CN105336823B - A kind of LED dispensing method and LED encapsulation method - Google Patents
A kind of LED dispensing method and LED encapsulation method Download PDFInfo
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- CN105336823B CN105336823B CN201510687703.0A CN201510687703A CN105336823B CN 105336823 B CN105336823 B CN 105336823B CN 201510687703 A CN201510687703 A CN 201510687703A CN 105336823 B CN105336823 B CN 105336823B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses provide a kind of LED dispensing method and LED encapsulation method, dispensing method include the following steps：When beginning, Glue dripping head declines against first position in the bracket of a LED；Control Glue dripping head blank position movable type plastic emitting into bracket from first position；Glue dripping head vertical ascent simultaneously shifts to another LED progress dispensing.LED encapsulation method includes die bond, bonding wire and above-mentioned LED dispensing method.Method of the invention can allow packaging plastic to be distributed more uniform in glue application region, and fluorescent powder is allowed to be evenly distributed in glue application region, improve out the uniformity of light, improve light extraction efficiency, prevent excessive glue phenomenon, improve production efficiency.
Description
Technical field
The present invention relates to a kind of LED encapsulation technology, especially a kind of LED dispensing method and packaging method.
Background technique
Existing LED is encapsulated：Die bond, bonding wire, dispensing, light splitting and packaging and other steps, existing dispensing method are will to fill
Have above the Glue dripping head perpendicular alignmnet LED chip of packaging plastic, then controls plastic emitting, then move Glue dripping head vertically upward and carry out down
The dispensing of one LED chip.Plastic emitting is carried out above this alignment LED chip, due to fishing out slot inside PPA bracket bowl than silver coating
Position is low, if from it is non-fishing groove location carry out dispensing due to uneven position presence meeting so that packaging plastic can not Uniform Flow and out
The phenomenon that existing excessive glue.
To solve the above-mentioned problems, newly there is a kind of dispensing method, i.e., vertically decline the Glue dripping head equipped with packaging plastic pair
Close to fishing groove location in a quasi- LED chip plastic stent, plastic emitting is then controlled, then rises Glue dripping head, finally moves dispensing
Head carries out dispensing operation to another LED chip position, but since dispensing is located proximate to plastic rubber bracket position, and in the position into
The disposable plastic emitting of row, after plastic emitting, packaging plastic is combined with the side close to plastic rubber bracket there is excessive glue, viscose glue phenomenon, thus
LED appearance is influenced, and excessive glue, viscose glue will lead to the problem of bracket can not be sucked in suction nozzle in subsequent movement stent procedures, reduced
Production efficiency.
Being in Chinese Patent Application No. be 2006.3.5 publication date 200610049704.3 applyings date is the special of 2007.9.5
A kind of heavy-duty diode dispensing method is disclosed in sharp document, and specifically discloses syringe needle vertically decline-plastic squeeze-syringe needle is vertical
The gluing process of rising, this gluing process is not damaged to product, is not in the bad phenomenons such as excessive glue, few glue, bubble, but
It is that above-mentioned one-point type dispensing is used for same bracket, packaging plastic is needed to flow freely from dispensing position to other positions, but is sealed
Filling glue has certain viscosity, accordingly, it is difficult to guarantee that packaging plastic flowing is evenly distributed in the bowl of bracket, moreover, for glimmering
For light arogel, when phosphor gel is in flow process, even if phosphor gel distribution is more uniform, but it is likely to result in fluorescent powder
It is unevenly distributed, in this way, can have an impact to photochromic, brightness the uniformity, also has an impact to light extraction efficiency.
In addition, being in Chinese Patent Application No. was that 2012.7.19 publication date is 201210250161.7 applyings date
2012.10.31 a kind of efficient LED dispensing coating method is disclosed in patent document, production and dispensing work including fluorescent glue
Skill includes the following steps：Step 1：It is uniformly mixed by fluorescent powder and with glue, is fabricated to viscosity within the scope of 100-8000Pa.s
Fluorescent glue；Step 2：Fluorescent glue made of step 1 is subjected to deaeration, until there is no bubble to emerge in fluorescent glue；Step
Rapid 3：Fluorescent glue made of step 2 is poured into the point packing element of dispensing coating machine, passes through the control journey on the dispensing coating machine
Dispensing step is arranged in sequence, and carries out dispensing；Wherein, the needle mouth wall thickness range of dispensing needle head is 0.02-0.10mm；Dispensing
The thickness range of rack plate is 0.3-0.5mm；Step 4：Baking, selects according to the viscosity of different fluorescent glues into the roasting time,
Most progress bakes the time no more than 15min.Control program in the step 3 includes following dispensing step：Step 31：By preceding
Processing routine is set to initialize dispensing coating machine；Step 32：Movement by controlling the dispensing arm of dispensing needle head is stood
Body three-dimensional point flowing mode dispensing：The moving direction of dispensing arm is as follows：Dispensing arm is moved upwards up to preset height by initial position,
Be moved horizontally to the surface of first row the first LED chip bowl again, then by dispensing arm be moved downward to dispensing needle head away from
From bowl highest point 0.8-3.0mm, it is then coated with fluorescent glue；Step 33：By control dispensing needle head dispensing arm movement into
Line point flowing mode dispensing：By step 32 by after the completion of the coating of first row the first LED chip, dispensing arm level is moved
The surface for moving first row the second LED chip bowl, coats fluorescent glue again；And the Linear Points flowing mode dispensing is repeated,
Until the coating of last LED chip of first row is completed；Step 34：By the mobile progress for controlling the dispensing arm of dispensing needle head
Two-dimentional crawl and linear crawl combine mode dispensing：Last LED chip of first row is coated by step 33 and is completed
Afterwards, dispensing arm is moved horizontally to the surface of last LED chip of second row, coats fluorescent glue again；Again by dispensing arm
It is moved horizontally to the surface of second row LED chip second from the bottom, coats fluorescent glue, repeats the Linear Points flowing mode dispensing,
Until the coating of second row the first LED chip is completed；Step 35：The two-dimentional crawl for repeating step 34 is mutually tied with linear crawl
Conjunction mode dispensing, to the last last LED chip of row coating is completed, and dispensing arm is resetted.In above-mentioned technical proposal
In, Linear Points flowing mode dispensing is moved horizontally although using between two LED chips, for single LED chip,
Or the fixed point mode for dispensing glue used, can equally exist the packaging plastic in same LED chip be unevenly distributed, fluorescent powder point
The non-uniform phenomenon of cloth.
Equally, a kind of method for dispensing glue is also disclosed in the patent document that China Patent No. is 201310742600.0,
Although the dispensing method has carried out the movement of lateral translation within the scope of bowl, which carried out after syringe needle vertical ascent
, its purpose is to change the homing action of syringe needle after dispensing so that residual colloid on dispensing needle head and be not entire
Glue amount is trapped in bowl, and is not to realize therefore mobile dispensing can equally have above-mentioned technology and ask during dispensing
Topic.
Summary of the invention
In order to allow packaging plastic to be distributed more uniform in glue application region, allows fluorescent powder to be evenly distributed in glue application region, improve out
The uniformity of light improves light extraction efficiency, prevents excessive glue phenomenon, improves production efficiency, the present invention provides a kind of LED dispensing methods
And LED encapsulation method.
In order to achieve the above objectives, a kind of LED dispensing method, includes the following steps：（1）When beginning, Glue dripping head is against a LED
Bracket in glue application region first position decline；（2）Control the sky of Glue dripping head glue application region out of first position upwards the bracket
White position movable type plastic emitting；（3）Glue dripping head vertical ascent simultaneously shifts to another LED progress dispensing.
Above-mentioned LED dispensing method, since Glue dripping head is fallen before against first position, then allow Glue dripping head from first position to
The blank position movable type plastic emitting of glue application region in above-mentioned bracket, in this way, distribution of the packaging plastic in glue application region mainly passes through a little
Rubber head moves plastic emitting to realize in bracket, and is not by packaging plastic flowing come what is realized in glue application region, and packaging plastic exists
The distribution of glue application region is not susceptible to the viscosity and the limitation of supporting structure of packaging plastic, so that distribution of the packaging plastic in glue application region is equal
It is even；In addition, packaging plastic is relatively uniformly mixed in the packing element with Glue dripping head, when using above-mentioned dispensing method,
If being mixed with fluorescent powder in packaging plastic, during dispensing, packaging plastic can then be encapsulated substantially according to the mixture homogeneity in packing element
In glue application region, fluorescent powder uniformly dividing in glue application region will not be influenced because the mobility of fluorescent powder and other glue is inconsistent
Cloth.Therefore, LED dispensing method of the invention and LED packaging technology can allow packaging plastic to be distributed more uniform in glue application region,
It allows fluorescent powder to be evenly distributed in glue application region, improves out the uniformity of light, improve light extraction efficiency, prevent excessive glue phenomenon, improve production
Efficiency.
Further, the first position is that groove location is fished out in bracket, and fishing slot is lower than the silver coating of bracket.From fishing groove location
Dispensing is carried out to solve since the presence of uneven position makes packaging plastic Uniform Flow and the phenomenon that excessive glue can not occur.
As an improvement, the first position is the position in bracket close to polarity line of demarcation.Due to demarcating close to polarity
Dispensing is carried out at line so as to prevent excessive glue phenomenon.
As an improvement, step（2）It specifically includes：It controls Glue dripping head and carries out the first glue amount within first time in first position
Plastic emitting, then from first position, into bracket, the blank position of glue application region carries out the plastic emitting of the second glue amount within the second time, the
One glue amount is less than or equal to the second glue amount.For same LED, due to using first put carried out behind upright position again mobile dispensing from
And partial encapsulation glue is prevented far from vertical position for dispensing glue due to excessively making packaging plastic and bracket in same point packaging plastic
Excessive contact leads to the generation of the problem of optical effect of influence bracket service life and LED.
As an improvement, step (2) specifically includes：Control blank position of the Glue dripping head from first position glue application region into bracket
Mobile equably plastic emitting.Due to using the dispensing of uniformity movable type, in the optical effect for improving bracket service life and LED
While can facilitate operation.
As an improvement, the blank position is position of the glue application region far from gold thread and chip in bracket, thus guaranteeing not
Influence the light-out effect that LED is further increased while gold thread and chip.
As an improvement, the first position into bracket blank position moving direction and Glue dripping head from a LED to another LED
Moving direction is identical.Since moving direction is identical as two LED moving directions in a LED support, to can be further improved
Working efficiency.
The present invention also provides a kind of LED encapsulation methods, and die bond, bonding wire are carried out before being included in above-mentioned LED dispensing method.
Above-mentioned LED encapsulation method, since Glue dripping head is fallen before against first position, then allow Glue dripping head from first position to
The blank position movable type plastic emitting of glue application region in above-mentioned bracket, in this way, distribution of the packaging plastic in glue application region mainly passes through a little
Rubber head moves plastic emitting to realize in bracket, and is not by packaging plastic flowing come what is realized in glue application region, and packaging plastic exists
The distribution of glue application region is not susceptible to the viscosity and the limitation of supporting structure of packaging plastic, so that distribution of the packaging plastic in glue application region is equal
It is even；In addition, packaging plastic is relatively uniformly mixed in the packing element with Glue dripping head, when using above-mentioned dispensing method,
If being mixed with fluorescent powder in packaging plastic, during dispensing, packaging plastic can then be encapsulated substantially according to the mixture homogeneity in packing element
In glue application region, fluorescent powder uniformly dividing in glue application region will not be influenced because the mobility of fluorescent powder and other glue is inconsistent
Cloth.Therefore, LED dispensing method of the invention and LED packaging technology can allow packaging plastic to be distributed more uniform in glue application region,
It allows fluorescent powder to be evenly distributed in glue application region, improves out the uniformity of light, improve light extraction efficiency, prevent excessive glue phenomenon, improve production
Efficiency.
As an improvement, the die bond step specifically includes：Carrying out plasma cleaning to bracket is roughened rack surface.It is logical
It crosses before chip is fixed on bracket, plasma cleaning processing is carried out to bracket, rack surface is roughened, thus a side
Face can be more conducive to the diffusion of elargol when die bond, to reduce the thickness of elargol, on the other hand subsequent to put packaging plastic again
When the occurrence of being further reduced viscose glue convenient for the diffusion of packaging plastic.
As an improvement, to bracket carry out plasma cleaning make further include after rack surface roughening step：To bracket
The test of water droplet angle is carried out chip is fixed on bracket if reaching preset requirement.It is tested by water droplet angle, it is clear to plasma
It washes effect to be verified, to efficiently control the thickness of elargol.
Detailed description of the invention
Fig. 1 is LED structure schematic diagram of the present invention.
Fig. 2 is the downward schematic diagram of a LED structure of the invention.
Fig. 3 is a kind of flow chart of LED dispensing method of the present invention.
Fig. 4 is a kind of flow chart of LED encapsulation method of the present invention.
Specific embodiment
The present invention will be described in further detail with reference to the accompanying drawings of the specification.
Embodiment 1.
As shown in Figure 1,2 and 3, the embodiment of the present invention provides a kind of LED dispensing method, firstly, by deployed packaging plastic
It is packed into the packing element of Glue dripping head 100, then the packaging plastic in packing element carries out waste discharge bubble and vacuumize process, according to the specification of product
The parameters such as 100 gel quantity of Glue dripping head and dispensing height, dispensing position are set, dispensing is started.As shown in Figure 1, Glue dripping head 100 moves
It moves to 1 top the first LED, and the first position of the corresponding LED of Glue dripping head 100 is moved vertically downward, which is LED
Bracket 2 in fish out groove location 4, fishing slot 4 be lower than bracket 2 silver coating, certainly, first position may be pole in the bracket 2 of LED
Property boundary line position, when Glue dripping head 100 is moved to determining dispensing height, as long as dispensing height guarantees to be higher by the height of chip 3
, control start plastic emitting, first time in carry out the first glue amount plastic emitting, then the second time control Glue dripping head 100 from
First position 200 blank position of glue application region into bracket is mobile to carry out the second glue amount plastic emitting, and the first glue amount is less than or equal to second
Glue amount；For same LED, due to carrying out mobile dispensing again after using first point upright position so that partial encapsulation glue can be remote
From vertical position for dispensing glue, prevent from causing to influence bracket due to contacting packaging plastic excessively with bracket in same point packaging plastic
The problem of optical effect of service life and LED, occurs.First position blank position moving direction and Glue dripping head into bracket
It is identical from a LED to another LED moving direction, to can be further improved working efficiency.The blank position is far from core
The position of piece 3, gold thread, to further increase the light-out effect of LED while guaranteeing does not influence gold thread and chip.When first
Between optimally be 0.5-3 second, the second time by every LED dispensing time subtract at the first time determination, every LED dispensing time can
To be determined according to setting gel quantity divided by plastic emitting speed.Then Glue dripping head 100 moves vertically upward in blank position, moves on to dispensing
Another LED is moved again to when grease head highness carries out above-mentioned single led dispensing operation until completing a batch LED dispensing operation.
In the present embodiment, since Glue dripping head 100 is fallen before against first position, then allow Glue dripping head 100 from first
The blank position movable type plastic emitting of the glue application region 200 into above-mentioned bracket is set, in this way, distribution master of the packaging plastic in glue application region 200
It if realized by the mobile plastic emitting of Glue dripping head 100, and is not to be realized by packaging plastic in the flowing of glue application region 200
, distribution of the packaging plastic in glue application region 200 is not susceptible to the viscosity and the limitation of supporting structure of packaging plastic, so that packaging plastic is in point
Jiao Qu's is evenly distributed；In addition, packaging plastic is relatively uniformly mixed in the packing element with Glue dripping head 100, work as use
When above-mentioned dispensing method, if being mixed with fluorescent powder in packaging plastic, during dispensing, packaging plastic then can be substantially according in packing element
Mixture homogeneity is encapsulated in glue application region, will not influence fluorescent powder in dispensing because the mobility of fluorescent powder and other glue is inconsistent
Being uniformly distributed in area.Therefore, LED dispensing method of the invention and LED packaging technology, can allow packaging plastic to be distributed in glue application region
More uniformly, it allows fluorescent powder to be evenly distributed in glue application region, improves out the uniformity of light, improve light extraction efficiency, prevent excessive glue existing
As improving production efficiency.
From fishing groove location 4 carry out dispensing solve due to the presence of uneven position make packaging plastic can not Uniform Flow and go out
The phenomenon that existing excessive glue.
Embodiment 2.
Another embodiment of the present invention the difference from embodiment 1 is that：During controlling mobile dispensing, from Glue dripping head 100
Uniformity movement is carried out after vertical decline in bracket 2 and completes dispensing.Blank position i.e. from from first position to glue application region 200
It is equably plastic emitting in moving process, facilitates operation while light-out effect can be improved in this way.
Embodiment 3.
As shown in figure 4, a kind of flow chart of LED encapsulation method of the present invention, this method include：Die bond, bonding wire and LED dispensing
Method.Wherein die bond step specifically includes：Carrying out plasma cleaning to bracket 2 is roughened rack surface, then passes through water droplet
Whether 2 roughing in surface degree of bracket is tested in angle test, reach particular by 2 surface of test bracket with Liquid contact angle
Preset value, such as less than 85 degree subsequently enter bonding wire, dispensing, light splitting and packaging etc. if so, then chip 3 is fixed on bracket 2
Step；Existing way realization can be used in bonding wire, light splitting and packaging；If it is not, plasma cleaning is then carried out again, if plasma is clear
It is all unsatisfactory for condition after washing three times and then judges that the bracket is unqualified.Due to before chip 3 is fixed on bracket 2 to bracket 2
Carry out the thickness that plasma cleaning makes rack surface roughening be further reduced elargol convenient for the flowing of elargol during die bond
Degree reduces thermal resistance, on the other hand increases the flowing of packaging plastic when so that putting packaging plastic since bracket 2 has rough surface,
A possibility that being further reduced bracket viscose glue, product appearance is good-looking, and improves manufacture efficiency.
Wherein, as shown in Figure 1,2 and 3, LED dispensing method is：Firstly, deployed packaging plastic is packed into Glue dripping head 100
Packing element in, then packaging plastic in packing element carries out waste discharge bubble and vacuumize process, sets Glue dripping head 100 according to the specification of product
The parameters such as gel quantity and dispensing height, dispensing position start dispensing.As shown in Figure 1, Glue dripping head 100 is moved to the first LED 1
Top, and the first position of the corresponding LED of Glue dripping head 100 is moved vertically downward, which is that slot is fished out in the bracket 2 of LED
Position 4, fishing slot 4 are lower than the silver coating of bracket 2, and certainly, first position may be polarity boundary line position in the bracket 2 of LED,
When Glue dripping head 100 is moved to determining dispensing height, as long as dispensing height guarantees the height for being higher by chip 3, control starts
Plastic emitting carries out the first glue amount plastic emitting within first time, then controls Glue dripping head 100 from first position to bracket in the second time
Interior 200 blank position of glue application region is mobile to carry out the second glue amount plastic emitting, and Glue dripping head 100 is in mobile plastic emitting, uniform plastic emitting or first
Glue amount is less than the second glue amount；For same LED, due to carrying out mobile dispensing again so that portion after using first point upright position
Divide packaging plastic that can prevent far from vertical position for dispensing glue due to contacting packaging plastic excessively with bracket in same point packaging plastic
The problem of leading to the optical effect of influence bracket service life and LED generation.First position blank position into bracket is mobile
Direction is identical from a LED to another LED moving direction as Glue dripping head, to can be further improved working efficiency.The blank
Position is the position far from chip 3, gold thread, to further increase going out for LED while guaranteeing does not influence gold thread and chip
Light effect.It is at the first time optimally 0.5-3 seconds, the second time was subtracted by every LED dispensing time and is determined at the first time, and every
The LED dispensing time can determine according to setting gel quantity divided by plastic emitting speed.Then Glue dripping head 100 blank position vertically upward
It is mobile, another LED is moved again to when moving on to dispensing grease head highness carries out above-mentioned single led dispensing operation until completing a batch LED point
Glue operation.
In the present embodiment, since Glue dripping head 100 is fallen before against first position, then allow Glue dripping head 100 from first
The blank position movable type plastic emitting of the glue application region 200 into above-mentioned bracket is set, in this way, distribution master of the packaging plastic in glue application region 200
It if realized by the mobile plastic emitting of Glue dripping head 100, and is not to be realized by packaging plastic in the flowing of glue application region 200
, distribution of the packaging plastic in glue application region 200 is not susceptible to the viscosity and the limitation of supporting structure of packaging plastic, so that packaging plastic is in point
Jiao Qu's is evenly distributed；In addition, packaging plastic is relatively uniformly mixed in the packing element with Glue dripping head 100, work as use
When above-mentioned dispensing method, if being mixed with fluorescent powder in packaging plastic, during dispensing, packaging plastic then can be substantially according in packing element
Mixture homogeneity is encapsulated in glue application region, will not influence fluorescent powder in dispensing because the mobility of fluorescent powder and other glue is inconsistent
Being uniformly distributed in area.Therefore, LED dispensing method of the invention and LED packaging technology, can allow packaging plastic to be distributed in glue application region
More uniformly, it allows fluorescent powder to be evenly distributed in glue application region, improves out the uniformity of light, improve light extraction efficiency, prevent excessive glue existing
As improving production efficiency.
From fishing groove location 4 carry out dispensing solve due to the presence of uneven position make packaging plastic can not Uniform Flow and go out
The phenomenon that existing excessive glue.
Above embodiment is only an explanation to the present invention from general idea, modular construction and realization functionally, all
Several improvement made under the premise of not departing from design philosophy of the present invention all belong to the scope of protection of the present invention.
Claims (10)
1. a kind of LED dispensing method, it is characterised in that：Include the following steps：（1）When beginning, bracket of the Glue dripping head against a LED
The first position of interior glue application region declines；（2）Glue dripping head is controlled to move from the blank position of first position glue application region into the bracket
Dynamic formula plastic emitting, so that partial encapsulation glue is far from first position；（3）Glue dripping head vertical ascent simultaneously shifts to another LED progress dispensing.
2. LED dispensing method according to claim 1, it is characterised in that：The first position is that groove location is fished out in bracket,
Fish out the silver coating that slot is lower than bracket.
3. LED dispensing method according to claim 2, it is characterised in that：The first position is in bracket close to polarity
The position in line of demarcation.
4. LED dispensing method according to claim 1, it is characterised in that：Step（2）It specifically includes：Control Glue dripping head exists
First position carries out the first glue amount plastic emitting within first time, and then from first position, into bracket, the blank position of glue application region exists
The plastic emitting of the second glue amount is carried out in second time, the first glue amount is less than or equal to the second glue amount.
5. LED dispensing method according to claim 1, it is characterised in that：Step (2) specifically includes：Control Glue dripping head from
The blank position movable type equably plastic emitting of first position glue application region into bracket.
6. LED dispensing method according to claim 1, it is characterised in that：The blank position is that glue application region is remote in bracket
Position from gold thread and chip.
7. LED dispensing method according to claim 1, it is characterised in that：First position blank position into bracket
Moving direction is identical from a LED to another LED moving direction as Glue dripping head.
8. a kind of realize LED encapsulation method using the described in any item LED dispensing methods of claim 1-7, it is characterised in that：?
Die bond, bonding wire are carried out before LED dispensing method.
9. LED encapsulation method according to claim 8, it is characterised in that：The die bond step specifically includes：To bracket into
Row plasma cleaning is roughened rack surface.
10. LED encapsulation method according to claim 9, it is characterised in that：To prop up carrying out plasma cleaning to bracket
Further include after frame roughing in surface step：The test of water droplet angle is carried out to bracket, chip is fixed on branch if reaching preset requirement
On frame.
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| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
| CN102755947B (en) * | 2012-07-19 | 2013-12-18 | 厦门多彩光电子科技有限公司 | Efficient LED (Light-Emitting Diode) gluing and coating method |
| CN103657975B (en) * | 2013-12-30 | 2016-02-17 | 广州市鸿利光电股份有限公司 | A kind of great power LED dispensing method |
| CN103962279A (en) * | 2014-05-28 | 2014-08-06 | 冯子相 | Automatic dispensing machine capable of moving in three directions |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant before: Guangzhou Hongli Tronic Co., Ltd. |
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