CN105228365B - The bilateral method that is located by connecting of bilateral positioning splicing band and material strip - Google Patents

The bilateral method that is located by connecting of bilateral positioning splicing band and material strip Download PDF

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Publication number
CN105228365B
CN105228365B CN201410250068.5A CN201410250068A CN105228365B CN 105228365 B CN105228365 B CN 105228365B CN 201410250068 A CN201410250068 A CN 201410250068A CN 105228365 B CN105228365 B CN 105228365B
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CN
China
Prior art keywords
positioning
stick
separate paper
adhesive tape
bilateral
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201410250068.5A
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Chinese (zh)
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CN105228365A (en
Inventor
周宝范
练群
田�健
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Shenzhen KHJ Technology Co Ltd
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Shenzhen KHJ Technology Co Ltd
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Priority to CN201410250068.5A priority Critical patent/CN105228365B/en
Priority to PCT/CN2014/079609 priority patent/WO2015184650A1/en
Publication of CN105228365A publication Critical patent/CN105228365A/en
Application granted granted Critical
Publication of CN105228365B publication Critical patent/CN105228365B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00Apparatus for splicing webs
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Replacement Of Web Rolls (AREA)

Abstract

The present invention relates to a kind of splicing band, more particularly to connection adhesive tape and the connection method of a kind of material strip for carrying electronic component, including adhesive tape (21), separate paper and the positioning stick being located on the separate paper, positioning stick includes the first positioning stick (22) and the second positioning stick (23), therebetween formed can place just material strip (31) to expect area (24), to material area (24) in and second positioning stick (23) and adhesive tape (21) between be provided with jointing tape (20);Separate paper includes the second separate paper (26) between the first separate paper (28) being arranged on the described pair of jointing tape (20) expected in area (24), and the second positioning stick (23) and jointing tape (20).It is bilateral to material strip progress to be located by connecting, to expecting to carry out position correction to material strip in area, corresponding separate paper and positioning stick are then thrown off, easily and fast, accurately can be connected material strip in another position under stick acts on.

Description

The bilateral method that is located by connecting of bilateral positioning splicing band and material strip
Technical field
It is more specifically to a kind of for the splicing band of binder band and the company of material strip the present invention relates to splicing band field Connect method.
Background technology
When being assembled to electronic product, traditional electronic component volume is generally large, assembling and using all can be by To considerable restraint, with the development of electronic technology, the device for there was only 1/tens using compressing it as volume now Part, it is achieved thereby that the high density of electronic product assembling, highly reliable, miniaturization, low cost, and the automation of production.Accordingly , the automatic pasting technique for installing electronic component has been widely used.In automatic pasting technique, electronic component is preset Position is cheated in the element of material strip, is fixed with plastic film, automatic placement machine is sent into by tape feed roller when electronic component material strip and sent When glassware carries out paster installation, for automatic placement machine gradually by plastic film breakdown, it is appropriate on circuit board that electronic component is attached to Position.
After material strip is sent into automatic placement machine, it will make due to the limited length of material strip in itself, therefore in one section of material strip , it is necessary to be docked untapped material strip with the material strip used soon using splicing band when being finished, can so avoid because of material Strip length is limited to cause automatic placement machine to be shut down, the problem of so as to cause production efficiency to reduce.
Traditional splicing band is to use unilateral positioning, and as shown in Figure 1 and Figure 2, it is that one layer of covering is anti-sticking on adhesive tape 1 Paper 3, it is provided with a side of separate paper and is used to correct the positioning stick 2 for making two material strip alignments to be connected, gone back on adhesive tape 1 Provided with positioning and guiding mark 4, when in use, the end of two material strips to be bonded is docked against positioning stick 2, afterwards will be anti-sticking Edge of the paper 3 along positioning side is thrown off, and it is bonded on material strip adhesive tape turnover, will finally be positioned side and adhesive tape is common Throw off, complete bonding process, for the adhesive tape of this unilateral positioning, although it is more whole to be bonded to a certain extent material strip Together, but when in use, start to be bonded, it is necessary to which positioning stick is thrown off after using positioning stick, two material strips are alignd, this Since sample, when material strip is pressed against on adhesive tape, two material strips are easy to loosen, and can still cause material strip docking irregular The problem of, moreover, the positioning stick 2 of unilateral locating adhesive tape does not allow easily openable yet, use very inconvenient.
The content of the invention
In order to solve the above-mentioned technical problem, the present invention provides a kind of more preferable and easy to use bilateral positioning of locating effect and connect The bilateral method that is located by connecting of material strip and material strip.
The present invention is that technical scheme is used by solving above-mentioned technical problem:Bilateral positioning splicing band, including transparent adhesive tape Band, the separate paper overlayed on the adhesive tape and the positioning stick being located on the separate paper, described positioning stick bag Include be arranged in parallel first positioning stick and second positioning stick, therebetween formed can place just material strip to expect area, It is described to material area in, and it is described second positioning stick and the adhesive tape between be provided with jointing tape;Described is anti- Sticky paper include be arranged on described pair material area in the jointing tape on the first separate paper, and it is described second positioning stick with The second separate paper between the jointing tape.
For above-mentioned bilateral positioning splicing band, the first positioning stick is bonded on described adhesive tape so that Adhesive tape can also be peeled while the first positioning stick is thrown off.
For above-mentioned bilateral positioning splicing band, the bonding force between the second positioning stick and second separate paper More than second separate paper and the adhesive tape and the bonding force between the jointing tape so that throwing off second During separate paper, the second positioning stick can be peeled from adhesive tape together simultaneously.
For above-mentioned bilateral positioning splicing band, the second described separate paper extends described adhesive tape, be easy to by Second separate paper is opened from adhesive tape.
Moreover, also the 3rd separate paper can be set between the first positioning stick and adhesive tape.
For above-mentioned bilateral positioning splicing band, feed strip is provided with reference to positioning on the first described positioning stick Positioning pit, when in use, material strip is provided with the side of positioning hole at the first locating piece during for using, moreover, fixed first The position line of the end part aligning for making two material strips to be bonded is additionally provided with the stick of position.
For above-mentioned bilateral positioning splicing band, described jointing tape is the adhesive tape with colored stripes, as Optimal selection, using black belt, it is easy to machine recognition.
The connection method of bilateral positioning is carried out to material strip using above-mentioned bilateral positioning splicing band, is comprised the following steps,
S1, bilateral positioning splicing band is thrown off to the first separate paper in material area, two material strips head and the tail to be connected are alignd It is put into expecting on the jointing tape in area, and makes material strip that there is the side of positioning hole close to the first positioning stick, material strip is pressed To on the jointing tape in material area;
S2, the second separate paper for throwing off bilateral positioning splicing band, while the second positioning stick departs from the second separate paper, will Side turnover of the exposed part of adhesive tape along material strip so that the jointing tape between the second separate paper and adhesive tape It is bonded on material strip;
S3, by first positioning stick thrown off jointly together with adhesive tape, jointing tape is stayed on material strip, that is, complete be bonded Journey.
For the above-mentioned connection method for carrying out bilateral positioning to material strip using above-mentioned bilateral positioning splicing band, when positioned at When jointing tape between second separate paper and adhesive tape is wider, is continued turnover and be bonded on material strip.
Had the advantages that, positioned using the bilateral method of being located by connecting of the bilateral positioning splicing band of the present invention and material strip Accurately, it is easy to use, because bilateral positioning splicing band provided by the invention is using the first positioning stick and second be arrangeding in parallel Position stick, and make region therebetween formed place material strip to expecting area, compared with traditional unilateral locating adhesive tape, make Two material strips to be connected conveniently directly can be placed on in material area, having good locating effect by the used time, be used Bilateral positioning splicing band in the present invention when in use, throw off by the first separate paper at Xian Jiangduiliao areas, by two material strip head and the tail Alignment is put on the jointing tape in material area, throwing off the second separate paper afterwards, and the jointing tape turnover that it is covered adheres to On material strip, finally the first positioning side is torn jointly with adhesive tape, you can complete bonding process, the present invention can avoid tradition Unilateral locating adhesive tape throw off positioning side after cause material strip to dock irregular problem, be additionally, since using bilateral positioning and Unilateral positioning formula bonding so that the bonding process of material strip becomes to be more prone to, and efficiency is greatly improved, and expects simultaneously The adhesive effect of band has also obtained great lifting.
Brief description of the drawings
Fig. 1 is the front view of traditional unilateral positioning splicing band;
Fig. 2 is the cross-sectional view of traditional unilateral positioning splicing band;
Fig. 3 is the front view of the first embodiment of the bilateral positioning splicing band of the present invention;
Fig. 4 is the cross-sectional view of the first embodiment of the bilateral positioning splicing band of the present invention;
Fig. 5 is that the present invention uses the bilateral positioning splicing band in the first embodiment to carry out bilateral be located by connecting to material strip One of journey schematic diagram;
Fig. 6 is that the present invention uses the bilateral positioning splicing band in the first embodiment to carry out bilateral be located by connecting to material strip The two of journey schematic diagram;
Fig. 7 is that the present invention uses the bilateral positioning splicing band in the first embodiment to carry out bilateral be located by connecting to material strip The three of journey schematic diagram;
Fig. 8 is that the present invention uses the bilateral positioning splicing band in the first embodiment to carry out bilateral be located by connecting to material strip The four of journey schematic diagram;
Fig. 9 is the front view of second of embodiment of the bilateral positioning splicing band of the present invention;
Figure 10 is the cross-sectional view of second of embodiment of the bilateral positioning splicing band of the present invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention In accompanying drawing, the technical scheme in the embodiment of the present invention is explicitly described, it is clear that described embodiment be the present invention Part of the embodiment, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having The every other embodiment obtained under the premise of creative work is made, belongs to the scope of protection of the invention.
As shown in Figure 1 and Figure 2, the unilateral locating adhesive tape of bonding material band, including adhesive tape 1 are traditionally used for, in the overlying of adhesive tape 1 One layer of separate paper 3 of lid, positioning stick 2 is provided with the side of adhesive tape 1, and positioning stick 2 is attached to one with its separate paper 3 covered Rise, and separate paper 3 has one of folding line on the interior survey side of positioning stick 2, will can be positioned simultaneously when being easy to take off positioning stick 2 The part separate paper that stick 2 is covered with is opened, and is easy to use the adhesive tape at this position to be bonded.
The first embodiment of the present invention as shown in Figure 3, Figure 4, bilateral positioning splicing band, including adhesive tape 21, saturating Gelatin band 21 is provided with two positioning sticks being parallel to each other, i.e., the first positioning stick 22 and second positions stick 23, and first is fixed The interval region that position stick 22 and second is positioned between stick 23 is formed to expecting area 24, and jointing tape is provided with material area 24 20, to expecting to be provided with the first separate paper 28 on the jointing tape 20 in area 24, when in use, material area 24 is used to accommodate to wait to be bonded Material strip 31, make two to be aligned with material strip to be bonded in material area 24, therefore the width of its width and material strip is adapted, and makes material strip 31 can put into in material area 24 just.
First positioning stick 22 bonds together with adhesive tape 21 so that energy while the first positioning stick 22 is thrown off It is enough to throw off adhesive tape 21.
Jointing tape 20 is again provided between the second positioning stick 23 and adhesive tape 21, and stick is positioned second The second separate paper 26 is additionally provided between 23 and jointing tape 20, the second positioning stick 23 is bonded on the second separate paper 26, it is necessary to note Meaning, will make the bonding force between the second positioning stick 23 and the second separate paper 26 be more than the second separate paper 26 and jointing tape Bonding force between 20, it is easy to the second separate paper 26 can be thrown off while the second positioning stick 23 is thrown off.
In the first embodiment, positioned to material area 24 in jointing tape 20 and positioned at the second separate paper 26 and transparent adhesive tape It is and the jointing tape between the second separate paper 26 and adhesive tape 21 in sunder with the jointing tape 20 between 21 20 width is less than the width equal to material strip 31, is easy to be rapidly completed bonding process.
Multiple positioning pits 222 identified as positioning are provided with the first positioning stick 22, when in use, for by material strip 31 side with positioning hole 311 avoids two material strip sides of appearance in bonding from not corresponding to against the first positioning stick 22 Situation;Jointing tape 20 uses colorful adhesive tape, can use the adhesive tape with stripeds such as black or red, for automatic patch Piece machine testing, it is set to learn that the connection end between material strip enters machine, moreover, being additionally provided with positioning on the first positioning stick 22 Line 223, when in use, this position line is can refer to, two material strips to be bonded are put into expecting in area 24, and make its end fixed Alignd at bit line 223.
Second separate paper 26 will extend adhesive tape 21, so be easy to it from adhesive tape 21 and jointing tape 20 On peel.
Using the bilateral positioning splicing band in the first embodiment to the bilateral method being located by connecting of material strip progress, including with Lower step:
S1, bilateral positioning splicing band is thrown off to the first separate paper 28 in material area 24, by two material strips head and the tail to be connected Alignment is put on the jointing tape 20 in material area 24, making material strip 31 have the side of positioning hole 311 close to the first positioning stick 22, and cause two material strips end align at position line 223, by material strip tightly press to expect area 24 in, such as Fig. 5 institutes Show;
S2, the second separate paper 26 for throwing off bilateral positioning splicing band, while the second positioning stick 23 is with the second separate paper 26 Depart from, side of the exposed part of adhesive tape 21 along material strip 31 is turned down so that positioned at the second separate paper 26 and adhesive tape Jointing tape 20 between 21 is bonded on material strip, as shown in Figure 6;
S3, by first positioning stick 22 thrown off jointly together with adhesive tape 21, jointing tape 20 is stayed on material strip 31, such as scheme 7th, shown in Fig. 8, bonding process is completed.
Second of embodiment of the present invention as shown in Figure 9, Figure 10, bilateral positioning splicing band, including adhesive tape 21, saturating Gelatin band 21 is provided with two positioning sticks being parallel to each other, i.e., the first positioning stick 22 and second positions stick 23, and first is fixed The interval region that position stick 22 and second is positioned between stick 23 is formed to expecting area 24, and jointing tape is provided with material area 24 20, to expecting to be provided with the first separate paper 28 on the jointing tape 20 in area 24, when in use, material area 24 is used to accommodate to wait to be bonded Material strip 31, make two to be aligned with material strip to be bonded in material area 24, therefore the width of its width and material strip is adapted, and makes material strip 31 can put into in material area 24 just;First positioning stick 22 bonds together with adhesive tape 21 so that is throwing off first Adhesive tape 21 can be thrown off while positioning stick 22.
Jointing tape 20 is again provided between the second positioning stick 23 and adhesive tape 21, and stick is positioned second The second separate paper 26 is additionally provided between 23 and jointing tape 20, the second positioning stick 23 is bonded on the second separate paper 26, it is necessary to note Meaning, will make the bonding force between the second positioning stick 23 and the second separate paper 26 be more than the second separate paper 26 and jointing tape Bonding force between 20, it is easy to the second separate paper 26 can be thrown off while the second positioning stick 23 is thrown off.
The difference of second of embodiment and the first embodiment is, positioned to expecting the He of jointing tape 20 in area 24 Jointing tape 20 between the second separate paper 26 and adhesive tape 21 connects together, and is located at the second separate paper 26 The width scientific research of jointing tape 20 between adhesive tape 21 be more than material strip 31 width, so since in use, Jointing tape 20 between the second separate paper 26 and adhesive tape 21 needs to turn over again beyond the part of the width of material strip 31 Folding, it is bonded in the another side of material strip 31.
Likewise, being provided with multiple positioning pits 222 as positioning mark on the first positioning stick 22, when in use, use In the side with positioning hole 311 of material strip 31 is positioned into stick 22 against first, avoid two material strip sides occur in bonding The not corresponding situation in side;Jointing tape 20 uses colorful adhesive tape, can use the adhesive tape with stripeds such as black or red, be used for Automatic chip mounting machine testing is given, it is learnt that the connection end between material strip enters machine.
Likewise, in second of embodiment, the second separate paper 26 will also extend adhesive tape 21, so be easy to it Peeled from adhesive tape 21 and jointing tape 20.
Using the bilateral positioning splicing band in second of embodiment to the bilateral method being located by connecting of material strip progress, including with Lower step:
S1, bilateral positioning splicing band is thrown off to the first separate paper 28 in material area 24, by two material strips head and the tail to be connected Alignment is put on the jointing tape 20 in material area 24, making material strip 31 have the side of positioning hole 311 close to the first positioning stick 22, and the end of two material strips to be bonded is alignd at position line, hereafter the pressing in material area 24 tightly by material strip can Referring to shown in Fig. 5 in the first embodiment;
S2, the second separate paper 26 for throwing off bilateral positioning splicing band, while the second positioning stick 23 is with the second separate paper 26 Depart from, side of the exposed part of adhesive tape 21 along material strip 31 is turned down so that positioned at the second separate paper 26 and adhesive tape Jointing tape 20 between 21 is bonded on material strip, and this process is with reference to shown in figure 6;
S3, by first positioning stick 22 thrown off jointly together with adhesive tape 21, jointing tape 20 is stayed on material strip 31, if position Jointing tape 20 between the second separate paper 26 and adhesive tape 21 exceeds the width of material strip 31, then will exceed material strip money speed portion Point, i.e., the another side that the part turnover that jointing tape 20 is not bonded is bonded at material strip 31 can complete bonding process.
In the present invention, as shown in figure 8, after the completion of bonding process, if jointing tape is provided with band color stripe, such as scheme In blackstreak, the striped can cover positioning hole 311 in bonding process, but positioning hole 311 can also be made exposed, This does not have too big influence.
The embodiment of the present invention is explained in detail above in conjunction with accompanying drawing, but invention is not limited to above-mentioned reality Mode is applied, in those skilled in the art's possessed knowledge, can also be made on the premise of present inventive concept is not departed from Go out various change.

Claims (9)

1. bilateral positioning splicing band, including adhesive tape (21), the separate paper that overlays on the adhesive tape (21) and it is located at Positioning stick on the separate paper, it is characterised in that:Described positioning stick includes the first positioning stick be arrangeding in parallel (22) and second positioning stick (23), therebetween formed can place just material strip (31) to expect area (24), described It is interior to material area (24), and it is provided with jointing tape (20) between the second positioning stick (23) and the adhesive tape (21); Described separate paper includes the first separate paper (28) being arranged on the described pair of jointing tape (20) expected in area (24), with And the second separate paper (26) between the second positioning stick (23) and the jointing tape (20).
2. bilateral positioning splicing band according to claim 1, it is characterised in that:The first positioning stick (22) is bonded in On described adhesive tape (21).
3. bilateral positioning splicing band according to claim 2, it is characterised in that:The second positioning stick and described second Bonding force between separate paper (26) be more than second separate paper (26) with the adhesive tape (21) and with it is described bonding Bonding force between adhesive tape (20).
4. bilateral positioning splicing band according to claim 3, it is characterised in that:Described the second separate paper (26) extends Described adhesive tape (21).
5. bilateral positioning splicing band according to claim 1, it is characterised in that:Described first positioning stick (22) with The 3rd separate paper is additionally provided between described adhesive tape (21).
6. bilateral positioning splicing band according to claim 1, it is characterised in that:On the first described positioning stick (22) Positioning pit (222) provided with feed strip with reference to positioning.
7. the bilateral positioning splicing band according to right wants 1, it is characterised in that:On the first described positioning stick (22) also Provided with the position line (223) for causing two material strips to be bonded to align.
8. the bilateral positioning splicing band according to any one of claim 1-7, it is characterised in that:Described jointing tape (20) it is the adhesive tape with colored stripes.
9. the bilateral positioning splicing band described in usage right requirement 1 carries out the connection method of bilateral positioning to material strip, its feature exists In:Comprise the following steps,
S1, bilateral positioning splicing band is thrown off to the first separate paper (28) in material area (24), by two material strips head and the tail to be connected Alignment is put on the jointing tape (20) in material area (24), and material strip (31) is had the side of positioning hole (311) close to the One positioning stick (22), material strip is pressed on the jointing tape (20) in material area (24);
S2, the second separate paper (26) for throwing off bilateral positioning splicing band, while the second positioning stick (23) is with the second separate paper (26) depart from, side of the exposed part of adhesive tape (21) along material strip (31) is turned down so that positioned at the second separate paper (26) Jointing tape (20) between adhesive tape (21) is bonded on material strip;
S3, the first positioning stick (22) to be thrown off together with adhesive tape (21) jointly, jointing tape (20) is stayed on material strip (31), Complete bonding process.
CN201410250068.5A 2014-06-06 2014-06-06 The bilateral method that is located by connecting of bilateral positioning splicing band and material strip Active CN105228365B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201410250068.5A CN105228365B (en) 2014-06-06 2014-06-06 The bilateral method that is located by connecting of bilateral positioning splicing band and material strip
PCT/CN2014/079609 WO2015184650A1 (en) 2014-06-06 2014-06-10 Double-sided positioning splice tape and double-sided positioning connection method for tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410250068.5A CN105228365B (en) 2014-06-06 2014-06-06 The bilateral method that is located by connecting of bilateral positioning splicing band and material strip

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CN105228365A CN105228365A (en) 2016-01-06
CN105228365B true CN105228365B (en) 2018-02-09

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WO (1) WO2015184650A1 (en)

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CN109762476B (en) * 2019-02-02 2023-09-19 广州视源电子科技股份有限公司 Plate edge wrapping mechanism and plate edge wrapping method
CN109969767A (en) * 2019-02-20 2019-07-05 上海燎熠智能设备有限公司 A kind of metal material belt Double-side feeding cutter pusher mould group
CN114126396A (en) * 2020-08-26 2022-03-01 金东奭 Connecting clamp adhesive tape
CN112645134A (en) * 2020-12-10 2021-04-13 苏州沸迩灵精密制造有限公司 Manual material receiving machine convenient to move
CN112888299B (en) * 2021-01-14 2022-07-19 雅达电子(罗定)有限公司 SMT line side bin material receiving reminding method

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CN105228365A (en) 2016-01-06

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