ATE396497T1 - THICKNESS MEASURING APPARATUS, THICKNESS MEASURING METHOD AND WET ETCHING APPARATUS AND WET ETCHING METHODS USING THE SAME - Google Patents

THICKNESS MEASURING APPARATUS, THICKNESS MEASURING METHOD AND WET ETCHING APPARATUS AND WET ETCHING METHODS USING THE SAME

Info

Publication number
ATE396497T1
ATE396497T1 AT01900776T AT01900776T ATE396497T1 AT E396497 T1 ATE396497 T1 AT E396497T1 AT 01900776 T AT01900776 T AT 01900776T AT 01900776 T AT01900776 T AT 01900776T AT E396497 T1 ATE396497 T1 AT E396497T1
Authority
AT
Austria
Prior art keywords
wet etching
light
thickness measuring
thickness
light intensity
Prior art date
Application number
AT01900776T
Other languages
German (de)
Inventor
Teruo Takahashi
Motoyuki Watanabe
Hidenori Takahashi
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000013151A external-priority patent/JP4347484B2/en
Priority claimed from JP2000371621A external-priority patent/JP4347517B2/en
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Application granted granted Critical
Publication of ATE396497T1 publication Critical patent/ATE396497T1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Weting (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Processing Of Meat And Fish (AREA)
  • Length-Measuring Instruments Using Mechanical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

At each measurement time, measurement light is supplied from a measurement light source 11, and interference light obtained when reflected light from a semiconductor wafer W and reference light from a reference light generating section 14 are coupled is detected by a photodetector 15. A thickness calculating section 16 obtains a light intensity distribution representing the correlation between the light intensity of the interference light and the reference optical path length, selects a wafer upper surface peak and wafer lower surface peak from a plurality of light intensity peaks in the light intensity distribution using a predetermined selection criterion, and calculates the thickness of the semiconductor wafer W from the optical path length difference between the light intensity peaks. With this arrangement, a thickness measuring apparatus and thickness measuring method capable of measuring the thickness of a semiconductor wafer during execution of wet etching independently of the presence of an etchant, and a wet etching apparatus and wet etching method using the thickness measuring apparatus and method are implemented. <IMAGE>
AT01900776T 2000-01-21 2001-01-16 THICKNESS MEASURING APPARATUS, THICKNESS MEASURING METHOD AND WET ETCHING APPARATUS AND WET ETCHING METHODS USING THE SAME ATE396497T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000013151A JP4347484B2 (en) 2000-01-21 2000-01-21 Thickness measuring apparatus, wet etching apparatus using the same, and wet etching method
JP2000371621A JP4347517B2 (en) 2000-12-06 2000-12-06 Thickness measuring apparatus, wet etching apparatus using the same, and wet etching method

Publications (1)

Publication Number Publication Date
ATE396497T1 true ATE396497T1 (en) 2008-06-15

Family

ID=26583934

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01900776T ATE396497T1 (en) 2000-01-21 2001-01-16 THICKNESS MEASURING APPARATUS, THICKNESS MEASURING METHOD AND WET ETCHING APPARATUS AND WET ETCHING METHODS USING THE SAME

Country Status (6)

Country Link
US (1) US6897964B2 (en)
EP (1) EP1258916B1 (en)
AT (1) ATE396497T1 (en)
AU (1) AU2001225543A1 (en)
DE (1) DE60134120D1 (en)
WO (1) WO2001059830A1 (en)

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JP2003315017A (en) * 2002-04-25 2003-11-06 Hamamatsu Photonics Kk Thickness measuring apparatus
WO2004034894A1 (en) * 2002-10-16 2004-04-29 Campbell Science Group, Inc. Cornea characteristics measuring device
US7130061B2 (en) * 2003-03-31 2006-10-31 Council Of Scientific And Industrial Research System and method for monitoring properties of a medium by fiber optics
GB0415766D0 (en) * 2004-07-14 2004-08-18 Taylor Hobson Ltd Apparatus for and a method of determining a characteristic of a layer or layers
CN100516772C (en) * 2004-09-09 2009-07-22 鸿富锦精密工业（深圳）有限公司 Optical signall processor and process thereof
TWI247096B (en) * 2004-12-17 2006-01-11 Hon Hai Prec Ind Co Ltd Optical fiber interference device used for thickness measuring and the method of the same
CN100395516C (en) * 2004-12-25 2008-06-18 鸿富锦精密工业（深圳）有限公司 Optical fiber interference type device and method for measuring thickness
JP2007204286A (en) * 2006-01-31 2007-08-16 Sumco Corp Method for manufacturing epitaxial wafer
US20090065478A1 (en) * 2007-09-11 2009-03-12 Dockery Kevin P Measuring etching rates using low coherence interferometry
JP5490462B2 (en) * 2009-08-17 2014-05-14 横河電機株式会社 Film thickness measuring device
DE102010015944B4 (en) * 2010-01-14 2016-07-28 Dusemund Pte. Ltd. A thinning apparatus having a wet etcher and a monitor, and methods for in-situ measuring wafer thicknesses for monitoring thinning of semiconductor wafers
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
FR2959305B1 (en) * 2010-04-26 2014-09-05 Nanotec Solution OPTICAL DEVICE AND METHOD FOR INSPECTING STRUCTURED OBJECTS.
KR101233687B1 (en) * 2010-10-28 2013-02-15 삼성디스플레이 주식회사 Apparatus of etching a glass substrate
CN102812157B (en) * 2010-11-30 2014-08-20 深圳市华星光电技术有限公司 Method For Etching Metal, Control Method For Etching Metal And Apparatus Thereof
GB2489722B (en) 2011-04-06 2017-01-18 Precitec Optronik Gmbh Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer
DE102011051146B3 (en) 2011-06-17 2012-10-04 Precitec Optronik Gmbh Test method for testing a bonding layer between wafer-shaped samples
JP6150490B2 (en) * 2012-10-19 2017-06-21 キヤノン株式会社 Detection apparatus, exposure apparatus, and device manufacturing method using the same
DE102012111008B4 (en) 2012-11-15 2014-05-22 Precitec Optronik Gmbh Optical measuring method and optical measuring device for detecting a surface topography
JP6107353B2 (en) * 2013-04-12 2017-04-05 株式会社島津製作所 Surface treatment status monitoring device
US9500471B2 (en) 2013-06-17 2016-11-22 Precitec Optronik Gmbh Optical measuring device and method for acquiring in situ a stage height between a support and an edge region of an object
ITBO20130403A1 (en) 2013-07-26 2015-01-27 Marposs Spa METHOD AND EQUIPMENT FOR OPTICAL CONTROL BY INTERFEROMETRY OF THE THICKNESS OF A PROCESSED OBJECT
US10026660B2 (en) 2014-10-31 2018-07-17 Veeco Precision Surface Processing Llc Method of etching the back of a wafer to expose TSVs
US10207489B2 (en) * 2015-09-30 2019-02-19 Sigma Labs, Inc. Systems and methods for additive manufacturing operations
TWI629720B (en) * 2015-09-30 2018-07-11 東京威力科創股份有限公司 Method and apparatus for dynamic control of the temperature of a wet etch process
TWI738757B (en) * 2016-04-05 2021-09-11 美商維克儀器公司 An apparatus and method to control etch rate through adaptive spiking of chemistry
US10234265B2 (en) 2016-12-12 2019-03-19 Precitec Optronik Gmbh Distance measuring device and method for measuring distances
WO2018160461A1 (en) 2017-03-03 2018-09-07 Veeco Precision Surface Processing Llc An apparatus and method for wafer thinning in advanced packaging applications
DE102017126310A1 (en) 2017-11-09 2019-05-09 Precitec Optronik Gmbh Distance measuring device
DE102018117470A1 (en) * 2018-07-19 2020-01-23 Carl Zeiss Microscopy Gmbh Method for determining the thickness and refractive index of a layer
CN110797272B (en) * 2018-08-01 2022-08-26 上海祖强能源有限公司 Chip cutting method and chip cutting device
DE102018130901A1 (en) 2018-12-04 2020-06-04 Precitec Optronik Gmbh Optical measuring device
CN111426273A (en) * 2019-01-29 2020-07-17 法国圣戈班玻璃公司 Measuring method and measuring device for measuring the thickness of a substrate
CN112599458A (en) * 2021-03-03 2021-04-02 西安奕斯伟硅片技术有限公司 Silicon wafer etching device and method

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US5220405A (en) 1991-12-20 1993-06-15 International Business Machines Corporation Interferometer for in situ measurement of thin film thickness changes
US5392124A (en) * 1993-12-17 1995-02-21 International Business Machines Corporation Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control
US5956142A (en) 1997-09-25 1999-09-21 Siemens Aktiengesellschaft Method of end point detection using a sinusoidal interference signal for a wet etch process
JPH11354489A (en) * 1998-06-05 1999-12-24 Toshiba Corp Production system of semiconductor and etching method for semiconductor device
JP4486217B2 (en) * 2000-05-01 2010-06-23 浜松ホトニクス株式会社 Thickness measuring apparatus, wet etching apparatus using the same, and wet etching method

Also Published As

Publication number Publication date
US20030090671A1 (en) 2003-05-15
WO2001059830A1 (en) 2001-08-16
DE60134120D1 (en) 2008-07-03
AU2001225543A1 (en) 2001-08-20
EP1258916A4 (en) 2006-10-25
US6897964B2 (en) 2005-05-24
EP1258916A1 (en) 2002-11-20
EP1258916B1 (en) 2008-05-21

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