CN206251438U - A kind of fingerprint identification device based on FPC - Google Patents

A kind of fingerprint identification device based on FPC Download PDF

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Publication number
CN206251438U
CN206251438U CN201621337600.8U CN201621337600U CN206251438U CN 206251438 U CN206251438 U CN 206251438U CN 201621337600 U CN201621337600 U CN 201621337600U CN 206251438 U CN206251438 U CN 206251438U
Authority
CN
China
Prior art keywords
hole
fpc
cover layer
identification device
fingerprint recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621337600.8U
Other languages
Chinese (zh)
Inventor
王家宏
王军
张江惠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yangzhou Huameng Electronics Co Ltd
Original Assignee
Yangzhou Huameng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yangzhou Huameng Electronics Co Ltd filed Critical Yangzhou Huameng Electronics Co Ltd
Priority to CN201621337600.8U priority Critical patent/CN206251438U/en
Application granted granted Critical
Publication of CN206251438U publication Critical patent/CN206251438U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of fingerprint identification device based on FPC, including FPC and fingerprint recognition chip, FPC includes the first cover layer, second cover layer, first conductive layer, basic unit, second conductive layer and the 3rd cover layer, there is welding region on first conductive layer, the fingerprint recognition chip is welded in the welding region, first cover layer has the first through hole of rectangle, second cover layer has the second through hole of rectangle, the first through hole and the second through hole are arranged such that first, one is formed between two cover layers and encloses stage portion, the FPC also includes through hole;There is adhesive glue in the first through hole and the second through hole.Fingerprint identification device fingerprint recognition chip of the present utility model and FPC fixing-stable.

Description

A kind of fingerprint identification device based on FPC
Technical field
The utility model is related to FPC field, and in particular to a kind of fingerprint recognition dress based on FPC Put.
Background technology
Fingerprint recognition has been widely used for every field at present, such as on the electronic product such as mobile phone, computer, and with Requirement more and more higher to miniaturization of electronic products, starting to coordinate FPC with fingerprint recognition chip in the prior art makes With, fingerprint recognition chip is welded on FPC, recycle adhesive glue to add fingerprint recognition chip and FPC It is strong fixed, but existing construction bonds glue is difficult to apply sometimes.
Utility model content
Utility model purpose:The utility model is intended to overcome the defect of prior art, there is provided one kind is based on FPC Fingerprint identification device.
Technical scheme:A kind of fingerprint identification device based on FPC, including FPC and fingerprint recognition core Piece, the FPC includes the first cover layer, the second cover layer, the first conductive layer, basic unit, the successively from top to bottom Two conductive layers and the 3rd cover layer, the fingerprint recognition chip welding region with rectangle, the finger on first conductive layer Line identification chip is welded in the welding region, and first cover layer has the first through hole of rectangle, second covering There is film the second through hole of rectangle, the first through hole and the second through hole to be formed between being arranged such that first and second cover layer One circle stage portion, the fingerprint recognition chip is located in second through hole, and the FPC also includes through hole, described The upper surface of the conductive layer of through hole insertion first and the lower surface of the 3rd cover layer, the upper end open of the through hole are located at institute State between the edge of fingerprint recognition chip and the second through hole;There is adhesive glue in the first through hole and the second through hole.
Further, the through hole has 4.
Further, each side of welding region has 1 through hole.
Further, first conductive layer and the second conductive layer are Copper Foil.
Further, the basic unit is polyimides basic unit.
Further, the area of the first through hole connects more than the face of the second through hole.
Further, the first through hole and the second through hole can not be rectangular through-hole, but manhole, first through hole With the radius that the radius of the axis collinear of the second through hole, and first through hole is more than the second through hole.Such setting is more beneficial for gluing Gum deposit enters the second through hole by through hole, enters back into first through hole.
Beneficial effect:Fingerprint identification device based on FPC of the present utility model, bonds glue and is easier to apply, and It is not in the situation of bubbles in excessive glue and glue.
Brief description of the drawings
Fig. 1 is the schematic cross-section of fingerprint identification device;
Fig. 2 is fingerprint identification device top view.
Specific embodiment
Reference:1 first cover layer;2 second cover layers;3 first conductive layers;4 basic units;5 second conductive layers;6 3rd cover layer;11 through holes;12 adhesive glues.
A kind of fingerprint identification device based on FPC, including FPC and fingerprint recognition chip 10, it is described FPC includes the first cover layer 1, the second cover layer 2, the first conductive layer 3, basic unit 4, second successively from top to bottom The cover layer 6 of conductive layer 5 and the 3rd, the fingerprint recognition chip welding region with rectangle, the finger on first conductive layer 1 Line identification chip is welded in the welding region, and first cover layer has the first through hole of rectangle, second covering There is film the second through hole of rectangle, the first through hole and the second through hole to be formed between being arranged such that first and second cover layer One circle stage portion, the fingerprint recognition chip is located in second through hole, and the FPC also includes through hole 11, institute State the upper surface of the first conductive layer of insertion 3 of through hole 11 and the lower surface of the 3rd cover layer 6, the upper end open of the through hole Between the fingerprint recognition chip and the edge of the second through hole;There is adhesive glue in the first through hole and the second through hole. The through hole has 4.Each side of welding region has 1 through hole, i.e., 4 through holes are located at fingerprint recognition respectively Four sides of chip.First conductive layer and the second conductive layer are Copper Foil.The basic unit is polyimides basic unit.
As shown in Figure 1, 2, when FPC of the present utility model makes, fingerprint recognition chip is welded on first conductive In the welding region of layer, so as to realize the electrical connection of fingerprint recognition chip and FPC, afterwards from flexible circuitry back The opening of through hole the second through hole is introduced into by through hole to adhesive glue, adhesive glue is injected in first and second through hole, full of First through hole is entered back into after two through holes, due to the presence of a circle stage portion, adhesive glue is more easily led to full of whole first and second Hole, fingerprint recognition chip steadily is fixed in welding region, and is not in the situation that glue overflows, and due to viscous Gum deposit enters back into first through hole from through hole into the second through hole, can effectively prevent bubble from entering in adhesive glue.
Although the utility model is illustrated and described with regard to preferred embodiment, those skilled in the art should manage Solution, without departing from claim limited range of the present utility model, the utility model can be carried out various change and Modification.

Claims (5)

1. a kind of fingerprint identification device based on FPC, it is characterised in that including FPC and fingerprint recognition core Piece, the FPC includes the first cover layer, the second cover layer, the first conductive layer, basic unit, the successively from top to bottom Two conductive layers and the 3rd cover layer, the fingerprint recognition chip welding region with rectangle, the finger on first conductive layer Line identification chip is welded in the welding region, and first cover layer has the first through hole of rectangle, second covering There is film the second through hole of rectangle, the first through hole and the second through hole to be formed between being arranged such that first and second cover layer One circle stage portion, the fingerprint recognition chip is located in second through hole, and the FPC also includes through hole, described The upper surface of the conductive layer of through hole insertion first and the lower surface of the 3rd cover layer, the upper end open of the through hole are located at institute State between the edge of fingerprint recognition chip and the second through hole;There is adhesive glue in the first through hole and the second through hole.
2. the fingerprint identification device based on FPC according to claim 1, it is characterised in that the through hole tool There are 4.
3. the fingerprint identification device based on FPC according to claim 2, it is characterised in that welding region it is every Individual side has 1 through hole.
4. the fingerprint identification device based on FPC according to claim 1, it is characterised in that described first is conductive Layer and the second conductive layer are Copper Foil.
5. the fingerprint identification device based on FPC according to claim 1, it is characterised in that the basic unit is poly- Acid imide basic unit.
CN201621337600.8U 2016-12-07 2016-12-07 A kind of fingerprint identification device based on FPC Expired - Fee Related CN206251438U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621337600.8U CN206251438U (en) 2016-12-07 2016-12-07 A kind of fingerprint identification device based on FPC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621337600.8U CN206251438U (en) 2016-12-07 2016-12-07 A kind of fingerprint identification device based on FPC

Publications (1)

Publication Number Publication Date
CN206251438U true CN206251438U (en) 2017-06-13

Family

ID=59004180

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621337600.8U Expired - Fee Related CN206251438U (en) 2016-12-07 2016-12-07 A kind of fingerprint identification device based on FPC

Country Status (1)

Country Link
CN (1) CN206251438U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108391368A (en) * 2018-03-06 2018-08-10 东莞森玛仕格里菲电路有限公司 One kind burying copper billet board manufacturing method
WO2020182089A1 (en) * 2019-03-08 2020-09-17 Oppo广东移动通信有限公司 Electronic device
WO2021114266A1 (en) * 2019-12-13 2021-06-17 南昌欧菲生物识别技术有限公司 Fingerprint module and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108391368A (en) * 2018-03-06 2018-08-10 东莞森玛仕格里菲电路有限公司 One kind burying copper billet board manufacturing method
WO2020182089A1 (en) * 2019-03-08 2020-09-17 Oppo广东移动通信有限公司 Electronic device
WO2021114266A1 (en) * 2019-12-13 2021-06-17 南昌欧菲生物识别技术有限公司 Fingerprint module and electronic device

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170613

Termination date: 20211207

CF01 Termination of patent right due to non-payment of annual fee