CN105242424B - Board structure - Google Patents
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- CN105242424B CN105242424B CN201410322554.3A CN201410322554A CN105242424B CN 105242424 B CN105242424 B CN 105242424B CN 201410322554 A CN201410322554 A CN 201410322554A CN 105242424 B CN105242424 B CN 105242424B
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- substrate
- board structure
- bonding layer
- gap
- joint
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Abstract
A kind of board structure includes a first substrate, multiple first joint sheets and a bonding layer.First substrate has an element configuring area and a peripheral region, and peripheral region is adjacent to the periphery in element configuration area.These the first joint sheet intervals are configured at peripheral region, and have a gap between two these adjacent first joint sheets.Bonding layer is set on first substrate, and covers these first joint sheets and these gaps, and the bonding layer of neighbouring element configuring area has multiple first curved edges.For board structure of the invention after long-time use, bonding layer can effectively stop moisture or oxygen to enter, and therefore, other than it can avoid the corrosion of the first joint sheet, can more have preferably engagement adherence.
Description
Technical field
The present invention, can be with the board structure of a circuit board electrical connection especially in regard to one kind about a kind of board structure.
Background technique
With the development of science and technology flat display apparatus is widely used in various fields, such as liquid crystal display dress
It sets, figure is frivolous, low power consumption and the advantageous characteristics such as radiationless because having, and gradually replaces conventional cathode ray tube aobvious
Showing device, and be applied in the electronic product of numerous species, such as mobile phone, portable multimedia device, laptop
Or tablet computer etc..
Wherein, for controlling the element on thin film transistor base plate, in order to which signal will be controlled by external control circuit
Plate is sent to the element being set on glass substrate, generally a joint sheet can be arranged prior to the edge of thin film transistor base plate
(bonding pads), after being coated with one layer of conducting resinl on joint sheet, hot press corresponding with control circuit board progress makes
Control signal can be sent on thin film transistor base plate by control circuit board, conducting resinl and joint sheet by outside, whereby to member
The movement that part is controlled.
However, the conducting resinl for engaging joint sheet with control circuit board is only simply covered in the prior art
On joint sheet, after prolonged use, conducting resinl possibly can not effectively stop moisture or oxygen to enter and contact joint gasket,
The corrosion of joint sheet is caused, so that problem occurs in the transmitting of control signal, in turn results in the failure of equipment.
Summary of the invention
It is an object of the present invention to provide a kind of board structures, keep away in addition to can effectively prevent moisture or oxygen from entering joint sheet
Exempt to cause except corrosion, can also have preferably engagement adherence.
The technical solution of the present invention is to provide a kind of board structure, which includes a first substrate, multiple first
Joint sheet and a bonding layer.First substrate has an element configuring area and a peripheral region, and peripheral region is adjacent to element configuration area
Periphery.These the first joint sheet intervals are configured at peripheral region, and have a gap between two these adjacent first joint sheets.It connects
It closes layer to be set on first substrate, and covers these first joint sheets and these gaps, and the bonding layer of neighbouring element configuring area
With multiple first curved edges.
In one embodiment, these first joint sheets are configured along a direction interval.
In one embodiment, these first curved edges correspond respectively between these gaps.
In one embodiment, these maximum widths of the first curved edge in the direction of one of them are greater than corresponding
The maximum width of gap in the direction.
In one embodiment, these first joint sheets have multiple first edges of neighbouring element configuring area, and bonding layer
Cover these first edges.
In one embodiment, these first joint sheets have more the multiple second edges opposite with these first edges, and
Bonding layer covers these second edges.
In one embodiment, the bonding layer far from element configuration area has multiple second curved edges.
In one embodiment, board structure further includes a second substrate, is connect by bonding layer with first substrate, second
Substrate has multiple second joint sheets, and these second joint sheets are correspondingly arranged and are electrically connected with these first joint sheets respectively.
In one embodiment, board structure further includes multiple driving electrodes and multiple sensing electrodes, is respectively arranged at element
Configuring area.
In one embodiment, first substrate is a protective substrate or a colored optical filtering substrates or a thin film transistor (TFT) base
Plate.
From the above, because in board structure of the invention, the peripheral region of first substrate is adjacent to the periphery in element configuration area,
And these the first joint sheet intervals are configured at peripheral region, and have a gap between two these adjacent first joint sheets.In addition, connecing
It closes layer to be set on first substrate, and covers these first joint sheets and these gaps, and the bonding layer of neighbouring element configuring area
With multiple first curved edges.These first joint sheets and these gaps are covered by bonding layer, and adjacent to element configuration
The bonding layer in area has multiple first curved edges, so that bonding layer can more fully protect the first joint sheet.Therefore, compared to
The prior art, for board structure of the invention after long-time use, bonding layer can effectively stop moisture or oxygen to enter, because
This can more have preferably engagement adherence other than it can avoid the corrosion of the first joint sheet.
Detailed description of the invention
Figure 1A is a kind of schematic top plan view of board structure of present pre-ferred embodiments.
Figure 1B is the enlarged schematic partial view of the board structure of Figure 1A.
Fig. 1 C is the schematic cross-sectional view of straight line A-A in Figure 1B.
Fig. 2A is the enlarged schematic partial view of the board structure of another state sample implementation of the present invention.
Fig. 2 B is the schematic cross-sectional view of straight line B-B in Fig. 2A.
Main element symbol description
1,1a: board structure
11: first substrate
111: element configuration area
112: peripheral region
12: the first joint sheets
13,13a: bonding layer
131: the first curved edges
132: the second curved edges
14: the second substrate
141: the second joint sheets
A-A, B-B: straight line
C: conducting wire
E1: first edge
E2: second edge
L1, L2: maximum width
X, Y, Z: direction
Specific embodiment
Hereinafter with reference to correlative type, illustrate the board structure according to present pre-ferred embodiments, wherein identical element will
It is illustrated with identical reference marks.The diagram of all state sample implementations of the present invention only illustrate, do not represent full-size(d) with than
Example.
It please refers to shown in Figure 1A to Fig. 1 C, wherein Figure 1A is a kind of vertical view of board structure 1 of present pre-ferred embodiments
Schematic diagram, Figure 1B is the enlarged schematic partial view of the board structure 1 of Figure 1A, and Fig. 1 C is in Figure 1B, and the section view of straight line A-A is illustrated
Figure.
Board structure 1 includes a first substrate 11, multiple first joint sheets 12 and a bonding layer 13.In addition, this implementation
The board structure 1 of example further includes a second substrate 14.But, in order to clearly illustrate the present invention, Figure 1A only shows first substrate 11
With the relativeness of the second substrate 14, other elements (these first joint sheets 12, bonding layer 13 and these conducting wires are not shown
C), and the second substrate 14 that Figure 1B is shown is to be represented by dotted lines it.In addition, Figure 1A system is by taking two the second substrates 14 as an example.
First substrate 11 has an element configuring area (being commonly called as in face) 111 and a peripheral region (being commonly called as outside face) 112, peripheral region
112 are adjacent to the periphery in element configuration area 111.In the present embodiment, element configuration area 111 is located at the middle area of first substrate 11
Domain, and be the region of circuit structure setting, peripheral region 112 is then surrounded on the periphery in element configuration area 111.Wherein, first substrate
11 can for made by light-permeable material, material be, for example, glass, quartz or the like, plastics, rubber, glass fibre or other
High molecular material；Alternatively, first substrate 11 also can for made by opaque material, and e.g. metal-glass fiber composite plate,
Metal-ceramic composite plate or printed circuit board or other materials, are not intended to limit.Special one is mentioned that, element configuration area 111 is
Its region being arranged for circuit structure or element (device) is indicated, if the place of conducting wire is only arranged for conduction merely
It is not element configuration area 111 of the present invention.For example, as shown in Figure 1A, if it is more in being arranged in element configuration area 111
A driving electrodes and when multiple sensing electrodes (Tx and Rx that are commonly called as) can make first substrate 11 become one with touch function
Substrate.Alternatively, in various embodiments, if in thin film transistor (TFT) or picture are arranged in the element configuration area 111 of first substrate 11
When the elements such as plain electrode, then first substrate 11 can become a thin film transistor base plate and be applied to plane and show on device.
As shown in Figure 1B and Fig. 1 C, these first joint sheets 12 interval is configured at peripheral region 112, and two it is adjacent these first
There is a gap (gap) between joint sheet 12.In the present embodiment, it is configured on the peripheral region 112 of 11 lower left side of first substrate
There is the first multiple joint sheets 12, and these first joint sheets 12 are configured along a direction interval X, so that two adjacent first engagements
All there is a gap between pad 12.Wherein, the plan view shape of the first joint sheet 12 is such as, but not limited to square, and for example
But it is not limited to transparency conducting layer (such as ITO or IZO) to be formed, and can be matched by conducting wire C (material is, for example, copper) with element
Set the element electrical connection being arranged in area 111.
Bonding layer 13 is for example set on first substrate 11 with coating method, and be completely covered these first joint sheets 12 and
These gaps.Wherein, bonding layer 13 can be such as, but not limited to anisotropic conducting rubber (Anisotropic Conductive
Film,ACF).Anisotropic conducting rubber is synthesized by resin and conducting particles, is mainly used for connecting two kinds of different substrate materials and line
Road.Anisotropic conducting rubber has upper and lower electrically conducting, but the characteristic of left and right plane insulation, and have it is excellent it is damp proof, then, lead
The functions such as electricity and insulation.In various embodiments, bonding layer 13 also can be adhesion glue).
In the present embodiment, these first joint sheets 12 have multiple first edges of neighbouring element configuring area 111
(edge) E1, and these first edges E1 is completely covered in bonding layer 13.Bonding layer 13 is in addition to covering all these the first engagements
Except gap between these first edges E1 of pad 12 and these first joint sheets 12, bonding layer 13 is also toward element configuration area
111 direction extends, and has multiple first curved edges 131 adjacent to the edge of the bonding layer in element configuration area 111 13.
Wherein, these first curved edges 131 correspond respectively between these gaps.Preferably, these first curved edges 131 and this
A little gaps are to correspond, and the vertex of each the first curved edge 131 corresponds respectively to the middle position in a gap.
" curved edge " of the present invention is not necessarily arc-shaped edge, as long as the vertex of curved edge is compared with two sides song outstanding
Wire shaped edge is all the so-called curved edge of the present invention.
In addition, maximum width L1 of these first curved edges 131 of one of them along direction X, is greater than corresponding gap
Along the maximum width L2 of direction X.The present embodiment is big along the maximum width L1 of direction X with each first curved edge 131
In corresponding gap along the maximum width L2 of direction X.Certainly, in various embodiments, can also part the first arc-shaped side
The maximum width L1 of edge 131 is greater than corresponding gap along the maximum width L2 of direction X, but first curved edge of another part
131 maximum width L1 is less than or equal to corresponding gap along the maximum width L2 of direction X.
The second substrate 14 is connect by bonding layer 13 with first substrate 11.In this, the second substrate 14 for example utilizes thermo-compression bonding
Together in first substrate 11.Wherein, the second substrate 14 has multiple second joint sheets 141, and these second joint sheets 141 are distinguished
It is correspondingly arranged and is electrically connected with these first joint sheets 12.Pass through the second joint sheet 141 and corresponding first joint sheet, 12 phase
To setting, and by bonding layer 13, the first joint sheet 12 can be made to be electrically connected with the second joint sheet 141, to carry out the transmitting of signal.
The second substrate 14 of the present embodiment is such as, but not limited to flexible printed wiring board (Flexible Print Circuit, FPC),
And the material of the second joint sheet 141 is, for example, copper.But, in other examples, the second substrate 14 can also be other patterns
Circuit board, such as printed circuit board (PCB) or Rigid Flex.Therefore, electric signal can pass through conducting wire C, the first joint sheet
12, bonding layer 13 and the second joint sheet 141 are transmitted between first substrate 11 and the second substrate 14.
Hold, be set on first substrate 11 by bonding layer 13, and be completely covered these first joint sheets 12 and these
Gap, and there are multiple first curved edges 131 adjacent to the bonding layer in element configuration area 111 13, so that bonding layer 13 can be compared with
Completely protect the first joint sheet 12.Therefore, compared to the prior art, the board structure 1 of the present embodiment by using for a long time
Afterwards, bonding layer 13 can effectively stop moisture or oxygen to enter, therefore, other than it can avoid the corrosion of the first joint sheet 12,
Can more have and preferably engage adherence with the second substrate 14.
In addition, referring to figure 2. shown in A and Fig. 2 B, wherein Fig. 2A is the board structure 1a of another state sample implementation of the present invention
Enlarged schematic partial view, and Fig. 2 B is the schematic cross-sectional view of straight line B-B in Fig. 2A.
With the board structure 1 of Figure 1A primary difference is that, in board structure 1a, these first joint sheets 12 have with
Its these first edge E1 opposite multiple second edge E2 (second edge E2 is far from element configuration area 111), and these second
Edge E2 and the edge for being not located at first substrate 11, but in the region of peripheral region 112, therefore, bonding layer 13a can be past separate
Element configuration area 111 extends and covers these second edges E2.In addition, the bonding layer 13a far from element configuration area 111 is with more
A second curved edge 132 (also in the region of peripheral region 112).Wherein, the first curved edge 131 and the second curved edge
132 systems relative configuration, quantity can be identical or not identical.It is with identical, and for for one-to-one in this.By in these
The bonding layer 13a of the opposite sides of one joint sheet 12 all has curved edge, can more effectively stop moisture or oxygen enter and
Contact these the first joint sheets 12.
In addition, the other technical characteristics of board structure 1a can refer to the similar elements of board structure 1, repeated no more in this.
It is further mentioned that, above-mentioned board structure 1 (or 1a) can be applied to such as touch panel, display panel or touch-control
On display panel, or it can also be applied on the board structure of other forms.
By taking touch panel as an example, when if plug-in (Out-Cell) formula touch panel, then first substrate is, for example, a glass
Substrate, and the circuit structure being arranged in element configuration area can (include multiple driving electrodes and multiple sensings for touch control sensing circuit
Electrode).Therefore, can by with touch control sensing circuit board structure and a display panel be combined into as a touch-control display panel
(a protection glass (Cover Lens) can be set again to protect touch-control display panel).But, in the aspect of OGS formula touch panel
In, the first substrate itself with touch control sensing circuit is protective substrate, and is not required to that Cover Lens separately is arranged.
When being externally embedded to the aspect of (On-Cell) formula touch panel, first substrate is, for example, a colored optical filtering substrates, and circuit
Structure is touch control sensing circuit, and is formed directly on the outer surface of colored optical filtering substrates, and and thin film transistor base plate
It is combined into as a touch-control display panel (the two can a sandwiched liquid crystal layer).
In the aspect of embedded (In-Cell) formula touch panel, first substrate is, for example, colored optical filtering substrates, and circuit knot
Structure is touch control sensing circuit, and can be formed directly in colored optical filtering substrates relative on a side surface of thin film transistor base plate；
Alternatively, first substrate can also be thin film transistor base plate, and circuit structure is touch control sensing circuit, and can be formed directly in film
Transistor base is on a side surface of colored optical filtering substrates.
In addition, in another embodiment, first substrate is, for example, thin film transistor base plate, and circuit structure is, for example, to show
Circuit structure (includes array architecture of thin film transistor and other elements), and therefore, board structure can be applied to display panel, such as
On liquid crystal display (LCD) panel or Organic Light Emitting Diode (OLED) display panel, to control film crystal by the second substrate
Circuit element on pipe substrate.
In conclusion the peripheral region of first substrate is adjacent to the periphery in element configuration area because in board structure of the invention,
And these the first joint sheet intervals are configured at peripheral region, and have a gap between two these adjacent first joint sheets.In addition, connecing
It closes layer to be set on first substrate, and covers these first joint sheets and these gaps, and the bonding layer of neighbouring element configuring area
With multiple first curved edges.These first joint sheets and these gaps are covered by bonding layer, and adjacent to element configuration
The bonding layer in area has multiple first curved edges, so that bonding layer can more fully protect the first joint sheet.Therefore, compared to
The prior art, for board structure of the invention after long-time use, bonding layer can effectively stop moisture or oxygen to enter, because
This can more have preferably engagement adherence other than it can avoid the corrosion of the first joint sheet.
The foregoing is merely illustratives, rather than are restricted person.It is any without departing from spirit and scope of the invention, and to it
The equivalent modifications or change of progress, are intended to be limited solely by claim.
Claims (9)
1. a kind of board structure, which is characterized in that the board structure includes:
One first substrate, has an element configuring area and a peripheral region, and the peripheral region is adjacent to the outer of the element configuration area
It encloses；
Multiple first joint sheets, interval are configured at the peripheral region, and have one first between two adjacent first joint sheets
Gap；
One bonding layer is set on the first substrate, and covers first joint sheet and first gap, and neighbouring institute
The bonding layer for stating element configuration area has multiple first curved edges；And
One the second substrate is connect by the bonding layer with the first substrate, and the second substrate has multiple second engagements
Pad, and second joint sheet is correspondingly arranged and is electrically connected with first joint sheet respectively, wherein two adjacent described second connect
Closing has one second gap between pad, and second gap is less than first gap.
2. board structure as described in claim 1, which is characterized in that first joint sheet is configured along a direction interval.
3. board structure as claimed in claim 2, which is characterized in that first curved edge corresponds respectively to described first
Between gap.
4. board structure as claimed in claim 3, which is characterized in that first curved edge of one of them is along the side
To maximum width, greater than corresponding first gap along the maximum width in the direction.
5. board structure as described in claim 1, which is characterized in that first joint sheet has the neighbouring element configuration
Multiple first edges in area, and the bonding layer covers the first edge.
6. board structure as claimed in claim 5, which is characterized in that first joint sheet has more and the first edge
Opposite multiple second edges, and the bonding layer covers the second edge.
7. board structure as described in claim 1, which is characterized in that the bonding layer far from the element configuration area has
Multiple second curved edges.
8. board structure as described in claim 1, which is characterized in that the board structure further include:
Multiple driving electrodes and multiple sensing electrodes are respectively arranged at the element configuration area.
9. board structure as described in claim 1, which is characterized in that the first substrate is a protective substrate, a colored filter
Photopolymer substrate or a thin film transistor base plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910002410.2A CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
| CN201410322554.3A CN105242424B (en) | 2014-07-08 | 2014-07-08 | Board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322554.3A CN105242424B (en) | 2014-07-08 | 2014-07-08 | Board structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910002410.2A Division CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105242424A CN105242424A (en) | 2016-01-13 |
| CN105242424B true CN105242424B (en) | 2019-02-12 |
Family
ID=55040114
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910002410.2A Pending CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
| CN201410322554.3A Active CN105242424B (en) | 2014-07-08 | 2014-07-08 | Board structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910002410.2A Pending CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
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| Country | Link |
|---|---|
| CN (2) | CN109521587A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060205A (en) * | 2006-04-18 | 2007-10-24 | Nec液晶技术株式会社 | Flat display panel and connection structure |
| CN204065604U (en) * | 2014-07-08 | 2014-12-31 | 群创光电股份有限公司 | Board structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
| JP2007165744A (en) * | 2005-12-16 | 2007-06-28 | Epson Imaging Devices Corp | Semiconductor device, mounting structure, electrooptical device, method of manufacturing semiconductor device, method of manufacturing mounting structure, method of manufacturing electrooptical device, and electronic equipment |
| US8035789B2 (en) * | 2007-03-19 | 2011-10-11 | Sony Corporation | Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
| KR101419229B1 (en) * | 2007-11-28 | 2014-07-15 | 엘지디스플레이 주식회사 | Display device and method of manufacturing the same |
| JP2009158766A (en) * | 2007-12-27 | 2009-07-16 | Panasonic Corp | Wiring board and connection method |
| CN101526676A (en) * | 2008-03-06 | 2009-09-09 | 北京京东方光电科技有限公司 | Pin bonding structure |
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN102364383B (en) * | 2011-10-20 | 2014-05-21 | 深圳市华星光电技术有限公司 | Liquid crystal display panel, flexible circuit board and liquid crystal display device |
| CN103367947A (en) * | 2012-04-10 | 2013-10-23 | 宸鸿科技(厦门)有限公司 | Connection structure |
-
2014
- 2014-07-08 CN CN201910002410.2A patent/CN109521587A/en active Pending
- 2014-07-08 CN CN201410322554.3A patent/CN105242424B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060205A (en) * | 2006-04-18 | 2007-10-24 | Nec液晶技术株式会社 | Flat display panel and connection structure |
| CN204065604U (en) * | 2014-07-08 | 2014-12-31 | 群创光电股份有限公司 | Board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109521587A (en) | 2019-03-26 |
| CN105242424A (en) | 2016-01-13 |
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