CN105355474A - AgW50 composite electric contact material for breaker and manufacturing method thereof - Google Patents

AgW50 composite electric contact material for breaker and manufacturing method thereof Download PDF

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Publication number
CN105355474A
CN105355474A CN201510807976.4A CN201510807976A CN105355474A CN 105355474 A CN105355474 A CN 105355474A CN 201510807976 A CN201510807976 A CN 201510807976A CN 105355474 A CN105355474 A CN 105355474A
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agw50
powder
contact material
sintering
agw
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CN105355474B (en
Inventor
郑奇
费玲娟
穆成法
陈晓统
方旋
吕鹏举
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Wenzhou Hongfeng Electrical Alloy Co Ltd
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Wenzhou Hongfeng Electrical Alloy Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/04Co-operating contacts of different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02Compacting only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes

Abstract

The invention discloses an AgW50 composite electric contact material for a breaker and a manufacturing method thereof. The method comprises steps that, W powder and Ag powder are mixed; ball milling for the mixed powder is carried out; the powder after ball milling is granulated and screened; molding is carried out; AgW50 base substrates are manufactured after infiltration sintering, and a surface of a copper sheet is coated with silver; the AgW50 base substrate and the copper sheet are composited; sintering is carried out. Through the method, one face of the molded raw AgW50 base substrate is closely combined with the contact surface of the copper sheet, the high-density AgW50 material is manufactured by employing the infiltration sintering method, the interface of the manufactured AgW50 composite electric contact material has relatively high combination strength, arc ablation resistance performance, conductivity and hardness are respectively improved relatively, processing performance is excellent, the yield is relatively high, the technology is simple, operation is convenient, cost is low, and no special requirements are for equipment.

Description

Multiple Cu contact material of a kind of AgW50 for circuit breaker and preparation method thereof
Technical field
The present invention relates to electrical contact material of a kind of field of material technology and preparation method thereof, specifically, what relate to is the preparation method that a kind of AgW50 for circuit breaker answers Cu contact material and the multiple Cu contact material of AgW50 prepared by the method.
Background technology
Circuit breaker is widely used in distribution system hinge control end at different levels, bears Energy control and the electric terminal management role of equipment.Contact material is the core parts of circuit breaker, is used for the connection of realizing circuit and disjunction, and its performance directly affects the reliability and stability of circuit breaker.The overall silver content of the contact material of circuit breaker is higher both at home and abroad at present, has both caused the waste of part noble metal, and has also made contact material cost higher simultaneously.In recent years, people adopt various measures, and under the condition not reducing contact performance, reduce the silver content in contact material, develop basic material simultaneously and carry out the limited and expensive silver of alternate resources.
AgW50 series electric contact materials is as contact material of new generation, mainly make use of the feature that the high-melting-point of the good conductive of Ag, thermal conductivity and W, high rigidity and resistance to wear are good, strong arc erosion can be stood, there is good resistance fusion welding and erosion resistant, be widely used in power electronics, the cathode material in middle/high-voltage electrical appliance field and electric resistance welding, the electrode material of spark machined plasma heating and other field.But the mass percent of Ag reaches 50% in AgW50, make the cost of material of AgW50 series electric contact materials higher.And copper has the performances such as the physics close with silver, chemistry, electricity, as contact material, copper has the advantages such as conductive and heat-conductive is good, thermal capacitance is large, contact temperature rise is low, machine-shaping property is excellent, cheap.Therefore, by multiple for AgW50 and Cu or Cu reasonable offer AgW50 Cu composite material is reduced silver content, wherein, AgW50 is working lining, Cu or Cu alloy is weld layer.
The method of the current AgW50 of preparation material mainly contains two kinds: (1) powder metallurgy process: i.e. mixed powder, shaping, sintering, multiple pressure, but the relative density of the AgW50 composite material that this method obtains is very low, is only about 90% of solid density; (2) infiltration method: tungsten powder or the mixed powder that mixes part silver powder are pressed into briquet, and then place required silver powder on briquet, melted by silver, in the hole that silver is penetrated in pressed compact, form AgW50 composite material, obtained material density is high.
Traditional complex method is that the method also sintered by AgW50 powder and Cu powder two kinds of component materials being directly compressed into green compact carries out compound, the density of the material that this method is prepared is lower, and AgW50 layer and Cu layer junction are difficult to avoid there is certain gap, thus affect bond strength, reduce conductivity.How raising the efficiency, under the prerequisite of not obvious increase cost, prepare electrical property and the excellent multiple Cu composite material of AgW50 of structure property, become difficult point and the focus of research.AgW50 and red copper are carried out soldering compound by adopting Ag-Cu-Zn solder by Chinese invention patent CN201410408623.2, thus increase strength of joint and can oscillating load be born, but cause the resistivity of material monolithic to increase due to the membership that adds of solder layer, temperature rise improves, and contact arc resistant scaling loss ability is low.
Summary of the invention
The present invention is directed to deficiency and the defect of the existence of above-mentioned prior art, multiple Cu contact material of a kind of AgW50 and preparation method thereof is provided, working lining AgW50 density prepared by the inventive method is high, the compound interface bond strength of the multiple Cu of AgW50 is high, sintering character is good, electric life, arc ablation resistance performance and conductivity are all greatly improved, and processing characteristics is very excellent.Technique is simple simultaneously, easy to operate, with low cost, to equipment without particular/special requirement.
For realizing above-mentioned object, the technical solution used in the present invention is:
The invention provides the multiple Cu contact material of a kind of AgW50 for circuit breaker, described contact material comprises weld layer, be overlying on working lining above weld layer, described working lining is AgW50 layer, described weld layer is Cu layer, and the ratio of described AgW50 layer thickness and described Cu layer thickness is between 1/3 ~ 1.
Preferably, described AgW50 layer and described Cu layer form the multiple Cu contact material of AgW50 by combination process.
Preferably, described AgW50 layer, its one side contacted with Cu layer is zigzag or reticulate pattern or other shape can combined closely with Cu sheet contact-making surface.
The invention provides the preparation method of the multiple Cu contact material of a kind of AgW50 for circuit breaker, comprise the following steps:
S1, by W powder and Ag powder Homogeneous phase mixing, then carry out mixed powder and obtain AgW mixed powder, wherein W powder content is not less than AgW mixed powder overall weight 50%, and surplus is Ag powder;
S2, carries out ball milling and sieves, obtaining composite granule by AgW mixed powder;
S3, carries out granulation by the composite granule after sieving;
S4, carries out shaping compacting by the powder after granulation and obtains AgW green compact, and wherein the one side of AgW green compact is the shape can combined closely with Cu sheet contact-making surface;
AgW green compact and Ag are synthesized AgW50 by melting infiltration sintering and expect block by S5;
S6, silver-plated by carrying out after the heat treatment of Cu sheet;
S7, expects that by AgW50 block and silver-plated rear Cu sheet carry out compound and obtain the multiple Cu base substrate of AgW50;
S8, sinters multiple for AgW50 Cu base substrate, obtains the multiple Cu contact material of AgW50 for circuit breaker.
AgW50 and Cu base substrate is just tentatively combined by physical mechanical power by S7 normal temperature compound by the present invention, and S8 sinters at high temperature atoms permeating, and AgW50 and Cu base substrate atom interpenetrates, and strengthens bond strength further.
Compared with prior art, the present invention has following beneficial effect:
One aspect of the present invention prepares the AgW50 material of high-compactness by infiltration method; On the other hand, by expecting that block carries out shaping to obtained AgW50, make it to present the shape and structure can combined closely with Cu sheet, and Cu sheet is heat-treated, make it the softness kept in follow-up combination process to a certain degree, thus AgW50 and Cu interface bond strength after substantially increasing compound, again by sintering, metallic atom is at high temperature spread, and AgW50 and Cu base substrate Atom interpenetrates, and strengthens the bond strength of AgW50 layer and Cu layer in the multiple Cu base substrate of AgW50 further.In addition weld layer of the present invention adopts Cu or Cu alloy, substantially increases the conductivity of contact material.The multiple Cu electrical contact material of AgW50 prepared by the multiple Cu electrical contact material arc ablation resistance energy force rate conventional method of AgW50 prepared by the present invention improves 10-20%; conductance improves 5-15%; electric life improves 10-30%; silver content reduces by 47%; and there is excellent processing characteristics; lumber recovery is high, is suitable for large-scale production.
Accompanying drawing explanation
Fig. 1-Fig. 2 is the structural representation that the present invention prepares the multiple Cu material of AgW50, and wherein the one side of AgW50 is zigzag;
Fig. 3-Fig. 4 is the structural representation that the present invention prepares the multiple Cu material of AgW50, and wherein the one side of AgW50 is reticulate pattern shape;
In figure: 1 is working lining, and 2 is weld layer.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
As Figure 1-Figure 2, it is the structural representation that the present invention prepares the multiple Cu material of AgW50, described contact material comprises weld layer, be overlying on working lining above weld layer, described working lining is AgW50 layer, described weld layer is Cu layer, and the ratio of described AgW50 layer thickness and described Cu layer thickness is between 1/3 ~ 1; Wherein the one side of AgW50 is zigzag, and this face is the one side with Cu layer close contact.Described Cu layer is pure Cu layer or Cu alloy-layer.
As Figure 3-Figure 4, be the structural representation that the present invention prepares the multiple Cu material of AgW50, difference is that the one side of AgW50 is reticulate pattern shape, and this face is the one side with Cu layer close contact.
Further, the invention provides multiple Cu contact material of a kind of AgW50 for circuit breaker and preparation method thereof, concrete, preparation method can adopt following steps and design parameter to implement:
The first step, first by W powder and Ag powder Homogeneous phase mixing, is then placed in mixed powder machine and carries out mixed powder.Wherein preferred parameter can adopt: W powder content is 60% ~ 70%, Ag powder content is 30% ~ 40%.Mixed powder speed is between 20 revs/min-35 revs/min; The mixed powder time is between 2-5 hour.
Second step, carries out ball milling granulation by the mixed powder that the first step obtains and sieves.Wherein preferred parameter can adopt: rotational speed of ball-mill is between 30 revs/min-150 revs/min; Ball-milling Time is at 5-15 hour; Ratio of grinding media to material (i.e. ball and powder part by weight) is between 2-10; The order number sieved is between 100 order-300 orders.
3rd step, carries out granulation by the composite granule that second step obtains.Wherein granulation can adopt glue mixing granulation.Described glue mixing granulation preferred parameter is: glue mixing amount used is the 0.5%-1% of composite granule weight.
4th step, carries out shaping compacting by the powder after the 3rd step granulation and obtains AgW green compact.The wherein shape that can combine closely with Cu sheet contact-making surface for zigzag, reticulate pattern etc. of the one side (one side contacted with Cu sheet) of AgW green compact, the height of sawtooth and reticulate pattern is between 0.1mm-0.5mm, AgW green compact thickness calculates acquisition needed for product, and briquetting pressure is between 1 ~ 15MPa.
AgW green compact and Ag are synthesized AgW50 by melting infiltration sintering by the 5th step.Preferably, described melting infiltration sintering is placed in by Ag on AgW green compact, and Ag liquid at high temperature sintering temperature immerses in AgW green compact under capillary force action, obtains dense sintering body AgW50 composite material.Better, the condition of described melting infiltration sintering can be included in reducibility gas, and wherein, reducibility gas can be hydrogen etc.Better, sintering temperature is between 1000-1200 DEG C, and temperature retention time is between 0.5-10 hour; The weight ratio of Ag and AgW green compact can be 0.20-0.40: 1, and the described herein Ag carrying out melting infiltration sintering together with AgW green compact can exist with block, sheet and the form such as Powdered, is preferably sheet.
6th step, heat-treats rear silver-plated by Cu sheet, preferably, heat treatment temperature is between 450 DEG C-700 DEG C, and heat treatment time, at 0.5-3 hour, electroplates rear silver layer 3-8 μm;
7th step, by melting infiltration sintering obtain AgW50 expect block with silver-plated after Cu sheet carry out compound obtain AgW50 answer Cu base substrate.Wherein, combination process adopts compound of colding pressing, and preferred parameter can adopt: pressure of colding pressing is at 4 ~ 20MPa, and 0.3 ~ 5 second dwell time, in the multiple Cu base substrate of AgW50, the ratio of AgW50 layer thickness and Cu layer thickness is between 0.20 ~ 1.
8th step, sintered by multiple for the AgW50 obtained after compound Cu base substrate, wherein preferred parameter can adopt: sintering temperature is between 750-850 DEG C; Sintering time is between 0.5-2 hour, and sintering atmosphere is H 2or N 2gas.
9th step, multiple for the AgW50 after sintering Cu base substrate is carried out shaping, and wherein preferred parameter can adopt: between shaping pressure 4 ~ 20MPa, between 0.3 ~ 1 second dwell time.
Tenth step, cleans multiple for the AgW50 obtained after shaping Cu base substrate.
The technical operation detailed to the present invention below by way of the embodiment of embody rule is described.
Embodiment one
In the first step, first by silver powder 35wt% and W powder 65wt% Homogeneous phase mixing, be then placed in mixed powder machine and carry out mixed powder, rotating speed is at 20 revs/min; 4 hours time.
In second step, the mixed powder that the first step obtains is carried out ball milling, and rotational speed of ball-mill is at 50 revs/min; Ball-milling Time was at 15 hours; Ratio of grinding media to material (i.e. ball and powder part by weight) is 8: 1; The order number sieved is at 200 orders.
In 3rd step, the composite granule that second step obtains is carried out glue mixing granulation, and glue quantity is 0.5% of total weight.
In 4th step, undertaken shaping, briquetting pressure 1MPa by the powder that the 3rd step obtains, the Ag35W65 base substrate side after wherein shaping is zigzag, and profile of tooth height is 0.25mm.
In 5th step, the Ag35W65 green compact after shaping are placed on Ag sheet metal, carry out melting infiltration sintering and prepare AgW50.Wherein parameter can adopt: the weight ratio of Ag sheet metal and Ag35W65 green compact is 0.30: 1, and sintering temperature is at 1100 DEG C; Sintering time is 3 hours, and sintering atmosphere is H 2.
In 6th step, Cu sheet is heat-treated, then at Cu sheet electroplate.Wherein parameter can adopt: heat treatment temperature is 500 DEG C, and the time is 2.5 hours;
In 7th step, Cu sheet electroplate after heat treatment, wherein parameter can adopt: silvering thickness is 5 μm.
In 8th step, the Cu sheet after the AgW50 base substrate of sintering acquisition and heat treatment is carried out colding pressing compound.Wherein parameter can adopt: pressure of colding pressing at 10MPa, 1 second dwell time.
In 9th step, the base substrate obtained after colding pressing is sintered.Wherein parameter can adopt: sintering temperature is 760 DEG C; Sintering time is 1.5 hours, and sintering atmosphere is H 2.
In tenth step, multiple for the AgW50 after sintering Cu base substrate is carried out shaping.Wherein parameter can adopt: between shaping pressure 5MPa, 5 seconds dwell times.
In 11 step, the base substrate obtained after shaping is cleaned.
Embodiment two
In the first step, first by 30wt%Ag powder and 70wt%W powder Homogeneous phase mixing, be then placed in mixed powder machine and carry out mixed powder, rotating speed is at 30 revs/min; 5 hours time.
In second step, the mixed powder that the first step obtains is carried out ball milling, and rotational speed of ball-mill is at 150 revs/min; Ball-milling Time was at 5 hours; Ratio of grinding media to material (i.e. ball and powder part by weight) is 3: 1; The order number sieved is at 150 orders.
In 3rd step, the composite granule that second step obtains is carried out glue mixing granulation, and glue quantity is 1% of total weight.
In 4th step, undertaken shaping, briquetting pressure 1MPa by the powder that the 3rd step obtains, the Ag30W70 base substrate side after wherein shaping is zigzag, and profile of tooth height is 0.40mm.
In 5th step, the Ag30W70 green compact skeleton after shaping is placed on Ag metal derby, carries out melting infiltration sintering and prepare AgW50.Wherein parameter can adopt: the weight ratio of Ag metal derby and Ag30W70 green compact is 0.4: 1, and sintering temperature is at 1020 DEG C; Sintering time is 8 hours, and sintering atmosphere is H 2.
In 6th step, Cu sheet is heat-treated.Wherein parameter can adopt: heat treatment temperature is 650 DEG C, and the time is 1 hour;
In 7th step, Cu sheet electroplate after heat treatment, wherein parameter can adopt: silvering thickness is 3 μm.
In 8th step, the Cu sheet after the AgW50 base substrate of sintering acquisition and heat treatment is carried out colding pressing compound.Wherein parameter can adopt: pressure of colding pressing at 15MPa, 1 second dwell time.
In 9th step, the base substrate obtained after colding pressing is sintered.Wherein parameter can adopt: sintering temperature is 830 DEG C; Sintering time is 0.5 hour, and sintering atmosphere is H 2.
In tenth step, multiple for the AgW50 after sintering Cu base substrate is carried out shaping.Wherein parameter can adopt: between shaping pressure 20MPa, 1 second dwell time.
In 11 step, the base substrate obtained after shaping is cleaned.
Embodiment three
In the first step, first by 40wt%Ag powder and 60wt%W powder Homogeneous phase mixing, be then placed in mixed powder machine and carry out mixed powder, rotating speed is at 20 revs/min; 5 hours time.
In second step, the mixed powder that the first step obtains is carried out ball milling, and rotational speed of ball-mill is at 100 revs/min; Ball-milling Time was at 9 hours; Ratio of grinding media to material (i.e. ball and powder part by weight) is 5: 1; The order number sieved is at 300 orders.
In 3rd step, the composite granule that second step obtains is carried out glue mixing granulation, and glue quantity is 1% of total weight.
In 4th step, undertaken shaping, briquetting pressure 1MPa by the powder that the 3rd step obtains, the Ag40W60 base substrate side after wherein shaping is reticulate pattern shape, and reticulate pattern height is at 0.30mm.
In 5th step, the Ag40W60 green compact skeleton after shaping is placed on Ag powder, carries out melting infiltration sintering and prepare AgW50.Wherein parameter can adopt: the weight ratio of Ag powder and Ag40W60 green compact is 0.20: 1, and sintering temperature is at 1180 DEG C; Sintering time is 0.5 hour, and sintering atmosphere is H 2.
In 6th step, Cu sheet is heat-treated.Wherein parameter can adopt: heat treatment temperature is 600 DEG C, and the time is 1.5 hours;
In 7th step, Cu sheet electroplate after heat treatment, wherein parameter can adopt: silvering thickness is 8 μm.
In 8th step, the Cu sheet after the AgW50 base substrate of sintering acquisition and heat treatment is carried out colding pressing compound.Wherein parameter can adopt: pressure of colding pressing at 10MPa, 4 seconds dwell times.
In 9th step, the base substrate obtained after colding pressing is sintered.Wherein parameter can adopt: sintering temperature is 800 DEG C; Sintering time is 1.3 hours, and sintering atmosphere is H 2.
In tenth step, multiple for the AgW50 after sintering Cu base substrate is carried out shaping.Wherein parameter can adopt: between shaping pressure 20MPa, 1 second dwell time.
In 11 step, the base substrate obtained after shaping is cleaned.
The foregoing is only section Example of the present invention, not do any restriction to technical scope of the present invention, all any amendments made within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. the multiple Cu contact material of the AgW50 for circuit breaker, it is characterized in that: described contact material comprises weld layer, be overlying on working lining above weld layer, described working lining is AgW50 layer, described weld layer is Cu layer, and the ratio of described AgW50 layer thickness and described Cu layer thickness is between 1/3 ~ 1; Described AgW50 layer, its one side contacted with Cu layer is zigzag or reticulate pattern shape.
2., for a preparation method for the multiple Cu contact material of AgW50 of circuit breaker, it is characterized in that comprising the following steps:
S1, by W powder and Ag powder Homogeneous phase mixing, then carry out mixed powder and obtain AgW mixed powder, wherein W powder content is not less than AgW mixed powder overall weight 50%, and surplus is Ag powder;
S2, carries out ball milling and sieves, obtaining composite granule by AgW mixed powder;
S3, carries out granulation by the composite granule after sieving;
S4, carries out shaping compacting by the powder after granulation and obtains AgW green compact, and wherein the one side of AgW green compact is the shape can combined closely with Cu sheet contact-making surface;
AgW green compact and Ag are synthesized AgW50 by melting infiltration sintering and expect block by S5;
S6, silver-plated by carrying out after the heat treatment of Cu sheet;
S7, expects that by AgW50 block and silver-plated rear Cu sheet carry out colding pressing compound, obtains the multiple Cu base substrate of AgW50;
S8, sinters multiple for AgW50 Cu base substrate.
3. a kind of AgW50 for circuit breaker answers the preparation method of Cu contact material as claimed in claim 2, it is characterized in that, in S1, described mixed powder, wherein W powder weight content is 60% ~ 70%, surplus is silver powder, and mixed powder speed is between 20 revs/min-35 revs/min, and the mixed powder time is between 2-5 hour.
4. a kind of AgW50 for circuit breaker answers the preparation method of Cu contact material as claimed in claim 2; it is characterized in that; in S3, described granulation adopts sintering granulation or glue mixing granulation, wherein: glue mixing granulation glue mixing amount used is the 0.5%-1% of composite granule weight.
5. a kind of AgW50 for circuit breaker answers the preparation method of Cu contact material as claimed in claim 2, it is characterized in that, in S4, the one side of described AgW green compact is zigzag or reticulate pattern shape, the height of sawtooth or reticulate pattern is between 0.1mm-0.5mm, and briquetting pressure is between 1 ~ 15MPa.
6. a kind of AgW50 for circuit breaker answers the preparation method of Cu contact material as claimed in claim 2, it is characterized in that, in S5, and described melting infiltration sintering, sintering temperature is between 1000-1200 DEG C, and temperature retention time is between 0.5-10 hour; The weight ratio of Ag and AgW green compact is 0.20-0.40: 1, and the described Ag carrying out melting infiltration sintering together with AgW green compact is block, sheet or Powdered.
7. the preparation method of the multiple Cu contact material of a kind of AgW50 for circuit breaker as described in any one of claim 2-6, it is characterized in that, in S6, described heat treatment, temperature is between 450 DEG C ~ 700 DEG C, and heat treatment time is between 0.5 ~ 3 hour.
8. the preparation method of the multiple Cu contact material of a kind of AgW50 for circuit breaker as described in any one of claim 2-6, it is characterized in that, in S7, described Combined Mining compound of colding pressing, cold pressing pressure at 4 ~ 20MPa, 0.3 ~ 5 second dwell time, in the multiple Cu base substrate of AgW50, the ratio of AgW50 layer thickness and Cu layer thickness is between 0.20 ~ 1.
9. the preparation method of the multiple Cu contact material of a kind of AgW50 for circuit breaker as described in any one of claim 2-6, it is characterized in that, in S8, described sintering, temperature is between 750-850 DEG C, and sintering time is between 0.5-2 hour, and sintering atmosphere is H 2or N 2.
10. the preparation method of the multiple Cu contact material of a kind of AgW50 for circuit breaker as described in any one of claim 2-6, it is characterized in that, S9 is performed further: the AgW50 after being sintered by S8 is multiple, and Cu base substrate carries out shaping after S8, described shaping pressure is between 4 ~ 20MPa, between 0.3 ~ 1 second dwell time.
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CN109994327A (en) * 2019-04-30 2019-07-09 温州宏丰电工合金股份有限公司 A kind of AgMe contact material and preparation method thereof for breaker
CN111054927A (en) * 2019-12-03 2020-04-24 同济大学 Aluminum/magnesium/aluminum composite board with interface structure design and powder hot-pressing preparation method thereof
CN113245548A (en) * 2021-05-27 2021-08-13 攀时(上海)高性能材料有限公司 Infiltration processing technology and silver-tungsten contact material prepared by same

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CN108015276A (en) * 2017-11-29 2018-05-11 温州宏丰电工合金股份有限公司 One kind enhancing phase gradient distribution infiltration class silver-based electric contact material and preparation method thereof
CN108015276B (en) * 2017-11-29 2019-08-23 温州宏丰电工合金股份有限公司 A kind of reinforced phase gradient distribution infiltration class silver-based electric contact material and preparation method thereof
CN109994327A (en) * 2019-04-30 2019-07-09 温州宏丰电工合金股份有限公司 A kind of AgMe contact material and preparation method thereof for breaker
CN109994327B (en) * 2019-04-30 2020-12-01 温州宏丰电工合金股份有限公司 AgMe contact material for circuit breaker and preparation method thereof
CN111054927A (en) * 2019-12-03 2020-04-24 同济大学 Aluminum/magnesium/aluminum composite board with interface structure design and powder hot-pressing preparation method thereof
CN113245548A (en) * 2021-05-27 2021-08-13 攀时(上海)高性能材料有限公司 Infiltration processing technology and silver-tungsten contact material prepared by same
CN113245548B (en) * 2021-05-27 2021-10-01 攀时(上海)高性能材料有限公司 Infiltration processing technology and silver-tungsten contact material prepared by same

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