CN105246261A - 一种芯片去除装置 - Google Patents

一种芯片去除装置 Download PDF

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CN105246261A
CN105246261A CN201510671659.4A CN201510671659A CN105246261A CN 105246261 A CN105246261 A CN 105246261A CN 201510671659 A CN201510671659 A CN 201510671659A CN 105246261 A CN105246261 A CN 105246261A
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heating head
base station
chip
removal device
microscope carrier
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CN105246261B (zh
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蔡光源
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
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    • H01L24/799—Apparatus for disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/7525—Means for applying energy, e.g. heating means
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    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
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Abstract

本发明涉及显示制备技术领域，公开了一种芯片去除装置，包括：载台，用于对显示面板上、固定芯片的各向异性导电胶进行软化的加热头，位于载台上、用于支撑显示面板的基台，位于载台上、用于支撑加热头的基座，加热头可旋转地安装于基座，且加热头的旋转轴线垂直于载台朝向基台的一面。上述芯片去除装置，在使用时，由于加热头可旋转，故将显示面板靠近加热头时，若显示面板上的芯片朝向加热头的一面与加热头朝向芯片的一面不平行时，显示面板上的芯片先碰到加热头的部分将推动加热头旋转，使得加热头朝向芯片的一面与芯片朝向加热头的一面可以更好的贴合，减小芯片先碰到加热头的部分的承受力，提高芯片的受力均匀性。

Description

一种芯片去除装置
技术领域
本发明涉及显示制备技术领域，尤其涉及一种芯片去除装置。
背景技术
在显示面板的制造过程中，需要将驱动芯片(DriveIntegratedCircuit)通过各向异性导电胶(ACF)贴附在显示面板上，以实现显示面板的显示功能。然而在实际生产过程中，芯片的贴附可能出现错位、破损等不良，这时就需要去除芯片进行修复。
现有去除芯片的方式是将显示面板放置在机台上，机台相对基座固定，加热头相对机台也固定，手动推移显示面板靠近加热头，通过加热头对芯片进行加热，使相应部位的各向异性导电胶受热软化，然后通过手动继续推移显示面板来去除芯片。
但现有技术中的加热头是固定不动的，人手动推移显示面板时，可能出现显示面板上的芯片朝向加热头的一面与加热头朝向芯片的一面不平行，导致芯片的某一角与加热头接触，芯片受力不均匀，容易出现芯片破裂划伤显示面板的电极的现象的发生。
发明内容
有鉴于此，本发明提供了一种芯片去除装置，用以提高芯片受力的均匀性，减小芯片破裂划伤显示面板的电极的现象的发生。
为达到上述目的，本方提供以下技术方案：
本发明提供了一种芯片去除装置，包括：载台，用于对显示面板上、固定芯片的各向异性导电胶进行软化的加热头，位于所述载台上、用于支撑显示面板的基台，位于所述载台上、用于支撑加热头的基座，所述加热头可旋转地安装于所述基座，且所述加热头的旋转轴线垂直于所述载台朝向所述基台的一面。
本发明提供的芯片去除装置，在使用时，将显示面板放置在基台上，手动推移显示面板靠近加热头，通过加热头对芯片进行加热，使相应部位的各向异性导电胶受热软化，由于加热头可旋转，故将显示面板靠近加热头时，若显示面板上的芯片朝向加热头的一面与加热头朝向芯片的一面不平行时，显示面板上的芯片先碰到加热头的部分将推动加热头旋转，使得加热头朝向芯片的一面与芯片朝向加热头的一面可以更好的贴合，减小芯片先碰到加热头的部分的承受力，提高芯片的受力均匀性。
在一些可选的实施方式中，所述旋转轴线位于所述基座的中垂线朝向所述基台的一侧。便于芯片与加热头更好的贴合。
在一些可选的实施方式中，所述加热头通过轴承安装于所述基座。
在一些可选的实施方式中，所述加热头通过安装轴安装于所述基座。
在一些可选的实施方式中，所述基台与所述载台滑动连接。便于推动基台，使得基台上的基板更方便靠近加热头。
在一些可选的实施方式中，所述基台朝向所述载台的一面设有多个滚轮，所述基台通过所述多个滚轮与所述载台滑动连接。
在一些可选的实施方式中，所述载台上设有向所述加热头方向延伸的滑轨，所述基台设有与所述滑轨滑动配合的滑块，所述基台和所述载台通过所述滑块和滑轨滑动连接。
在一些可选的实施方式中，所述载台上设有向所述加热头方向延伸的滑块，所述基台设有与所述滑块滑动配合的滑轨，所述基台和所述载台通过所述滑块和滑轨滑动连接。
在一些可选的实施方式中，所述基台用于支撑所述显示面板的一面设有多个真空吸附孔，所述多个真空吸附孔用于吸附所述显示面板。便于更好的将基板与基台固定，避免基板碰到加热头后移动。
在一些可选的实施方式中，上述芯片去除装置还包括：位于所述基台背离所述基座一侧、相对所述基座固定的固定板，所述固定板与所述基座之间设有弹簧，所述弹簧的一端与所述固定板连接，另一端与所述基座连接。弹簧的设置可以便于基台复位，当芯片被去除后，不需要人为将基板远离加热头，即当基台处于第一位置时(基板上的芯片未与加热头接触时)，弹簧处于原长，当基台带动基板靠近加热头时，弹簧处于伸长状态，当芯片被加热去除后，弹簧伸缩将带动基台回到第一位置。
附图说明
图1为本发明实施例提供的芯片去除装置的结构示意图。
附图标记：
1-载台2-加热头
3-基台4-基板
5-基座6-轴承
7-滚轮8-真空吸附孔
9-芯片
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1所示，图1为本发明实施例提供的芯片去除装置的结构示意图，本发明提供了一种芯片去除装置，包括：载台1，用于对显示面板上、固定芯片9的各向异性导电胶进行软化的加热头2，位于载台1上、用于支撑显示面板的基台3，位于载台1上、用于支撑加热头2的基座5，加热头2可旋转地安装于基座5，且加热头2的旋转轴线垂直于载台1朝向基台3的一面。
本发明提供的芯片去除装置，在使用时，将显示面板放置在基台3上，手动推移显示面板靠近加热头2，通过加热头2对芯片9进行加热，使相应部位的各向异性导电胶受热软化，由于加热头2可旋转，故将显示面板靠近加热头2时，若显示面板上的芯片9朝向加热头2的一面与加热头2朝向芯片9的一面不平行时，显示面板上的芯片9先碰到加热头2的部分将推动加热头2旋转，使得加热头2朝向芯片9的一面与芯片9朝向加热头2的一面可以更好的贴合，减小芯片9先碰到加热头2的部分的承受力，提高芯片9的受力均匀性，减小芯片破裂划伤显示面板的电极的现象的发生。
各向异性导电胶主要包括树脂黏着剂、导电粒子两大部分，树脂黏着剂的功能除了防湿气、黏着、耐热及绝缘功能外，主要用于固定芯片与玻璃面板间电极的相对位置，并提供压迫力量以维持电极与导电粒子间的接触面积。其中，各向异性导电胶的特点在于Z轴电气导通方向与XY绝缘平面的电阻特性具有明显的差异，当Z轴导通方向的电阻值与XY绝缘平面的电阻值的差异超过一定比值后，既可称为良好的导电异向性。导通原理为：利用导电粒子连接芯片与显示面板两者之间的电极使之导通，同时又能避免相邻两电极间导通短路，达到只在Z轴电气导通方向导通的目的。
进一步的，上述旋转轴线位于基座5的中垂线朝向基台3的一侧。便于芯片9与加热头2更好的贴合。
上述加热头2可以通过多种方式安装于基座5：
一种可选的实施方式中，上述加热头2通过轴承6安装于基座5。安装和拆卸较方便。
另一种可选的实施方式中，加热头2通过安装轴安装于基座5。
为了便于推动基台3，使得基台3上的基板4更方便靠近加热头2。较佳的实施方式中，基台3与载台1滑动连接。
一种可选的实施方式中，基台3朝向载台1的一面设有多个滚轮7，基台3通过多个滚轮7与载台1滑动连接。
另一种可选的实施方式中，载台1上设有向加热头2方向延伸的滑轨，基台3设有与滑轨滑动配合的滑块，基台3和载台1通过滑块和滑轨滑动连接。
再一种可选的实施方式中，载台1上设有向加热头2方向延伸的滑块，基台3设有与滑块滑动配合的滑轨，基台3和载台1通过滑块和滑轨滑动连接。
一种具体实施方式中，上述基台3用于支撑显示面板的一面设有多个真空吸附孔8，多个真空吸附孔8用于吸附显示面板。便于更好的将基板4与基台3固定，避免基板4碰到加热头2后移动。
优选的，上述芯片去除装置还包括：位于基台3背离基座5一侧、相对基座5固定的固定板，固定板与基座5之间设有弹簧，弹簧的一端与固定板连接，另一端与基座5连接。弹簧的设置可以便于基台3复位，当芯片9被去除后，不需要人为将基板4远离加热头2，即当基台3处于第一位置时(基板4上的芯片9未与加热头2接触时)，弹簧处于原长，当基台3带动基板4靠近加热头2时，弹簧处于伸长状态，当芯片9被加热去除后，弹簧伸缩将带动基台3回到第一位置。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (10)

1.一种芯片去除装置，包括：载台，用于对显示面板上、固定芯片的各向异性导电胶进行软化的加热头，位于所述载台上、用于支撑显示面板的基台，位于所述载台上、用于支撑加热头的基座，其特征在于，所述加热头可旋转地安装于所述基座，且所述加热头的旋转轴线垂直于所述载台朝向所述基台的一面。
2.如权利要求1所述的芯片去除装置，其特征在于，所述旋转轴线位于所述基座的中垂线朝向所述基台的一侧。
3.如权利要求1所述的芯片去除装置，其特征在于，所述加热头通过轴承安装于所述基座。
4.如权利要求1所述的芯片去除装置，其特征在于，所述加热头通过安装轴安装于所述基座。
5.如权利要求1～4任一项所述的芯片去除装置，其特征在于，所述基台与所述载台滑动连接。
6.如权利要求5所述的芯片去除装置，其特征在于，所述基台朝向所述载台的一面设有多个滚轮，所述基台通过所述多个滚轮与所述载台滑动连接。
7.如权利要求5所述的芯片去除装置，其特征在于，所述载台上设有向所述加热头方向延伸的滑轨，所述基台设有与所述滑轨滑动配合的滑块，所述基台和所述载台通过所述滑块和滑轨滑动连接。
8.如权利要求5所述的芯片去除装置，其特征在于，所述载台上设有向所述加热头方向延伸的滑块，所述基台设有与所述滑块滑动配合的滑轨，所述基台和所述载台通过所述滑块和滑轨滑动连接。
9.如权利要求5所述的芯片去除装置，其特征在于，所述基台用于支撑所述显示面板的一面设有多个真空吸附孔，所述多个真空吸附孔用于吸附所述显示面板。
10.如权利要求6～9任一项所述的芯片去除装置，其特征在于，还包括：位于所述基台背离所述基座一侧、相对所述基座固定的固定板，所述固定板与所述基座之间设有弹簧，所述弹簧的一端与所述固定板连接，另一端与所述基座连接。
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