CN105325067A - Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same - Google Patents
Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same Download PDFInfo
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- CN105325067A CN105325067A CN201480034531.0A CN201480034531A CN105325067A CN 105325067 A CN105325067 A CN 105325067A CN 201480034531 A CN201480034531 A CN 201480034531A CN 105325067 A CN105325067 A CN 105325067A
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- radiating fins
- conductive radiating
- layer
- heat conduction
- fins according
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Abstract
Disclosed herein are a conductive heat-dissipating sheet comprising a heat diffusion layer formed using metal materials; a heat conduction layer which is disposed on one surface or both surfaces of the heat diffusion layer and which is formed using inorganic materials including at least one material from the group consisting of metal oxides and alloys; and an adhesive layer disposed on one surface or both surfaces of the heat conduction layer; and an electrical part and an electronic device comprising the conductive heat-dissipating sheet.
Description
Technical field
The present invention relates to conductive radiating fins and comprise electric component and the electronic product of this conductive radiating fins, and more specifically, relate to the conductive radiating fins also comprising the heat conduction layer formed by inorganic material, the heat dissipation characteristics of the raising except electromagnetic wave shielding performance and conductivity is provided thus.
Background technology
Recently, according to slimming and the simplification of electronic equipment, electronic unit and electric component become miniaturized, and according to the high-performance of electronic equipment, electronic unit and electric component create a large amount of heat.A large amount of heat causes the faulty operation, the lost of life etc. of electronic unit and electric component.
Therefore, the heat that effectively absorbs and produced by electronic unit and electric component is employed and by the conductive radiating fins of absorbed heat trnasfer to outside.
Conductive radiating fins comprises the thermal diffusion layer heat produced by electronic unit and electric component be discharged to the outside, and thermal diffusion layer is attached to the adhesive layer of electronic unit and electric component.Metal such as copper is mainly used as the material of thermal diffusion layer.
Organic polymer is mainly used as the material of adhesive phase.Organic polymer has low thermal conductivity usually.Therefore, the thermal diffusion performance degradation of the conductive radiating fins of adhesive phase is comprised.
In order to improve the low heat conductivity of adhesive phase, with the addition of thermal conductive particles, but by adding thermal conductive particles, elasticity is increased, the adhesiveness of adhesion layer reduces.
Therefore, needed to provide excellent thermal diffusion performance and the conductive radiating fins of adhesiveness.
Summary of the invention
Technical problem
In one aspect of the invention, the invention provides a kind of conductive radiating fins/heat loss through conduction sheet with new structure.
In another aspect of this invention, the invention provides a kind of electric component comprising conductive radiating fins.
In still another aspect of the invention, the invention provides a kind of electronic product comprising conductive radiating fins.
Technical solution
An exemplary of the present invention provides a kind of conductive radiating fins, and described conductive radiating fins comprises:
The thermal diffusion layer formed by metal material;
And to be arranged on a surface of thermal diffusion layer or two surfaces and by the heat conduction layer comprising the one or more of inorganic material be selected from inorganic metal, metal oxide and alloy and formed.
Another exemplary of the present invention provides a kind of electronic unit, and described electronic unit comprises:
Heater; And
Be arranged on the conductive radiating fins on a surface of heater or two surfaces.
Another exemplary of the present invention provides a kind of electronic product comprising conductive radiating fins.
Beneficial effect
According to an aspect of the present invention, comprise the heat conduction layer with novel composition, make it possible to acquisition in the fusible situation not reducing adhesive phase and there is excellent thermal diffusion performance and the conductive radiating fins of electromagnetic wave shielding performance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the conductive radiating fins illustrated according to an exemplary.
Fig. 2 is the schematic diagram of the conductive radiating fins illustrated according to another exemplary.
Fig. 3 is the schematic diagram of the conductive radiating fins illustrated according to another exemplary.
Fig. 4 is the schematic diagram of the conductive radiating fins illustrated according to another exemplary.
Fig. 5 is the schematic diagram of the conductive radiating fins illustrated according to another exemplary.
Fig. 6 is the schematic diagram of the conductive radiating fins illustrated according to another exemplary.
The description > of < Reference numeral
(100): fin (001): adhesive phase
(002): heat conduction layer (003): thermal diffusion layer
(004): inorganic metal layer (005): release layer
Embodiment
Hereinafter, by the conductive radiating fins according to exemplary, and comprise the electric component of described conductive radiating fins and electronic product is explained in more detail.
Conductive radiating fins according to an exemplary comprises: the thermal diffusion layer formed by metal material; And to be arranged on a surface of thermal diffusion layer or two surfaces and by the heat conduction layer comprising the one or more of inorganic material be selected from inorganic metal, metal oxide and alloy and formed.Metal material does not have concrete restriction, but can be such as copper and aluminium.Inorganic metal is the metal different from the metal material forming thermal diffusion layer.Such as, inorganic metal can be iron, zinc and nickel.
Conductive radiating fins can also comprise be arranged on heat conduction layer a surface or two surfaces on protective layer.Protective layer can comprise polymer.Protective layer comprises polymer, make protective layer by heating and melting, and can be attached to base material etc., or polymer itself has adhesiveness, makes protective layer to be attached to base material etc.The polymer used in protective layer has no particular limits, and can be by the thermoplastic polymer of heating and melting or have fusible binder polymer.
Such as, protective layer can be the adhesive phase comprising binder polymer.
Meanwhile, in general conductive radiating fins in the related, adhesive layer comprises thermal conductive particles, the thermal conductivity of adhesive layer is improved, but adhesiveness is deteriorated.By contrast, in conductive radiating fins of the present invention, thermal conductive particles is formed in independent heat conduction layer, makes it possible to prevent the thermal diffusion performance degradation of conductive radiating fins and the adhesiveness that can improve adhesive layer.
Adhesive layer in conductive radiating fins does not comprise thermal conductive particles or comprises the poor thermal conductive particles of the thermal conductive particles than the conductive radiating fins in correlation technique, makes it possible to provide the thermal diffusion performance similar to the thermal diffusion performance of the conductive radiating fins in correlation technique.
In conductive radiating fins, metal oxide can be black oxide.Metal oxide can suppress deterioration by black oxide according to the variations in temperature of conductive radiating fins effectively.In addition, the adhesiveness between heat conduction layer and adhesive layer can improve more.In addition, heat conduction layer has black substantially, provides excellent outward appearance thus, and more effectively shields electromagnetic wave, reduces electromagnetic interference in electronic equipment thus.Such as, black oxide can be the oxide of one or more transition metal.Such as, black oxide can be the oxide comprising copper, nickel and cobalt.Meanwhile, metal oxide can be Cu oxide.
In conductive radiating fins, inorganic material can comprise that to be selected from alloy and carbon-based material one or more of in addition.
Inorganic material also comprises alloy, thus provides the thermal conductivity of raising than alloy with Metal Phase, makes heat conduction layer can have the thermal conductivity more improved.That is, heat conduction layer can serve as in fact new thermal diffusion layer.
In addition, inorganic material also comprises carbon-based material, and the thermal conductivity of heat conduction layer can be significantly improved.Therefore, heat conduction layer can serve as in fact new thermal diffusion layer.In addition, compared with the thermal diffusion layer formed by metal material, the heat conduction layer also comprising carbon-based material can provide in fact the thermal diffusion more improved performance.Such as, the heat conduction layer comprising carbon-based material can form the metal oxide-carbon composite bed with following structure, and carbon-based material is dispersed in metal oxide matrix in the structure shown here.
Compared with the carbon back fin formed by graphite in correlation technique, this composite bed does not have the problem of the dispersiveness of such as carbon-based material, crackle and fragmentation (crushing), and do not need to utilize independent polymer film etc. to apply, realize simple and firm structure thus.Therefore, composite bed can provide excellent thermal diffusion performance and durability simultaneously.
Such as, carbon-based material can comprise carbon-based nano structure.Carbon-based nano structure is the structure with nano-scale structure.Such as, there is one-dimensional nano structure, wherein only a dimension is unrestricted for the size of carbon-based nano structure, and the size of remaining two dimensions is limited to 1000nm or less; And two-dimensional nanostructure, wherein only two dimensions are unrestricted for the size of carbon-based nano structure, and only the size of a remaining dimension is limited to 1000nm or less.
One-dimensional nano structure is the unrestricted nanostructure of length, and comprises such as carbon nano-tube and carbon nano-fiber.Carbon nano-tube has no particular limits, if the such as carbon nano-tube of metal carbon nanotube, semiconductor carbon nanometer tube, Single Walled Carbon Nanotube, double-walled carbon nano-tube and multi-walled carbon nano-tubes is spendable in the art, so described carbon nano-tube can be used as carbon nano-tube of the present invention.Carbon nano-fiber is that diameter is less than 1000nm and has the carbon fiber of very high thermal conductivity compared with general carbon fiber.Such as, the thermal conductivity of the carbon nano-fiber of vapor phase growth can be 500W/mK or higher.Two-dimensional nanostructure is the unrestricted nanostructure of area, and comprises Graphene etc.If the area of Graphene does not have concrete restriction, so in the art can the Graphene of any kind can be used as two-dimensional nanostructure.
In addition, carbon-based material can also comprise that to be selected from graphite, expanded graphite and carbon fiber one or more of.Graphite is the carbon-based material with high crystalline, and its thermal conductivity is high and be 350W/mK to 400W/mK.Expanded graphite is by utilizing the process graphite such as the strong acid then handled graphite crossed of dry and/or sintering, and makes the graphite that the distance between surface increases.Carbon fiber is the fibrous carbon of diameter in micron level.
The heat conduction layer be formed on thermal diffusion layer can be integrally formed the organic binder bond not using such as adhesive or adhesive on thermal diffusion layer.Such as, heat conduction layer can be formed directly on thermal diffusion layer by plating.Therefore, the thermal conductivity in the interface between thermal diffusion layer and heat conduction layer can not be reduced by adhesive or adhesive.
The content of the alloy in heat conduction layer can be by weight 10% to by weight 90% of the total weight of heat conduction layer, but is substantially not limited in described scope, and can suitably change as required.
The content of the carbon-based material in heat conduction layer can up to by weight 10% of the total weight of heat conduction layer.Such as, the content of the carbon-based material in heat conduction layer can be by weight 0.01% to by weight 10% of the total weight of heat conduction layer.Such as, the content of the carbon-based material in heat conduction layer can be by weight 0.1% to by weight 10% of the total weight of heat conduction layer.Such as, the content of the carbon-based material in heat conduction layer can be by weight 0.5% to by weight 10% of the total weight of heat conduction layer.Such as, the content of the carbon-based material in heat conduction layer can be by weight 1% to by weight 10% of the total weight of heat conduction layer.When the too high levels of the carbon-based material in heat conduction layer, the heat conduction layer comprising metal oxide may have crackle.
Heat conduction layer can not comprise organic material substantially.That is, heat conduction layer can not use the organic material of such as polymeric binder and only be formed by be selected from metal oxide, alloy and carbon-based material one or more of.Because heat conduction layer does not comprise organic binder bond, so can the thermal conductivity significantly improved be provided compared with the heat conduction layer comprising organic binder bond.Such as, heat conduction layer can be formed by plating, chemical plating etc.In addition, heat conduction layer can be formed when not implementing stringent condition such as high temperature and/or high pressure.Therefore, the conductive radiating fins comprising heat conduction layer can be manufactured in simple economy ground.
Alloy in conductive radiating fins can for comprising the alloy of two or more elements be selected from Cu, Ni, Co, Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn.Such as, alloy can be the one or more of alloy in Cu and above-mentioned residual metallic.
Metal oxide in conductive radiating fins can comprise Cu.Such as, metal oxide can be Cu oxide.Such as, Cu oxide can be CuO, Cu
2o etc.
Metal oxide in conductive radiating fins can also comprise the one or more of elements be selected from Ni, Co, Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn.Such as, metal oxide can comprise that to be selected from nickel oxide, cobalt/cobalt oxide, ferriferous oxide, zinc oxide, chromated oxide, molybdenum oxide, tungsten oxide, barium oxide, Mn oxide, titanium oxide and tin-oxide one or more of.Such as, metal oxide can comprise oxide and/or hydroxide.Such as Co
3o
4, CoO (OH), CoO, NiO, Ni
2o
3, Ni (OH)
2.
The thickness of the heat conduction layer in conductive radiating fins can be 10 μm or less.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 5 μm or less.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 4 μm.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 3 μm.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 2 μm.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 1 μm.When the thickness of heat conduction layer is more than 10 μm, the thermal resistance of heat conduction layer may increase.
Heat conduction layer in conductive radiating fins can have flexibility.Compared with the general heat conduction layer in correlation technique, heat conduction layer can have flexibility.Particularly, even if heat conduction layer is the composite bed comprising carbon-based material, the heat conduction layer (it is easy to break) of carbon-based material is comprised unlike correlation technique, described heat conduction layer also can have flexibility, makes heat conduction layer have quite high durability and may be used for various object.
The metal material of the thermal diffusion layer in conductive radiating fins can be copper or aluminium.The thermal conductivity of copper and aluminium is 200W/mK or higher.Therefore, this metal material can diffuse to outside by while receiving from heater through the heat of adhesive phase and heat conduction layer effectively.Such as, thermal diffusion layer can be Copper Foil.
The thickness of the thermal diffusion layer in conductive radiating fins can be 4 μm to 100 μm.When the thickness of thermal diffusion layer is 4 μm or less, when the heat sent by heater is large, the thermal capacity of thermal diffusion layer may be saturated.When the thickness of thermal diffusion layer is more than 100 μm, the heat diffusion properties of thermal diffusion layer may can not get improving.Such as, the thickness of thermal diffusion layer can be 10 μm to 60 μm.Such as, the thickness of thermal diffusion layer can be 20 μm to 50 μm.Such as, the thickness of thermal diffusion layer can be 30 μm to 45 μm.
Conductive radiating fins can also comprise metal level, and the described metal level be arranged on a surface of thermal diffusion layer or two surfaces comprises the metal in chosen from Fe, zinc and nickel.On the surface that ferrous metal layer, zinc metal level and/or nickel metal layer are also included in thermal diffusion layer or two surfaces, prevent thermal diffusion layer deterioration thus.
The thickness of the adhesive phase in conductive radiating fins can be 50 μm or less.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 1 μm to 40 μm.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 5 μm to 30 μm.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 10 μm to 20 μm.Such as, the thickness of the heat conduction layer in conductive radiating fins can be 15 μm to 20 μm.
Adhesive phase in conductive radiating fins can comprise organic based polymer.If organic based polymer provides adhesiveness, so organic based polymer has no particular limits, and can comprise, such as, and acrylic acid based polymer, styrene-based polymer, polyurethane based-polymer and based polymer.
In addition, the adhesive phase in conductive radiating fins can not comprise heat conducting material.But, in order to improve the thermal conductivity of conductive radiating fins further, the heat conducting material of particle form can also be comprised.
Inorganic nitride particle, metal hydroxide particle, metal oxide particle, metallic particles, carbon granule etc. can be used as heat conducting material.Such as, boron nitride particle, aluminum nitride particle, silicon nitride particle and gallium nitride particle can be used as inorganic nitride particle.Wherein, because the more excellent thermal conductivity of boron nitride particle and excellent electrical insulation capability can use boron nitride particle.That is, at least boron nitride particle can be used as inorganic nitride particle.Such as, each particle in aluminium hydroxide and magnesium hydroxide can be used as metal hydroxide particle.Wherein, because the more excellent thermal conductivity of aluminum hydroxide particles and excellent electrical insulation capability can use aluminum hydroxide particles as metal hydroxide particle.The tin-oxide of aluminum oxide, titanium oxide, zinc oxide, tin-oxide, Cu oxide, nickel oxide and antimony dopant can be used as metal oxide particle.Wherein, because the more excellent thermal conductivity of al oxide granule and excellent electrical insulation capability can use al oxide granule as metal oxide particle.
Each particle in carborundum, silicon dioxide, calcium carbonate, barium titanate, copper, silver, gold, nickel, aluminium, platinum, carbon black, carbon pipe (carbon nano-tube), carbon fiber and diamond can be used as heat conducting material.
Can be used alone the one in various particle, or can combine and use two or more in various particle as heat conducting material.The shape of thermal conductive particles does not have concrete restriction, and can be such as spherical, aciculiform or plate shape.
When thermal conductive particles has spherical, the primary average particle size of thermal conductive particles can be 0.1 μm to 1000 μm, is preferably 1 μm to 100 μm, is more preferably 2 μm to 20 μm.When primary average particle size is 1000 μm or less, the ratio of the size of thermal conductive particles and the thickness of heat transfer adhesive phase can reduce, and makes to be not easy to produce deviation in the thickness of heat transfer adhesive phase.
In addition, when thermal conductive particles has aciculiform or plate shape, the maximum length of thermal conductive particles can be 0.1 μm to 1000 μm, preferably, and 1 μm to 100 μm, more preferably, 2 μm to 20 μm.When maximum length is 1000 μm or less, possible thermal conductive particles is difficult to cohesion, makes easily to process thermal conductive particles.
In addition, the aspect ratio represented by long axis length/minor axis length or long axis length/thickness when thermal conductive particles has aciculiform, or the aspect ratio represented by catercorner length/thickness or long edge lengths/thickness when thermal conductive particles has plate shape can be 1 to 10000, more preferably, 10 to 1000.
General merchandise on market can be used as thermal conductive particles.Name is called the product of " HP-40 " (MiZshimaKokintez company), name is called that the product of " PT620 " (Momentive company) etc. can be used as the particle of boron nitride, name is called that the product etc. of " HeidilightH-32 " and " HeidilightH-42 " (ShowaDenko company) can be used as aluminum hydroxide particles, name is called that the product etc. of " KISUMA5A " (KowaKakaguKogyo company) can be used as magnesium hydroxide particle, name is called " SN-100S ", the products of " SN-100P " and " SN-100D (aqueous dispersion product) " (IshiharaSangyo company) etc. can be used as the silicon oxide particles of antimony dopant, the product etc. that name is called " TTO series " (IshiharaSangyo company) can be used as the particle of titanium oxide, and name is called " SnO-310 ", the product etc. of " SnO-350 " and " SnO-410 " (SumimotoOsaka cement company) can be used as zinc oxide particle.
Relative to the organic polymer compositions of 100 weight portions, operable thermal conductive particles is 10 weight portion to 1000 weight portions, such as, and 50 weight portion to 500 weight portions, or 100 weight portion to 400 weight portions.Relative to the polymers compositions of 100 weight portions, the thermal conductive particles used is 10 weight portions or more weight portion, make to there is advantage in the thermal conductivity improving heat transfer adhesive layer further, and the thermal conductive particles used is 1000 weight portions or less weight portion, make improve further heat transfer adhesive phase flexible in there is advantage, and the bonding force of heat transfer adhesive layer becomes excellent.
Adhesive phase in conductive radiating fins can also comprise fire proofing.Magnesium hydroxide and aluminium hydroxide can be used as fire proofing, but fire proofing is not limited thereto in fact, and if certain fire proofing is spendable in the art, so can uses the described fire proofing of any kind.The particle diameter of magnesium hydroxide can be 0.5 μm to 5 μm, but due to the particle diameter of magnesium hydroxide little, so the performance of fire proofing can be improved.
The content of magnesium hydroxide can be 10 volume % to 40 volume % of the cumulative volume of adhesive layer.When the content of magnesium hydroxide is less than 10 volume %, adhesive phase may be difficult to the performance showing anti-flammability, and when the content of magnesium hydroxide is more than 40 volume %, thermal conductivity reduces and elasticity increases, and the adhesiveness of adhesive phase may be reduced.
Adhesive phase can be coated on heat conduction layer by various method.Such as, the method that heat conduction layer applies adhesive layer can be selected from gravure (Gravure) rubbing method, fine gravure (MicroGravure) rubbing method, kiss formula gravure (KissGravure) rubbing method, comma scraper (CommaKnife) rubbing method, roller (Roll) is coated with method, spray (spray) is coated with method, Meyer rod (MeyerBar) rubbing method, slit (SlotDie) rubbing method, oppositely (Reverser) rubbing method, flexible board (printing) method, and offset printing (offset) method, but be not limited thereto in essence, and if a kind of method can form the adhesive phase in this area, described method so can be adopted as the method for coated with adhesive layers on heat conduction layer.
Conductive radiating fins can also comprise setting release layer over the binder layer.Release layer protection conductive radiating fins, and can paper using, polymer film etc. be made, and if a kind of release layer is spendable in the art, so described release layer can be used as release layer of the present invention.Such as, polymer film can be PET film, acrylic film etc.
Insulating barrier can also be provided with on of a thermal diffusion layer surface or two surfaces.Thus the surface of insulating barrier cover heating diffusion layer prevents from having due to metallic property.So the member contact in the thermal diffusion layer of conductivity and conductive radiating fins and other electronic products, and provides the electric insulation for conductive radiating fins.
If a kind of electrical insulating material is spendable in the art, so described electrical insulating material can be used as the material used in insulating barrier.Such as, PETG (PET), poly-naphthalenedicarboxylic acid ethylene glycol (PEN), polyphenylene sulfide (PPS), polyethylene (PE), polypropylene (PP), polyimides (PI), Merlon (PC), silicones and polyurethane resin can be used as electrical insulating material.
The insulating barrier of preferred lower thermal conductivity.Particularly, preferably, thermal conductivity is 0.5W/mK, and more preferably, thermal conductivity is 0.2W/mK.The thermal conductivity of the thermal conductivity of PET and PI to be the thermal conductivity of about 0.15W/mK, PP be about 0.12W/mK, PC is the thermal conductivity of about 0.19W/mK, PE is about 0.50W/mK, and the thermal conductivity of PPS is about 0.29W/mK.Therefore, in the above-described example, preferred PET, PP, PI and PC.
The thickness of insulating barrier is preferably from 10 μm to 100 μm.When the thickness of insulating barrier is less than 10 μm, the heat transfer of thermal diffusion layer through-thickness is not fully obstructed, and therefore, thermal diffusion layer can not fully increase along the thermal conductivity of surface direction.When the thickness of thermal insulation layer is more than 100 μm, between thermal diffusion layer and insulating barrier, and there is the risk that heat can not go out from the diffusion into the surface of conductive radiating fins in thermal accumlation.
The knitting layer that thermal diffusion layer in conductive radiating fins can comprise multiple metal level and be arranged between described metal level.That is, thermal diffusion layer by the multiple metal levels connected by knitting layer, also can be formed by a metal level.The number of the metal level that thermal diffusion layer comprises does not have concrete restriction, and can suitably select as required.
Such as, the thermal diffusion layer knitting layer that can comprise two metal levels and be arranged between metal level.The summation of the thickness of described two metal levels can be, such as, and 10 μm to 60 μm.The summation of the thickness of described two metal levels can be, such as, and 20 μm to 50 μm.The summation of the thickness of described two metal levels can be, such as, and 30 μm to 45 μm.
Such as, thermal diffusion layer can be the first metal layer of 15 μm to 20 μm and thickness be that second metal level of 13 μm to 17 μm is formed by thickness.
The knitting layer be arranged between metal level can be fluoropolymer resin.Such as, polyurethane-based resin, acrylic resin (acyl group resin), epoxy and Lauxite can be used as fluoropolymer resin.The method forming knitting layer can be identical with the method forming adhesive phase.
Differently, conductive radiating fins comprises the thermal diffusion layer formed by the first metal material, and to be arranged on a surface of thermal diffusion layer or two surfaces and to comprise the heat conduction layer of the second metal material, and the second metal material is the one or more of metals in chosen from Fe, zinc and nickel.
First metal material can be copper, aluminium etc., but is not limited thereto in essence, and if a kind of material can be used as the thermal diffusion layer in this area, so described material can be used as the first metal material.Second metal material is the metal different from the first metal material, and the second metal material can be iron, zinc and nickel.The heat conduction layer comprising the second metal material is formed on thermal diffusion layer, and thermal diffusion performance and electromagnetic wave shielding performance can be improved.
Conductive radiating fins can also comprise be arranged on heat conduction layer a surface or two surfaces on protective layer.Protective layer can comprise polymer.Protective layer comprises polymer and makes protective layer by heating and melting, and can be attached to basal substrate etc., or polymer itself has adhesiveness and makes protective layer to be attached to basal substrate etc.The polymer used in protective layer has no particular limits, and can be by the thermoplastic polymer of heating and melting or have fusible binder polymer.
Conductive radiating fins can have the structure of such as the following stated.
Such as, conductive radiating fins 100 can have following structure, and this structure comprises: the thermal diffusion layer 003 formed by metal material; On the surface being arranged on thermal diffusion layer 003 and the heat conduction layer 002 formed by the inorganic material comprising metal oxide; And the adhesive phase 001 be arranged on a surface of heat conduction layer 002.
Such as, as shown in Figure 2, conductive radiating fins 100 can have following structure, and this structure comprises: the thermal diffusion layer 003 formed by metal material; On the surface being arranged on thermal diffusion layer 003 and the heat conduction layer 002 formed by the inorganic material comprising metal oxide; Be arranged on the adhesive phase 001 on a surface of heat conduction layer 002; And the heat conduction layer 002 be arranged on another surface of thermal diffusion layer 003.
Such as, as shown in Figure 3, conductive radiating fins 100 can have following structure, and this structure comprises: the thermal diffusion layer 003 formed by metal material; On the surface being arranged on thermal diffusion layer 003 and the heat conduction layer 002 formed by the inorganic material comprising metal oxide; Be arranged on the adhesive phase 001 on a surface of heat conduction layer 002; Be arranged on the heat conduction layer 002 on another surface of thermal diffusion layer 003; And the adhesive phase 001 be arranged on a surface of heat conduction layer 002.
Such as, as shown in Figure 4, conductive radiating fins 100 can have following structure, and this structure comprises: the thermal diffusion layer 003 formed by metal material; On the surface being arranged on thermal diffusion layer 003 and the heat conduction layer 002 formed by the inorganic material comprising metal oxide; Be arranged on the adhesive phase 001 on a surface of heat conduction layer 002; And the nickel dam 004 be arranged on another surface of thermal diffusion layer 003.
Such as, as shown in Figure 5, conductive radiating fins 100 can have following structure, and this structure comprises: the thermal diffusion layer 003 formed by metal material; Be arranged on the nickel dam 004 on a surface of thermal diffusion layer 003; Be arranged on the adhesive phase 001 on a surface of nickel dam 004; And the nickel dam 004 be arranged on another surface of thermal diffusion layer 003.Such as, as shown in Figure 6, conductive radiating fins 100 can have following structure, and this structure comprises: the thermal diffusion layer 003 formed by metal material; On the surface being arranged on thermal diffusion layer 003 and the heat conduction layer 002 formed by the inorganic material comprising metal oxide; Be arranged on the release layer 005 on a surface of heat conduction layer; Be arranged on the heat conduction layer 002 on another surface of thermal diffusion layer 003; Be arranged on the adhesive phase 001 on a surface of heat conduction layer 002; And the release layer 005 be arranged on a surface of adhesive phase 001.
In addition, although not shown in the accompanying drawings, each layer of the structure fin in scope feasible technically can be arranged on two surfaces of another layer of structure fin.
Electronic unit according to another exemplary comprises heater, and is arranged on the above-mentioned conductive radiating fins on a surface of heater or two surfaces.Heater has no particular limits, and if heater produces heat, so described heater is applicable to as heater of the present invention.Heater and/or electronic unit can be such as battery, motor and IC chip, but be not limited thereto, if a kind of heater and/or electronic unit need heat radiation in the art, so described heater and/or electronic unit can be used as heater of the present invention and/or electronic unit.
Above-mentioned conductive radiating fins is adopted according to the electronic product of another exemplary.
Electronic product can be film flat panel display equipment, the such as smart phone of such as panel TV and the portable electric appts etc. of Intelligent flat computer, but electronic product is not limited thereto, if a kind of electronic product needs heat radiation in the art, so described electronic product can be used as electronic product of the present invention.
Such as, electronic product can be flexible display device, such as flexible TV.Conductive radiating fins has excellent flexibility, and being widely used in thus needs in flexible electronic product.
Method according to the manufacture conductive radiating fins of another exemplary comprises: prepare metallic film; Metallic film forms metal oxide layer; And adhesive phase is formed on metal oxide layer.
First, metallic film is prepared.
Metallic film can be Copper Foil or aluminium foil.Such as, Copper Foil can be used.Copper Foil can be electrolytic copper foil, rolled copper foil etc.
Copper Foil be can produce wide width and its thickness can be the electrolytic copper foil of 4 μm to 100 μm.Such as, the thickness of Copper Foil can be 1 μm to 35 μm.Such as, the thickness of Copper Foil can be 6 μm to 18 μm.The surface roughness (Rz:DIN) of Copper Foil can be 0.1 μm to 2.0 μm.Such as, the surface roughness of Copper Foil can be 0.5 μm to 1.5 μm.When the surface roughness of Copper Foil is less than 0.1 μm, the adhesiveness of knitting layer may reduce.Possibly metal oxide layer cannot be obtained when the surface roughness of Copper Foil is all greater than 2.0 μm.
Next, metallic film forms metal oxide layer.
Metal oxide layer arranges Copper Foil by the negative electrode place in the electrolysis plating bath comprising the metal causing black, and depositing metal oxide coating is formed on the copper foil surface of negative electrode.Be called as and cause the metal of the metal of black to comprise Cu, Cr, Co and Ni.In order to make the electrodeposited coating of Cu, Co, Ni etc. present black, metal oxide layer needs by carrying out metallide such as Co in the form of the oxide near limiting current density
3o
4, CoO (OH), CoO, NiO, Ni
2o
3with Ni (OH)
2deposition on surfaces of the copper foil.
Metal oxide layer can obtain the metal oxide coating as having uniform outer appearance by the following method: ammonium component is added to the electrolysis plating bath comprising Cu, Co and Ni, and by so-called wherein as the ammonium of ligand be bonded to the complex ion plating bath of central metallic ions Cu, Co and Ni, to form complex compound, and form metal oxide coating on Copper Foil.
Complicated to generating the intermediate reaction process of final reacting product after injection first reactant, therefore, be difficult to find out detailed reaction path exactly, but when Cu, Co and Ni are plated on Copper Foil by complex ion plating bath, the plating bath of Cu, Co and Ni becomes completely different from the plating bath (ammonium compounds stays out of) in correlation technique, therefore, the non-homogeneous metal oxide preventing and electroplate in correlation technique is thought.
Concrete electroplating process is such as undertaken by utilizing Ir electrode to carry out electroplating as negative electrode as positive electrode and Copper Foil, and is described to the concrete component of electrolysis plating bath below.
When each concentration in Cu, Co and Ni is less than 1g/l, coating does not have black completely, and when each concentration in Cu, Co and Ni is more than 20g/l, and this can relate to defile due to component and create residue.Therefore, each content in Cu, Co and Ni of comprising in electrolysis plating bath can be 1g/l to 20g/l.
Meanwhile, in order to add physical characteristic or the mechanical property of thermal diffusion needs, or the adhesiveness improved between adhesive phase and thermal diffusion layer, except Cu, Co and Ni, the one or more of components in Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn can also be added in plating bath.
Because ammonium compounds is as ligand, therefore can add ammonium salt, such as ammonium sulfate, ammonium chloride and ammonium acetate, and also can in order to the ammonium compounds of the form of the complex compound of ammonium.When the concentration of the ammonium compounds in plating bath is more than 50g/l, metal oxide layer can not become complete black, and therefore the concentration of ammonium compounds can be 50g/l or less.In addition, when the concentration of ammonium compounds is less than 1g/l, the solution resistance of plating bath is large, and make ammonium compounds uneconomical, therefore the concentration of ammonium compounds is more preferably 1g/l to 50g/l.
As the complexing agent for bonding ammonium and metal ion, glycine, citric acid (salt), pyrophosphoric acid etc. are suitable.When the concentration of complexing agent is more than 100g/l, metal oxide layer can not become complete black, and produces stain on the surface of Copper Foil, and therefore the concentration of complexing agent can be 100g/l or less.In addition, in order to make ammonium compounds and metal ion effectively react, the concentration of complexant can be 5g/l, and the thus concentration of complexant more preferably 5g/l, to 100g/l or less.
Plating bath can also comprise carbon-based material.Carbon-based material can comprise that to be selected from carbon nano-tube, carbon nano-fiber, Graphene, ultra-dispersed diamond (UDD), diamond-like-carbon (UDC), graphite, expanded graphite and carbon fiber one or more of.
In plating bath, the content of carbon-based material can be 1g/l to 100g/l.Such as, in plating bath, the content of carbon-based material can be 1g/l to 50g/l.Such as, in plating bath, the content of carbon-based material can be 1g/l to 20g/l.Such as, in plating bath, the content of carbon-based material can be 1g/l to 20g/l.Such as, in plating bath, the content of carbon-based material can be 2g/l to 15g/l.Such as, in plating bath, the content of carbon-based material can be 3g/l to 15g/l.Such as, in plating bath, the content of carbon-based material can be 7g/l to 15g/l.
The current density of industrial Eco-power plating bath is 0.1A/dm
2to 60A/dm
2, and particularly, preferably, 5A/dm
2to 45A/dm
2.When current density is less than 0.1A/dm
2time, then cannot obtain the metal oxide layer of required black, and when current density is greater than 60A/dm
2time, then plating is excessively, and generation is defiled phenomenon.The pH value of plating bath can be 2.5 to 6.0, and particularly, preferably 4.0 to 5.8.When the pH value of plating bath is less than 2.5, the blackening layer of plating is dissolved, and when the pH value of plating bath is equal to or greater than 6.0, and (without the black surface process) variable color of contrary surface and plating solution are separated out, and the stability of liquid is declined.
In addition, electroplating time can be 1 second to 40 seconds, but considers the concentration etc. of current density, electrolyte, and other scopes except the scope of 1 second to 40 seconds are available.
Meanwhile, in order to reduce reflectivity, and improve the adhesiveness with transparent substrates substrate, fine copper stratum granulosum can deposit and be attached to the surface of Copper Foil.The copper particle deposited, as anchor, makes to improve adhesiveness by improving peel strength when copper foil layer is stacked on adhesive phase material.
Fine copper stratum granulosum can by being used in roughening process that Copper Foil carries out and being formed.Usually, in copper sulfate bath, carry out roughening process, and the adhesion amount of copper particle can be 0.1g/m during roughening process
2to 10g/m
2, be more preferably 0.5g/m
2to 8g/m
2.As mentioned above, the surface roughness run through for the formation of all surface processing procedure of fine copper stratum granulosum and metal oxide coating needs Rz (DIN standard) to remain on 0.1 μm to 2.0 μm.When carrying out surface treatment under the formation condition and plating melanism condition of described fine copper stratum granulosum, surface roughness can remain in above-mentioned scope.
In addition, corrosion-resistant treatments can be carried out on Copper Foil of the present invention, such as electrolytic chromate process.In addition, when on the surface that the electroplating film formed by Ni, Zn, Ni alloy or Zn alloy is formed in non-melanism plating (blackeningplated), can prevent metal oxide layer from during heating process, being added thermo-color.
Finally, metal oxide layer forms adhesive phase.
Adhesive phase by being applied on metal oxide layer by the solution comprising acrylic acid (class) polymer, styrene-based polymer, polyurethane based-polymer, based polymer etc., can be formed by drying subsequently.Described solution selectably can comprise thermal conductive particles and fire-retardant particle.
Protection tunic and/or dielectric film can arrange over the binder layer as required.
Implement pattern of the present invention
Hereinafter, will be explained in more detail the present invention by embodiment.But embodiment only for describing object of the present invention, and is apparent that to those skilled in the art and is not limited to following examples according to the scope of the present invention of principle matter of the present invention.
(manufacture conductive radiating fins)
Embodiment 1: metal oxide heat conduction layer
(formation heat conduction layer)
Be that the electrolytic copper foil (ILJIN material) of 35 μm is immersed in 5 seconds, pickling processes in the sulfuric acid of 100g/l by thickness, then use pure water, the surface being then commonly called glossy surface under the following conditions on Copper Foil is carried out the electroplating technology of metal oxide.As the result of plating, the surface of Copper Foil forms the melanism metal oxide layer comprising Cu, Co and Ni that thickness is 1 μm.
Electrobath composition and plating conditions
Cu ion (CuSO
45H
2o) concentration: 4g/l
Co ion (CoSO
47H
2o) concentration: 4g/l
Ni ion (NiSO
46H
2o) concentration: 5g/l
Ammonium sulfate ((NH
4)
2sO
4) concentration: 15g/l
Natrium citricum (C
6h
5na
3o
72H
2o) concentration: 25g/l
Electrolyte pH:5.4
Electrolyte temperature: 25 DEG C
Current density: 20A/dm
2
Electroplating time: 8 seconds
(formation adhesive phase)
The adhesive phase that thickness is about 10 μm is formed by applying acrylic adhesives (robondPS-61, industrial coating) on black metal oxide layer.
Embodiment 2: metal oxide+carbon-based material (CNT) heat conduction layer
Except being that the carbon nano-tube of 10g/L is added to except electrobath in addition by concentration, manufacture conductive radiating fins by the method identical with the method for embodiment 1.
Embodiment 3: metal oxide+carbon-based material (carbon nano-fiber) heat conduction layer
Except being that the carbon nano-fiber of 10g/L adds to except electrobath in addition by concentration, manufacture conductive radiating fins by the method identical with the method for embodiment 1.
Embodiment 4: metal oxide+carbon-based material (Graphene) heat conduction layer
Except being that the Graphene of 5g/L adds to except electrobath in addition by concentration, manufacture conductive radiating fins by the method identical with the method for embodiment 1.
Embodiment 5: metal oxide+carbon-based material (expanded graphite) heat conduction layer
Be that the expanded graphite powder of 5g/L is added to outside electrobath unless otherwise by concentration, manufacture conductive radiating fins by the method identical with the method for embodiment 1.
Embodiment 6: nickel plating heat conduction layer
(formation heat conduction layer)
Be that the electrolytic copper foil (ILJIN material) of 35 μm is immersed in 5 seconds, pickling processes in the sulfuric acid of 100g/l by thickness, then use pure water, two surfaces then under the following conditions on Copper Foil are carried out the electroplating technology of metal oxide.As the result of plating, the surface of Copper Foil forms the Ni layer that thickness is 0.21 μm.
Electrobath composition or plating conditions
Ni ion (NiSO
47H
2o) concentration: 200g/l
Sulfuric acid (H
2sO
4) concentration: 100g/l
Electrolyte pH:1.0
Electrolyte temperature: 30 DEG C
Current density: 10A/dm
2
Electroplating time: 10 seconds
(formation adhesive phase)
The adhesive phase that thickness is about 10 μm is formed by applying acrylic adhesives (robondPS-61, industrial coating) on nickel dam.
Embodiment 7: metal oxide heat conduction layer+nickel metal layer
(formation heat conduction layer)
Be that the electrolytic copper foil (ILJIN material) of 35 μm is immersed in 5 seconds, pickling processes in the sulfuric acid of 100g/l by thickness, then use pure water, on two surfaces of Copper Foil, then carry out the electroplating technology of metal oxide under the following conditions.As the result of plating, the surface of Copper Foil forms the melanism metal oxide layer comprising Cu, Co and Ni that thickness is 1 μm.
Electrobath composition and plating conditions
Cu ion (CuSO
45H
2o) concentration: 4g/l
Co ion (CoSO
47H
2o) concentration: 4g/l
Ni ion (NiSO
46H
2o) concentration: 5g/l
Ammonium sulfate ((NH
4)
2sO
4) concentration: 15g/l
Natrium citricum (C
6h
5na
3o
72H
2o) concentration: 25g/l
Electrolyte pH:5.4
Electrolyte temperature: 25 DEG C
Current density: 20A/dm
2
Electroplating time: 8 seconds
(forming Ni metal level)
The Copper Foil it being formed with black metal oxide layer is immersed in 5 seconds, pickling processes in the sulfuric acid of 100g/l, then uses pure water, on the surface of black oxidation nitride layer, then carry out the electroplating technology of metal oxide under the following conditions.As the result of plating, the surface of black oxidation nitride layer forms the Ni layer that thickness is 0.2 μm.
Electrobath composition or plating conditions
Ni ion (NiSO
47H
2o) concentration: 200g/l
Sulfuric acid (H
2sO
4) concentration: 100g/l
Electrolyte pH:1.0
Electrolyte temperature: 30 DEG C
Current density: 10A/dm
2
Electroplating time: 10 seconds
(formation adhesive phase)
The adhesive phase that thickness is about 10 μm is formed by applying acrylic adhesives (robondPS-61, industrial coating) on nickel dam.
Embodiment 8: metal oxide+carbon-based material (carbon nano-fiber) heat conduction layer
Be that the carbon nano-fiber of 10g/L adds electrobath to for the formation of outside heat conduction layer unless otherwise by concentration, manufacture conductive radiating fins by the method identical with the method for embodiment 7.
Comparative example 1: the adhesive phase comprising carbon thermal conductive particles
Except omitting the step forming metal oxide layer, Copper Foil directly forms adhesive phase, and add to outside adhesive phase with the carbon granule (it is for thermal conductive particles) that average grain diameter is 1 μm by the mode making to comprise by weight 5%, manufacture conductive radiating fins by the method identical with the method for embodiment 1.
Comparative example 2: the adhesive phase comprising Ni metal heat conduction particle
Except omitting the step forming metal oxide layer, Copper Foil directly forms adhesive phase, and add to outside adhesive phase by nickel (Ni) metallic particles (it is thermal conductive particles) being 1 μm by the average grain diameter of 5% content by weight, manufacture conductive radiating fins by the method identical with the method for embodiment 1.
Evaluation Example 1: evaluate thermal diffusivity
By the laser flash method under ASTME1461 to passing through embodiment 1 to embodiment 8, and the thermal diffusivity of the conductive radiating fins of comparative example 1 and comparative example 2 manufacture is evaluated.The measuring equipment used is the model LFA447 of MEZSCH.
In laser flash method, the short flash of light carries out homogeneous heating to the front surface of sample, by the rising of temperature along with the time using infrared (IR) transducer the rear surface of sample to be detected, then the thermal diffusivity (α) based on the sample by using software to be calculated by sensor measurement data is measured.Some in measurement result are shown in in following table 1.
[table 1]
| Thermal diffusivity (α) [W/mk] | |
| Embodiment 1 | 343 |
| Embodiment 2 | 351 |
| Embodiment 3 | 350 |
| Embodiment 4 | 341 |
| Embodiment 5 | 337 |
| Embodiment 6 | 344 |
| Embodiment 7 | 359 |
| Comparative example 1 | 332 |
| Comparative example 2 | 331 |
As the result measured, as compared to the conductive radiating fins of comparative example 1 with comparative example 2, the conductive radiating fins of embodiment 1 to embodiment 7 presents the thermal diffusion performance of raising.
Even if when using the rolled copper foil of same thickness to carry out alternative electrolytic copper foil during the conductive radiating fins manufacturing embodiment 1 to embodiment 7, also present substantially identical thermal diffusion results of property.If commercially available rolled copper foil, so rolled copper foil does not have concrete restriction.
Compared with the conductive radiating fins of embodiment 7, the conductive radiating fins of embodiment 8 presents the electromagnetic wave shielding characteristic of raising.
In addition, the concentration of the carbon nano-tube during the conductive radiating fins manufacturing embodiment 3 in electrobath changes over 1g/L, 5g/L, 20g/L, 50g/L, the situation being 1g/L with 50g/L with the concentration of carbon nano-tube is compared, and increases many in the concentration of carbon nano-tube for thermal diffusivity when 5g/L, 10g/L and 20g/L is relative.
Evaluation Example 2: evaluate electromagnetic wave shielding characteristic
Measure by using the electromagnetic wave shielding characteristic of network analyser (Agilent, E5701A) to the conductive radiating fins manufactured in embodiment 1 to embodiment 8 and comparative example 1 and comparative example 2.By measuring the value of the prearranged signal value being applied to fin and the signal of telecommunication reflected from fin and using the ratio of described two signals recorded to calculate electromagnetic shielding effect.Such as, when applied signal is completely reflected, shield effectiveness is 100%.Some in measurement result are shown in in following table 2.
[table 2]
| Shield effectiveness (%) | |
| Embodiment 1 | 99.9 |
| Embodiment 2 | 99.8 |
| Embodiment 3 | 99.8 |
| Embodiment 4 | 99.8 |
| Embodiment 5 | 99.8 |
| Embodiment 6 | 99.9 |
| Embodiment 7 | 99.9 |
| Comparative example 1 | 80.3 |
| Comparative example 2 | 84.1 |
As the result measured, as shown in table 2, as compared to the conductive radiating fins of comparative example 1 with comparative example 2, the conductive radiating fins of embodiment 1 to embodiment 7 presents the electromagnetic wave shielding characteristic of raising.
Compared with the conductive radiating fins of embodiment 7, the conductive radiating fins of embodiment 8 presents the electromagnetic wave shielding characteristic of raising.
Even if when using the rolled copper foil of same thickness to carry out alternative electrolytic copper foil during the conductive radiating fins manufacturing embodiment 1 to embodiment 7, also present substantially identical electromagnetic wave shielding characteristic.If commercially available rolled copper foil, so rolled copper foil does not have concrete restriction.
Commercial Application
According to an aspect of the present invention, comprise the heat conduction layer with new compositions, make it possible to acquisition in the fusible situation not reducing adhesive phase and there is excellent thermal diffusion performance and the conductive radiating fins of electromagnetic wave shielding performance.
Claims (26)
1. a conductive radiating fins, comprising:
One or more thermal diffusion layer formed by metal material; And
Heat conduction layer, described heat conduction layer to be arranged on a surface of described thermal diffusion layer or two surfaces and to be formed by comprising the one or more of inorganic material be selected from inorganic metal, metal oxide and alloy.
2. conductive radiating fins according to claim 1, also comprises:
Be arranged on the protective layer on a surface of described heat conduction layer or two surfaces.
3. conductive radiating fins according to claim 2, wherein said protective layer comprises polymer.
4. conductive radiating fins according to claim 2, wherein said protective layer is adhesive phase.
5. conductive radiating fins according to claim 1, wherein said metal oxide is black oxide.
6. conductive radiating fins according to claim 1, wherein said inorganic material also comprises carbon-based material.
7. conductive radiating fins according to claim 6, wherein said carbon-based material comprises carbon-based nano structure.
8. conductive radiating fins according to claim 7, wherein said carbon-based nano structure comprises that to be selected from carbon nano-tube, carbon nano-fiber and Graphene one or more of.
9. conductive radiating fins according to claim 6, wherein said carbon-based material also comprises that to be selected from ultra-dispersed diamond (UDD), diamond-like-carbon (UDC, diamond-likecarbon), graphite, expanded graphite and carbon fiber one or more of.
10. conductive radiating fins according to claim 6, the content of wherein said carbon-based material accounts for 10% or less of the total weight of described heat conduction layer by weight.
11. conductive radiating fins according to claim 1, wherein said alloy comprises two or more elements be selected from Cu, Ni, Co, Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn.
12. conductive radiating fins according to claim 1, wherein said metal oxide comprises Cu.
13. conductive radiating fins according to claim 1, wherein said metal oxide also comprises the one or more of elements be selected from Ni, Co, Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn.
14. conductive radiating fins according to claim 1, the thickness of wherein said heat conduction layer is 10 μm or less.
15. conductive radiating fins according to claim 1, wherein said heat conduction layer has flexibility.
16. conductive radiating fins according to claim 1, wherein said metal material is copper or aluminium.
17. conductive radiating fins according to claim 1, wherein said thermal diffusion layer is electrolytic copper foil or rolled copper foil.
18. conductive radiating fins according to claim 1, the thickness of wherein said thermal diffusion layer is 4 μm to 100 μm.
19. conductive radiating fins according to claim 1, wherein said heat conduction layer is integrally formed on described thermal diffusion layer.
20. conductive radiating fins according to claim 1, also comprise:
Metal level, described metal level to be arranged on a surface of described thermal diffusion layer or two surfaces and to be formed by the one or more of metals in chosen from Fe, zinc and nickel.
21. conductive radiating fins according to claim 4, wherein said adhesive phase comprises fire proofing.
22. conductive radiating fins according to claim 21, also comprise:
Be arranged on the release layer on described adhesive phase.
23. 1 kinds of conductive radiating fins, comprising:
The thermal diffusion layer formed by the first metal material; And
Heat conduction layer, described heat conduction layer to be arranged on a surface of described thermal diffusion layer or two surfaces and to comprise the second metal material,
Wherein said second metal material is the one or more of metals in chosen from Fe, zinc and nickel, and described first metal material is different from described second metal material.
24. 1 kinds of electronic units, comprising:
Heater; And
Conductive radiating fins according to any one of claim 1 to 23, on the surface that described conductive radiating fins is arranged on described heater or two surfaces.
25. 1 kinds of electronic products, it adopts the conductive radiating fins according to any one of claim 1 to 23.
26. electronic products according to claim 25, wherein said electronic product is flexible display apparatus.
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| KR10-2013-0070497 | 2013-06-19 | ||
| KR20130070497 | 2013-06-19 | ||
| KR10-2014-0073692 | 2014-06-17 | ||
| KR1020140073692A KR101707042B1 (en) | 2013-06-19 | 2014-06-17 | Conducting heart dissipating sheet, electric component and electronics device comprising the sheet |
| PCT/KR2014/005363 WO2014204204A1 (en) | 2013-06-19 | 2014-06-18 | Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same |
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| CN105325067B CN105325067B (en) | 2017-09-19 |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469805A (en) * | 2000-10-18 | 2004-01-21 | ������������ʽ���� | Multilayered metal laminate and process for producing the same |
| CN2694491Y (en) * | 2004-03-20 | 2005-04-20 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator and heat radiation module |
| JP2006093546A (en) * | 2004-09-27 | 2006-04-06 | Oki Electric Ind Co Ltd | Heat sink sheet, heat radiating cylinder and heat radiating structure employing it |
| US20070087483A1 (en) * | 2003-09-18 | 2007-04-19 | Fuji Electric Systems Co., Ltd. | Heat sink and method for its production |
| KR20070057356A (en) * | 2005-12-02 | 2007-06-07 | 에스케이케미칼주식회사 | Heat dissipation pad for electronic part with improved thermoconductive and electric insulating properties |
| JP2010171129A (en) * | 2009-01-21 | 2010-08-05 | Kaneka Corp | Heat radiation structure |
| CN101958392A (en) * | 2009-07-15 | 2011-01-26 | 协和电线株式会社 | Plating structure and method for manufacturing electric material |
| KR20110119256A (en) * | 2010-04-27 | 2011-11-02 | 나노캠텍주식회사 | Resin composition for heat-radiating sheet, heat-radiating sheet and copper clad laminate employing the same |
| CN102384697A (en) * | 2010-07-05 | 2012-03-21 | 栗村化学株式会社 | Heat radiation tape and manufacturing method thereof |
| US20120067399A1 (en) * | 2009-06-11 | 2012-03-22 | Chung Kwon Park | Photovoltaic module with ceramic coating heat radiating sheet |
| KR20120052605A (en) * | 2010-11-16 | 2012-05-24 | 한국전기연구원 | Manufacturing method of thermal conduction adhesive and sheet using thermal conduction adhesive thereby |
| CN102479760A (en) * | 2010-11-24 | 2012-05-30 | 岑尚仁 | Thermal diffusion element with aluminum nitride film and manufacturing method thereof |
| KR20120073792A (en) * | 2010-12-27 | 2012-07-05 | 율촌화학 주식회사 | Heat radiating sheet |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140154469A1 (en) * | 2011-07-26 | 2014-06-05 | Seiji Kagawa | Electromagnetic-wave-absorbing film having high thermal dissipation |
-
2014
- 2014-06-17 KR KR1020140073692A patent/KR101707042B1/en active IP Right Grant
- 2014-06-18 CN CN201480034531.0A patent/CN105325067B/en not_active Expired - Fee Related
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469805A (en) * | 2000-10-18 | 2004-01-21 | ������������ʽ���� | Multilayered metal laminate and process for producing the same |
| US20070087483A1 (en) * | 2003-09-18 | 2007-04-19 | Fuji Electric Systems Co., Ltd. | Heat sink and method for its production |
| CN2694491Y (en) * | 2004-03-20 | 2005-04-20 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator and heat radiation module |
| JP2006093546A (en) * | 2004-09-27 | 2006-04-06 | Oki Electric Ind Co Ltd | Heat sink sheet, heat radiating cylinder and heat radiating structure employing it |
| KR20070057356A (en) * | 2005-12-02 | 2007-06-07 | 에스케이케미칼주식회사 | Heat dissipation pad for electronic part with improved thermoconductive and electric insulating properties |
| JP2010171129A (en) * | 2009-01-21 | 2010-08-05 | Kaneka Corp | Heat radiation structure |
| US20120067399A1 (en) * | 2009-06-11 | 2012-03-22 | Chung Kwon Park | Photovoltaic module with ceramic coating heat radiating sheet |
| CN101958392A (en) * | 2009-07-15 | 2011-01-26 | 协和电线株式会社 | Plating structure and method for manufacturing electric material |
| KR20110119256A (en) * | 2010-04-27 | 2011-11-02 | 나노캠텍주식회사 | Resin composition for heat-radiating sheet, heat-radiating sheet and copper clad laminate employing the same |
| CN102384697A (en) * | 2010-07-05 | 2012-03-21 | 栗村化学株式会社 | Heat radiation tape and manufacturing method thereof |
| KR20120052605A (en) * | 2010-11-16 | 2012-05-24 | 한국전기연구원 | Manufacturing method of thermal conduction adhesive and sheet using thermal conduction adhesive thereby |
| CN102479760A (en) * | 2010-11-24 | 2012-05-30 | 岑尚仁 | Thermal diffusion element with aluminum nitride film and manufacturing method thereof |
| KR20120073792A (en) * | 2010-12-27 | 2012-07-05 | 율촌화학 주식회사 | Heat radiating sheet |
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| WO2018188341A1 (en) * | 2017-04-12 | 2018-10-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Composite structure and method for producing the same and electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20140147719A (en) | 2014-12-30 |
| KR101707042B1 (en) | 2017-02-17 |
| CN105325067B (en) | 2017-09-19 |
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