CN101526676A - Pin bonding structure - Google Patents
Pin bonding structure Download PDFInfo
- Publication number
- CN101526676A CN101526676A CN 200810101458 CN200810101458A CN101526676A CN 101526676 A CN101526676 A CN 101526676A CN 200810101458 CN200810101458 CN 200810101458 CN 200810101458 A CN200810101458 A CN 200810101458A CN 101526676 A CN101526676 A CN 101526676A
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- CN
- China
- Prior art keywords
- pin
- pad
- panel
- drive
- row
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a pin bonding structure, which comprises a panel pin and a driver IC pin; a first bonding pad part of the panel pin is matched with the size and shape of a second bonding pad part of the driver IC pin; the first bonding pad part of the panel pin and the second bonding pad part of the driver IC pin corresponding to each other are bonded together to form a bonding pad pair; the bonding pad pair is divided into an upper row and a lower row; and the lower edge of the bonding pad pair in the upper row is higher than the upper edge of the bonding pad pair in the lower row. The pin bonding structure can set the width of each bonding pad wider under the condition of not changing the width of a whole panel, so that the overlapped area of the bonding pads of the panel pin and the driver IC pin is larger; and even if the bonding pads are misplaced due to extension by heating, the circuit connecting performance of the pin bonding structure can be still ensured so as to contribute to improving the yield.
Description
Technical field
The present invention relates to a kind of pin bonding structure, belong to circuit design field.
Background technology
At available liquid crystal display (Liquid Crystal Display, hereinafter to be referred as: (the Outer Lead Bonding of outer pin bonding LCD), be called for short: OLB) in the technology, need with drive integrated circult (hereinafter to be referred as: drive IC) carry out circuit and be connected with the panel of LCD.Particularly, the pin configuration of the pin of drive IC (Lead) structure and panel is respectively shown in Figure 1A, 1B.When carrying out the circuit connection, when between only guaranteed both sides' pin enough coincidence areas being arranged, circuit could conducting.Shown in Fig. 2 A, for drive IC pin and panel pin overlap structural representation when aliging fully.Wherein, part is represented the panel pin shown in the right diagonal line hatches, and part is represented the drive IC pin shown in the left diagonal line hatches, and part is represented the intersection of panel pin and drive IC pin shown in the mesh lines shade.
The defective of prior art is: because the influence of factors such as equipment precision or the material precision of pin own usually misplaces between drive IC pin and the panel pin (Misalign), it is bad product to take place when dislocation exceeds certain specification.Shown in Fig. 2 B, because having taken place, dislocation do not overlap fully between drive IC pin and the panel pin.
What for example, existing drive IC pin was connected employing with the circuit of panel pin is the welding manner that is heated.In this mode, the material of drive IC pin adopts polyimide usually.Polyimide has the inherent characteristic that extends in the back that is heated, and elongation is about 0.1%.And the shape of drive IC pin field be X to about 40mm, Y is to about 2mm, obviously, X to the influence that is subjected to ductility be far longer than Y to, especially X is influenced bigger to the pin at two ends.Therefore, existing drive IC is connected the dislocation that the frequent X of generation in back causes because of ductility to two ends with the circuit that panel carries out pin.When X to dislocation when excessive, then owing to overlap the minimizing of area, make that the circuit connectivity between drive IC and the panel can variation, and also make between the pin of adjacent driven IC and be easy to be short-circuited, thereby cause that easily product is bad, influence yields.
Summary of the invention
The problem to be solved in the present invention is: a kind of pin bonding structure is provided, and the circuit connectivity energy with behind the assurance bonding improves yields.
In order to address the above problem, the invention provides a kind of pin bonding structure, comprising panel pin and drive IC pin; The size and the shape of first welding disk of described panel pin and second welding disk of described drive IC pin are complementary; First welding disk of corresponding panel pin and second welding disk of drive IC pin are bonded together, and to form pad right; Described pad is to minute two rows, on arrange pad right lower limb be higher than the right coboundary of row's pad down.
By the present invention, because pad is provided with being divided into two rows, compare with the pin bonding structure of existing single setting, under the constant condition of whole front panel width, can make the width of each pad be provided with widelyer, thereby make the pad coincidence area of panel pin and drive IC pin bigger, dislocation take place even pad extends owing to being heated, also can guarantee the circuit connectivity energy of pin bonding structure, therefore help improving yields.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Figure 1A is the structural representation of existing drive IC pin;
Figure 1B is the structural representation of existing panel pin;
Structural representation when Fig. 2 A aligns for existing drive IC pin and panel pin overlap fully;
Structural representation when Fig. 2 B for having drive IC pin and panel pin now dislocation takes place;
Fig. 3 is the embodiment of the invention 1 a described pin bonding structure synoptic diagram;
Fig. 4 A is the size marking figure of the embodiment of the invention 1 described panel pin;
Fig. 4 B is the size marking figure of the embodiment of the invention 1 described drive IC pin;
Fig. 4 C is the size marking figure of the described pin bonding structure of the embodiment of the invention 1 when dislocation takes place;
Fig. 5 A is the embodiment of the invention 2 described a kind of pin bonding structure synoptic diagram;
Fig. 5 B is the embodiment of the invention 2 described another kind of pin bonding structure synoptic diagram;
Fig. 5 C is the embodiment of the invention 2 described another pin bonding structure synoptic diagram.
Embodiment
Embodiment 1
Present embodiment provides a kind of pin bonding structure, as shown in Figure 3, comprises panel pin and drive IC pin.Wherein, the panel pin comprises first welding disk 11 and first leading part 12; The drive IC pin comprises second welding disk 21 and second leading part 22.Wherein, part is represented the panel pin shown in the right diagonal line hatches, and part is represented the drive IC pin shown in the left diagonal line hatches, and part is represented the intersection of panel pin and drive IC pin shown in the mesh lines shade.
First welding disk 11 of described panel pin is complementary with the size and the shape of second welding disk 21 of described drive IC pin; Corresponding first welding disk 11 in position and second welding disk 21 are bonded together, and to form pad right.Pad is to minute two rows, on arrange pad right lower limb be higher than the right coboundary of row's pad down.Particularly, to row on being positioned at, another pad is to being positioned at row down, interlaced with each other being arranged side by side at a pad of two adjacent pad centerings.
By the described structure of present embodiment, because pad is provided with being divided into two rows, compare with the pin bonding structure of existing single setting, under the constant condition of whole front panel width, can make the width of each pad be provided with widelyer, thereby make the pad coincidence area of panel pin and drive IC pin bigger, dislocation take place even pad extends owing to being heated, also can guarantee the circuit connectivity energy of pin bonding structure, therefore help improving yields.
Below data specify and adopt the technique effect that the embodiment of the invention reached by experiment.
Shown in Fig. 4 A, be the size marking figure of the described panel pin of present embodiment; Shown in Fig. 4 B, be the size marking figure of the described drive IC pin of present embodiment; Shown in Fig. 4 C, the size marking figure when dislocation taking place for the described pin bonding structure of present embodiment.As shown in table 1, for the X of the welding disk that will have panel pin and drive IC pin now increases by 2 times to width, the comparing data of Y behind contraction in length 43%.
Table 1
From above-mentioned data as can be seen, after the described structure of employing present embodiment, when dislocation took place, the coincidence area of welding disk had increased by 54% than prior art.In addition; show also that by experiment when dislocation took place, the coincidence area of welding disk was than the every increase by 0.10% of prior art; the bad incidence that misplaces then can reduce to 0.15%, correspondingly also can reduce to 0.5% because of adjusting the bad equipment downtime rate that causes of dislocation.
Embodiment 2
Present embodiment by changing the relative position relation of leading part and welding disk, provides multiple pin bonding structure on the basis of embodiment 1.
In the structure shown in Fig. 5 A, one of two adjacent pad centerings is positioned at upper left row, and another is positioned at bottom right row.Wherein, be positioned at upper left row's pad centering, first leading part 121 of panel pin is positioned at the left side of its first welding disk 111; Second leading part 221 of drive IC pin is positioned at the left side of its second welding disk 211.Be positioned at bottom right row's pad centering, first leading part 122 of panel pin is positioned at the right side of its first welding disk 112; Second leading part 222 of drive IC pin is positioned at the middle part of its second welding disk 212.
In the structure shown in Fig. 5 B, one of two adjacent pad centerings is positioned at lower-left row, and another is positioned at upper right row.Wherein, be positioned at lower-left row's pad centering, panel pin first leading part 123 is positioned at the left side of its first welding disk 113; Second leading part 223 of drive IC pin is positioned at the middle part of its second welding disk 213.Be positioned at upper right row's pad centering, first leading part 124 of panel pin is positioned at the right side of its first welding disk 114; Second leading part 224 of drive IC pin is positioned at the right side of its second welding disk 214.
In the structure shown in Fig. 5 C, one of two adjacent pad centerings is positioned at upper left row, and another is positioned at bottom right row.Wherein, be positioned at upper left row's pad centering, panel pin first leading part 125 is positioned at the right side of its first welding disk 115; Second leading part 225 of drive IC pin is positioned at the left side of its second welding disk 215.Be positioned at bottom right row's pad centering, first leading part 126 of panel pin is positioned at the right side of its first welding disk 116; Second leading part 226 of drive IC pin is positioned at the middle part of its second welding disk 216.
Need to illustrate, above-mentioned three kinds of structures are explanation as an example only herein, and other situations of the relative position relation of leading part and welding disk can be carried out accommodation according to the needs of the spacing of adjacent legs portion.
By the described structure of present embodiment, make the spacing of adjacent legs portion obtain adjusting by the relative position relation that changes leading part and welding disk, with the panel construction that adapts to various models and the cabling requirement of drive IC.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (6)
1, a kind of pin bonding structure is characterized in that comprising panel pin and drive IC pin; The size and the shape of first welding disk of described panel pin and second welding disk of described drive IC pin are complementary; First welding disk of corresponding panel pin and second welding disk of drive IC pin are bonded together, and to form pad right; Described pad is to minute two rows, on arrange pad right lower limb be higher than the right coboundary of row's pad down.
2, pin bonding structure according to claim 1, a pad that it is characterized in that two adjacent described pad centerings is to being positioned at row, and another pad is to being positioned at row down.
3, pin bonding structure according to claim 2 is characterized in that of two adjacent described pad centerings is positioned at lower-left row, and another is positioned at upper right row.
4, pin bonding structure according to claim 2 is characterized in that of two adjacent described pad centerings is positioned at upper left row, and another is positioned at bottom right row.
5,, it is characterized in that first leading part of described panel pin is positioned at the left side of described first welding disk, right side or middle part according to the arbitrary described pin bonding structure of claim 1-4.
6,, it is characterized in that second leading part of described drive IC pin is positioned at the left side of described second welding disk, right side or middle part according to the arbitrary described pin bonding structure of claim 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810101458 CN101526676A (en) | 2008-03-06 | 2008-03-06 | Pin bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810101458 CN101526676A (en) | 2008-03-06 | 2008-03-06 | Pin bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101526676A true CN101526676A (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810101458 Pending CN101526676A (en) | 2008-03-06 | 2008-03-06 | Pin bonding structure |
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| CN (1) | CN101526676A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| WO2015180301A1 (en) * | 2014-05-29 | 2015-12-03 | 京东方科技集团股份有限公司 | Array substrate and display device |
| CN108133665A (en) * | 2017-12-18 | 2018-06-08 | 武汉华星光电半导体显示技术有限公司 | Panel display apparatus structure |
| CN109521587A (en) * | 2014-07-08 | 2019-03-26 | 群创光电股份有限公司 | Board structure |
| CN113330561A (en) * | 2019-05-23 | 2021-08-31 | 深圳市柔宇科技股份有限公司 | Pin structure and flexible panel |
-
2008
- 2008-03-06 CN CN 200810101458 patent/CN101526676A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| WO2013033935A1 (en) * | 2011-09-09 | 2013-03-14 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| WO2013053153A1 (en) * | 2011-10-12 | 2013-04-18 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| US20130093990A1 (en) * | 2011-10-12 | 2013-04-18 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display module and a liquid crystal display panel |
| WO2015180301A1 (en) * | 2014-05-29 | 2015-12-03 | 京东方科技集团股份有限公司 | Array substrate and display device |
| US9349755B2 (en) | 2014-05-29 | 2016-05-24 | Boe Technology Group Co., Ltd. | Array substrate and display device |
| CN109521587A (en) * | 2014-07-08 | 2019-03-26 | 群创光电股份有限公司 | Board structure |
| CN108133665A (en) * | 2017-12-18 | 2018-06-08 | 武汉华星光电半导体显示技术有限公司 | Panel display apparatus structure |
| CN113330561A (en) * | 2019-05-23 | 2021-08-31 | 深圳市柔宇科技股份有限公司 | Pin structure and flexible panel |
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Application publication date: 20090909 |