panel thinning suite of equipment are boundless.At present, domesticly do not grasp liquid crystal panel thinning core technology, can not produce liquid crystal panel thinning suite of equipment, a few countries such as the global Jin You U.S., Japan, Korea S can produce this kind equipment, and domestic all same categories of device are all from Korea S and Japanese import.
As shown in Figure 1, the spray equipment of conventional wet etching machine several shower nozzles 200 of generally comprising several shower 100 and being located on every root shower 100.Spray model generally adopts integrated design, independently cannot control the region etched, and overall homogeneity is by PVD (PhysicalVaporDeposition, physical vapor deposition) film quality and self board design impact, and adjustable is poor; The flow wherein sprayed, pressure, angle all adopt the design of integration, therefore spray processing procedure cannot adjust for the film quality of PVD film forming (spill, convex, waviness), therefore, is necessary to provide a kind of spray equipment, to solve the problem.
Summary of the invention
The object of the present invention is to provide a kind of spray equipment, can realize carrying out independent control respectively to the spray processing procedure of several spray unit.
For achieving the above object, the invention provides a kind of spray equipment, comprise several spray unit, each spray unit comprises several shower and is installed on several nozzles of every root shower outside surface respectively, thus makes described several spray unit can carry out independent control respectively.
Described several spray unit is matrix distribution.
The quantity of described spray unit is 4.
These 4 spray unit are the distribution of sphere of movements for the elephants shape.
Spray flow in described several spray unit and spray pressure independently control.
The spray angles of each nozzle can independently control.
Described nozzle is removably installed on shower.
Described spray equipment is used for wet etching processing procedure.
Described spray equipment is used for the wet etching processing procedure of TFT-LCD panel.
Beneficial effect of the present invention: spray equipment of the present invention, by arranging several spray unit, and the spray flow of described several spray unit and spray pressure independently control, and each nozzle can independently control in this spray equipment, thus realize carrying out independent control respectively to the spray processing procedure of described several spray unit, can ensure that large-size substrate carries out homogeneity when spraying processing procedure.
Accompanying drawing explanation
In order to further understand feature of the present invention and technology contents, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
In accompanying drawing,
Fig. 1 is the structural representation of the spray equipment in existing wet etching equipment;
Fig. 2 is the structural representation of spray equipment of the present invention.
Embodiment
For further setting forth the technique means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 2, the invention provides a kind of spray equipment, comprise several spray unit 1, each spray unit 1 comprises several shower 11 and is installed on several nozzles 12 of every root shower 11 outside surface respectively, thus makes described several spray unit 1 can carry out independent control respectively.
Preferably, described several spray unit 1 is in matrix distribution.
Preferably, the quantity of described spray unit 1 is 4, the distribution in sphere of movements for the elephants shape of these 4 spray unit 1.
Concrete, the spray flow in described several spray unit 1 and spray pressure independently control.
Preferably, in described spray equipment, the spray angles of each nozzle 12 can independently control.
Preferably, described nozzle 12 is removably installed on shower 11.
Concrete, described spray equipment may be used for wet etching processing procedure, in particular for the wet etching processing procedure of TFT-LCD panel.Further, described spray equipment can be applicable in wet etching equipment, this spray equipment is used for etching to substrate spray etching liquid to be etched, compared to the spray equipment only arranging an overall spray unit in prior art, spray equipment of the present invention, by arranging several spray unit, thus can the spray unit corresponding to different zones on substrate independently be controlled, comprise spray flow, spray pressure and spray angles, the problem of non-uniform caused when can effectively prevent to etch large substrates, improves the homogeneity of large substrates etching.
Further, spray equipment of the present invention, except carrying out except spray processing procedure to a monoblock large substrates, can also carry out spray processing procedure to the substrate several to be etched corresponding to the arrangement of several spray unit simultaneously, thus can be cost-saving, enhances productivity.
In sum, a kind of spray equipment provided by the invention, by arranging several spray unit, and the spray flow of described several spray unit and spray pressure independently control, and the spray angles of each nozzle can independently control in this spray equipment, thus realize carrying out independent control respectively to the spray processing procedure of described several spray unit, can ensure that large-size substrate carries out homogeneity when spraying processing procedure.
The above; for the person of ordinary skill of the art; can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection domain that all should belong to the accompanying claim of the present invention.

Claims (9)

1. a spray equipment, it is characterized in that, comprise several spray unit (1), each spray unit (1) comprises several shower (11) and is installed on several nozzles (12) of every root shower (11) outside surface respectively, thus makes described several spray unit (1) can carry out independent control respectively.
2. spray equipment as claimed in claim 1, it is characterized in that, described several spray unit (1) is in matrix distribution.
3. spray equipment as claimed in claim 2, it is characterized in that, the quantity of described spray unit (1) is 4.
4. spray equipment as claimed in claim 3, it is characterized in that, these 4 spray unit (1) distribute in sphere of movements for the elephants shape.
5. spray equipment as claimed in claim 1, it is characterized in that, the spray flow in described several spray unit (1) and spray pressure independently control.
6. spray equipment as claimed in claim 1, it is characterized in that, the spray angles of each nozzle (12) can independently control.
7. spray equipment as claimed in claim 1, it is characterized in that, described nozzle (12) is removably installed on shower (11).
8. spray equipment as claimed in claim 1, is characterized in that, described spray equipment is used for wet etching processing procedure.
9. spray equipment as claimed in claim 8, is characterized in that, described spray equipment is used for the wet etching processing procedure of TFT-LCD panel.
CN201510866640.5A 2015-11-30 2015-11-30 Spraying device Pending CN105366953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510866640.5A CN105366953A (en) 2015-11-30 2015-11-30 Spraying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510866640.5A CN105366953A (en) 2015-11-30 2015-11-30 Spraying device

Publications (1)

Publication Number Publication Date
CN105366953A true CN105366953A (en) 2016-03-02

Family

ID=55369661

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510866640.5A Pending CN105366953A (en) 2015-11-30 2015-11-30 Spraying device

Country Status (1)

Country Link
CN (1) CN105366953A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111447751A (en) * 2020-04-25 2020-07-24 深圳市科路迪机械设备有限公司 Precision etching device and etching spray frame thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101481217A (en) * 2008-01-09 2009-07-15 伊可尼股份有限公司 An apparatus for etching a glass wafer, and a glass sheet manufactured by the same
KR101026744B1 (en) * 2010-09-29 2011-04-08 주식회사 아바텍 Apparatus for etching a glass substrate
CN102976623A (en) * 2012-11-12 2013-03-20 合肥市华美光电科技有限公司 Line etching assembly line equipment of capacitive touch screen
TWM468007U (en) * 2013-07-03 2013-12-11 Unimicron Technology Corp Partial etching apparatus
CN204356425U (en) * 2014-12-24 2015-05-27 苏州道蒙恩电子科技有限公司 A kind of anodic oxidation production line sealing of hole groove spray equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101481217A (en) * 2008-01-09 2009-07-15 伊可尼股份有限公司 An apparatus for etching a glass wafer, and a glass sheet manufactured by the same
KR101026744B1 (en) * 2010-09-29 2011-04-08 주식회사 아바텍 Apparatus for etching a glass substrate
CN102976623A (en) * 2012-11-12 2013-03-20 合肥市华美光电科技有限公司 Line etching assembly line equipment of capacitive touch screen
TWM468007U (en) * 2013-07-03 2013-12-11 Unimicron Technology Corp Partial etching apparatus
CN204356425U (en) * 2014-12-24 2015-05-27 苏州道蒙恩电子科技有限公司 A kind of anodic oxidation production line sealing of hole groove spray equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111447751A (en) * 2020-04-25 2020-07-24 深圳市科路迪机械设备有限公司 Precision etching device and etching spray frame thereof

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Application publication date: 20160302

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