CN105280703A - 功率集成器件、包括其的电子器件和包括其的电子*** - Google Patents
功率集成器件、包括其的电子器件和包括其的电子*** Download PDFInfo
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- CN105280703A CN105280703A CN201510058392.1A CN201510058392A CN105280703A CN 105280703 A CN105280703 A CN 105280703A CN 201510058392 A CN201510058392 A CN 201510058392A CN 105280703 A CN105280703 A CN 105280703A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1083—Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0080091 | 2014-06-27 | ||
KR1020140080091A KR20160001913A (ko) | 2014-06-27 | 2014-06-27 | 전력용 전자 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105280703A true CN105280703A (zh) | 2016-01-27 |
CN105280703B CN105280703B (zh) | 2020-06-26 |
Family
ID=54931364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510058392.1A Active CN105280703B (zh) | 2014-06-27 | 2015-02-04 | 功率集成器件、包括其的电子器件和包括其的电子*** |
Country Status (4)
Country | Link |
---|---|
US (1) | US9627518B2 (zh) |
KR (1) | KR20160001913A (zh) |
CN (1) | CN105280703B (zh) |
TW (1) | TWI660510B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108847423A (zh) * | 2018-05-30 | 2018-11-20 | 矽力杰半导体技术(杭州)有限公司 | 半导体器件及其制造方法 |
CN113330578A (zh) * | 2019-01-21 | 2021-08-31 | 日产自动车株式会社 | 半导体装置及其制造方法 |
CN115020497A (zh) * | 2022-08-09 | 2022-09-06 | 广州粤芯半导体技术有限公司 | 半导体器件及其制备方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10217821B2 (en) * | 2014-09-01 | 2019-02-26 | Sk Hynix System Ic Inc. | Power integrated devices, electronic devices and electronic systems including the same |
CN106960841B (zh) * | 2016-01-12 | 2021-02-26 | 联华电子股份有限公司 | 高压晶体管 |
US10134891B2 (en) * | 2016-08-30 | 2018-11-20 | United Microelectronics Corp. | Transistor device with threshold voltage adjusted by body effect |
US9905558B1 (en) | 2016-12-22 | 2018-02-27 | Texas Instruments Incorporated | Conductivity modulated drain extended MOSFET |
TWI614812B (zh) * | 2017-06-01 | 2018-02-11 | 立錡科技股份有限公司 | 高壓金屬氧化物半導體元件及其製造方法 |
US10283622B1 (en) * | 2018-01-16 | 2019-05-07 | Globalfoundries Singapore Pte. Ltd. | Extended drain transistor on a crystalline-on-insulator substrate |
KR102233049B1 (ko) * | 2019-07-24 | 2021-03-26 | 주식회사 키 파운드리 | 채널 길이 조정이 용이한 반도체 소자 및 그 제조방법 |
US11742422B2 (en) | 2021-09-13 | 2023-08-29 | Macronix International Co., Ltd. | Semiconductor device and method of fabricating the same |
TWI794969B (zh) * | 2021-09-13 | 2023-03-01 | 旺宏電子股份有限公司 | 半導體元件及其製造方法 |
CN116190369B (zh) * | 2023-02-28 | 2023-11-03 | 海信家电集团股份有限公司 | 智能功率模块和具有其的电子设备 |
Citations (3)
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CN101572271A (zh) * | 2008-04-30 | 2009-11-04 | 万国半导体股份有限公司 | 短沟槽横向金属氧化物半导体场效应晶体管及其制造方法 |
CN103280462A (zh) * | 2013-05-27 | 2013-09-04 | 东南大学 | 一种高鲁棒性的p型对称横向双扩散场效应晶体管 |
US8716791B1 (en) * | 2011-08-11 | 2014-05-06 | Maxim Integrated Products, Inc. | LDMOS with corrugated drift region |
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JP2978467B2 (ja) * | 1998-03-16 | 1999-11-15 | 株式会社日立製作所 | 半導体集積回路装置の製造方法 |
US6900101B2 (en) * | 2003-06-13 | 2005-05-31 | Texas Instruments Incorporated | LDMOS transistors and methods for making the same |
US7602037B2 (en) * | 2007-03-28 | 2009-10-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | High voltage semiconductor devices and methods for fabricating the same |
WO2008147172A1 (en) * | 2007-05-29 | 2008-12-04 | X-Fab Semiconductor Foundries Ag | Mos transistor with a p-field implant overlying each end of a gate thereof |
KR20100063576A (ko) | 2008-12-03 | 2010-06-11 | 한국전자통신연구원 | 고전압 ldmos 트랜지스터 및 그 제조 방법 |
US8174070B2 (en) * | 2009-12-02 | 2012-05-08 | Alpha And Omega Semiconductor Incorporated | Dual channel trench LDMOS transistors and BCD process with deep trench isolation |
KR20110078861A (ko) | 2009-12-31 | 2011-07-07 | 주식회사 동부하이텍 | 수평형 디모스 트랜지스터 |
US8772871B2 (en) * | 2010-08-20 | 2014-07-08 | Freescale Semiconductor, Inc. | Partially depleted dielectric resurf LDMOS |
TWI478336B (zh) * | 2011-05-06 | 2015-03-21 | Episil Technologies Inc | 減少表面電場的結構及橫向雙擴散金氧半導體元件 |
KR101872942B1 (ko) * | 2012-03-29 | 2018-06-29 | 삼성전자주식회사 | 반도체 장치 |
US9231083B2 (en) * | 2012-06-29 | 2016-01-05 | Freescal Semiconductor Inc. | High breakdown voltage LDMOS device |
-
2014
- 2014-06-27 KR KR1020140080091A patent/KR20160001913A/ko not_active Application Discontinuation
- 2014-12-11 US US14/567,521 patent/US9627518B2/en active Active
- 2014-12-15 TW TW103143641A patent/TWI660510B/zh active
-
2015
- 2015-02-04 CN CN201510058392.1A patent/CN105280703B/zh active Active
Patent Citations (3)
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CN101572271A (zh) * | 2008-04-30 | 2009-11-04 | 万国半导体股份有限公司 | 短沟槽横向金属氧化物半导体场效应晶体管及其制造方法 |
US8716791B1 (en) * | 2011-08-11 | 2014-05-06 | Maxim Integrated Products, Inc. | LDMOS with corrugated drift region |
CN103280462A (zh) * | 2013-05-27 | 2013-09-04 | 东南大学 | 一种高鲁棒性的p型对称横向双扩散场效应晶体管 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108847423A (zh) * | 2018-05-30 | 2018-11-20 | 矽力杰半导体技术(杭州)有限公司 | 半导体器件及其制造方法 |
CN108847423B (zh) * | 2018-05-30 | 2022-10-21 | 矽力杰半导体技术(杭州)有限公司 | 半导体器件及其制造方法 |
CN113330578A (zh) * | 2019-01-21 | 2021-08-31 | 日产自动车株式会社 | 半导体装置及其制造方法 |
CN115020497A (zh) * | 2022-08-09 | 2022-09-06 | 广州粤芯半导体技术有限公司 | 半导体器件及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201601318A (zh) | 2016-01-01 |
KR20160001913A (ko) | 2016-01-07 |
CN105280703B (zh) | 2020-06-26 |
US9627518B2 (en) | 2017-04-18 |
TWI660510B (zh) | 2019-05-21 |
US20150380402A1 (en) | 2015-12-31 |
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