CN105336655A - Bearing apparatus and semiconductor processing device - Google Patents
Bearing apparatus and semiconductor processing device Download PDFInfo
- Publication number
- CN105336655A CN105336655A CN201410259553.9A CN201410259553A CN105336655A CN 105336655 A CN105336655 A CN 105336655A CN 201410259553 A CN201410259553 A CN 201410259553A CN 105336655 A CN105336655 A CN 105336655A
- Authority
- CN
- China
- Prior art keywords
- supporter
- chuck
- pallet
- elevated
- bogey
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a bearing apparatus and a semiconductor processing device. The bearing apparatus comprises a chuck, a pallet, a pressure ring and an elevating mechanism, wherein the pallet is provided with multiple bearing positions for bearing substrates, the pallet is superposed on the chuck, and the pressure ring is used for fixing the pallet on the chuck; the elevating mechanism comprises an elevating driving unit, a first support body and a second support body, the first support body is elevated in the chuck for jacking or dropping the pallet on the chuck; and the second support body is elevated in the chuck for driving the pressuring ring to be elevated, and the elevating driving unit is used for driving the first support body and the second support body to be elevated simultaneously in the chuck. According to the bearing apparatus provided by the invention, conflicts caused when the first support body is elevated and the second support body drives the pressure ring to be elevated in case of signal errors can be avoided, parts of the bearing apparatus can be prevented from damage, and accordingly, the reliability of the bearing apparatus can be improved.
Description
Technical field
The invention belongs to semiconductor equipment manufacturing technology field, be specifically related to a kind of bogey and semiconductor processing equipment.
Background technology
Graphical sapphire substrate (PatternedSapphireSubstrate, hereinafter referred to as PSS) be one of method of the comparatively raising blue-ray LED light extraction efficiency of main flow at present, the method adopts dry etching technology to etch the Sapphire Substrate that there is mask pattern usually, to make figure on a sapphire substrate.Usual employing etching apparatus completes dry etch process.
Fig. 1 is the structural representation of existing etching apparatus.Refer to Fig. 1, this etching apparatus comprises reaction chamber 10 and manipulator 20, is provided with the bogey for carrying substrates in reaction chamber 10, and this bogey comprises chuck 11, pallet 12, pressure ring 13 and elevating mechanism.Pallet 12 is stacked on chuck 11, the annular region near its annular distance of pressure ring 13 pushes down the fringe region of pallet 12, elevating mechanism comprises elevation driving unit 14, thimble 15 and support column 16, elevation driving unit 14 comprises the first driver 141 and the second driver 142, first driver 141 is elevated in chuck 11 for driving thimble 15, in order to by the pallet be positioned on chuck 11 12 jack-up or put down, to make pallet 12 away from chuck 11 or to be stacked on chuck 11; Second driver 142 is elevated in chuck 11 for driving support column 16, and the second driver 142 is fixedly connected with pressure ring 13 by support column 16, drives support column 16 lifting to drive pressure ring 13 to be elevated.
Can be learnt by foregoing description adopts above-mentioned bogey inevitably to there is following technical problem in actual applications: due in the transmitting procedure of pallet 12, the first driver 141 and the second driver 142 is needed to complete in phase in order, this another signal transmission backward completed with regard to a lifting in both needs, another is elevated again, therefore, misoperation can be caused when signal is wrong, probably cause pallet 12 lifting to be elevated with pressure ring 13 to conflict mutually, thus damage with causing part, such as, if the signal be elevated pressure ring 13 collected is wrong, then when the first driver 141 drives thimble 15 to rise with jack-up pallet 12, pressure ring 13 still pushes down the edge of pallet 12, this just causes thimble 15 firmly contact with pallet 12 and fracture.
Summary of the invention
The present invention is intended to solve the technical problem existed in prior art, provide a kind of bogey and semiconductor processing equipment, it can avoid first supporter lifting and the second supporter when signal is wrong to drive pressure ring lifting to clash, thus the damage parts of bogey can be avoided, and then the reliability of bogey can be improved.
For solving the problems of the technologies described above, the invention provides a kind of bogey, comprise chuck, pallet, pressure ring and elevating mechanism, described pallet is provided with the multiple carrying positions for carrying substrates, described pallet is stacked on described chuck, and described pressure ring is for being fixed on described chuck by described pallet; Described elevating mechanism comprises elevation driving unit, the first supporter and the second supporter, and described first supporter is elevated in described chuck, in order to by the pallet jack-up be positioned on described chuck or put down; Described second supporter is elevated in described chuck, and in order to drive described pressure ring to be elevated, described elevation driving unit is elevated in described chuck for driving described first supporter and described second supporter simultaneously.
Wherein, described elevation driving unit comprises a driver, and described driver is used for driving described first supporter and described second supporter lifting simultaneously.
Wherein, described first supporter and described second supporter are mutually permanently connected by connector, and described connector is connected with the driving shaft of described driver.
Wherein, described driver is located on the center line of described chuck.
Wherein, described first supporter comprises at least three thimbles, and described at least three thimbles are arranged along the circumferential interval of described chuck.
Wherein, described second supporter comprises at least three support columns, and described at least three support columns are arranged along the circumferential interval of described chuck.
Wherein, described second supporter is fixedly connected with described pressure ring.
Wherein, described second supporter and described pressure ring adopt integrated mode to process.
The present invention also provides a kind of semiconductor processing equipment, comprises reaction chamber, in described reaction chamber, be provided with bogey, and described bogey adopts above-mentioned bogey provided by the invention.
The present invention has following beneficial effect:
Bogey provided by the invention, it drives the first supporter and the second supporter to be elevated in chuck by elevation driving unit simultaneously, can realize, when needs first supporter is elevated, driving the first supporter and the second supporter to be elevated simultaneously, when needs second supporter is elevated, drive the second supporter and the first supporter to be elevated simultaneously, and due in the process of loading and unloading pallet, the lifting of the first supporter and the second supporter drive the lifting of pressure ring to have sequencing, therefore, do not exist when the rising of needs first supporter makes pallet away from chuck surface, need the second supporter to drive pressure ring to decline makes pressure ring pallet is fixed on situation on chuck simultaneously, and do not exist when the decline of needs first supporter makes pallet be stacked on chuck, need the second supporter to drive pressure ring to rise makes pressure ring away from the situation of pallet simultaneously, that is, there is not the situation that can not realize the first supporter and the second supporter and carry out being elevated simultaneously, therefore, drive the first supporter and the second supporter to carry out being elevated the requirement that can meet in loading and unloading pallet process simultaneously, this compared with prior art, can not need to carry out one of them between the first supporter lifting and the lifting of the second supporter and be elevated another signal transmission backward, thus first supporter lifting and the second supporter when signal is wrong can be avoided to drive pressure ring lifting to clash, thus can avoid conflict and cause the damage parts of bogey, and then the reliability of bogey can be improved.
Semiconductor processing equipment provided by the invention, it adopts bogey provided by the invention, can avoid bogey damage parts, thus can improve the reliability of bogey, and then can improve the reliability of semiconductor processing equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing etching apparatus;
The structural representation of the bogey that Fig. 2 provides for the embodiment of the present invention; And
The structural representation of the semiconductor processing equipment that Fig. 3 provides for the embodiment of the present invention.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, bogey provided by the invention and semiconductor processing equipment are described in detail.
The structural representation of the bogey that Fig. 2 provides for the embodiment of the present invention.Refer to Fig. 2, the bogey that the present embodiment provides comprises chuck 21, pallet 22, pressure ring 23 and elevating mechanism.Wherein, pallet 22 is provided with the multiple carrying positions for carrying substrates, pallet 22 is stacked on chuck 21, and pressure ring 23 is for being fixed on chuck 21 by pallet 22; Elevating mechanism comprises elevation driving unit, the first supporter 24 and the second supporter 25, first supporter 24 is elevated in chuck 21, in order to by the pallet be positioned on chuck 21 22 jack-up or put down, to make pallet 22 away from chuck 21 or to be stacked on chuck 21, particularly, the first supporter 24 comprises at least three thimbles 241, and at least three thimbles 241 are arranged along the circumferential interval of chuck 21, each thimble 241 runs through the upper and lower surface of chuck 21, and can be elevated in chuck 21; Preferably, at least three thimbles 241 along chuck 21 circumferential interval and evenly arrange, this can realize stably support tray 22.
Second supporter 25 is elevated in chuck 21, be elevated in order to drive pressure ring 23, the fringe region of pallet 22 is pushed down away from the annular region near its annular distance of pallet 22 or pressure ring 23 to make pressure ring 23, thus pressure ring 23 realizes pallet 22 to be fixed on chuck, particularly, second supporter 25 is fixedly connected with pressure ring 23, second supporter 25 comprises at least three support columns 251, at least three support columns 251 are arranged along the circumferential interval of chuck 21, each support column 251 runs through the upper and lower surface of chuck 21, and can be elevated in chuck 21, continue to decline after the decline of support column 251 descent tape dynamic pressure ring 23 contacts with the lower surface of pallet 22, pressure ring 23 can be made to apply certain thrust to pallet 22, to push down the fringe region of pallet 22, preferably, at least three support columns 251 along chuck 21 circumferential interval and evenly arrange, this can make the thrust of pressure ring 23 pairs of pallets 22 be applied to the fringe region of pallet 22 equably, thus can ensure that pallet 22 contacts well with chuck 21 further.In actual applications, at least three support columns 251 and pressure ring 23 can adopt integrated mode to process.
Elevation driving unit is elevated in chuck 21 for driving the first supporter 24 and the second supporter 25 simultaneously.In the present embodiment, as shown in Figure 2, preferably, elevation driving unit comprises a driver 26, this driver 26 is elevated for driving the first supporter 24 and the second supporter 25 simultaneously, to realize driving first supporter 24 and the second supporter 25 is elevated in chuck 21 simultaneously.Particularly, the first supporter 24 and the second supporter 25 are mutually permanently connected by connector 27, and connector 27 is connected with the driving shaft of driver 26; Driver 26 is arranged on the below of chuck 21, and this bogey also comprises the chuck pedestal 28 for carrying chuck, and driver 26 is fixed on the lower surface of chuck pedestal 28.In actual applications, also can be connected with the driving shaft of driver 26 respectively with the second supporter 25 by the first supporter 24, drive the first supporter 24 and the second supporter 25 to be elevated to realize driver 26 simultaneously; Certainly, in actual applications, driver 26 can also be fixed in other structures, such as, when bogey is placed in reaction chamber, when first supporter 24 and the second supporter 25 all run through the bottom of reaction chamber, driver 26 can be arranged on the below of reaction chamber, and is fixed on the lower surface bottom reaction chamber.
Easy understand, in the present embodiment, elevation driving unit only comprises a driver 26, drive the first supporter 24 and the second supporter 25 to be elevated for realizing simultaneously, this and prior art comprise and are respectively used to driving first supporter 24 and compare with two drivers that the second supporter 25 is elevated, the magnitude setting of driver can be reduced, thus can reduce costs; And, this and the prior art space below reaction chamber is very limited, in addition, structure below chuck is also very complicated, such as, the cooling line comprising chuck go out liquid inlet, He gas cooled pipeline, the access of bottom electrode radio frequency and two drivers service line time compare, the magnitude setting at the driver of the below of reaction chamber and the power pipeline of driver can be reduced, thus the parts below reaction chamber can be avoided to a certain extent to heap install, thus maintenance and the dismounting difficulty of each parts can be reduced to a certain extent.
In the present embodiment, elevation driving unit comprises a driver 26, further preferably, this driver 26 is positioned on the center line of chuck 21, because the underlying space at reaction chamber is very limited in this and prior art, can not to arrange on center line that two drivers are all positioned at chuck and to be easy to cause pallet to lift injustice or the phenomenon of pressure ring to the thrust inequality of pallet is compared, this can make to be central force along chuck hub line to the top lift of pallet and the thrust of pressure ring to pallet, thus can ensure that level lifted by pallet and the thrust of pressure ring to pallet is even, thus the stability of reaction chamber can be improved.In actual applications, driver 26 also can be set and be positioned at optional position below chuck.
The bogey that detailed hereafter adopts the present embodiment to provide carries out the course of work of loading pallet.Particularly, certain position pre-set directly over chuck 21 is the transmission location of pallet 22, and, by manipulator, pallet 22 is transferred to this transmission location.The process of loading pallet 22 comprises the following steps:
Step S10, before pallet 22 transfers to transmission location, rises to the top of this transmission location, and thimble 241 is positioned at the below of transmission location by pressure ring 23;
Step S11, pallet 22 is transferred to transmission location by the manipulator carrying pallet 22;
Step S12, be the step needing the first supporter 24 to rise, that is, driver 26 drives connector 27 to rise, to make thimble 241 and support column 251 rise simultaneously, until pallet 22 jack-up that thimble 241 will be located on the manipulator at transmission location place;
Step S13, unloaded manipulator is return;
Step S14, for the step needing the first supporter 24 to decline, namely, driver 26 drives connector 27 to decline, decline with the thimble 241 and support column 251 that make to carry pallet simultaneously, until thimble 241 is positioned at the below of the upper surface of chuck 21, be stacked on the upper surface of chuck 21 to make the pallet 22 be located thereon;
Step S15, for the step needing the second supporter 25 to decline, that is, driver 26 continues to drive connector 27 to decline, continue to decline, until pressure ring 23 presses down the fringe region of pallet 22 in the indirect drive of connector 27 with the thimble 241 and support column 251 pressure ring that make to carry pallet 22 simultaneously.
The process of unloading pallet 22 comprises the following steps:
Step S20, be the step needing the second supporter 25 to rise, that is, driver 26 drives connector 27 to rise, to make thimble 241 and support column 251 rise simultaneously, until pressure ring 23 rises away from pallet 22 upper surface;
Step S21 is the step needing the first supporter 24 to rise, that is, driver 26 continues to drive connector 27 to rise, until thimble 241 by pallet 22 jack-up that is positioned on chuck 21 to the top of transmission location;
Step S22, unloaded manipulator moves to transmission location;
Step S23 is the step needing the first supporter 24 to decline, namely, driver 26 drives connector 27 to decline, to make thimble 241 and support column 251 decline simultaneously, until thimble 241 drops to the below of transmission location, the pallet 22 be positioned on thimble 241 is made to be positioned on manipulator;
Step S24, the manipulator carrying pallet 22 is return.
It should be noted that, in the present embodiment, for coordinating existing need upper surface pallet 22 being placed on manipulator to transmit again structure that this pallet 22, first supporter 24 adopts at least three thimbles 241, the second supporter 25 adopts the structure of at least three support columns 251.But, the present invention is not limited thereto, in actual applications, the structure of the first supporter 24 and the second supporter 25 specifically can be set, as long as can realize its corresponding function according to concrete actual conditions, such as, when adopting the manipulator of sucked type, that is, on lower surface pallet 22 being adsorbed on manipulator during conveying tray 22, first supporter 24 and the second supporter 25 all can adopt the supporter of loop configuration, or the structure such as the supporter of two semi-loops.
Also it should be noted that, in the present embodiment, elevation driving unit comprises a driver 26, but, the present invention is not limited thereto, in actual applications, also can be same as the prior art, namely, elevation driving unit also can comprise two drivers 26, these two drivers 26 are respectively used to drive at least three thimbles 241 (namely, first supporter 24) lifting and at least three support columns 251 (namely, second supporter 25) lifting, as long as meet these two drivers 26 can realize driving first supporter and the second supporter carries out being elevated simultaneously, in this case, when space below reaction chamber is enough, preferably, arranging each driver 26 is positioned on the center line of chuck 21, this can make to be central force along chuck 21 center line to the top lift of pallet 22 and the thrust of pressure ring 23 pairs of pallets 22, thus can ensure that the thrust of level and pressure ring 23 pairs of pallets 22 lifted by pallet 22 even, thus the stability of reaction chamber can be improved.
In sum, the bogey that the present embodiment provides, drive the first supporter 24 and the second supporter 25 to be elevated in chuck 21 by elevation driving unit simultaneously, can realize when needs first supporter 24 is elevated, drive the first supporter 24 and the second supporter 25 to be elevated simultaneously, when needs second supporter 25 is elevated, drive the second supporter 25 and the first supporter 24 to be elevated simultaneously, and due in the process of loading and unloading pallet 22, lifting and second supporter 25 of the first supporter 24 drive the lifting of pressure ring 23 to have sequencing, therefore, do not exist when the rising of needs first supporter 24 makes pallet 22 away from chuck 21 surface, need the second supporter 25 to drive pressure ring 23 to decline makes pressure ring 23 that pallet 22 is fixed on the situation of chuck 21 simultaneously, and do not exist when the decline of needs first supporter 24 makes pallet 22 be stacked on chuck 21, need the second supporter 25 to drive pressure ring 23 to rise makes pressure ring 23 away from the situation of pallet 22 simultaneously, that is, there is not the situation that can not realize the first supporter 24 and the second supporter 25 and carry out being elevated simultaneously, thus drive the first supporter 24 and the second supporter 25 to carry out being elevated the requirement that can meet in loading and unloading pallet process simultaneously, this compared with prior art, the first supporter 24 can not be needed to be elevated and to carry out one of them lifting action between the lifting of the second supporter 25 to complete another signal transmission backward, thus first supporter 24 lifting and the second supporter 25 when signal is wrong can be avoided to drive pressure ring 23 to be elevated clash, thus can avoid conflict and cause the damage parts of bogey, and then the reliability of bogey can be improved.
As another one technical scheme, the present invention also provides a kind of semiconductor processing equipment, the structural representation of the semiconductor processing equipment that Fig. 3 provides for the embodiment of the present invention.Refer to Fig. 3, the semiconductor processing equipment that the present embodiment provides comprises reaction chamber 30 and manipulator 32, in reaction chamber 30, be provided with bogey, the bogey that this bogey adopts above-described embodiment to provide; The lateral wall of reaction chamber 30 is also provided with transmission mouth 31, manipulator 32 for via transmission mouth 31 to reaction chamber 30 conveying tray 22.Particularly, this semiconductor processing equipment comprises PSS etching apparatus.
In the present embodiment, owing to coordinating the loading and unloading process realizing pallet 22 in the course of work of loading and unloading pallet 22 and above-described embodiment similar between manipulator 32 and bogey, and owing to being described later in detail in the above-described embodiments, do not repeat them here.At this, be only described in detail the difference of the two: particularly, transmission mouth 31 arranges the position corresponding with Preset Transfer position be on reaction chamber 30 sidewall.
In the present embodiment, as shown in Figure 3, the position corresponding with chuck 21 bottom reaction chamber 30 is formed with breach 33, the internal diameter of this breach 33 is less than the external diameter of chuck base 28, be positioned at this breach 33 position can form closed reaction chamber 30 to realize chuck base 28, in this case, driver 26 is fixedly installed on the lower surface of chuck pedestal 28.Certainly, in actual applications, can according to the concrete fixed drive 26 of actual conditions, such as, in the bottom of reaction chamber 30, breach is not set, when first supporter 24 and the second supporter 25 all run through the bottom of reaction chamber 30, driver 26 is arranged on the below of reaction chamber 30, and is fixedly installed on the lower surface bottom reaction chamber 30.
The semiconductor processing equipment that the present embodiment provides, the bogey adopting above-described embodiment to provide, can avoid bogey damage parts, thus can improve the reliability of bogey, and then can improve the reliability of semiconductor processing equipment.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, when not departing from principle of the present invention and essence, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (9)
1. a bogey, comprises chuck, pallet, pressure ring and elevating mechanism, and described pallet is provided with the multiple carrying positions for carrying substrates, described pallet is stacked on described chuck, and described pressure ring is for being fixed on described chuck by described pallet; Described elevating mechanism comprises elevation driving unit, the first supporter and the second supporter, and described first supporter is elevated in described chuck, in order to by the pallet jack-up be positioned on described chuck or put down; Described second supporter is elevated in described chuck, in order to drive described pressure ring to be elevated, it is characterized in that, described elevation driving unit is elevated in described chuck for driving described first supporter and described second supporter simultaneously.
2. bogey according to claim 1, is characterized in that, described elevation driving unit comprises a driver, and described driver is used for driving described first supporter and described second supporter lifting simultaneously.
3. bogey according to claim 2, is characterized in that, described first supporter and described second supporter are mutually permanently connected by connector, and described connector is connected with the driving shaft of described driver.
4. bogey according to claim 2, is characterized in that, described driver is located on the center line of described chuck.
5. bogey according to claim 1, is characterized in that, described first supporter comprises at least three thimbles, and described at least three thimbles are arranged along the circumferential interval of described chuck.
6. bogey according to claim 1, is characterized in that, described second supporter comprises at least three support columns, and described at least three support columns are arranged along the circumferential interval of described chuck.
7. bogey according to claim 1, is characterized in that, described second supporter is fixedly connected with described pressure ring.
8. bogey according to claim 1, is characterized in that, described second supporter and described pressure ring adopt integrated mode to process.
9. a semiconductor processing equipment, comprises reaction chamber, is provided with bogey, it is characterized in that in described reaction chamber, and described bogey adopts the bogey described in claim 1-8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410259553.9A CN105336655A (en) | 2014-06-12 | 2014-06-12 | Bearing apparatus and semiconductor processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410259553.9A CN105336655A (en) | 2014-06-12 | 2014-06-12 | Bearing apparatus and semiconductor processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105336655A true CN105336655A (en) | 2016-02-17 |
Family
ID=55287097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410259553.9A Pending CN105336655A (en) | 2014-06-12 | 2014-06-12 | Bearing apparatus and semiconductor processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105336655A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341720A (en) * | 2018-12-19 | 2020-06-26 | 江苏鲁汶仪器有限公司 | Wafer unloading and pressing device |
| CN111508890A (en) * | 2020-04-28 | 2020-08-07 | 北京北方华创微电子装备有限公司 | Wafer loading and unloading mechanism and semiconductor process equipment |
| CN111725107A (en) * | 2020-06-22 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and process chamber thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090067954A1 (en) * | 2007-09-07 | 2009-03-12 | Khamsidi Lanee | Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters |
| CN102108502A (en) * | 2009-12-25 | 2011-06-29 | 东京毅力科创株式会社 | Film deposition apparatus and film deposition method |
| CN102623375A (en) * | 2012-03-15 | 2012-08-01 | 哈尔滨工业大学 | Z-axis lifting mechanism with stress state balancing function |
| CN102939648A (en) * | 2010-06-01 | 2013-02-20 | 松下电器产业株式会社 | Plasma processing device and plasma processing method |
| KR20130125013A (en) * | 2012-05-08 | 2013-11-18 | 삼성전자주식회사 | Electrostatic chuck structure and dry etching apparatus including the same |
| US20140130743A1 (en) * | 2012-11-15 | 2014-05-15 | Tokyo Electron Limited | Film forming apparatus |
-
2014
- 2014-06-12 CN CN201410259553.9A patent/CN105336655A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090067954A1 (en) * | 2007-09-07 | 2009-03-12 | Khamsidi Lanee | Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters |
| CN102108502A (en) * | 2009-12-25 | 2011-06-29 | 东京毅力科创株式会社 | Film deposition apparatus and film deposition method |
| CN102939648A (en) * | 2010-06-01 | 2013-02-20 | 松下电器产业株式会社 | Plasma processing device and plasma processing method |
| CN102623375A (en) * | 2012-03-15 | 2012-08-01 | 哈尔滨工业大学 | Z-axis lifting mechanism with stress state balancing function |
| KR20130125013A (en) * | 2012-05-08 | 2013-11-18 | 삼성전자주식회사 | Electrostatic chuck structure and dry etching apparatus including the same |
| US20140130743A1 (en) * | 2012-11-15 | 2014-05-15 | Tokyo Electron Limited | Film forming apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341720A (en) * | 2018-12-19 | 2020-06-26 | 江苏鲁汶仪器有限公司 | Wafer unloading and pressing device |
| CN111508890A (en) * | 2020-04-28 | 2020-08-07 | 北京北方华创微电子装备有限公司 | Wafer loading and unloading mechanism and semiconductor process equipment |
| CN111508890B (en) * | 2020-04-28 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Wafer loading and unloading mechanism and semiconductor process equipment |
| CN111725107A (en) * | 2020-06-22 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and process chamber thereof |
| CN111725107B (en) * | 2020-06-22 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and process chamber thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102915944B (en) | Substrate connecting method | |
| CN105336655A (en) | Bearing apparatus and semiconductor processing device | |
| US10586727B2 (en) | Suction stage, lamination device, and method for manufacturing laminated substrate | |
| WO2016180007A1 (en) | Reaction chamber and semiconductor processing apparatus | |
| CN105552009A (en) | Semiconductor processing equipment | |
| KR20130090829A (en) | Substrate processing apparatus and substrate processing method | |
| KR20240055128A (en) | Process chambers, semiconductor process devices and semiconductor process methods | |
| CN102270597B (en) | Wafer switching equipment and wafer bracket assembly applied to same | |
| TW202306001A (en) | Process chamber and wafer processing method | |
| CN112133657A (en) | Semiconductor processing equipment and method for transmitting wafer | |
| CN104752290B (en) | Jacking system and plasma processing device | |
| CN102859664A (en) | Plasma processing device | |
| CN106816402B (en) | Method for eliminating electrostatic charge and method for unloading substrate | |
| CN105448787A (en) | Transmission device and semiconductor processing equipment | |
| CN110660723B (en) | Manipulator, bonding cavity, wafer bonding system and bonding method | |
| KR100920384B1 (en) | Lift pin module of fpd manufacturing machine | |
| CN105609459B (en) | Substrate fixing method and device and semiconductor processing equipment | |
| CN105206555B (en) | Transmission positioning system and semiconductor processing equipment | |
| CN105789013A (en) | Plasma etching device for slicing wafer and method for loading and unloading wafer | |
| KR101345605B1 (en) | Elevating apparatus, system for processing a substrate and method of processing the substrate using the same | |
| CN104752296A (en) | Positioning device of ejector pin mechanism and reaction chamber | |
| CN105655279A (en) | Bearing device and semiconductor processing equipment | |
| KR100980448B1 (en) | Lift pin module of fpd manufacturing machine | |
| CN105762098B (en) | Film conveying system and semiconductor processing equipment | |
| CN104916572A (en) | Bearing device and plasma processing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160217 |