CN105290985B - A kind of superhard resin wheel - Google Patents

A kind of superhard resin wheel Download PDF

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CN105290985B
CN105290985B CN201510814362.9A CN201510814362A CN105290985B CN 105290985 B CN105290985 B CN 105290985B CN 201510814362 A CN201510814362 A CN 201510814362A CN 105290985 B CN105290985 B CN 105290985B
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parts
diamond
wheel
emery wheel
hollow ball
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CN105290985A (en
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惠珍
丁玉龙
丁春生
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Zhengzhou Research Institute for Abrasives and Grinding Co Ltd
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Zhengzhou Research Institute for Abrasives and Grinding Co Ltd
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Abstract

The invention belongs to a kind of superhard resin wheel, it is made up of the raw material of following portions by weight:15 25 parts of epoxy resin liquid, 15 20 parts of diluent, 0.5 1 parts of coupling agent, 0.5 1 parts of hollow ball, 40 60 parts of diamond, 10 15 parts of curing agent.This hair to hollow ball by carrying out baking oven foaming and sieving, it can be very good the porosity and the aperture of control emery wheel, the porosity for preparing emery wheel may be up to 50% 60%, and 100 200 μm of pore size, the emery wheel layer tissue uniformity prepared is high, can continue repair from sharp, the high appearance of the porosity is considered to be worth doing, substrate surface damaging layer is low, has good grinding performance to substrate base material, and improving processing efficiency reduces processing cost.

Description

A kind of superhard resin wheel
Technical field
The invention belongs to substrate base Ultraprecision Machining field, and in particular to a kind of superhard resin wheel.
Background technology
It is hard to SiC, GaAs, monocrystalline sapphire etc. crisp with the fast development of opto-electronic device industry and microelectric technique The processing request of crystal substrates is more and more harsher, and these crystal substrates hardness are high, fragility is big, anisotropy and chemical stability It is good, high machining accuracy, processing efficiency and relatively low processing cost are not required nothing more than, also exigent surface quality, chip Surface roughness reaches Subnano-class, and either surface or sub-surface does not have micro-crack, spots, fault, dislocation and distortion The defects of layer and damage.The process issues of crystal substrates are mainly surface quality difference and high processing costs at present.
At present, the hard grinding wheel of substrate base processing is prepared using compression-moulding methods more, this to suppress the sand come Take turns that density uniformity is poor, the porosity is low, and then cause that the crystal substrates surface quality after abrasive machining is inconsistent, lines depth, table There is the problems such as damaging layer of 8-10 μm or so of thickness in face, subsequently needs by CMP planarization process to eliminate surface damage layer, drop The low processing efficiency of substrate, while there may be ultrathin substrate and cause the broken of substrate during processing.Due to fragility Material removal total amount is big, so the appearance bits functional requirement to emery wheel is higher.
Conventional porous resin emery wheel is mostly that water soluble particle or hollow material are mixed into the slurry of flowing, and formation " accounts for Position " situation, produces stomata.Water soluble particle method is mainly by the way that the water soluble particle that can form hole is added in abrasive material " occupy-place ".Hollow material rule is that loose structure is manufactured into emery wheel by adding hollow spherical closed-cell materials.This two Kind manufactures more air hole grinding wheels using the method for " occupy-place " and can restricted by the upper limit of solid substance quantity, causes on the porosity of resin wheel Limit is restricted;Resin fluid viscosity is big simultaneously, causes that the well mixed difficulty of molding mass is big, and this causes resin to a certain extent The gas cell distribution of emery wheel is uneven.
The content of the invention
It is an object of the invention to provide the superhard resin wheel that a kind of structural homogenity is good, the porosity is high.
To achieve the above object, the technical solution adopted by the present invention is a kind of superhard resin wheel, by following mass fractions Raw material be made:Epoxy resin liquid 15-25 parts, diluent 15-20 parts, coupling agent 0.5-1 parts, hollow ball 0.5-1 parts, diamond 40-60 parts, curing agent 10-15 parts.
Described diluent is n-butanol.
The diamond is nickel plating diamond.
The granularity of the diamond is 4-8 μm.
The epoxy resin liquid is the epoxy resin liquid SQPN051 of Shengquan Group Co. Ltd., Jinan's production;It is described Coupling agent is the coupling agent kh570 of Jinan Ying Chu Chemical Industry Science Co., Ltd production;The hollow ball is that Rui'an City wins remote green wood Expect the hollow glass micropearl of limited company's production, model SD300D is stomata binder, 50 μm of initial particle, 80-100 It is expandable after baking 0.5-4h at DEG C to arrive 100-200 μm of particle diameter;The curing agent produces for Shengquan Group Co. Ltd., Jinan Curing agent HY 10-15.
The preparation method of described superhard resin wheel, comprises the following steps:
1. after hollow ball is dried into 0.5-4h at 80-100 DEG C in an oven, 100-120 is crossed after being well mixed with diamond Eye mesh screen;
2. epoxy resin liquid after agitating and heating 2-5 minutes, is added into the 30-40% of diluent total amount under 70-80 DEG C of water-bath Diluent and coupling agent, after continuing agitating and heating 5-10 minutes, obtained hollow ball and diamond is mixed in adding step 1. Compound, continue agitating and heating 5-10 minutes;
3. by step, 2. middle bath temperature drops to 55-60 DEG C, and remaining 60-70% diluent and curing agent are well mixed In the slurry obtained in being added to step afterwards 2., it is poured into after stirring in mould, after hardening 3-8h at 80-90 DEG C, then Solidified;
4. the material after step 3. middle solidification is down into the room temperature demoulding, emery wheel ring is obtained;
5. 4. emery wheel ring that step obtains produces described superhard resin wheel by processing.
Preferably, the solidification divides three phases to carry out, and to be warming up to 90-100 DEG C after hardening, heating rate is first paragraph 50-70min is incubated at 0.2-0.5 DEG C/min, 90-100 DEG C;Second stage is 90-100 DEG C and is warming up to 100-110 DEG C, and heating is fast Rate is 0.2-0.5 DEG C/min, and 50-70min is incubated at 100-110 DEG C;Phase III is warming up to 110-120 DEG C for 100-110 DEG C, Heating rate is 0.2-0.5 DEG C/min, and 8-10h is incubated at 110-120 DEG C.
The beneficial effect comprise that:Using the diluent and hollow ball in the present invention, diluent can be very good Fine dilution effect is played, and hollow ball of getting along well reacts;, can be fine by carrying out baking oven foaming and sieving to hollow ball Control emery wheel the porosity and aperture, the porosity for preparing emery wheel may be up to 50%-60%, and 100-200 μm of pore size, make The standby emery wheel layer tissue uniformity come out is high, can continue repair from sharp, the high appearance of the porosity is considered to be worth doing, substrate surface damaging layer It is low, there is good grinding performance to substrate base material, improving processing efficiency reduces processing cost.
Brief description of the drawings
Fig. 1 is the emery wheel ESEM micro-structure diagram prepared in embodiment 1;
Fig. 2 is the PV values that wheel grinding substrate rear surfaces roughness Ra value and substrate are prepared in embodiment 1.
Embodiment
With reference to embodiment, the present invention is further illustrated, but the scope of the present invention is not limited to that.
Epoxy resin liquid described in following examples is the epoxy resin liquid of Shengquan Group Co. Ltd., Jinan's production SQPN051;The coupling agent is the coupling agent kh570 of Jinan Ying Chu Chemical Industry Science Co., Ltd production;The hollow ball is auspicious Pacify the hollow glass micropearl of city Bo Yuan new materials limited companies production, model SD300D is stomata binder, initial particle It is expandable after baking 0.5-4h at 50 μm, 80-100 DEG C to arrive 100-200 μm of particle diameter;The curing agent is that Jinan holy well group share has The curing agent HY 10-15 of limit company production.
Embodiment 1
A kind of superhard resin wheel, is made up of the raw material of following mass fractions:18 parts of epoxy resin liquid, 18 parts of diluent, 0.7 part of coupling agent, 0.8 part of hollow ball, 55 parts of diamond, 13 parts of curing agent;Described diluent is n-butanol, the diamond For nickel plating diamond, the granularity of diamond is 5 μm.
The preparation method of described superhard resin wheel, comprises the following steps:
1. after hollow ball is dried into 4h at 80 DEG C in an oven, 100 eye mesh screens are crossed after being well mixed with diamond;
2. by epoxy resin liquid under 70 DEG C of water-baths after agitating and heating 5 minutes, add diluent total amount 30% diluent and Coupling agent, continue agitating and heating after 6 minutes, the hollow ball and the mixture of diamond obtained in adding step 1., continue to stir Heating 7 minutes;
3. by step, 2. middle bath temperature drops to 55 DEG C, is added after the diluent of residue 70% and curing agent are well mixed To step 2. in obtained slurry, be poured into mould after stirring, after hardening 8h at 80 DEG C, then solidified;
4. the material after step 3. middle solidification is down into the room temperature demoulding, emery wheel ring is obtained;
5. 4. emery wheel ring that step obtains is processed by conventional method produces described superhard resin wheel.
The solidification divides three phases to carry out, and for first paragraph to be warming up to 90 DEG C after hardening, heating rate is 0.2 DEG C/min, 70min is incubated at 90 DEG C;Second stage is 90 DEG C and is warming up to 100 DEG C, and heating rate is 0.3 DEG C/min, is incubated at 100 DEG C 70min;Phase III is 100 DEG C and is warming up to 110 DEG C, and heating rate is 0.5 DEG C/min, and 10h is incubated at 110 DEG C.
Embodiment 2
A kind of superhard resin wheel, is made up of the raw material of following mass fractions:15 parts of epoxy resin liquid, 20 parts of diluent, 0.5 part of coupling agent, 0.5 part of hollow ball, 40 parts of diamond, 10 parts of curing agent;Described diluent is n-butanol, the diamond For nickel plating diamond, the granularity of diamond is 4 μm.
The preparation method of described superhard resin wheel, comprises the following steps:
1. after hollow ball is dried into 2h at 90 DEG C in an oven, 120 eye mesh screens are crossed after being well mixed with diamond;
2. epoxy resin liquid after agitating and heating 2 minutes, is added into 30% diluent of diluent total amount under 80 DEG C of water-baths And coupling agent, continue agitating and heating after 10 minutes, the hollow ball and the mixture of diamond obtained in adding step 1., continue to stir Mix heating 5 minutes;
3. by step, 2. middle bath temperature drops to 60 DEG C, is added after the diluent of residue 70% and curing agent are well mixed To step 2. in obtained slurry, be poured into mould after stirring, after hardening 3h at 90 DEG C, then solidified;
4. the material after step 3. middle solidification is down into the room temperature demoulding, emery wheel ring is obtained;
5. 4. emery wheel ring that step obtains is processed by conventional method produces described superhard resin wheel.
The solidification divides three phases to carry out, and for first paragraph to be warming up to 100 DEG C after hardening, heating rate is 0.3 DEG C/min, 50min is incubated at 100 DEG C;Second stage is 100 DEG C and is warming up to 110 DEG C, and heating rate is 0.2 DEG C/min, is incubated at 110 DEG C 50min;Phase III is 110 DEG C and is warming up to 120 DEG C, and heating rate is 0.2 DEG C/min, and 8h is incubated at 120 DEG C.
Embodiment 3
A kind of superhard resin wheel, is made up of the raw material of following mass fractions:25 parts of epoxy resin liquid, 15 parts of diluent, 1 part of coupling agent, 1 part of hollow ball, 60 parts of diamond, 15 parts of curing agent;Described diluent is n-butanol, and the diamond is plating Nickel diamond, the granularity of diamond is 8 μm.
The preparation method of described superhard resin wheel, comprises the following steps:
1. after hollow ball is dried into 0.5h at 100 DEG C in an oven, 100 eye mesh screens are crossed after being well mixed with diamond;
2. by epoxy resin liquid under 75 DEG C of water-baths after agitating and heating 3 minutes, add diluent total amount 35% diluent and Coupling agent, continue agitating and heating after 5 minutes, the hollow ball and the mixture of diamond obtained in adding step 1., continue to stir Heating 10 minutes;
3. by step, 2. middle bath temperature drops to 56 DEG C, is added after the diluent of residue 65% and curing agent are well mixed To step 2. in obtained slurry, be poured into mould after stirring, after hardening 5h at 85 DEG C, then solidified;
4. the material after step 3. middle solidification is down into the room temperature demoulding, emery wheel ring is obtained;
5. 4. emery wheel ring that step obtains is processed by conventional method produces described superhard resin wheel.
The solidification divides three phases to carry out, and for first paragraph to be warming up to 95 DEG C after hardening, heating rate is 0.5 DEG C/min, 60min is incubated at 95 DEG C;Second stage is 95 DEG C and is warming up to 105 DEG C, and heating rate is 0.5 DEG C/min, is incubated at 105 DEG C 60min;Phase III is 105 DEG C and is warming up to 115 DEG C, and heating rate is 0.3 DEG C/min, and 9h is incubated at 115 DEG C.
Grind performance evaluation
Obtained emery wheel ESEM micro-structure diagram in embodiment 1 as shown in figure 1, emery wheel the porosity be 60%, stomata It is evenly distributed and pore size is 100-200 μm.
The test of substrate base grinding performance is carried out to the emery wheel that method in above-described embodiment 1 manufactures:
Grinding machine:Disco DFG840;
Rough grinding wheel is existing 320 mesh emery wheel;
Finishing wheel is the emery wheel prepared in embodiment 1;Roughly grind and the size of finishing wheel is:209mm is (outside emery wheel Footpath) * 22.5mm (emery wheel gross thickness) * 158mm (emery wheel aperture) * 2.5mm (emery wheel ring gear is wide) * 5mm (emery wheel tooth height);
Grinding order:First roughly grind and refine afterwards;
Grinding process parameterses
Speed of grinding wheel spindle:5500rpm;
Grinding fluid:Deionized water;
Workpiece material:Substrate base material 50*50mm, 500 μm of original depth;
Removal amount:250μm
Load plate rotating speed:20/20/20rpm.
Substrate base material is refined using the emery wheel prepared in embodiment 1, entered at least 50 substrate bases Row thinning back side grinding experiment, substrate base material Ra values(Surface roughness)With PV values(Peak-to-valley value)As a result it is as shown in Fig. 2 super The substrate base of hard porous wheel grinding shows metastable Ra values, and substrate surface Ra values reach nanoscale.This species The grinding performance of abrasive wheel is highly suitable for the back side grinding of hard fragility substrate base, realizes excellent effect, can obtain stabilization Use parameter, therefore for such superhard porous resin emery wheel manufacture method can be fragile material attrition process make tribute Offer.
Abrasive material has used plating diamond abrasive in above example, and abrasive species are not limited in nickel plating this type, Other types of abrasive material manufacture porous resin emery wheel can also be used, it is of the invention equally applicable.

Claims (4)

1. a kind of superhard resin wheel, it is characterised in that be made up of the raw material of following portions by weight:Epoxy resin liquid 15-25 parts, Diluent 15-20 parts, coupling agent 0.5-1 parts, hollow ball 0.5-1 parts, diamond 40-60 parts, curing agent 10-15 parts;The ring Oxygen resin liquid is the epoxy resin liquid SQPN051 of Shengquan Group Co. Ltd., Jinan's production;The hollow ball is Rui'an City The hollow glass micropearl of Bo Yuan new materials limited company production, model SD300D;The coupling agent is that Jinan English goes out chemical industry The coupling agent kh570 of Science and Technology Ltd.'s production;The curing agent is the solidification of Shengquan Group Co. Ltd., Jinan's production Agent HY 10-15.
2. superhard resin wheel as claimed in claim 1, it is characterised in that:Described diluent is n-butanol.
3. superhard resin wheel as claimed in claim 1, it is characterised in that:The diamond is nickel plating diamond.
4. superhard resin wheel as claimed in claim 1, it is characterised in that:The granularity of the diamond is 4-8 μm.
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CN106392908A (en) * 2016-05-30 2017-02-15 广东工业大学 Diamond grinding wheel with ceramic binders and production method thereof
CN106217275A (en) * 2016-07-29 2016-12-14 无锡市三峰仪器设备有限公司 A kind of resin wheel of high porosity
CN107116485B (en) * 2017-06-07 2019-04-16 广州捷骏电子科技有限公司 A kind of manufacturing method of expansion type porous grinding wheel
CN108299796B (en) * 2017-12-30 2020-12-15 苏州赛尔科技有限公司 Resin-based diamond scribing knife for LED segmentation and preparation method thereof

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JP3539854B2 (en) * 1997-11-28 2004-07-07 株式会社ノリタケカンパニーリミテド Resinoid grinding wheel
CN103753412B (en) * 2014-01-23 2016-06-29 泉州市易光石材工具有限公司 A kind of formula of nylon abrading block
CN104526577B (en) * 2014-12-12 2017-04-12 郑州博特硬质材料有限公司 Preparation method for ceramic resin composite bonding agent grinding wheel
CN104690654B (en) * 2015-02-14 2017-04-12 郑州磨料磨具磨削研究所有限公司 Super-hard resin grinding wheel for grinding hard and brittle materials and preparation method of super-hard resin grinding wheel

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