CN208410450U - A kind of SMD sealing die holder - Google Patents

A kind of SMD sealing die holder Download PDF

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Publication number
CN208410450U
CN208410450U CN201820787087.5U CN201820787087U CN208410450U CN 208410450 U CN208410450 U CN 208410450U CN 201820787087 U CN201820787087 U CN 201820787087U CN 208410450 U CN208410450 U CN 208410450U
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CN
China
Prior art keywords
die holder
smd
injecting glue
glue road
liquid state
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CN201820787087.5U
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Chinese (zh)
Inventor
易巨荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong LCLED Lighting Co Ltd
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Guangdong LCLED Lighting Co Ltd
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Priority to CN201820787087.5U priority Critical patent/CN208410450U/en
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Abstract

The utility model discloses a kind of SMD sealing die holder, including lower die holder and upper die holder, the lower die holder is equipped with several shaping mold cavities, and the upper die holder corresponds to shaping mold cavity position equipped with inclined injecting glue road, and injecting glue road inner surface is equipped with several convex blocks.The utility model improves the probability that the minute bubbles in liquid state colloid are separated from liquid state colloid, reduces the minute bubbles in liquid state colloid, improve the quality and yields of LED encapsulation by inclined injecting glue road and the convex block cooperation to set within it on surface.

Description

A kind of SMD sealing die holder
Technical field
The utility model relates to SMD sealing adhesive device technical field, in particular to a kind of SMD sealing die holder.
Background technique
The LED produced using SMD technique, after expanding the processes such as crystalline substance, dispensing, die bond, sintering and pressure welding, to LED's Two electrode energizations can be lighted, but the structure in order to protect it fragile, can generally select to encapsulate on the outside Glue-line.The encapsulation of LED includes glue dispensing and packaging, encapsulating encapsulation and moulded package, and wherein the step of encapsulating encapsulation generally comprises: 1. is existing Liquid state colloid is injected in LED shaping mold cavity;2. being inserted into the good LED support of pressure welding, and baking oven is put by its solidification;3. most LED is deviate from from die cavity afterwards and is shaped.
In encapsulating encapsulation process, the minute bubbles being mingled in liquid state colloid can not be eliminated, and the presence of these minute bubbles is to LED The illuminating effect of product causes extreme influence.
Utility model content
It can be in liquid state colloid injection moulding die cavity to solve the above problems, the purpose of this utility model is to provide one kind The scheme of minute bubbles, i.e., a kind of SMD sealing die holder are eliminated in the process.
The technical solution adopted by the utility model to solve the problem is as follows:
A kind of SMD sealing die holder, including lower die holder and upper die holder, the lower die holder be equipped with several shaping mold cavities, it is described on Die holder corresponds to shaping mold cavity position equipped with inclined injecting glue road, and injecting glue road inner surface is equipped with several convex blocks.
Further, the upper die holder is additionally provided with several vertical air passages, and the air passage is connected to injecting glue road.
Further, vacuum pump is communicated on the air passage.
Further, the two sides of the upper die holder are equipped with card column, and the two sides of the lower die holder are equipped with matched with the card column Card slot.
Further, the shaping mold cavity is hemispherical.
Further, the injecting glue road is cylindrical.
The beneficial effects of the utility model are: the utility model use a kind of SMD sealing die holder, by will be used for at The injecting glue road of pattern chamber perfusion liquid state colloid is set to heeling condition, so that the speed of liquid state colloid injection moulding die cavity is opposite Injecting glue road under vertical state slows down, so that minute bubbles therein are separated during liquid state colloid flows;Meanwhile In liquid state colloid, the effect that the convex block on injecting glue road inner surface can be stirred to liquid state colloid one flowed, be disturbed is set, into One step promotes the probability that minute bubbles therein are separated.The utility model passes through inclined injecting glue road and the surface that sets within it On convex block cooperation, improve the probability that the minute bubbles in liquid state colloid are separated from liquid state colloid, reduce in liquid state colloid Minute bubbles, improve LED encapsulation quality and yields.
Detailed description of the invention
The utility model is described in further detail with example with reference to the accompanying drawing.
Fig. 1 is a kind of cross-sectional view of SMD sealing die holder of the utility model;
In figure, 1- upper die holder, 11- injecting glue road, 12- convex block, 13- air passage, 14- lower port, 15- upper port, 2- lower die holder, 21- shaping mold cavity, 3- card column, 4- card slot.
Specific embodiment
Referring to Fig.1, a kind of SMD sealing die holder of the utility model, including lower die holder 2 and upper die holder 1, the lower die holder 2 Equipped with several shaping mold cavities 21, corresponding 21 position of shaping mold cavity of the upper die holder 1 is equipped with inclined injecting glue road 11, the injecting glue road 11 is cylindrical, and 11 lower port 14 of injecting glue road is connected to shaping mold cavity 21, and 11 upper port 15 of injecting glue road is connected to hot melt Glue machine, the inner surface for having liquid state colloid to flow through in the injecting glue road 11 are equipped with several convex blocks 12, and the convex block 12 is fixed on for one Tetrahedron on 11 inner surface of injecting glue road, the tetrahedral bottom surface are fixed on 11 inner surface of injecting glue road, so that with the bottom surface Opposite angle is towards 11 upper port 15 of injecting glue road, and the liquid state colloid for flowing through the angle disturbs, and minute bubbles therein are under disturbance It rises rapidly and separates.
Preferably, the upper die holder 1 is additionally provided with several vertical air passages 13, and the air passage 13 connects with injecting glue road 11 It is logical.The gas separated from liquid state colloid is discharged rapidly by air passage 13, and gas is avoided to be deposited in injecting glue road 11 again There is a situation where re-mix with liquid state colloid.
Specifically, it is communicated with vacuum pump on the air passage 13, liquid state colloid is perfused into injecting glue road 11 in hot melt adhesive machine Before, the die joint of upper die holder 1 and lower die holder 2 fits closely.By vacuum pump from air passage 13 by shaping mold cavity 21 and injecting glue road Most of air in 11 detaches, and then opening injecting glue road 11 again flows into liquid state colloid, and this avoid air by liquid glue Body, which is pushed down, to be trapped in shaping mold cavity 21, and product defects are caused.
In order to facilitate the docking of upper die holder 1 and lower die holder 2, the two sides of the upper die holder 1 are equipped with card column 3, the lower die holder 2 Two sides be equipped with and the matched card slot 4 of the card column 3.
Specifically, the shaping mold cavity 21 is hemispherical, and the colloform texture for drying later half spherical shape has the function of lens, changes It has been apt to the illumination effect of LED.
The above, the only preferred embodiment of the utility model, the utility model are not limited to above-mentioned implementation Mode, as long as its technical effect for reaching the utility model with identical means, all should belong to the protection scope of the utility model.

Claims (6)

1. a kind of SMD sealing die holder, it is characterised in that: including lower die holder and upper die holder, the lower die holder is equipped with several shaping moulds Chamber, the upper die holder correspond to shaping mold cavity position equipped with inclined injecting glue road, and injecting glue road inner surface is equipped with several convex blocks.
2. a kind of SMD sealing die holder according to claim 1, it is characterised in that: the upper die holder is additionally provided with several vertical Air passage, the air passage is connected to injecting glue road.
3. a kind of SMD sealing die holder according to claim 2, it is characterised in that: be communicated with vacuum pump on the air passage.
4. a kind of SMD sealing die holder according to claim 3, it is characterised in that: the two sides of the upper die holder are equipped with card column, The two sides of the lower die holder are equipped with and the matched card slot of the card column.
5. a kind of SMD sealing die holder according to claim 4, it is characterised in that: the shaping mold cavity is hemispherical.
6. a kind of SMD sealing die holder according to claim 5, it is characterised in that: the injecting glue road is cylindrical.
CN201820787087.5U 2018-05-24 2018-05-24 A kind of SMD sealing die holder Active CN208410450U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820787087.5U CN208410450U (en) 2018-05-24 2018-05-24 A kind of SMD sealing die holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820787087.5U CN208410450U (en) 2018-05-24 2018-05-24 A kind of SMD sealing die holder

Publications (1)

Publication Number Publication Date
CN208410450U true CN208410450U (en) 2019-01-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820787087.5U Active CN208410450U (en) 2018-05-24 2018-05-24 A kind of SMD sealing die holder

Country Status (1)

Country Link
CN (1) CN208410450U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109961697A (en) * 2019-04-29 2019-07-02 合肥畅想光电科技有限公司 Outdoor jewelry shows lamp bar
CN111124181A (en) * 2019-12-25 2020-05-08 业成科技(成都)有限公司 Display device and touch display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109961697A (en) * 2019-04-29 2019-07-02 合肥畅想光电科技有限公司 Outdoor jewelry shows lamp bar
CN111124181A (en) * 2019-12-25 2020-05-08 业成科技(成都)有限公司 Display device and touch display device
CN111124181B (en) * 2019-12-25 2022-11-11 业成科技(成都)有限公司 Display device and touch display device

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