CN105324629B - Optical measuring device and measuring method for obtaining range difference - Google Patents
Optical measuring device and measuring method for obtaining range difference Download PDFInfo
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- CN105324629B CN105324629B CN201480034685.XA CN201480034685A CN105324629B CN 105324629 B CN105324629 B CN 105324629B CN 201480034685 A CN201480034685 A CN 201480034685A CN 105324629 B CN105324629 B CN 105324629B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0691—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of objects while moving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/50—Using chromatic effects to achieve wavelength-dependent depth resolution
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Optical measuring device and measuring method for obtaining step height.Invention is related to a kind of optical measuring device, and the optical measuring device obtains the distance between bearing (8) and the fringe region (10) of the object to be measured (12) difference (6) in situ.The optical measuring device has:The measurement head (14) of (15) is guided with two-beam, the measurement head (14) guides the first measurement beam (16) into bearing (8), and the second measurement beam (18) is guided into the fringe region (10) of the object to be measured (12).Reflectance spectrum for obtaining and being formed the first measurement beam (16) for being led to bearing (8) is provided, and is led to the tool of the reflectance spectrum of the second measurement beam (18) of the fringe region (10) of the object to be measured (12).Measuring device has the multi-channel measurement equipment (34) that a spectrum line (72) is arranged.The assessment unit (32) for reflectance spectrum for obtaining the step height between bearing (8) and the fringe region (10) of object (12), works together with spectrometer (48) and display unit (66).
Description
Invention is related to a kind of for obtaining the optical measuring device of range difference and a kind of optics using the measuring device
Measurement method.
Optical measuring device for measurement surface is known according to open 10 2,008 041 062 A1 of DE.It is known
Measuring device generate measuring beam, measuring beam is incident on object after the optical module individually focused across at least three
Surface on, by the surface reflection of object, and examined by spatial decomposition photodetector together with the reference light for then interfering superposition
It surveys.
To such end it is known that measuring device have include at least three individual focus optics optical accessories.These
The main shaft of the optical module individually focused is offset from one another and placed side by side.Furthermore it is known that measuring device have be placed on measurement
Beam splitter in the light path of light beam.In addition, being directed to known device, the plane of reference and spatial decomposition photodetector are provided.
Light source, beam splitter and optical accessories are arranged so that relative to each other so that are emitted by light source and across focusing light
The measurement light for learning component is incident on surface, is incident on detector by surface reflection and via focus optics.In addition,
There is known measuring device assessment system, the assessment system to be used to receive image data and defeated from spatial decomposition photodetector
Go out to indicate the measurement data of the surface shape on surface.For this purpose, indicating the distance between position and the focus optics on surface
Distance value be acquired.According to these distance values, assessment system forms the parameter for the surface shape for indicating surface.
In addition, the method that patent disclosed above discloses the surface for measuring object, this method consists essentially of following
Step:First, it generates and measures light.The segment beam that light is formed as measuring three convergences of the first part of light is measured as a result, with
Illuminate three regions of the body surface for being separated by a distance placement.Three part light of reflected light or light by surface reflection
Beam is led to spatial decomposition detector, these light shapes in the spatial decomposition detector together with the second part for measuring light
At interference.Finally, these interference are analyzed by the detector of detection light intensity, to indicate the table of object by corresponding measurement data
The surface shape in face.
Furthermore it is known that method in 10 2,008 041 062 7826068 B2, US 2009/ of A1, US of open DE
0078888 AS1、WO 2013/070732 A1、US 7853429 B2、US 7443517 B2、DE 10 2011 081 596
Illustrate in A1, DE 10 2,011 055 735 and KR 10 2,008 0112436.
Step between rotary support and the rotated edge region for the object (in particular, the object to be thinned) to be measured
Measurement need robust (robust) measuring device, the robust measure device to be occupied while bearing high environmental pollution limited
Space.
For this purpose, traditional robust step height measurement device ground as before is operated using tactile probe, a probe
The surface of the fringe region of the narrow exposure for the object to be measured is scanned, the second probe is located on the upper surface of rotary support,
Allow to obtain from the distance between two probes obtained, occur during processing slave millimeter range to multiple microns
The step height of range.On the one hand one difficult point of this tactile measurement method is, suitably to measure to be measured
The pressing force of pressing force and another aspect on the surface of support material on the fringe region of object.
If pressing force is too high, the possibility damaged to the fringe region for the object to be measured is can not rule out,
Especially because object grinding rotation multiplicity need the thickness by object out of millimeter be thinned to 100 microns it is below
Thickness.If pressing force is too low, since probe at least easily incurs sizable survey on the upper surface of the relative coarseness of bearing
Amount error is inaccurate with measurement, so interfering, wherein the upper surface of bearing is because being thinned the abrasive grains of period appearance due to phase
To coarse..
A kind of robust measure device and corresponding robust measure method are needed, to overcome the defect described in this field, simultaneously
Deliver reliable measurement result.
A kind of optical measuring device of the characteristic with independent claims 1 and the characteristic of independent claims 14 are provided
Measurement method.
Herein, colored confocal range measurement (chromatic confocal distance measuring) technology
It is understood to that a kind of lens using the different wave length for light have the effect of the method for different focal point.Here it is colored it is confocal away from
From the dispersion measured using spectrum broadband light in optical imaging system, come accurately determine between reflecting surface and measurement head away from
From.The spectral width band point light source of the form of the first pinhole diaphragm of generally use or optical fiber connector is focused onto in optical imaging system
Object on.Here, the distance from focus to imaging system is known, for good and all limits the function of wavelength.Reflected light is same
One imaging system indicates again, is decoupled and the light path by illuminating is projected onto pin hole light positioned at the mirror point of beam splitter
On door screen.Selectively, reflected light can also be fed back directly into the first pinhole diaphragm, then be decoupled.Then, pinhole diaphragm
Subsequent detector determines the dominant wavelength of reflected light.By the knowledge of the focal length of individual wavelength, can directly determine and dominant wavelength
Object distance.The advantage of this method is without moving assembly.
In addition, optical coherence tomography (OCT) indicates inspection method, wherein use spectral width band by interferometer
Light measures the distance between object.In this process, examined object is by spot scan.Arm with known optical path length
As the reference to measuring arm.The interference of the subwave of two arms generates pattern, and the light of two arms can be read from the pattern
Difference between the length of road.
Here, area has been carried out between two interferometries and appraisal procedure (so-called " time domain " OCT and " frequency domain " OCT)
Point.They relate in one aspect to time domain (TD) signal, are on the other hand related to frequency domain (FD) signal.It means that the length of frequency arm
Change, and do not consider spectrum and constantly measure the intensity (time domain) of interference, or obtains the interference (frequency of individual spectral components
Domain).
Filling according to the measurement of the application with both colored confocal and interference distance measuring techniques can be advantageously used
It sets and measurement method.Especially during the processing of the wheel measuring object and rotary support that be measured or be thinned, for step
The in situ of height reduces, and uses the measuring device of the application.
Specifically, in order to establish reliable and contactless measuring technique, in the first embodiment of invention, one can be used
Optical measuring device of the kind for obtaining range difference, the optical measuring device include the measurement head that there is two-beam to guide, the two-beam
The fringe region that guiding measures first Shu Yinxiang bearings and measure Shu Yinxiang objects by second, wherein the measuring technique
It is robust in the case where grinding environment.
In addition, optical measuring device, which has, places measurement head to obtain the measurement head guide device of step height.In addition, light
Learning measuring device has the spectrum wideband light source for generating light beam.Corresponding measurement head optical device can indicate on bearing at least
Second measurement point on the fringe region of one the first measurement point and object.For obtaining and being formed the first measurement beam
It works together with the assessment unit for reflectance spectrum with the tool of the reflectance spectrum of the second measurement beam, to obtain bearing and object
Fringe region between step height, wherein the first measurement beam is led to bearing, and the second measurement beam, which is led to, to be measured
The fringe region of object.
One advantage of the optical measuring device is, by by two adjacent measurements in the further embodiment of invention
Head is inserted into measurement head guide device and the two-beam guiding of the measurement head of realization, and the first measurement beam is led to and the object to be measured
The adjacent abutment surface of the fringe region of body, the second of the second measurement head measures the edge of the beam in-situ scanning object to be measured
Region.
In the further embodiment of invention, measurement can be separated by measuring optical device in measurement head accordingly
Beam so that in optical measuring device, first in abutment surface, which measures hot spot, generates the reflection for being suitable for distance assessment, and wants
The second measurement hot spot that the fringe region of measured object is adjacent generates the reflection for being also applied for distance assessment.Two distance knots
The difference of fruit can constantly monitor the reduction of the thickness for the object to be measured, and by its home position manifestation in display appropriate
On.
Such as the scan rate of 4kHz can realize the measurement error that identification measures exceptional value and thus brings, and by using suitable
When digital measurement filter eliminate them.Due to the scan values per second that can obtain 4000 or more, because dust is gentle molten
Glue particle and the measurement error that generates can reliably be eliminated and the measurement result of robust filters out so that although deteriorating
Environmental condition under, this optical measuring device can also be used, reliably and robustly to measure the reduction of step height.
The robustness of measurement method can be improved by selecting the measurement to the light wave length range of wideband light source, be
This, the material of bearing and both the materials of object to be measured are opaque.
In the further embodiment of invention, provide for the colored confocal measurement head for obtaining step height in situ.In addition,
Measuring device is also equipped with the measurement head that step height is obtained for interferometry in situ.By changing measurement head and process of measurement
Simple process, another method can be switched to from a kind of method, and realize optical measuring device for measuring environment
Optimum apjustment.
Such as above illustrated, optical measuring device can be with two optical measurement for including multi-channel measurement equipment
Head, the two optical measuring heads are placed side by side in measurement head guide device and are mechanically connected.However, measurement head guide device
In such compact measurement head still obtain systems with two independent measured values together with work, to obtain range difference.
In the further embodiment of invention, measurement head can have there are two optical fiber is measured, the two measure optical fiber can be with
Mechanically positioning and work together with multi-channel measurement equipment (preferentially with two pass bands equipment).Such measurement head
Also it works together with obtaining system with two mutually independent measured values.
Here, two measurement head optical fiber of optical measuring device can be supplied via fibre optics Y couplers, wherein
Fibre optics Y couplers will be decoupled into two optical fiber from light of the spectral width with light source.Even if measuring method needs to refer to
Part is measured, this can be measured by fibre optics and robustly realized relatively, wherein only one fibre optics part is in side
It is mirrored, and can be incorporated into the fibre optics line (robust fibre optic strand) of robust.
Two measurement points are come from (on the one hand from the upper surface of bearing and on the other hand from the object to be measured in order to assess
The surface of the fringe region of body) reflected light, multi-channel measurement equipment can have at least two spectrometers.Selectively,
It can use and a spectrometer and place multiplexer at its upstream so that under multichannel pattern, first measures beam and the
The scanning result of two measurement beams is alternately transmitted to a signal light spectrometer via optical fiber.On the other hand, multi-channel measurement equipment
There can also be multi-thread circuit detector.This indicates cost-effective replacement.
In the further embodiment of invention, optical measuring device is equipped at least one spectrum line, using the spectrum line,
The measurement that can be expressed apart from peak value and be evaluated as step height measured.For this purpose, being examined using identical spectrum line
It surveys and measures from first and measure the light that beam reflects, and detect and measure from second and measure the light that beam reflects.Although this situation is simultaneously
It is unnecessary, but when it is several measurement head is rendered as measuring several distance values when, spectrometer can also have several spectrum
Line.Accordingly, there exist can measure the embodiment of several light to measurement head using a single spectrum line.
Using colored confocal method, can directly be determined by reflectance spectrum apart from peak value.In spectral interference measurement method
In addition it is used or alternatively in the other embodiment of property, in order to determine apart from peak value, equalization then Fourier transformation, or
The so-called Fast Fourier Transform (FFT) of person (FFT) preferentially occurs.
In order to create several Measurement channels, each measurement head can advantageously be individually connected to light guide (especially optical fiber),
To which light is provided separately via the guiding of individual light to the common light spectral line distributed all measurement heads.For this purpose, light guides
Or each of optical fiber may be coupled to the input of multi-channel measurement equipment, and in multi-channel measurement equipment, input can be
Individually, that is, spectrometer is connected to by the special light guide of individual.In spectrometer input, light guide or optical fiber can be in fiber optics
It learns and is terminated in connector, fiber light connector is inserted into holder, to which fiber light connector can be located at spectrometer
Collimator lens before.
Therefore, it is possible to the Multichannel device of measurement that realize special robust and accurate, while also can be cost-effective.
In the further embodiment of invention, optical measuring device has for making the first measurement beam and second measure beam
The digitized tool of reflectance spectrum, wherein the first measurement beam is led to bearing, and the second measurement beam is led to the object to be measured
Fringe region.There is measuring device the assessment unit for these digitized reflectance spectrums, reflectance spectrum can be used for obtaining
Take the step height between bearing and the fringe region of object.
Here, as has been stated, can be detected by environment because of the high optics scan rate of for example, at least 4kHz
Chip particles, measure exceptional value caused by aerosol particle and powder dust particle, and use electronic filter as described above
They are filtered out.In view of the variation of the refractive index compared to air environment of any generation, pass through gas bleed or liquid
Body, which rinses, can also protect double environment for measuring beam.
The another aspect of invention is related to a kind of measuring method, which obtains bearing and want in situ
The distance between measured fringe region of object difference.For this purpose, measurement method includes the following steps.In measurement head guide device
Middle setting has the optical measuring device of the measurement head of two-beam guiding, to get the distance on the surface of bearing and to being tested
The distance on the surface of the fringe region of the object of amount.
Then, the spectrum broadband light of light source is applied to branch via light guide and as the measurement head optical device for measuring hot spot
On on the surface of the seat and surface of the fringe region of object to be measured.In this process, the measurement beam of reflection is fed back
It returns in the Measurement channel of the measuring device at least one interference spectroscope, the reflectance spectrum of the light beam of reflection is by interference light
Spectrometer obtains.
Then, reflectance spectrum is evaluated, and system and extreme measurement error is removed, and measured object constantly subtracts
Small thickness is determined in situ.
This method makes robustness monitor being thinned for object (such as semiconductor wafer or ceramic wafers), wherein such as object
Body is maintained in corresponding grinding device and encloses and is pivoted, and the fringe region for the object to be measured is suitable for having with bearing
The step height of pass measures, and bearing is also rotated in rotation but in the opposite direction.
The bearing of rotation is generally about the rotary shaft rotation that radius is significantly greater than the diameter for the disc shaped object to be measured
The abrasive disk turned so that several objects to be measured can be located on abrasive disk.The object to be each measured is rotated
Maintaining part is maintained on the surface of abrasive disk, this enables to the diameter of this object to be measured more than 10 inches and this
The beginning thickness of the kind object to be measured is within the scope of millimeter.Then, backed by means of the tool rotated in opposite directions
Abrasive disk and maintaining part, object can be thinned to the thickness less than 100 microns.
Because of the high scan rate per second more than 4000 turns, this method can be obtained, be filtered out and eliminate and be generated because of interference
Measurement error and other random or the period measurement errors, to when filtered out because of high scan rate it is such measure it is different
When constant value, ensure that the reduction of the robustly thickness of the monitoring object to be measured, the interference may be because of abrasive grains, air
The particle of grinding dust or aerosol and milled mixtures and occur.
The constant error of even system (for example occurs because of the vibrations of the curvature on the surface of bearing or entire abrasive structure
Constant error) can be acquired and by means of two-beam guiding and downstream assessment unit and be eliminated, due to two individually
Measured value obtain system, enabling the measurement method of opposite robust is provided for the problematic environment of autogenous mill.
For this purpose, in the preferred embodiment of this method, the measurement head in measurement head guide device can have in multichannel
Two optical measuring heads placed side by side and mechanically connected in measuring apparatus.Such optical measuring device has such as
Lower advantage, that is, can not interact between two measurement heads, therefore, not influenced between range measurements.
In addition, measurement head can have can mechanically position and together with multi-channel measurement equipment (preferentially and bilateral
Road measuring apparatus) work two measurement fibers.Such measurement head only with two individual fibers or fibre bundle can
With constructively relative compact, therefore it is not take up too many space and is suitable for thinned device.
In addition, such fibre optics scheme can be used in other embodiment, to be coupled via fibre optics Y
Device will be in the photodissociation coupling of spectrum wideband light source to two optical fiber.
In processing during measurement, the first measurement point is formed on bearing, and the second measurement point, which is formed in, to be measured
On the fringe region of object, the distance from them to measurement head is acquired, and calculates step height by subtraction.
As has been stated, two different measurement methods can be used to the method, that is, for obtaining step
The colored confocal measurement method and interferometric method of height.
Second for being led to the reflectance spectrum of the first measurement beam of bearing and being led to the fringe region of object measures beam
Reflectance spectrum will be special advantage by digitlization.For example, by using above-mentioned electronic filter, by digitlization can eliminate by
Exceptional value caused by abrasive grains in the environment of grinder.Therefore, measurement method disclosed in invention is in milling apparatus environment
In be extremely robust.
Because measurement head is by double measurement heads rather than is individually arranged, optical device only needs a small amount of spaces, makes
For example for during the grinding of the semiconductor wafer of electronics industry and ceramic wafers, device is particularly suitable for object height
In-situ test and in situ measurement.In addition, when grinding object corresponding to multiple optics wavelength, there is step in edge region.
Optical measuring device and method can also be advantageously used in, and be ground the general of dust, milled mixtures and Aerosol Pollution
Under conditions of manufacturing enterprise, it is used especially in the optics step height measurement on surface of revolution.
Invention is more fully described with reference to the accompanying drawings.
Fig. 1 shows the optical measurement dress of the acquisition range difference used on the thin grinder according to one embodiment of invention
The schematic diagram set.
The measurement head of the device according to Fig. 1 is shown in detail in Fig. 2.
The modification of the measurement head according to Fig. 1 is shown in detail in Fig. 3.
Fig. 4 shows the schematic diagram of the optical measuring device for obtaining range difference of the embodiment according to invention, wherein
There is optical measuring device 2 measurement head and multi-channel measurement equipment, multi-channel measurement device configuration to have the light of single spectrum line
Spectrometer.
Fig. 5 shows the schematic diagram of the optical measuring device for obtaining range difference of the embodiment according to invention, wherein
Optical measuring device has 2n measurement head and multi-channel measurement equipment, multi-channel measurement device configuration single with preferably one
One single spectrometer of spectrum line.
Fig. 1 shows that is used on the thin grinder 50 according to the embodiment of invention is used to obtain range difference 6 (here:Platform
Rank height) optical measuring device 2 schematic diagram.Thin grinder 50 has an abrasive disk 52, and the surface 54 of abrasive disk 52 can be by
It is covered with the layer 56 of grinding agent.Abrasive disk 52 is supported so that it can surround axis 58 in the direction of arrow and rotate.It will quilt
The disc shaped object 12 of measurement has the thickness d within the scope of millimeter and the diameter D more than 10 inches (25cm), present disc shaped
Body 12 has storage and/or the logic core of big production ready early period in the movable upper side that it blocks maintaining part
Piece, 12 maintained portion 60 of disc shaped object to be measured along the direction of arrow C press to abrasive disk 52 with to be measured
The surface 54 of the rear-face contact of object, wherein maintaining part 60 rotates in the direction of arrowb during grinding.
For this purpose, the diameter of selection rotating holding portion 60 so that the fringe region 10 of disc shaped object 12 is kept beyond rotation
The edge in portion 60 generates the table of the fringe region 10 and the abrasive disk 52 for forming bearing 8 of the object 12 rotated with maintaining part 60
Measurable step height 6 between face 54.For this purpose, the radius R of abrasive disk 52 is significantly greater than the diameter D of rotating holding portion.Therefore,
Multiple objects 12 may be placed on the abrasive disk 52 rotated along the direction of arrow A.Rotating holding portion 60 can have with
Direction of rotation B opposite the direction of rotation A of abrasive disk 52.
In order to measure the step 6 of the decreasing height during thin grinding, the static measurement head guide device of optical measuring device 2
20 place in a fixed manner with each maintaining part 60.To exist in the object 12 (in particular, fringe region 10) to be measured
While second measurement beam 18 of measurement head 14 moves in rotary manner below, measurement head guide device 20 keeps measurement head 14
It is in resting position with two-beam guiding 15.
It is simultaneously moved below the first measurement beam 16 of two-beam guiding 15 on the surface 54 of abrasive disk 52 so that in invention
In the embodiment, measurement head 14 can be by the fringe region of the first measurement point 28 and thin objects 12 on the surface 54 of bearing 8
The reflected light of the second measurement point 30 on 10 surface, is supplied to multiplexer 40, wherein multichannel is multiple via optical fiber 36 and 38
The broadband light from light source 22 is supplied to measurement head 14 via light guide 46 with 40 one side of device, on the other hand by 28 He of measurement point
30 reflected light component is supplied to spectrometer 48 via light guide 42.
Spectrometer 48 is connected to assessment unit 32 via sensing line 62, and digitized interference spectrum is supplied via electronic filter 44
It is given to assessment unit 32.Here, electronic filter 44 can eliminate the measurement exceptional value (example because of caused by the environment of grinder
Such as, error) so that assessment unit 32 can connect the value measured for the step height of measuring error correction via connecting line 64
Display unit 66 is provided continuously.
It is apparent that in such grinder for each object to be measured, measurement head guiding is provided
There is corresponding measurement head 14 and measured downstream and assessment unit, measurement head to draw for device 20, each measurement head guide device 20
Leading device 20 can assess because of multiplexer 40 and be indicated from the multiple of required measurement head on display unit 66
Signal.According to the relationship between the radius R and the diameter for the object to be measured of abrasive disk 52, to be measured three to ten six
Object 12 is monitored by corresponding measurement head 14, and the thickness d out of millimeter is thinned to the thickness in tens micron ranges
d。
The measurement head 14 according to the device of Fig. 1 is shown in detail in Fig. 2.The measurement head 14 is measured a guide device 20 and protects
It holds, and is included in the individual measurement head 140 and 141 of two to keep together side by side in measurement head guide device 20, first
Measurement head 140 obtains the distance between measurement head 140 and the surface 54 of bearing 8 e, and the second single measurement head 141 obtains measurement head
The distance between 141 and the surface of fringe region 10 of object 12 to be measured c.By the non-of the range measurement disk 52 that obtains
Bright surface or want thinning object 12 fringe region distance e and c (t) difference come thickness d (t)=e-c for being reduced
(t)。
The modification of the measurement head 14 ' according to Fig. 1 is shown in detail in Fig. 3.The measurement head 14 ' of the modification and the measurement in Fig. 2
First 14 difference is, two individual measurement points are formed (that is, the survey on bearing 8 by measurement head optical device 26 appropriate
Measurement point 30 on the fringe region 10 of amount point 28 and the object 12 to be measured).As shown in fig. 1, reflected light is fed back to
Optical fiber 36 and 38, and the assessment unit for assessment is proceeded to via multiplexer 40, the interference values of spectrometer 48 are counted
Word.
Fig. 4 shows optical measuring device 3 according to third embodiment.Optical measuring device can be with above-mentioned into one
The thin grinder 50 explained in detail is walked to be used in combination.However, invention is not limited to such application scheme.In fact, no matter
By measuring method determine range difference where, can use invention.These can be on bearing and bearing
The distance between surface of object difference, such as, the range difference generated by the form and shape of the object to be measured.Although
For purposes of simplicity, it is contemplated that entirely different application, but here without being explained in more detail.For example, being directed to this
In the possible application of optical measuring device that describes may include measurement to bottle or other objects.
However, optical measuring device 3 is particularly suitable for measuring thickness, for example, particularly, in the bearing 12 of thin grinder 50
The thickness that be ground thinning object (such as object 12) of upper placement.To the further of this reason is that, due in a kind of change
In type, two measurement heads 140 and 141 can be in conjunction with the measurement head 14 for being designed to double measurement heads with formation, so optical measurement
Device 3 can have particularly compact and robust design.
Some of the element of optical measuring device 3 according to third embodiment shown in Fig. 4 and other elements have been joined
It is explained according to attached drawing detailed above, all of which need not be described in detail again here.
It is contrasted with above-described embodiment, in the present embodiment, explains the particular variant of multi-channel measurement equipment 34
Structure.Multi-channel measurement equipment 34 has spectrum line 72.Spectrum line 72, which is placed on also, to be had collimator 73, grating 74 and focuses saturating
In the spectrometer 48 of mirror 75.It would be recognized by those skilled in the art that these components are exemplary, and in other embodiment
In, for example, grating 74 can be replaced by prism.
In addition, there is multi-channel measurement equipment 34 light source 22, light source 22 itself can also have individual light source 76.It is mostly logical
Two Y couplers 77 are placed in road measuring apparatus 34, an input of each Y couplers is connected to the one of each light source 76
It is a.In this way, measurement head 140 and 141 can be provided with particularly effective broadband spectral light.
As has been stated, measurement head 140 and 141 is located in the optical measuring head 14 with two-beam guiding 15, from
And form double measurement heads.For this purpose, measurement head 140 and 141 is abreast located in measurement head guide device 20, and it is mechanically connected
Together.Therefore, the optical measuring device near the object to be measured of range difference to be measured can have special robust
With space-saving design.
Light source 22 or two individual light sources 76 provide spectrum broadband light, and the measurement of beam 16 and second is measured to form first
Beam 18.In this way, in this embodiment, the first measurement head 140 guides the first measurement beam 16 into the first measurement point on bearing 8
28, and the second measurement head 141 guides the second measurement beam 18 into the second measurement point 30 on the fringe region 10 of object 12.
In the first measurement head 140, for obtain and formed be led to the first measurement point 28 first measure
The tool of the reflectance spectrum of beam 16.In addition, in the second measurement head 141, second is led to for obtaining and being formed
The second of measurement point 30 measures the tool of the reflectance spectrum of beam 18.Tool for obtaining and being formed reflectance spectrum can basis
Interferometric method (interferometric method) operates, wherein relevant measurement head 141 and 141 can have
Reference mirror and beam splitter cube (not shown).However, invention is not limited to such embodiment.For example, 140 He of measurement head
At least one of 141 can also be according to colored confocal method come work.
Two measurement heads 140 and 141 position toward each other in a predefined manner, as shown in Figure 4, can be preferential
In identical geometric height.As a result, therefore measuring measurement of the measurement head 140 of relatively large distance e than therefore measuring small distance c
The more blue light of first 141 detection.That is, the first measurement head 140 should measure more blue light, and the second measurement head 141 should
Measure redder light.
Light from reflectance spectrum is coupled to by optical fiber 36 and 38 in multi-channel measurement equipment 34, and the first optical fiber 38 is by
One measurement head 140 is connected to the first input 70 of multi-channel measurement equipment 34, and the second measurement head 141 is connected to by the second optical fiber 36
Second input 71 of multi-channel measurement equipment 34.Optical measurement is each corresponded in the input 70 of multi-channel measurement equipment and 71
The individual Measurement channel of device.As shown in Figure 4, input 70 and 71 can be connected to spectrometer 48 via Y couplers.Defeated
Enter side, there is spectrometer holder 78 to be used as fiber light connector.Optical fiber 36 and 38 can be routed to guarantor via Y couplers
Gripping member 78 can be such that light guide 79 and 80 is deviated associated with one another on spectrum direction along the direction of spectrum line 72.
Here, the degree 81 of offset can cause characteristic curve different, cause measurement head 140 and 141 reflectance spectrum that
This is different.This characteristic difference is considered in the right way in the assessment apart from peak value then obtained.It is this
Situation prior applicability is when using colored confocal measurement method.In interferometric method using such as OCT, for example, light guide 79
It should be preferably located at identical height on spectrum direction with 80, but can also be placed vertically with spectrum line 72, instead of each other
Offset.Spectrum line 72 should obtain all light of the arrival spectrometer 34 detected by measurement head 140 and 141.For this purpose, spectrum line
72 preferentially have enough height, and have enough detector pixels.
In fact it can be seen that the specific advantage of embodiment shown here is, it is only necessary to a monochromatic light spectral line 72
The reflectance spectrum for assessing both measurement head 140 and 141, to which characteristic curve can be different.As a result, can also in the least unambiguously
Assessment peak position corresponding with detector pixel.
Fig. 5 shows the fourth embodiment of optical measuring device 5.As shown in Figure 5, optical measuring device 5 can have
Multiple optical measuring heads 14, each optical measuring head 14 are guided with two-beam as has been explained.
In addition, each measurement head can be operating independently so that every double measurement heads 14 can be obtained in a manner of above-mentioned explanation
Take distance d1To dnDifference.All double measurement heads 14 may be coupled to two channels of multi-channel measurement equipment 34 so that optics
Measuring device 5 has 2n single measurement heads 140 and 141, and with 2n channel a multi-channel measurement equipment 34.Again
Secondary, multi-channel measurement equipment can use spectrum line 72 equipped with the single spectrometer 48 with single spectrum line 72 here
Come all measuring signals for assessing measurement head 140 and 141 and all reflectance spectrums.Embodiment shown in Fig. 4 and Fig. 5
It can be combined with the embodiment in Fig. 1 to Fig. 3.
For example, according to embodiment shown in Fig. 5, spectrometer 34 can also have one or more multiplexers.When
When such case occurs, multiplexer should be preferentially placed so that be directed to different pairs of 140 He of measurement head of each pulse choice
141.About examples presented above, the operation of multiplexer and the details of frequency are specifically illustrated, and multichannel is multiple
It can also be applied to here according to reorganization appropriate with the operation of device and the details of frequency.It is furthermore possible to also provide making characteristic
The tool of further differentiation between curve.In the case of colored confocal measurement, this is determined by 2n the specific of light guide 79,80
Position and partly realize, wherein 2n light guide 79,80 can be along the direction of the spectrum line 72 of spectrometer 48 in different positions
In be located at spectrum direction on.
The list of reference numeral
2 optical measuring devices (first embodiment)
3 optical measuring devices (3rd embodiment)
4 optical measuring devices (second embodiment)
5 optical measuring devices (fourth embodiment)
6 step heights
8 bearings
10 fringe regions
12 objects
14,14 ' measurement heads
15 two-beams guide
16 first measure beam
18 second measure beam
20 measurement head guide devices
22 light sources
23 first light beams
24 second light beams
26,26 ' measurement head optical devices
28 first measurement points (on bearing)
30 second measurement points (object)
32 assessment units
34 multi-channel measurement equipment
36 optical fiber
38 optical fiber
39 spectrometers
40 multiplexers
42 light guides
44 electronic filters
46 light guides
48 spectrometers
50 thin grinders
52 abrasive disks
The surface of 54 abrasive disks
56 layers
The axis of 58 abrasive disks
60 are directed to the maintaining part for the object to be measured
62 sensing lines
64 connecting lines
66 display units
70 multi-channel measurement equipment input
71 multi-channel measurement equipment input
72 spectrum lines
75 condenser lenses
76 light sources
77 Y couplers
78 are directed to the holder of fiber light connector
79 light guides
80 light guides
Offset on 81 spectrum directions
140 single measurement heads
141 single measurement heads
The direction of A rotations
The direction of B rotations
The direction of C rotations
C distances
The diameter of the D objects to be measured
D thickness
E distances
The radius of R abrasive disks
Claims (23)
1. a kind of optical measuring device for obtaining range difference, for the marginal zone in situ for obtaining bearing (8) and object (12)
Step height (6) between domain (10), the optical measuring device include:
The optical measuring head (14,14 ') that (15) are guided with two-beam is configured with the first measurement head (140) and second and surveys
Measure double measurement heads of head (141);
Measurement head guide device (20), wherein the first measurement head (140) and the second measurement head (141) are placed side by side and mechanical
Ground connects;
At least one spectrum wideband light source (22), for generates first measurement beam (16) and second measurement beam (18) light (23,
24), wherein the first measurement head (140) guides the first measurement beam (16) into the first measurement point (28) on bearing (8), the
Two measurement heads (141) guide the second measurement beam (18) into the second measurement point on the fringe region (10) of object (12)
(30);
Tool in the first measurement head (140) and the second measurement head (141) is led to the first survey for obtaining and being formed
Measure point (28) first measures the reflectance spectrum of beam (16), and is led to the second of the second measurement point (30) and measures beam (18)
Reflectance spectrum;
First optical fiber (38) and the second optical fiber (36), for will be measured respectively from the light of the first measurement beam (16) reflection and from second
The light of beam (18) reflection is coupled to via respective light guide in multi-channel measurement equipment (34) measures the mostly logical of input with multiple
The different measurement inputs of road measuring apparatus (34);
Spectrum line (72) is located in multi-channel measurement equipment (34), wherein first, which measures the reflectance spectrum of beam and second, measures beam
(18) reflectance spectrum can be measured, and on the measurement input side of multi-channel measurement equipment (34), be made using holder (78)
Respective light guide is deviated along the direction of spectrum line (72) on spectrum direction associated with one another, wherein measures beam from first
(16) light reflected and the light reflected from the second measurement beam (18) are led to the spectrum line (72), and the characteristic of reflectance spectrum is bent
Line is different from each other and the reflectance spectrum of measurement head is different from each other;
Assessment unit (32) is connected to spectrum line (72), wherein can be by passing through spectrum line apart from peak value via sensing line (62)
(72) the first measurement beam (16) measured and second measures the reflectance spectrum of beam (18) and is formed, and can be commented apart from peak value
Estimate the measurement for range difference.
2. optical measuring device according to claim 1, wherein the optical measuring device has configuration two-beam guiding
(15) multiple optical measuring heads (14,14 '), each measurement head (14,14 ') be configured with the first measurement head (140) and
Double measurement heads of second measurement head (141).
3. optical measuring device according to claim 2, wherein each first measurement head (140) and each second measures
The different measurements that head (141) is connected to multi-channel measurement equipment (34) by optical fiber input so that each first measurement head
(140) and the reflectance spectrum of each second measurement head (141) can be by the spectrum line in multi-channel measurement equipment (34)
(72) it assesses.
4. optical measuring device according to claim 1, wherein the first measurement head (140) and the second measurement head (141) are used
In colored confocal acquisition range difference in situ.
5. optical measuring device according to claim 1, wherein the first measurement head (140) and the second measurement head (141) are used
Range difference is obtained in interferometry in situ.
6. according to the optical measuring device described in a claim in claim 1 to 5, wherein optical measuring device (2)
At least one fibre optics Y couplers of (70,71) are inputted with each of multi-channel measurement equipment (34).
7. optical measuring device according to claim 2, wherein multi-channel measurement equipment (34) has at least one multichannel
Multiplexer (40), at least one multiplexer (40) is in one-to-one the first measurement head (140) and one second measurement
Switch between head (141).
8. optical measuring device according to claim 7, wherein multi-channel measurement equipment (34) is detected with multi-line
Device.
9. optical measuring device according to claim 1, wherein at least one spectrum wideband light source (22) has needle
To the light source (76) of each first measurement head (140) and each second measurement head (141).
10. optical measuring device according to claim 1, wherein optical measuring device (2) has for making the first measurement
The digitized tool of reflectance spectrum of beam (16) and the second measurement beam (18), wherein the first measurement beam (16) is led to bearing
(8), the second measurement beam (18) is led to the fringe region (10) of object (12).
11. optical measuring device according to claim 10, wherein in order to obtain the edge of bearing (8) and object (12)
The distance between region (10) difference, optical measuring device (2) have the assessment unit (32) for digitized reflectance spectrum.
12. optical measuring device according to claim 1, wherein optical measuring device (2) has at least optics of 4kHz
Scan rate.
13. optical measuring device according to claim 1, wherein optical measuring device (2) tool in assessment unit (32)
There is electronic filter (44).
14. a kind of measuring method for obtaining at least one range difference obtains bearing (8) and object (12) in situ
Fringe region (10) between step height (6), this approach includes the following steps:
The measuring device of the optical measuring head (14,14 ') with two-beam guiding (15) is provided, the measuring device is configured as having
There are one double measurement heads of the first measurement head (140) and second measurement head (141), in measurement head guide device (20),
First measurement head (140) and the second measurement head (141) are placed side by side and mechanically connected,
First is generated by the first measurement head measure beam (16) and by the production of the second measurement head by least one spectrum wideband light source
Raw second measures beam (18), wherein and the first measurement head (140) guides the first measurement beam (16) into the first measurement point (28), and
Second measurement head (141) guides the second measurement beam (18) into the second measurement point (30), forms reflectance spectrum in every case,
Light that beam (16) reflects will be measured from first measure light that beam (18) reflects via the via the first light guide and from second
Two light guides are coupled to, and have the different measurement inputs of multiple multi-channel measurement equipment (34) for measuring input,
On the measurement input side of the spectrometer of multi-channel measurement equipment (34), make the first light guide and second using holder (78)
Light guide is deviated along the direction of spectrum line (72) on spectrum direction associated with one another, wherein spectrum line (72) is located at multichannel
In measuring apparatus (34), it is led to from the light of the first measurement beam (16) reflection and from the light of the second measurement beam (18) reflection described
Spectrum line (72), the characteristic curve of reflectance spectrum is different from each other and the reflectance spectrum of measurement head is different from each other,
Reflectance spectrum is measured by the assessment unit of the downstream connection of spectrum line and spectrum line, is surveyed according to first apart from peak value
It measures the distance between point and the first measurement head and the distance between the second measurement point and the second measurement head and is formed, and distance
Peak value is assessed as the measurement of range difference.
15. measuring method according to claim 14, wherein during measurement processing, measurement head (14) is kept
Fixed position in measurement head guide device (20), bearing (8) and object (12) are below measurement head (14) with opposite
It rotatably moves direction of rotation.
16. the measuring method according to claims 14 or 15, wherein during measurement, the first measurement point (28) quilt
On bearing (8), the second measurement point (30) is configured on the fringe region (10) of object (12) for configuration, and it is each to obtain them
From at a distance from measurement head (14).
17. measuring method according to claim 16, wherein remembered in situ by calculating the difference of the distance value obtained
Record the object thickness to successively decrease.
18. measuring method according to claim 14, wherein colored confocal measurement method is for obtaining range difference.
19. measuring method according to claim 14, wherein interferometric method is for obtaining range difference.
20. measuring method according to claim 14, wherein the light of spectrum wideband light source (22) is by fibre optics Y
Coupler is decoupled towards measurement head (14) into two optical fiber (36,38).
21. measuring method according to claim 14, wherein be led to bearing (8) first measure beam (16) and
The reflectance spectrum for being led to the second measurement beam (18) of the fringe region (10) of object (12) is digitized to assess.
22. measuring method according to claim 14, wherein the surface of the fringe region (10) of object (12) and branch
The surface of seat (8) is scanned with the scan rate more than 4kHz.
23. measuring method according to claim 14, wherein measurement error is evaluated the electron number in unit (32)
Word filter (44) filters out.
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PCT/IB2014/062290 WO2014203161A1 (en) | 2013-06-17 | 2014-06-17 | Optical measuring device for recording differences in distance and optical measuring method |
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JP (1) | JP6247752B2 (en) |
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Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012111008B4 (en) | 2012-11-15 | 2014-05-22 | Precitec Optronik Gmbh | Optical measuring method and optical measuring device for detecting a surface topography |
US9500471B2 (en) | 2013-06-17 | 2016-11-22 | Precitec Optronik Gmbh | Optical measuring device and method for acquiring in situ a stage height between a support and an edge region of an object |
US9115980B2 (en) * | 2013-09-25 | 2015-08-25 | Seagate Technology, Llc | Row bar thickness measurement device, system and methods |
WO2016030227A1 (en) * | 2014-08-29 | 2016-03-03 | Asml Netherlands B.V. | Method for controlling a distance between two objects, inspection apparatus and method |
JP6725988B2 (en) * | 2016-01-26 | 2020-07-22 | 大塚電子株式会社 | Thickness measuring device and thickness measuring method |
EP3222964B1 (en) * | 2016-03-25 | 2020-01-15 | Fogale Nanotech | Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer |
US10317344B2 (en) * | 2016-09-07 | 2019-06-11 | Kla-Tencor Corporation | Speed enhancement of chromatic confocal metrology |
US10260865B1 (en) * | 2016-09-13 | 2019-04-16 | National Technology & Engineering Solutions Of Sandia, Llc | High resolution, non-contact removal rate module for serial sectioning |
US10234265B2 (en) | 2016-12-12 | 2019-03-19 | Precitec Optronik Gmbh | Distance measuring device and method for measuring distances |
JP6829992B2 (en) * | 2016-12-28 | 2021-02-17 | 株式会社キーエンス | Optical scanning height measuring device |
JP6831700B2 (en) * | 2016-12-28 | 2021-02-17 | 株式会社キーエンス | Optical scanning height measuring device |
JP6768500B2 (en) * | 2016-12-28 | 2020-10-14 | 株式会社キーエンス | Optical scanning height measuring device |
EP3387919B1 (en) * | 2017-04-12 | 2020-01-29 | Sodim S.A.S. | Method and system for determining the track of origin of products of the tobacco processing industry, cigarette inspection station |
US11022094B2 (en) * | 2017-05-24 | 2021-06-01 | General Electric Company | Modular blade structure and method of assembly |
CN107478180B (en) * | 2017-07-19 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate detection system and method |
TWI668413B (en) * | 2017-10-20 | 2019-08-11 | 財團法人國家實驗研究院 | Flexible optical measuring device |
DE102017126310A1 (en) | 2017-11-09 | 2019-05-09 | Precitec Optronik Gmbh | Distance measuring device |
DE102018130901A1 (en) | 2018-12-04 | 2020-06-04 | Precitec Optronik Gmbh | Optical measuring device |
DE102019102873B4 (en) | 2019-02-06 | 2022-01-20 | Carl Mahr Holding Gmbh | Sensor system and method for determining geometric properties of a measurement object and coordinate measuring machine |
CN110160450B (en) * | 2019-05-13 | 2020-12-25 | 天津大学 | Method for rapidly measuring height of large step based on white light interference spectrum |
DE102019114167A1 (en) * | 2019-05-27 | 2020-12-03 | Precitec Optronik Gmbh | Optical measuring device and method |
JP6875489B2 (en) * | 2019-11-06 | 2021-05-26 | 株式会社キーエンス | Confocal displacement meter |
US20220049951A1 (en) * | 2020-08-13 | 2022-02-17 | Optipro Systems, LLC | Surface metrology systems and methods thereof |
CN112525073B (en) * | 2020-11-19 | 2022-06-03 | 哈尔滨工业大学 | Structural crack identification method based on Brillouin gain spectrum characteristic parameters |
US11463250B2 (en) | 2020-12-14 | 2022-10-04 | Kyndryl, Inc. | Sharing data among different service providers at edge level through collaboration channels |
JP2022112634A (en) * | 2021-01-22 | 2022-08-03 | 株式会社ディスコ | Measurement device |
US11619594B2 (en) | 2021-04-28 | 2023-04-04 | Applied Materials, Inc. | Multiple reflectometry for measuring etch parameters |
JP2023012630A (en) * | 2021-07-14 | 2023-01-26 | 住友電気工業株式会社 | Optical fiber and method for manufacturing optical fiber |
US11885609B2 (en) * | 2021-11-22 | 2024-01-30 | Wojciech Jan Walecki | Wafer thickness, topography, and layer thickness metrology system |
CN115096212B (en) * | 2022-07-14 | 2022-11-18 | 儒众智能科技(苏州)有限公司 | Three-dimensional shape measuring device and method |
Family Cites Families (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3431298A (en) | 1965-01-05 | 1969-03-04 | Asahi Chemical Ind | Process for the preparation of oxadicarboxylic acids |
FR2615279B1 (en) * | 1987-05-11 | 1990-11-02 | Commissariat Energie Atomique | DISPLACEMENT SENSOR WITH OFFSET FIBER OPTICS |
US6099522A (en) | 1989-02-06 | 2000-08-08 | Visx Inc. | Automated laser workstation for high precision surgical and industrial interventions |
ATE112086T1 (en) * | 1990-03-28 | 1994-10-15 | Landis & Gyr Business Support | PROCEDURE FOR SELF-CALIBRATION OR RE-CALIBRATION OF MEASUREMENTS OF A PHYSICAL DIMENSION. |
JP3208682B2 (en) | 1992-08-20 | 2001-09-17 | 清水建設株式会社 | Joint structure between core wall and steel beam |
US5392124A (en) | 1993-12-17 | 1995-02-21 | International Business Machines Corporation | Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control |
US5532815A (en) | 1994-06-17 | 1996-07-02 | Kdy Associates, Inc. | System and method for aligning a first surface with respect to a second surface |
DE19525770C1 (en) | 1995-07-14 | 1996-08-29 | Fraunhofer Ges Forschung | Bonding connections testing system for bonded semiconductor wafers |
JP3624476B2 (en) | 1995-07-17 | 2005-03-02 | セイコーエプソン株式会社 | Manufacturing method of semiconductor laser device |
EP0876677B1 (en) | 1996-01-23 | 1999-07-21 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Ion source for an ion beam arrangement |
US5691540A (en) | 1996-04-30 | 1997-11-25 | Ibm Corporation | Assembly for measuring a trench depth parameter of a workpiece |
US5905572A (en) | 1997-08-21 | 1999-05-18 | Li; Ming-Chiang | Sample inspection using interference and/or correlation of scattered superbroad radiation |
US5956142A (en) | 1997-09-25 | 1999-09-21 | Siemens Aktiengesellschaft | Method of end point detection using a sinusoidal interference signal for a wet etch process |
JP2000205833A (en) | 1999-01-06 | 2000-07-28 | Internatl Business Mach Corp <Ibm> | Non-destructive method and device for measuring depth of recessed material |
US6396069B1 (en) | 1999-06-25 | 2002-05-28 | Macpherson David C. | Topographer for real time ablation feedback having synthetic wavelength generators |
ATE396497T1 (en) | 2000-01-21 | 2008-06-15 | Hamamatsu Photonics Kk | THICKNESS MEASURING APPARATUS, THICKNESS MEASURING METHOD AND WET ETCHING APPARATUS AND WET ETCHING METHODS USING THE SAME |
US6368881B1 (en) | 2000-02-29 | 2002-04-09 | International Business Machines Corporation | Wafer thickness control during backside grind |
JP4486217B2 (en) | 2000-05-01 | 2010-06-23 | 浜松ホトニクス株式会社 | Thickness measuring apparatus, wet etching apparatus using the same, and wet etching method |
JP3854810B2 (en) * | 2000-06-20 | 2006-12-06 | 株式会社日立製作所 | Method and apparatus for measuring film thickness of material to be processed by emission spectroscopy, and method and apparatus for processing material using the same |
US9295391B1 (en) | 2000-11-10 | 2016-03-29 | The General Hospital Corporation | Spectrally encoded miniature endoscopic imaging probe |
US6672943B2 (en) | 2001-01-26 | 2004-01-06 | Wafer Solutions, Inc. | Eccentric abrasive wheel for wafer processing |
US6720567B2 (en) | 2001-01-30 | 2004-04-13 | Gsi Lumonics Corporation | Apparatus and method for focal point control for laser machining |
US6532068B2 (en) | 2001-07-17 | 2003-03-11 | National Research Council Of Canada | Method and apparatus for depth profile analysis by laser induced plasma spectros copy |
JP2003097935A (en) * | 2001-09-20 | 2003-04-03 | Nippei Toyama Corp | Range detecting device and thickness detecting device |
US6806969B2 (en) | 2001-10-19 | 2004-10-19 | Agilent Technologies, Inc. | Optical measurement for measuring a small space through a transparent surface |
JP3761444B2 (en) | 2001-10-23 | 2006-03-29 | 富士通株式会社 | Manufacturing method of semiconductor device |
US7329611B2 (en) | 2002-04-11 | 2008-02-12 | Nec Corporation | Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part |
US20050140981A1 (en) | 2002-04-18 | 2005-06-30 | Rudolf Waelti | Measurement of optical properties |
US7133137B2 (en) | 2002-06-27 | 2006-11-07 | Visx, Incorporated | Integrated scanning and ocular tomography system and method |
US6686270B1 (en) | 2002-08-05 | 2004-02-03 | Advanced Micro Devices, Inc. | Dual damascene trench depth monitoring |
US7306696B2 (en) | 2002-11-01 | 2007-12-11 | Applied Materials, Inc. | Interferometric endpoint determination in a substrate etching process |
US7271916B2 (en) | 2002-11-14 | 2007-09-18 | Fitel Usa Corp | Characterization of optical fiber using Fourier domain optical coherence tomography |
JP2004233163A (en) | 2003-01-29 | 2004-08-19 | Hitachi High-Technologies Corp | Method and device for inspecting pattern defect |
WO2004073501A2 (en) | 2003-02-20 | 2004-09-02 | Gutin Mikhail | Optical coherence tomography with 3d coherence scanning |
US7106454B2 (en) | 2003-03-06 | 2006-09-12 | Zygo Corporation | Profiling complex surface structures using scanning interferometry |
US7049156B2 (en) | 2003-03-19 | 2006-05-23 | Verity Instruments, Inc. | System and method for in-situ monitor and control of film thickness and trench depth |
WO2004090195A1 (en) | 2003-04-07 | 2004-10-21 | Fuji Photo Film Co. Ltd. | Crystalline-si-layer-bearing substrate and its production method, and crystalline si device |
DE10319843A1 (en) | 2003-05-03 | 2004-12-02 | Infineon Technologies Ag | Depth measurement system for determining depth of blind bores in semiconductor workpieces has IR source with beam splitter and polarizer directing beam into workpiece at 45 degree angle |
US6927860B2 (en) | 2003-05-19 | 2005-08-09 | Oti Ophthalmic Technologies Inc. | Optical mapping apparatus with optimized OCT configuration |
US7443511B2 (en) | 2003-11-25 | 2008-10-28 | Asml Netherlands B.V. | Integrated plane mirror and differential plane mirror interferometer system |
DE102004011189B4 (en) | 2004-03-04 | 2011-05-05 | Carl Mahr Holding Gmbh | Optical measuring head |
US7177030B2 (en) | 2004-04-22 | 2007-02-13 | Technion Research And Development Foundation Ltd. | Determination of thin film topography |
JP2006058056A (en) * | 2004-08-18 | 2006-03-02 | Opto One Kk | Spectral film thickness measuring device |
US7433046B2 (en) | 2004-09-03 | 2008-10-07 | Carl Ziess Meditec, Inc. | Patterned spinning disk based optical phase shifter for spectral domain optical coherence tomography |
DE102004052205A1 (en) | 2004-10-20 | 2006-05-04 | Universität Stuttgart | Interferometric method e.g. for recording of separation and form and optical coherence tomography (OCT), involves having multi-wavelength source or tunable source and imaging on receiver by focusing systems |
US7477401B2 (en) | 2004-11-24 | 2009-01-13 | Tamar Technology, Inc. | Trench measurement system employing a chromatic confocal height sensor and a microscope |
US7705995B1 (en) | 2004-12-20 | 2010-04-27 | J.A. Woollam Co., Inc. | Method of determining substrate etch depth |
JP4761774B2 (en) * | 2005-01-12 | 2011-08-31 | 東京エレクトロン株式会社 | Temperature / thickness measuring device, temperature / thickness measuring method, temperature / thickness measuring system, control system, control method |
WO2006084279A2 (en) | 2005-02-04 | 2006-08-10 | University Of Florida Research Foundation, Inc. | Single fiber endoscopic full-field optical coherence tomography (oct) imaging probe |
CN1329766C (en) * | 2005-06-17 | 2007-08-01 | 哈尔滨工业大学 | Space aligning method of ultra-precision rotary shaft and direct writing optical axis of laser direct writing apparatus |
DE102005036719A1 (en) | 2005-07-28 | 2007-02-01 | Carl Zeiss Industrielle Messtechnik Gmbh | Method for correcting interpolation errors of a machine, in particular a coordinate measuring machine |
GB2429522A (en) | 2005-08-26 | 2007-02-28 | Univ Kent Canterbury | Optical mapping apparatus |
TWI279606B (en) | 2005-09-06 | 2007-04-21 | Univ Nat Cheng Kung | Method and device for automatic focusing of optical fiber type optical coherence tomography |
US20070148792A1 (en) | 2005-12-27 | 2007-06-28 | Marx David S | Wafer measurement system and apparatus |
US7289220B2 (en) | 2005-10-14 | 2007-10-30 | Board Of Regents, The University Of Texas System | Broadband cavity spectrometer apparatus and method for determining the path length of an optical structure |
DE102005052743B4 (en) * | 2005-11-04 | 2021-08-19 | Precitec Optronik Gmbh | Measuring system for measuring boundary or surfaces of workpieces |
GB0523722D0 (en) | 2005-11-22 | 2005-12-28 | Taylor Hobson Ltd | Trench measurement |
JP4880701B2 (en) | 2005-12-21 | 2012-02-22 | スリーエム イノベイティブ プロパティズ カンパニー | Method and apparatus for processing multi-photon curable reactive compositions |
CA2637508C (en) | 2006-01-19 | 2014-07-08 | Optovue, Inc. | A fourier-domain optical coherence tomography imager |
US7368207B2 (en) | 2006-03-31 | 2008-05-06 | Eastman Kodak Company | Dynamic compensation system for maskless lithography |
US7648242B2 (en) | 2006-05-01 | 2010-01-19 | Physical Sciences, Inc. | Hybrid spectral domain optical coherence tomography line scanning laser ophthalmoscope |
US7791734B2 (en) | 2006-05-02 | 2010-09-07 | Lawrence Livermore National Security, Llc | High-resolution retinal imaging using adaptive optics and Fourier-domain optical coherence tomography |
WO2008010996A2 (en) | 2006-07-17 | 2008-01-24 | Bioptigen, Inc. | Methods, systems and computer program products for removing undesired artifacts in fourier domain optical coherence tomography (fdoct) systems using continuous phase modulation and related phase modulators |
DE102006034244A1 (en) | 2006-07-21 | 2008-01-31 | Schott Ag | Method and device for measuring the thickness of large glass substrates |
JP4810411B2 (en) | 2006-11-30 | 2011-11-09 | 東京応化工業株式会社 | Processing equipment |
JP4959318B2 (en) | 2006-12-20 | 2012-06-20 | 株式会社ディスコ | Wafer measuring device and laser processing machine |
DE102007016444A1 (en) | 2007-04-05 | 2008-10-16 | Precitec Optronik Gmbh | processing device |
EP2149067A1 (en) | 2007-04-19 | 2010-02-03 | D.V.P. Technologies Ltd. | Imaging system and method for use in monitoring a field of regard |
US7853429B2 (en) | 2007-04-23 | 2010-12-14 | Kla-Tencor Corporation | Curvature-based edge bump quantification |
JP4892401B2 (en) * | 2007-04-24 | 2012-03-07 | 株式会社山武 | Optical interference measurement device |
US8634082B2 (en) * | 2007-06-20 | 2014-01-21 | The Trustess of Dartmouth College | Pulsed lasers in frequency domain diffuse optical tomography and spectroscopy |
KR101327492B1 (en) * | 2007-06-21 | 2013-11-08 | 세메스 주식회사 | Apparatus for grinding wafer backside |
DE102007035519B4 (en) | 2007-07-26 | 2011-12-08 | Vistec Semiconductor Systems Gmbh | Method for correcting the measured values due to the deflection of a substrate |
US7823216B2 (en) | 2007-08-02 | 2010-10-26 | Veeco Instruments Inc. | Probe device for a metrology instrument and method of fabricating the same |
US7812966B2 (en) | 2007-08-30 | 2010-10-12 | Infineon Technologies Ag | Method of determining the depth profile of a surface structure and system for determining the depth profile of a surface structure |
US7800766B2 (en) | 2007-09-21 | 2010-09-21 | Northrop Grumman Space & Mission Systems Corp. | Method and apparatus for detecting and adjusting substrate height |
DE102008041062A1 (en) | 2007-09-25 | 2009-04-02 | Carl Zeiss Smt Ag | Measuring device for measuring surface of object, has source, splitter, surface and detector arranged relatively to each other in such manner that light emitted from source and light reflected from surface meets on detector |
TWI358538B (en) | 2008-02-22 | 2012-02-21 | Ind Tech Res Inst | Apparatus for measuring defects in semiconductor w |
EP2103249B9 (en) | 2008-03-19 | 2016-10-19 | Carl Zeiss Meditec AG | Surgical microscopy system having an optical coherence tomography facility |
US8199321B2 (en) | 2008-05-05 | 2012-06-12 | Applied Spectra, Inc. | Laser ablation apparatus and method |
JP5473265B2 (en) | 2008-07-09 | 2014-04-16 | キヤノン株式会社 | Multilayer structure measuring method and multilayer structure measuring apparatus |
ATE478319T1 (en) | 2008-08-28 | 2010-09-15 | Optopol Technology S A | APPARATUS FOR OPTICAL COHERENCE TOMOGRAPHY AND NON-INTERFEROMETRIC IMAGING |
DE102008049821B4 (en) | 2008-10-01 | 2018-11-22 | Volkswagen Ag | Distance sensor and method for determining a distance and / or distance variations between a processing laser and a workpiece |
CN101393015B (en) * | 2008-10-17 | 2010-06-16 | 华中科技大学 | On-line measurement method and device for micro/nano deep trench structure |
CN102197298A (en) | 2008-10-29 | 2011-09-21 | 柯尼卡美能达精密光学株式会社 | Optical tomographic image forming method |
US8500279B2 (en) | 2008-11-06 | 2013-08-06 | Carl Zeiss Meditec, Inc. | Variable resolution optical coherence tomography scanner and method for using same |
US20100321671A1 (en) | 2009-06-23 | 2010-12-23 | Marx David S | System for directly measuring the depth of a high aspect ratio etched feature on a wafer |
US8649016B2 (en) | 2009-06-23 | 2014-02-11 | Rudolph Technologies, Inc. | System for directly measuring the depth of a high aspect ratio etched feature on a wafer |
JP2011017552A (en) * | 2009-07-07 | 2011-01-27 | Oputouea Kk | Device for detecting multipoint displacement |
FR2950441B1 (en) * | 2009-09-23 | 2012-05-18 | Sabban Youssef Cohen | OPTICAL SENSOR WITH LATERAL FIELD FOR 3D SCANNING |
DE102010015944B4 (en) | 2010-01-14 | 2016-07-28 | Dusemund Pte. Ltd. | A thinning apparatus having a wet etcher and a monitor, and methods for in-situ measuring wafer thicknesses for monitoring thinning of semiconductor wafers |
US8478384B2 (en) | 2010-01-19 | 2013-07-02 | Lightlab Imaging, Inc. | Intravascular optical coherence tomography system with pressure monitoring interface and accessories |
US8525073B2 (en) | 2010-01-27 | 2013-09-03 | United Technologies Corporation | Depth and breakthrough detection for laser machining |
KR20110095823A (en) | 2010-02-19 | 2011-08-25 | 엘지전자 주식회사 | Method and apparatus for mapping multiple layers to mutilple antenna ports |
DE102010016862B3 (en) | 2010-05-10 | 2011-09-22 | Precitec Optronik Gmbh | Material processing device with in-situ measurement of the machining distance |
CN101929848B (en) * | 2010-06-30 | 2012-04-25 | 北京理工大学 | Product confocal-scanning detection method with high spatial resolution |
US8194251B2 (en) * | 2010-08-26 | 2012-06-05 | Mitutoyo Corporation | Method for operating a dual beam chromatic point sensor system for simultaneously measuring two surface regions |
GB2489722B (en) | 2011-04-06 | 2017-01-18 | Precitec Optronik Gmbh | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer |
US9714825B2 (en) | 2011-04-08 | 2017-07-25 | Rudolph Technologies, Inc. | Wafer shape thickness and trench measurement |
DE102011051146B3 (en) | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Test method for testing a bonding layer between wafer-shaped samples |
US8520222B2 (en) | 2011-11-08 | 2013-08-27 | Strasbaugh | System and method for in situ monitoring of top wafer thickness in a stack of wafers |
DE102011055735A1 (en) * | 2011-11-25 | 2013-05-29 | Precitec Optronik Gmbh | Multi-head device for testing material thickness or profile gradients of moving object, has measurement and evaluation unit for detecting thickness of material by optical coherence tomography-process |
DE102012111008B4 (en) | 2012-11-15 | 2014-05-22 | Precitec Optronik Gmbh | Optical measuring method and optical measuring device for detecting a surface topography |
JP5966982B2 (en) * | 2013-03-15 | 2016-08-10 | オムロン株式会社 | Confocal measuring device |
US9500471B2 (en) | 2013-06-17 | 2016-11-22 | Precitec Optronik Gmbh | Optical measuring device and method for acquiring in situ a stage height between a support and an edge region of an object |
-
2014
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AT514500A3 (en) | 2018-04-15 |
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