CN105246260A - 一种铝基线路板的制造方法 - Google Patents
一种铝基线路板的制造方法 Download PDFInfo
- Publication number
- CN105246260A CN105246260A CN201510771320.1A CN201510771320A CN105246260A CN 105246260 A CN105246260 A CN 105246260A CN 201510771320 A CN201510771320 A CN 201510771320A CN 105246260 A CN105246260 A CN 105246260A
- Authority
- CN
- China
- Prior art keywords
- energy storage
- aluminum
- storage device
- pressing container
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 55
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 238000002360 preparation method Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 80
- 238000004146 energy storage Methods 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 27
- 238000005086 pumping Methods 0.000 claims description 22
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011256 inorganic filler Substances 0.000 claims description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 12
- 238000010792 warming Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 6
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000284 extract Substances 0.000 claims description 4
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 150000001398 aluminium Chemical class 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510771320.1A CN105246260B (zh) | 2015-11-12 | 2015-11-12 | 一种铝基线路板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510771320.1A CN105246260B (zh) | 2015-11-12 | 2015-11-12 | 一种铝基线路板的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105246260A true CN105246260A (zh) | 2016-01-13 |
CN105246260B CN105246260B (zh) | 2017-12-12 |
Family
ID=55043666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510771320.1A Active CN105246260B (zh) | 2015-11-12 | 2015-11-12 | 一种铝基线路板的制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105246260B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109451668A (zh) * | 2018-11-30 | 2019-03-08 | 四川海英电子科技有限公司 | 一种应用于电力电源印制电路板的工艺 |
CN110325310A (zh) * | 2017-03-17 | 2019-10-11 | 三菱综合材料株式会社 | 接合体的制造方法、绝缘电路基板的制造方法及自带散热片的绝缘电路基板的制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297027A1 (de) * | 1987-05-27 | 1988-12-28 | Fela Planungs Ag | Vakuumpressverfahren und -vorrichtung zur Herstellung von Mehrlagenschaltungen |
CN1242789A (zh) * | 1996-11-05 | 2000-01-26 | 雷伊化学公司 | 高导热且易贴合的氧化铝填充组合物及其制造方法 |
WO2002054453A1 (en) * | 2000-12-29 | 2002-07-11 | Lam Research Corporation | Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof |
CN101068452A (zh) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | 一种铝基覆铜箔层压板以及制造工艺 |
CN102079959A (zh) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | 高导热白色胶粘剂组合物、使用其制备的高导热型白色覆盖膜及其制作方法 |
CN102337006A (zh) * | 2010-07-02 | 2012-02-01 | 日立化成工业株式会社 | 树脂组合物、b阶片材、金属箔、金属基板和led基板 |
CN202998656U (zh) * | 2012-11-09 | 2013-06-12 | 苏州赛伍应用技术有限公司 | 一种金属基覆铜板 |
CN104363697A (zh) * | 2014-10-16 | 2015-02-18 | 金壬海 | 陶瓷填充介质铝衬底覆铜板及其制造方法 |
-
2015
- 2015-11-12 CN CN201510771320.1A patent/CN105246260B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297027A1 (de) * | 1987-05-27 | 1988-12-28 | Fela Planungs Ag | Vakuumpressverfahren und -vorrichtung zur Herstellung von Mehrlagenschaltungen |
CN1242789A (zh) * | 1996-11-05 | 2000-01-26 | 雷伊化学公司 | 高导热且易贴合的氧化铝填充组合物及其制造方法 |
WO2002054453A1 (en) * | 2000-12-29 | 2002-07-11 | Lam Research Corporation | Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof |
CN101068452A (zh) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | 一种铝基覆铜箔层压板以及制造工艺 |
CN102337006A (zh) * | 2010-07-02 | 2012-02-01 | 日立化成工业株式会社 | 树脂组合物、b阶片材、金属箔、金属基板和led基板 |
CN102079959A (zh) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | 高导热白色胶粘剂组合物、使用其制备的高导热型白色覆盖膜及其制作方法 |
CN202998656U (zh) * | 2012-11-09 | 2013-06-12 | 苏州赛伍应用技术有限公司 | 一种金属基覆铜板 |
CN104363697A (zh) * | 2014-10-16 | 2015-02-18 | 金壬海 | 陶瓷填充介质铝衬底覆铜板及其制造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110325310A (zh) * | 2017-03-17 | 2019-10-11 | 三菱综合材料株式会社 | 接合体的制造方法、绝缘电路基板的制造方法及自带散热片的绝缘电路基板的制造方法 |
CN110325310B (zh) * | 2017-03-17 | 2021-08-17 | 三菱综合材料株式会社 | 接合体的制造方法、绝缘电路基板的制造方法及自带散热片的绝缘电路基板的制造方法 |
US11478868B2 (en) | 2017-03-17 | 2022-10-25 | Mitsubishi Materials Corporation | Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink |
CN109451668A (zh) * | 2018-11-30 | 2019-03-08 | 四川海英电子科技有限公司 | 一种应用于电力电源印制电路板的工艺 |
Also Published As
Publication number | Publication date |
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CN105246260B (zh) | 2017-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Huang Hai Inventor after: Li Fangfang Inventor before: Wu Wenwen |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171116 Address after: Fuquan Island Industrial Park Road, Guo Xi Street of Ouhai District 325016 in Zhejiang province Wenzhou City No. 75 Applicant after: Zhejiang Zapon Electronic Technology Co.,Ltd. Address before: A large rocky mountain town of Wencheng County of Wenzhou city of Zhejiang province Jianshe Road No. 376 325300 Applicant before: Wu Wenwen |
|
GR01 | Patent grant | ||
GR01 | Patent grant |