CN105280586B - The infrared movement heat abstractor of non-refrigeration type and heat dissipating method - Google Patents
The infrared movement heat abstractor of non-refrigeration type and heat dissipating method Download PDFInfo
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- CN105280586B CN105280586B CN201510782969.3A CN201510782969A CN105280586B CN 105280586 B CN105280586 B CN 105280586B CN 201510782969 A CN201510782969 A CN 201510782969A CN 105280586 B CN105280586 B CN 105280586B
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Abstract
The infrared movement heat abstractor of non-refrigeration type and heat dissipating method, belong to non-refrigeration type infrared imaging field, the heat dissipation problem for solving the infrared movement of existing non-refrigeration type.The heat dissipating method of the present invention includes：Two heat sink structures for being applied to the radiating of non-refrigeration type infrared detector of design, there is provided the heat dissipation path of infrared detector；A kind of printing road plate radiating mode based on heat conduction hole array and heat conduction aluminium lamination is set, there is provided the heat dissipation path of heating power component；A kind of multi-temperature point TEC (TEC) control method is proposed, realizes low-power consumption, steady operation in wide temperature range.Using the heat dissipating method of the present invention, infrared detector, heating power component in the infrared movement of non-refrigeration type are radiated, meanwhile, the infrared movement of non-refrigeration type is reliablely and stablely worked in wide temperature range, the image quality of infrared movement is improved, extends the service life of infrared movement.
Description
Technical field
The invention belongs to non-refrigeration type infrared imagery technique field, and in particular to a kind of infrared movement radiating dress of non-refrigeration type
Put and heat dissipating method.
Background technology
Infrared movement just develops towards the direction such as miniaturization, round-the-clock, remote, high-resolution, high-performance, low-power consumption, red
Outer movement is divided into refrigeration mode and the infrared movement of non-refrigeration type, the infrared movement of non-refrigeration type because volume and power consumption are smaller, by
Gradually it is widely used, but there is also many shortcomings for the infrared movement of non-refrigeration type.
The infrared movement space of non-refrigeration type is limited, and circuit board size is smaller, and space is just very limited for components' placement.
Component tends to miniaturization, highly integrated, high frequency characteristic at present, and its heat density substantially increases.Traditional non-refrigeration type is red
Mainly include inside outer movement non-refrigeration type infrared detector 6, non-refrigeration type infrared detector drive circuit, temperature controller,
Power supply chip and other discrete chips；Non-refrigeration type infrared detector 6 mainly includes infrared temperature sensor, infrared temperature control chip
9th, infrared power supply chip 10 and TEC TECs, outside mainly include non-refrigeration type infrared detector package and mechanical erection
Face 7 etc.；Non-refrigeration type infrared detector drive circuit mainly includes the heating powers such as temperature-control circuit, infrared power circuit member
Device, the sinking path of high heating power component are to be radiated by the surface of component to surrounding air, but only by very
Small surface area is very inadequate to radiate.Effective cooling measure is taken just to can guarantee that the stability and reliability of circuit.
The purpose of radiating is when component temperature exceedes Reliability Assurance temperature, takes appropriate radiating countermeasure, is reduced to temperature
In the range of reliability Work.
Non-refrigeration type infrared detector 6 has been internally integrated TEC TECs in shell, by its with inside infrared detector
The temperature signal of temperature sensor output accesses in the TEC control loops outside infrared detector together, it is possible to achieve to non-system
The refrigeration of cold mould infrared detector 6 or heating, non-refrigeration type infrared detector 6 is set to maintain on a stable temperature spot, but
It is when background ambient temperature is with selecting temperature deviation larger, the power consumption of infrared movement will be increased, produce substantial amounts of heat, reduced
The overall performance of the infrared movement of non-refrigeration type.
The content of the invention
In order to solve the problems, such as that prior art is present, the work(of the invention according to each part in the infrared movement of non-refrigeration type
Energy and temperature characterisitic, a kind of reliable infrared movement heat abstractor of non-refrigeration type and heat dissipating method are proposed, it is red to improve non-refrigeration type
The Iimaging Stability and reliability of outer movement, so as to ensure the image quality of the infrared movement of non-refrigeration type.It is infrared in non-refrigeration type
When movement exceedes Reliability Assurance temperature, appropriate radiating countermeasure is taken, temperature is reduced in the range of reliability Work.
The present invention is that technical scheme is as follows used by solving technical problem：
The infrared movement heat abstractor of non-refrigeration type of the present invention, including：
The printed circuit board of sandwich construction is designed to, non-refrigeration type infrared detector welds on a printed circuit board, non-system
Infrared temperature control chip and infrared power supply chip inside cold mould infrared detector are respectively welded at top layer and the bottom of printed circuit board
Layer；
The first heat sink structure being connected with the bottom shell of non-refrigeration type infrared detector, first heat sink structure with it is non-
The infrared machine core shell body phase of refrigeration mode connects；
The second heat sink structure being connected with the mechanical erection face of non-refrigeration type infrared detector both sides, the second heat sink knot
Infrared with non-refrigeration type machine core shell body and the first heat sink structure are connected structure respectively；
Set on a printed circuit board and regularly arranged multiple heat conduction hole arrays, multiple heat conduction hole arrays are respectively positioned on infrared
The underface of Temperature Controlling Chip and infrared power supply chip；
The heat conduction aluminium lamination of printed circuit intralamellar part is arranged on, the heat conduction hole array is penetrated into from printed circuit plate surface to be led
Hot aluminium lamination, the part that the heat conduction aluminium lamination stretches out printed circuit board both ends are crimped onto on the second heat sink structure.
Further, first heat sink structure and the second heat sink structure are less than 4K/W heat conduction aluminium block from thermal resistance.
Further, the size of first heat sink structure is 15mm × 10mm, and the size of second heat sink structure is
23.5mm×3.5mm。
Further, the printed circuit board is 10 Rotating fields：Set between the layers 2 and 3 of printed circuit board
Heat conduction aluminium lamination, while it is also provided with heat conduction aluminium lamination between the 8th layer of printed circuit board and the 9th layer.
Further, the printed circuit intralamellar part is additionally provided with thick line, copper foil or thin plate.
Present invention also offers a kind of infrared movement heat dissipating method of non-refrigeration type, this method comprises the following steps：
Step 1: non-refrigeration type infrared detector is welded on single printed circuit board, the printed circuit board is set
Sandwich construction is set to, the infrared temperature control chip and infrared power supply chip of non-refrigeration type infrared detector are respectively welded at printed circuit
The top layer and bottom of plate；
Step 2: two heat sink structures for being applied to the radiating of non-refrigeration type infrared detector of design, respectively first is heat sink
Structure and the second heat sink structure, the bottom shell of non-refrigeration type infrared detector is fixed on the first heat sink structure center, first
Heat sink structure connects with the infrared machine core shell body phase of non-refrigeration type；
Step 3: install the second heat sink structure additional in the mechanical erection face of non-refrigeration type infrared detector both sides, the second heat
Sink structure connects with the first heat sink structure and the infrared machine core shell body phase of non-refrigeration type respectively；By setting the first heat sink structure and second
Heat sink structure reduces non-refrigeration type infrared detector power consumption to help non-refrigeration type infrared detector to radiate；
Step 4: setting the heat conduction hole array of multiple regular arrays on a printed circuit board, multiple heat conduction hole arrays are located at
The underface of infrared temperature control chip and infrared power supply chip；
Step 5: set multiple heat conduction aluminium laminations in printed circuit intralamellar part, the heat conduction hole array is from printed circuit board table
Face is penetrated into heat conduction aluminium lamination, and the part that the heat conduction aluminium lamination stretches out printed circuit board both ends is crimped onto on the second heat sink structure；It is logical
Cross radiating mode of the design based on heat conduction hole array and heat conduction aluminium lamination, there is provided the heat dissipation path of heating power component, improve and dissipate
The thermal efficiency；
Step 6: design multi-temperature point TEC TEC control modes
TEC TECs are internally integrated in non-refrigeration type infrared detector package, by itself and the infrared spy of non-refrigeration type
The TEC controls that the temperature signal for the infrared temperature sensor output surveyed inside device accesses outside non-refrigeration type infrared detector jointly
In loop, the refrigeration to non-refrigeration type infrared detector or heating are realized, non-refrigeration type infrared detector is maintained one surely
On fixed temperature spot.
The beneficial effects of the invention are as follows：
1st, present invention employs the heat sink structure of non-refrigeration type infrared detector, there is provided effective radiating road of infrared detector
Footpath, reduce the operating temperature of non-refrigeration type infrared detector.
2nd, the present invention additionally uses the printed circuit board radiating mode based on heat conduction hole array and heat conduction aluminium lamination, there is provided heating
The heat dissipation path of power component.
3rd, multi-temperature point TEC (TEC) control method proposed by the present invention, is realized low in wide temperature range
Power consumption, steady operation, this infrared movement heat dissipating method of non-refrigeration type improve the stability of the infrared movement temperature of non-refrigeration type
And reliability, drastically increase the image quality of the infrared movement of non-refrigeration type.
Brief description of the drawings
Fig. 1 is printed circuit board, heat sink structure and non-refrigeration type infrared detector, non-refrigeration type infrared machine in the present invention
Position connection relationship diagram between core shell body.
Fig. 2 is the heat conduction hole array and heat conduction aluminium lamination sinking path schematic diagram employed in the present invention.
Fig. 3 is single temperature spot TEC power consumption profiles (T=30 DEG C).
Fig. 4 is multi-temperature point TEC power consumption profiles (T=-10 DEG C, 10 DEG C, 30 DEG C, 50 DEG C).
In figure：1st, printed circuit board, the 2, first heat sink structure, the 3, second heat sink structure, 4, heat conduction hole array, 5, heat conduction aluminum
Layer, 6, non-refrigeration type infrared detector, 7, mechanical erection face, 8, the infrared machine core shell body of non-refrigeration type, 9, infrared temperature control chip,
10th, infrared power supply chip.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
As depicted in figs. 1 and 2, the infrared movement heat abstractor of non-refrigeration type of the invention, mainly includes：Printed circuit board 1,
First heat sink structure 2, the second heat sink structure 3, multiple heat conduction hole arrays 4, multiple heat conduction aluminium laminations 5.
Non-refrigeration type infrared detector 6 belongs to temperature sensor, and it is infrared that the change of its temperature directly affects non-refrigeration type
The image quality of detector 6, therefore, it is necessary to carry out heat dissipation design to the shell of non-refrigeration type infrared detector 6.As shown in figure 1, set
Count two heat sink structures for being suitable for non-refrigeration type infrared detector 6.Non-refrigeration type infrared detector 6 is needed away from first device that generates heat
Part, it is typically welded on single printed circuit board 1, printed circuit board 1 is arranged to sandwich construction.Non-refrigeration type infrared detector
6 bottom shell is fixed on the center of the first heat sink structure 2, and the first heat sink structure 2 is connected with the infrared machine core shell body 8 of non-refrigeration type
Connect, the size of the first heat sink structure 2 is 15mm × 10mm.Installed additional in the mechanical erection face 7 of the both sides of non-refrigeration type infrared detector 6
Upper second heat sink structure 3, the size of the second heat sink structure 3 is 23.5mm × 3.5mm, the second heat sink structure 3 and the first heat sink knot
Structure 2 is connected, and the second heat sink structure 3 is also connected with the infrared machine core shell body 8 of non-refrigeration type, non-refrigeration type infrared detector 6
The size in mechanical erection face 7 is 23.5mm × 3.5mm.By setting the first heat sink structure 2 and the second heat sink structure 3 non-to help
Refrigeration type infrared detector 6 radiates, and reduces the power consumption of non-refrigeration type infrared detector 6, at the same time, non-refrigeration type infrared acquisition
Enough spaces should be left around the top of device 6, are advantageous to the flowing of radiating gas.
As shown in Fig. 2 two infrared temperature control chips 9 of non-refrigeration type infrared detector 6 and two infrared power supply chip 10
The top layer and bottom of printed circuit board 1 are separately mounted to, so that printed circuit board 1 is 10 layers as an example：Two infrared temperature control chips 9 are put
Put in the 1st layer of outside of printed circuit board 1, two infrared power supply chip 10 is placed on the 10th layer of outside of printed circuit board 1；
The heat conduction hole arrays 4 of a large amount of rules are set on printed circuit board 1, and these heat conduction hole arrays 4 are located at infrared temperature control chip 9 and infrared
The underface of power supply chip 10；Multiple heat conduction aluminium laminations 5 are set in the inside of printed circuit board 1, being 10 layers with printed circuit board 1 is
Example：One piece of heat conduction aluminium lamination 5 is provided between the layers 2 and 3 of printed circuit board 1, at the 8th layer of printed circuit board 1 and
One piece of heat conduction aluminium lamination 5 is also equipped between 9th layer, or is set between other interlayers；Heat conduction hole array 4 is from printed circuit board
1 surface is penetrated into heat conduction aluminium lamination 5；Heat conduction aluminium lamination 5 is crimped onto second heat sink structure 3 at the both ends of printed circuit board 1.
The drive circuit of non-refrigeration type infrared detector 6 includes the heating powers such as temperature-control circuit, infrared power circuit
Component, the sinking path of heating power component are to be radiated by the surface of component to surrounding air, but only by very
Small surface area is very inadequate to radiate.Using the heat dissipation path that heat conduction hole array 4 and heat conduction aluminium lamination 5 are radiated as schemed
Shown in 2, on printed circuit board 1, the underface of infrared temperature control chip 10 and infrared power supply chip 11 leading for a large amount of rules is set
Hot hole array 4, it is equivalent to thin copper conductor tube one by one and is penetrated into heat conduction aluminium lamination 5 along the thickness direction of printed circuit board 1 from surface, so
The heat of heating power component top layer on printed circuit board 1 can be made to be transmitted to heat conduction aluminium lamination 5, heat conduction aluminium lamination 5 passes heat
Second heat sink structure 3 at the both ends of printed circuit board 1 is passed, the second heat sink structure 3 and the infrared machine core shell body 8 of non-refrigeration type contact,
So heat can is smoothly transmitted to the infrared machine core shell body 8 of non-refrigeration type.Meanwhile also include when printed circuit board 1 designs
Other heat dissipating methods, for example copper etc. is spread using thick line, thick copper foil, thin plate, multilayer, large area.Setting is based on the He of heat conduction hole array 4
The radiating mode of printed circuit board 1 of heat conduction aluminium lamination 5, there is provided the heat dissipation path of heating power component, improve radiating efficiency.
A kind of infrared movement heat dissipating method of non-refrigeration type of the present invention, the heat abstractor realization of the above is mainly based upon,
This method comprises the following steps：
Step 1: design two is advantageous to the heat sink structure of the radiating of non-refrigeration type infrared detector 6
As shown in figure 1, two heat sink structures are respectively the first heat sink structure 2 and the second heat sink structure 3, non-refrigeration type is infrared
Detector 6 is welded on single printed circuit board 1, and it is heat sink that the bottom shell of non-refrigeration type infrared detector 6 is fixed on first
The center of structure 2, the first heat sink structure 2 are connected with the infrared machine core shell body 8 of non-refrigeration type, and the size of the first heat sink structure 2 is
15mm×10mm.Install the second heat sink structure 3 additional in the mechanical erection face 7 of the both sides of non-refrigeration type infrared detector 6, second is heat sink
Structure 3 is connected with the first heat sink structure 2, and the second heat sink structure 3 is also connected with the infrared machine core shell body 8 of non-refrigeration type, and second
The size of heat sink structure 3 is 23.5mm × 3.5mm.By setting the first heat sink structure 2 and the second heat sink structure 3 to help non-system
Cold mould infrared detector 6 radiates, and reduces the power consumption of non-refrigeration type infrared detector 6, at the same time, non-refrigeration type infrared detector
Enough spaces should be left around 6 top, are advantageous to the flowing of radiating gas.
Step 2: radiating mode of the design based on heat conduction hole array 4 and heat conduction aluminium lamination 5
As shown in Fig. 2 printed circuit board 1 is arranged to sandwich construction, two infrared temperature controls of non-refrigeration type infrared detector 6
Chip 9 and two infrared power supply chip 10 are separately mounted to the top layer and bottom of printed circuit board 1, with printed circuit board 1 for 10
Exemplified by layer：Two infrared temperature control chips 9 are placed on the 1st layer of outside of printed circuit board 1, and two infrared power supply chip 10 is placed on
10th layer of outside of printed circuit board 1；The heat conduction hole array 4 of a large amount of rules, these thermal hole battle arrays are set on printed circuit board 1
Row 4 are located at the underface of infrared temperature control chip 9 and infrared power supply chip 10；In the inside of printed circuit board 1, heat conduction aluminium lamination is set
5, so that printed circuit board 1 is 10 layers as an example：Heat conduction aluminium lamination 5 is provided between the layers 2 and 3 of printed circuit board 1, is being printed
Heat conduction aluminium lamination 5 is also equipped between the 8th layer of circuit board 1 processed and the 9th layer；Heat conduction hole array 4 penetrates from the surface of printed circuit board 1
To heat conduction aluminium lamination 5；Heat conduction aluminium lamination 5 is crimped onto second heat sink structure 3 at the both ends of printed circuit board 1.
On printed circuit board 1, the underface of infrared temperature control chip 10 and infrared power supply chip 11 a large amount of rules are set
Heat conduction hole array 4, it is equivalent to thin copper conductor tube one by one and is penetrated into heat conduction aluminium lamination 5 along the thickness direction of printed circuit board 1 from surface, this
Sample can make the heat of heating power component top layer on printed circuit board 1 be transmitted to heat conduction aluminium lamination 5, and heat conduction aluminium lamination 5 is by heat
Second heat sink structure 3 at the both ends of printed circuit board 1 is passed to, the second heat sink structure 3 is connected with the infrared machine core shell body 8 of non-refrigeration type
Connect, such heat can is smoothly transmitted to the infrared machine core shell body 8 of non-refrigeration type.The driving electricity of non-refrigeration type infrared detector 6
Road includes the heating power components such as temperature-control circuit, infrared power circuit, and the sinking path of heating power component is logical
The surface for crossing component is radiated to surrounding air, but is only very inadequate to radiate by very small surface area, by setting
Count the radiating mode of printed circuit board 1 based on heat conduction hole array 4 and heat conduction aluminium lamination 5, there is provided the radiating road of heating power component
Footpath, improve radiating efficiency.
Meanwhile also include other heat dissipating methods when printed circuit board 1 designs, such as using thick line, thick copper foil, thin plate,
Multilayer, large area paving copper etc..
Step 3: design multi-temperature point TEC TEC control modes
TEC TECs are internally integrated in the shell of non-refrigeration type infrared detector 6, by itself and the infrared spy of non-refrigeration type
The TEC controls that the temperature signal for the infrared temperature sensor output surveyed inside device 6 accesses outside non-refrigeration type infrared detector 6 together
In loop processed, it is possible to achieve refrigeration or heating to non-refrigeration type infrared detector 6, maintain non-refrigeration type infrared detector 6
On a stable temperature spot.
In present embodiment, the first heat sink structure 2 and the second heat sink structure 3 select the heat conduction aluminium block that thermal resistance is less than 4K/W,
Reduce thermal contact resistance, but excessively increase heat conduction aluminium block quality, increase heat conduction aluminum by increasing the area of heat conduction aluminium block contact surface
Block sectional area etc. all can increase the quality of focal plane component, consider in the design.
In present embodiment, using the grade of non-refrigeration type infrared detector 6 of following model as radiating object, it is specially：
The producer of non-refrigeration type infrared detector 6 and model are respectively Beijing Guang Weiji electricity companies, GWIR0302X1A, temperature controller
Model MAX1978, the model of two infrared power supply chip 9 is respectively ADR440 and LT1529.Using the radiating of the present invention
Device and heat dissipating method radiate to the non-refrigeration type infrared detector 6 of above-mentioned model, as a result as shown in Figure 3 and Figure 4, Dan Wen
Spend point TEC power consumption profiles (T=30 DEG C) as shown in figure 3, multi-temperature point TEC power consumption profiles (T=-10 DEG C, 10 DEG C, 30 DEG C, 50
DEG C) as shown in Figure 4.By Fig. 3 and Fig. 4 contrast, using the heat abstractor and heat dissipating method of the present invention to non-refrigeration type
Infrared detector 6 is radiated, while uses multi-temperature point TEC TEC control modes, and non-refrigeration type can be made infrared
Detector 6 can reliablely and stablely work in wide temperature range under different background ambient temperatures, reduce work(to greatest extent
Consumption, lift the overall performance of the infrared movement of non-refrigeration type.
Claims (6)
1. the infrared movement heat abstractor of non-refrigeration type, it is characterised in that including：
The printed circuit board (1) of sandwich construction is designed to, non-refrigeration type infrared detector (6) is welded on printed circuit board (1),
Infrared temperature control chip (9) is welded on the top layer of printed circuit board (1), and infrared power supply chip (10) is welded on printed circuit board (1)
Bottom；
The first heat sink structure (2) being connected with the bottom shell of non-refrigeration type infrared detector (6), first heat sink structure
(2) machine core shell body (8) infrared with non-refrigeration type is connected；
The second heat sink structure (3) being connected with the mechanical erection face (7) of non-refrigeration type infrared detector (6) both sides, described second
Machine core shell body (8) infrared with non-refrigeration type and the first heat sink structure (2) are connected heat sink structure (3) respectively；
Multiple heat conduction hole arrays (4) on printed circuit board (1) and regularly arranged are arranged on, multiple heat conduction hole arrays (4) are respectively
Positioned at the underface of infrared temperature control chip (9) and infrared power supply chip (10)；
It is arranged on the internal heat conduction aluminium lamination (5) of printed circuit board (1), the heat conduction hole array (4) is from printed circuit board (1) surface
Heat conduction aluminium lamination (5) is penetrated into, the part that the heat conduction aluminium lamination (5) stretches out printed circuit board (1) both ends is crimped onto the second heat sink knot
On structure (3).
2. the infrared movement heat abstractor of non-refrigeration type according to claim 1, it is characterised in that first heat sink structure
(2) and the second heat sink structure (3) is less than 4K/W heat conduction aluminium block from thermal resistance.
3. the infrared movement heat abstractor of non-refrigeration type according to claim 1, it is characterised in that first heat sink structure
(2) size is 15mm × 10mm, and the size of second heat sink structure (3) is 23.5mm × 3.5mm.
4. the infrared movement heat abstractor of non-refrigeration type according to claim 1, it is characterised in that the printed circuit board
(1) it is 10 Rotating fields：Heat conduction aluminium lamination (5) is set between the layers 2 and 3 of printed circuit board (1), while in printed circuit
Heat conduction aluminium lamination (5) is also provided between the 8th layer of plate (1) and the 9th layer.
5. the infrared movement heat abstractor of non-refrigeration type according to claim 1, it is characterised in that the printed circuit board
(1) it is internal to be additionally provided with thick line, copper foil or thin plate.
6. the manufacture method of the infrared movement heat abstractor of non-refrigeration type as claimed in claim 1, it is characterised in that this method bag
Include following steps：
Step 1: non-refrigeration type infrared detector (6) is welded on single printed circuit board (1), the printed circuit board
(1) it is arranged to sandwich construction, infrared temperature control chip (9) is welded on the top layer of printed circuit board (1), infrared power supply chip (10) weldering
It is connected on the bottom of printed circuit board (1)；
Step 2: two heat sink structures for being applied to non-refrigeration type infrared detector (6) radiating of design, the respectively first heat sink knot
Structure (2) and the second heat sink structure (3), the bottom shell of non-refrigeration type infrared detector (6) is fixed on the first heat sink structure (2)
Center, the first heat sink structure (2) machine core shell body (8) infrared with non-refrigeration type are connected；
Step 3: install upper second heat sink structure (3) additional in the mechanical erection face of non-refrigeration type infrared detector (6) both sides, second
Heat sink structure (3) is connected with the first heat sink structure (2) and the infrared machine core shell body (8) of non-refrigeration type respectively；By setting the first heat
Sink structure (2) and the second heat sink structure (3) reduce the infrared spy of non-refrigeration type to help non-refrigeration type infrared detector (6) to radiate
Survey device (6) power consumption；
Step 4: the heat conduction hole array (4) of multiple regular arrays is set on printed circuit board (1), multiple heat conduction hole arrays (4)
Positioned at the underface of infrared temperature control chip (9) and infrared power supply chip (10)；
Step 5: set multiple heat conduction aluminium laminations (5) inside the printed circuit board (1), the heat conduction hole array (4) is from printed circuit
Plate (1) surface is penetrated into heat conduction aluminium lamination (5), and the part that the heat conduction aluminium lamination (5) stretches out printed circuit board (1) both ends is crimped onto the
On two heat sink structures (3)；By designing the radiating mode based on heat conduction hole array (4) and heat conduction aluminium lamination (5), there is provided heating power
The heat dissipation path of component, improve radiating efficiency；
Step 6: design multi-temperature point TEC TEC control modes
In non-refrigeration type infrared detector (6), shell has been internally integrated TEC TECs, by itself and non-refrigeration type infrared acquisition
The temperature signal of the internal infrared temperature sensor output of device (6) accesses the outside TEC of non-refrigeration type infrared detector (6) jointly
In control loop, the refrigeration to non-refrigeration type infrared detector (6) or heating are realized, ties up non-refrigeration type infrared detector (6)
Hold on a stable temperature spot.
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| CN108493271B (en) * | 2018-03-13 | 2019-12-13 | 东南大学 | Chip-scale ultra-micro refrigerator for non-refrigeration type infrared detector |
| CN111147699B (en) * | 2018-11-02 | 2022-01-07 | 南昌欧菲光电技术有限公司 | Electronic equipment, camera device and mounting base thereof |
| CN109405978A (en) * | 2018-11-28 | 2019-03-01 | 西安泰豪红外科技有限公司 | A kind of infrared machine core of refrigeration mode and preparation method thereof |
| CN109587380B (en) * | 2018-12-06 | 2020-04-28 | 天津津航技术物理研究所 | Miniaturized high-temperature working multi-interface refrigeration type infrared imager |
| CN109698173B (en) * | 2019-02-14 | 2024-03-12 | 亨通洛克利科技有限公司 | Optical module structure for precisely positioning optical and electric chip bonding and assembling mode thereof |
| CN112015030B (en) * | 2020-08-28 | 2022-06-14 | 天津津航技术物理研究所 | Refrigeration infrared core assembly heat radiation structure and refrigeration infrared core |
| WO2023035933A1 (en) * | 2021-09-09 | 2023-03-16 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
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| CN103606546A (en) * | 2013-11-28 | 2014-02-26 | 华为技术有限公司 | Optical device |
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