CN105336839A - Pad, light emitting diode (LED) and pad printing template - Google Patents
Pad, light emitting diode (LED) and pad printing template Download PDFInfo
- Publication number
- CN105336839A CN105336839A CN201510788559.XA CN201510788559A CN105336839A CN 105336839 A CN105336839 A CN 105336839A CN 201510788559 A CN201510788559 A CN 201510788559A CN 105336839 A CN105336839 A CN 105336839A
- Authority
- CN
- China
- Prior art keywords
- pad
- silver
- colored portion
- covers
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007649 pad printing Methods 0.000 title claims abstract description 42
- 229910052709 silver Inorganic materials 0.000 claims abstract description 34
- 239000004332 silver Substances 0.000 claims abstract description 34
- 238000007639 printing Methods 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 11
- 238000005476 soldering Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 description 19
- 230000007423 decrease Effects 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- -1 this Chemical compound 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention discloses a pad, a light emitting diode (LED) and a pad printing template. The pad is partially coated with silver. The LED comprises a body, a light emitting part and the pad, wherein the light emitting part and the pad are arranged on the body. The pad printing template is used for printing the pad and comprises at least a pad printing unit, wherein each pad printing unit is partially provided with holes; and the holes in the pad printing unit correspond to the silver-coated part of the pad. On the one hand, the consumption of silver is reduced, and on the other hand, the quantity of soldering tin needed by soldering is also reduced as the pad is partially coated with silver, thus greatly reducing the production cost. The soldering thrust of the LED does not have obvious change, so that the soldering effects are not affected.
Description
Technical field
The present invention relates to microelectronic component technical field, in particular to a kind of pad, light-emitting diode and pad printing stencil.
Background technology
Light-emitting diode is a kind of semiconductor subassembly, spreads all over the various aspects of people's life at present as a kind of general electronic devices and components, comprises normal lighting, electrical equipment display, traffic lights all at use light-emitting diode.But the new product that along with the development of science and technology, volume is little, quality is light becomes main trend, so sheet light-emitting diode will become most widely used electronic devices and components in life, production.
Refer to Fig. 1, light-emitting diode comprises body 10 and illuminating part 20, and the pad (not shown) of light-emitting diode is covered in the end face 102 of body 10, side 106 and bottom surface 108, is electrically connected in circuit by light-emitting diode by pad.Silver electrode is covered entirely in the light-emitting diode pad two ends of current use, causes will using more scolding tin during welding, and silver electrode itself also consumes a large amount of precious metal-Yin simultaneously.In view of the application of sheet light-emitting diode is extensively, and during its production and application, used up silver and soldering tin amount are comparatively large, and how reducing precious metal use amount when not affecting LED welding effect is current problem demanding prompt solution.
Summary of the invention
Based on this, be necessary the problem that consumption that is silver-colored for light-emitting diode and scolding tin is larger to provide a kind of pad, light-emitting diode and pad printing stencil.
A kind of pad, described pad portion covers silver.
Due to this pad for part covers silver, decrease the consumption of silver on the one hand, the soldering tin amount on the other hand needed for welding decreases, and greatly reduce production cost, and the thrust of LED welding there is no significant change, welding effect is unaffected.
Wherein in an embodiment, described pad covers silver-colored area and accounts for 1/2 of the described pad gross area or more.
Wherein in an embodiment, described pad comprises end face, side and bottom surface, and the described end face of described pad, described side and described bottom surface are part and cover silver.
Wherein in an embodiment, the silver-colored area that covers of the described end face of described pad is 1/3 or more.
Wherein in an embodiment, the described end face of described pad comprises pars intermedia and is positioned at the end at described pars intermedia two ends, and described pars intermedia all covers silver, and described end sections covers silver.
Wherein in an embodiment, described end comprises three and non-ly covers silver-colored portion, lay respectively at two ends and the middle part of described end, and be positioned at two ends described non-to cover silver-colored portion adjacent with described pars intermedia, what be positioned at middle part described non-ly covers silver-colored portion and is positioned at side away from described pars intermedia.
Wherein in an embodiment, be positioned at two ends described non-to cover silver-colored portion be 1/4 circular, be positioned at the described non-of middle part and cover silver-colored portion for semicircle; The described end face of described pad is rectangle, and the described non-diameter covering silver-colored portion being positioned at two ends is greater than the half of the side adjacent with described pars intermedia, and the described non-diameter covering silver-colored portion being positioned at middle part is greater than 1/3 of the side relative with described pars intermedia.
Wherein in an embodiment, the described end face of described pad is identical with the structure of described bottom surface.
Wherein in an embodiment, the side of described pad comprises to be covered silver-colored portion and non-ly covers silver-colored portion, described in cover the centre that silver-colored portion is positioned at the side of described pad, describedly non-ly cover the two ends that silver-colored portion is positioned at the side of described pad.
The present invention also discloses a kind of light-emitting diode, comprises body, is arranged at the illuminating part on body and is arranged at the above-mentioned pad on body.
The pad that this light-emitting diode uses is for partly covering silver, decrease the consumption of silver on the one hand, the soldering tin amount on the other hand needed for welding decreases, and greatly reduces production cost, and the thrust of LED welding there is no significant change, welding effect is unaffected.
The present invention also discloses a kind of pad printing stencil, for printing above-mentioned pad, described pad printing stencil comprises at least one pad printing element, and each described pad printing element is part open, and the perforate of described pad printing element is silver-colored partly corresponding with covering of described pad.
Because pad printing element is part open, therefore the pad utilizing its printing to make corresponds to part and covers silver, decrease the consumption of silver on the one hand, soldering tin amount on the other hand needed for welding decreases, greatly reduce production cost, and the thrust of LED welding there is no significant change, welding effect is unaffected.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of light-emitting diode;
Fig. 2 is the structural representation of pad one execution mode of the present invention; And
Fig. 3 is the structural representation of this reverse side pad printing stencil one execution mode.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Preferred embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, it can directly on another element or the element that also can exist between the two.When an element is considered to " connection " another element, it can be the element being directly connected to another element or may existing between the two simultaneously.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
The pad portion of an embodiment of the present invention covers silver.
Due to this pad for part covers silver, decrease the consumption of silver on the one hand, the soldering tin amount on the other hand needed for welding decreases, and greatly reduce production cost, and the thrust of LED welding there is no significant change, welding effect is unaffected.
Preferably, pad covers silver-colored area and accounts for 1/2 of the pad gross area or more.Have 1/2 at least because pad covers silver-colored area, therefore can ensure that welding effect is unaffected while the consumption reducing silver and scolding tin.
Preferably, pad comprises end face, side and bottom surface, and the end face of pad, side and bottom surface are part and cover silver.
Preferably, refer to Fig. 2, Figure 2 shows that the structural representation of the pad end face of an embodiment of the present invention.The end face of the pad 30 of an embodiment of the present invention comprises pars intermedia 31 and is positioned at the end 33 at pars intermedia 31 two ends, and pars intermedia 31 all covers silver, and end 33 part covers silver.Particularly, the dash area of Fig. 2 medial end portions 33 is for covering silver-colored portion, and the non-shaded portion of end 33 is non-ly cover silver-colored portion 331.
Preferably, the silver-colored area that covers of the end face of pad 30 is 1/3 or more.
Preferably, end 33 comprises three and non-ly covers silver-colored portion 331, lays respectively at two ends and the middle part of end 33, and be positioned at two ends non-to cover silver-colored portion 331 adjacent with pars intermedia 31, what be positioned at middle part non-ly covers silver-colored portion 331 and is positioned at side away from pars intermedia 31.
Preferably, be positioned at two ends non-to cover silver-colored portion 331 be 1/4 circular, be positioned at the non-of middle part and cover silver-colored portion 331 for semicircle.More specifically, the end face of pad 30 is rectangle, and the non-diameter covering silver-colored portion 331 being positioned at two ends is greater than the half of the side adjacent with pars intermedia 31, and the non-diameter covering silver-colored portion 331 being positioned at middle part is greater than 1/3 of the side relative with pars intermedia 31.Non-this structure and the shape setting covering silver-colored portion 331 of pad 30, can ensure welding effect during scolding tin better.The non-shape covering silver-colored portion 331 being appreciated that the end 33 of the end face of pad 30 can be other shapes, and its setting position also can adjust as required.
Preferably, the end face of pad 30 is identical with the structure of bottom surface.
Preferably, the side (not shown) of pad 30 comprises and covers silver-colored portion and non-ly cover silver-colored portion.Particularly, cover the centre that silver-colored portion is positioned at the side of pad 30, non-ly cover the two ends that silver-colored portion is positioned at the side of pad 30.Be appreciated that the non-setting position covering silver-colored portion of the side of pad 30 can adjust as required.
The present invention also provides a kind of light-emitting diode, and it comprises body, is arranged at the illuminating part on body and is arranged at the above-mentioned pad 30 on body, and pad 30 is arranged at the end face of body, side and bottom surface.Particularly, the end face of pad 30, side and bottom surface are covered in the end face of body, side and bottom surface respectively.
Refer to Fig. 3, the structural representation of the pad printing stencil of an embodiment of the present invention.Pad printing stencil 50 comprises at least one pad printing element 51, and each pad printing element 51 is part open, and the perforate of pad printing element 51 is silver-colored partly corresponding with covering of pad 30.Particularly, the shape and size of the end face of the corresponding pad 30 of shape and size of pad printing element 51, during printing pad 30, pad printing stencil 50 is covered on the pad 30 of silver, like this, silver is printed onto pad 30 from the first perforate 511 and non-aperture area 5133, and silver is not then covered in the position of the non-perforate of pad 30 corresponding pad printing stencil 50, namely pad 30 forms electrode through high temperature sintering after printing silver layer, can produce pad 30 easily by pad printing stencil 50.
Because pad printing element 51 is part open, therefore the pad 30 utilizing its printing to make corresponds to part and covers silver, decrease the consumption of silver on the one hand, soldering tin amount on the other hand needed for welding decreases, greatly reduce production cost, and the thrust of LED welding there is no significant change, welding effect is unaffected.
Preferably, pad printing stencil 50 comprises at least two pad printing elements 51.Specifically in the present embodiment, pad printing stencil 50 comprises four pad printing elements 51.Pad printing stencil 50 being arranged multiple pad printing element 51 can the multiple pad 30 of disposable printing, then the pad 30 printed is cut into single product, improves production efficiency.
Preferably, pad printing element 51 comprises the first perforate 511 and is positioned at the end template 513 at the first perforate 511 two ends, and end template 513 comprises aperture area 5131 and non-aperture area 5133.
Preferably, pad printing element 51 1/3 or more area perforate.
Preferably, pad printing element 51 comprises three non-aperture area 5133, lay respectively at two ends and the middle part of end template 513, and the non-aperture area 5133 being positioned at two ends is adjacent with the first perforate 511, the non-aperture area 5133 in the middle part of being positioned at is positioned at the side away from the first perforate 511.
Preferably, the non-aperture area 5133 being positioned at two ends is 1/4 circle, is positioned at the non-aperture area 5133 at middle part for semicircle.More specifically, pad printing element 51 is rectangle, and the diameter being positioned at the non-aperture area 5133 at two ends is greater than the half of the side adjacent with the first perforate 511, and the diameter being positioned at the non-aperture area 5133 at middle part is greater than 1/3 of the side relative with the first perforate 511.Be appreciated that the shape of the non-aperture area 5133 of the end template 513 of pad printing element 51 can for other shapes, its setting position also can adjust as required.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (11)
1. a pad (30), is characterized in that, described pad (30) part covers silver.
2. pad according to claim 1, is characterized in that, described pad (30) covers silver-colored area and accounts for 1/2 of described pad (30) gross area or more.
3. pad according to claim 2, is characterized in that, described pad (30) comprises end face, side and bottom surface, and the described end face of described pad (30), described side and described bottom surface are part and cover silver.
4. pad according to claim 3, is characterized in that, the silver-colored area that covers of the described end face of described pad (30) is 1/3 or more.
5. pad according to claim 3, it is characterized in that, the described end face of described pad (30) comprises pars intermedia (31) and is positioned at the end (33) at described pars intermedia (31) two ends, described pars intermedia (31) all covers silver, and described end (33) part covers silver.
6. pad according to claim 5, it is characterized in that, described end (33) comprises three and non-ly covers silver-colored portion (331), lay respectively at two ends and the middle part of described end (33), and the described non-silver-colored portion (331) of covering being positioned at two ends is adjacent with described pars intermedia (31), the described non-silver-colored portion (331) of covering being positioned at middle part is positioned at side away from described pars intermedia (31).
7. pad according to claim 6, is characterized in that, the described non-silver-colored portion (331) of covering being positioned at two ends is 1/4 circle, is positioned at the described non-silver-colored portion (331) of covering at middle part for semicircle; The described end face of described pad (30) is rectangle, the described non-diameter covering silver-colored portion (331) being positioned at two ends is greater than the half of the side adjacent with described pars intermedia (31), and the described non-diameter covering silver-colored portion (331) being positioned at middle part is greater than 1/3 of the side relative with described pars intermedia (31).
8. the pad according to claim 4-7 any one, is characterized in that, the described end face of described pad (30) is identical with the structure of described bottom surface.
9. pad according to claim 3, it is characterized in that, the side of described pad (30) comprises to be covered silver-colored portion and non-ly covers silver-colored portion, describedly cover the centre that silver-colored portion is positioned at the side of described pad (30), describedly non-ly cover the two ends that silver-colored portion is positioned at the side of described pad (30).
10. a light-emitting diode, comprise body, be arranged at the illuminating part on body and be arranged at the pad (30) on body, it is characterized in that, described pad (30) is the pad (30) as described in claim 1-9 any one.
11. 1 kinds of pad printing stencils, it is characterized in that, for printing the pad (30) as described in claim 1-9 any one, described pad printing stencil (50) comprises at least one pad printing element (51), each described pad printing element (51) is part open, and the perforate of described pad printing element (51) is silver-colored partly corresponding with covering of described pad (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510788559.XA CN105336839A (en) | 2015-11-16 | 2015-11-16 | Pad, light emitting diode (LED) and pad printing template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510788559.XA CN105336839A (en) | 2015-11-16 | 2015-11-16 | Pad, light emitting diode (LED) and pad printing template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105336839A true CN105336839A (en) | 2016-02-17 |
Family
ID=55287252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510788559.XA Pending CN105336839A (en) | 2015-11-16 | 2015-11-16 | Pad, light emitting diode (LED) and pad printing template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105336839A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727050A (en) * | 1980-07-25 | 1982-02-13 | Hitachi Ltd | Lead frame and semiconductor device using said lead frame |
| JPS6017939A (en) * | 1983-07-11 | 1985-01-29 | Nec Corp | Lead frame for semiconductor device |
| JPH02205062A (en) * | 1989-02-02 | 1990-08-14 | Nec Kyushu Ltd | Lead frame |
| CN201563294U (en) * | 2009-12-15 | 2010-08-25 | 英华达（南京）科技有限公司 | Welding structure of circuit board |
| CN102005297A (en) * | 2009-08-31 | 2011-04-06 | Tdk株式会社 | Ceramic electronic component and method for producing same |
| CN102593287A (en) * | 2011-01-10 | 2012-07-18 | 展晶科技(深圳)有限公司 | LED crystal grain and manufacturing method thereof as well as LED packaging structure |
| CN103918144A (en) * | 2011-09-28 | 2014-07-09 | 釜屋电机株式会社 | Electrostatic protective component and method for manufacturing same |
| CN204045618U (en) * | 2014-07-22 | 2014-12-24 | 上海博恩世通光电股份有限公司 | A kind of flip LED chips encapsulation components and parts |
| CN104701290A (en) * | 2013-12-06 | 2015-06-10 | 上海北京大学微电子研究院 | QFN (quad flat no-lead) package structure for multiple circles of lead frames |
| CN104993024A (en) * | 2015-06-19 | 2015-10-21 | 圆融光电科技股份有限公司 | Light-emitting diode chip, manufacturing method thereof and encapsulation method of light-emitting diode chip |
| CN205159367U (en) * | 2015-11-16 | 2016-04-13 | 格力电器（合肥）有限公司 | Pad, emitting diode and pad printing template |
-
2015
- 2015-11-16 CN CN201510788559.XA patent/CN105336839A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727050A (en) * | 1980-07-25 | 1982-02-13 | Hitachi Ltd | Lead frame and semiconductor device using said lead frame |
| JPS6017939A (en) * | 1983-07-11 | 1985-01-29 | Nec Corp | Lead frame for semiconductor device |
| JPH02205062A (en) * | 1989-02-02 | 1990-08-14 | Nec Kyushu Ltd | Lead frame |
| CN102005297A (en) * | 2009-08-31 | 2011-04-06 | Tdk株式会社 | Ceramic electronic component and method for producing same |
| CN201563294U (en) * | 2009-12-15 | 2010-08-25 | 英华达（南京）科技有限公司 | Welding structure of circuit board |
| CN102593287A (en) * | 2011-01-10 | 2012-07-18 | 展晶科技(深圳)有限公司 | LED crystal grain and manufacturing method thereof as well as LED packaging structure |
| CN103918144A (en) * | 2011-09-28 | 2014-07-09 | 釜屋电机株式会社 | Electrostatic protective component and method for manufacturing same |
| CN104701290A (en) * | 2013-12-06 | 2015-06-10 | 上海北京大学微电子研究院 | QFN (quad flat no-lead) package structure for multiple circles of lead frames |
| CN204045618U (en) * | 2014-07-22 | 2014-12-24 | 上海博恩世通光电股份有限公司 | A kind of flip LED chips encapsulation components and parts |
| CN104993024A (en) * | 2015-06-19 | 2015-10-21 | 圆融光电科技股份有限公司 | Light-emitting diode chip, manufacturing method thereof and encapsulation method of light-emitting diode chip |
| CN205159367U (en) * | 2015-11-16 | 2016-04-13 | 格力电器（合肥）有限公司 | Pad, emitting diode and pad printing template |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 519000 Qianshan Golden Chicken West Road in Zhuhai, Guangdong Applicant after: GREE ELECTRIC APPLIANCES Inc. OF ZHUHAI Applicant after: GREE ELECTRIC(HEFEI) Co.,Ltd. Address before: 230088 208, Ming Chuan Road, Anhui science and Technology Park, Hefei high tech Zone Applicant before: GREE ELECTRIC(HEFEI) Co.,Ltd. Applicant before: GREE ELECTRIC APPLIANCES Inc. OF ZHUHAI |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160217 |
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| RJ01 | Rejection of invention patent application after publication |