CN105182575A - Thinning method of display panel - Google Patents
Thinning method of display panel Download PDFInfo
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- CN105182575A CN105182575A CN201510667121.6A CN201510667121A CN105182575A CN 105182575 A CN105182575 A CN 105182575A CN 201510667121 A CN201510667121 A CN 201510667121A CN 105182575 A CN105182575 A CN 105182575A
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- substrate
- internal
- outermost layer
- cascade
- bonding land
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
Abstract
The invention discloses a thinning method of a display panel. The thinning method comprises the following steps: providing a first laminating substrate and a second laminating substrate, wherein the first laminating substrate is provided with a first connecting zone used for connecting the first laminating substrate, and the second laminating substrate is provided with a second connecting zone used for connecting the second laminating substrate; forming display elements on the first laminating substrate and the second laminating substrate; oppositely arranging and gluing the first laminating substrate and the second laminating substrate; cutting off the first connecting zone and the second connecting zone, so as to separate a first inner substrate from a first outer substrate of the first laminating substrate, and separate a second inner substrate from a second outer substrate of the second laminating substrate; remaining the first inner substrate and the second inner substrate which are mutually glued, and the display elements clamped between the first inner substrate and the second inner substrate, so as to form the display panel.
Description
Technical field
The present invention relates to the manufacture method of display panel, particularly relate to a kind of method of thinning display panel.
Background technology
In recent years, the development and progression along with science and technology and the demand in response to market, the manufacturing process of display device except except large-sized future development, also simultaneously towards the future development of lightweight and slimming.Affect the substrate of Chief for adopting in display panel of final finished thickness in a display device.Therefore, in the manufacturing technology of display device, can pass through the substrate attenuation in display panel, to obtain frivolous display device.
Specifically, in the display panel manufacture process of conventional display device, after completing liquid crystal to become the step of box, the two substrates up and down of display panel can be carried out slimming step.Described slimming step realizes by adopting physical property or method chemically.Traditional physical property thinning technique is by the substrate of display panel is carried out mechanical lapping, and so that substrate is ground to desired thickness, but described Ginding process can cause the rough surface of substrate and reduce the penetrability of display panel.Further, in the process of grinding, easily there is the problem of substrate breakage.Secondly, traditional chemically thinning technique utilizes hydrofluorite (HF) solution to be etched by the substrate of display panel.But the method need use the man-hour of a large amount of high concentration of hydrofluoric acid solution and at substantial, cause the production cost of product improve and the production cycle longer.Moreover, because hydrofluorite is a kind of chemical liquid of severe corrosive, therefore there is the risk that human body is worked the mischief.
In view of this, a kind of method proposing thinning display panel is necessary, to solve the problem existing for prior art.
Summary of the invention
For solving the problem of above-mentioned prior art, fundamental purpose of the present invention is the thinning method providing a kind of display panel, by multi-piece substrate is stacked and be bonded together to form a multilayer board.And adopt described multilayer board as the upper and lower base plate of display panel, then, after completing liquid crystal to become the step of box, the joint of described multilayer board is excised, to make described multi-piece substrate be separated, and then obtain the display panel with thin base.
To achieve these goals, the thinning method that the invention provides a kind of display panel comprises: provide a first cascade substrate and a second layer laminated substrate, described first cascade substrate has the first bonding land that described first cascade substrate is engaged, and described second layer laminated substrate has the second bonding land that described second layer laminated substrate is engaged; Described first cascade substrate and described second layer laminated substrate form display element; Described first cascade substrate and described second layer laminated substrate to be oppositely arranged and by described first cascade substrate and described second layer laminated substrate gluing; Excise described first bonding land of described first cascade substrate and described second bonding land of described second layer laminated substrate, one first internal substrate of described first cascade substrate is separated with one first outermost layer substrate, and one second internal substrate of described second layer laminated substrate is separated with one second outermost layer substrate; And remove described first outermost layer substrate of described first cascade substrate and described second outermost layer substrate of described second layer laminated substrate, with the described display element retaining described first internal substrate of mutual gluing and described second internal substrate and be sandwiched between described first internal substrate and described second internal substrate, and then form described display panel.
In the preferred embodiment of the present invention, also comprised before described display panel is provided: described first internal substrate, described first outermost layer substrate, described second internal substrate and described second outermost layer substrate are provided; By described first internal substrate and described first outermost layer substrate aligned with each other stacked and by described second internal substrate and described second outermost layer substrate aligned with each other stacked; And engage described first internal substrate stacked mutually and described first outermost layer substrate by described first bonding land, and engage described second internal substrate stacked mutually and described second outermost layer substrate, to form described first cascade substrate and described second layer laminated substrate by the second bonding land.
In the preferred embodiment of the present invention, by described second bonding land of described first bonding land in the first internal substrate described in laser scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate, make described first internal substrate and described first outermost layer substrate welding and described second internal substrate and described second outermost layer substrate welding.
In the preferred embodiment of the present invention, the whole outer peripheral edges that described laser is stacked mutually in the first internal substrate described in scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate respectively.
In the preferred embodiment of the present invention, the side that described laser is stacked mutually in the first internal substrate described in scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate respectively.
In the preferred embodiment of the present invention, also comprised before described second bonding land by described first bonding land in the first internal substrate described in laser scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate: described first internal substrate stacked mutually and described first outermost layer substrate and described second internal substrate stacked mutually and described second outermost layer substrate are heated to 400 to 600 degree Celsius.
In the preferred embodiment of the present invention, described first bonding land and described second bonding land extend internally one apart from the scope defined from one of described first cascade substrate and described second bonding land side, and wherein said distance is between 1 millimeter to 15 millimeters.
In the preferred embodiment of the present invention, there is a frame glue-line for engaging described first internal substrate and described second internal substrate between described first internal substrate of described first cascade substrate and described second internal substrate of described second layer laminated substrate.
In the preferred embodiment of the present invention, the material of described first cascade substrate and described second layer laminated substrate comprises glass or plastic cement.
In the preferred embodiment of the present invention, when described first cascade substrate and described second layer laminated substrate are oppositely arranged, described first bonding land of described first cascade substrate is also relative to described second bonding land of described second layer laminated substrate, make when excising described first bonding land of described first cascade substrate along a vertical direction, can simultaneously by the described second bonding land excision of described second layer laminated substrate.
Accompanying drawing explanation
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, be described in detail below:
Fig. 1 to Fig. 8 display is according to the schematic flow sheet of the thinning display panel of the display panel of the embodiment of the present invention.
Embodiment
The preferred embodiments of the present invention coordinate accompanying drawing and explanation to be below described in detail, different graphic in, identical element numbers represents same or analogous assembly.
Please refer to Fig. 1 to Fig. 8, its display is according to the schematic flow sheet of the thinning display panel of the embodiment of the present invention.First, as shown in Figures 1 to 4, by least two panels substrate is engaged to form multilayer board required for the present invention.Specifically, as shown in Figure 1, there is provided one first outermost layer substrate 110,1 first internal substrate 120,1 second outermost layer substrate 210 and one second internal substrate 220, the material of wherein said first outermost layer substrate 110, described first internal substrate 120, described second outermost layer substrate 210 and described second internal substrate 220 comprises glass or plastic cement.Then as shown in Figure 2, by described first outermost layer substrate 110 and described first internal substrate 120 aligned with each other and stacked, and by described second outermost layer substrate 210 and described second internal substrate 220 aligned with each other and stacked.Then, as shown in the side view of Fig. 2 and the top view of Fig. 3, the overlapping being positioned at outer side edges by laser 20 in described first outermost layer substrate 110 and described first internal substrate 120 carries out scorification, makes described first outermost layer substrate 110 and described first internal substrate 120 welding.In like manner, the overlapping being positioned at outer side edges by laser 20 in described second outermost layer substrate 210 and described second internal substrate 220 carries out scorification, makes described second outermost layer substrate 210 and described second internal substrate 220 welding.As shown in Figure 4, by the scorification of described laser 20, described first outermost layer substrate 110 and described first internal substrate 120 are formed first bonding land 130 of the distance D that to extend internally from the described outer side edges of described first outermost layer substrate 110 and described first internal substrate 120, and on described second outermost layer substrate 210 and described second internal substrate 220, forms second bonding land 230 of the distance D that to extend internally from the described outer side edges of described second outermost layer substrate 210 and described second internal substrate 220.And first outermost layer substrate 110 and described first internal substrate 120 and described second outermost layer substrate 210 and described second internal substrate 220 welding described in the position of described first bonding land 130 and described second bonding land 230, and then form first cascade substrate 100 and second layer laminated substrate 200.Be understandable that, described first bonding land 130 and described second bonding land 230 only can be positioned at a wherein side or the whole outer peripheral edges as shown in Figure 3 of two substrates stacked mutually, are not limited to this.Further, in the present embodiment, the distance D of described first bonding land 130 and described second bonding land 230 is preferably between 1 millimeter to 15 millimeters.On the other hand, in the present invention, if adopt glass as the raw material of described first outermost layer substrate 110, described first internal substrate 120, described second outermost layer substrate 210 and described second internal substrate 220, due to glass substrate can be made in the process using described laser 20 to be engaged by stacked two substrates to produce thermal stress, thus cause glass substrate in successive process, have the problem of high fragment rate.Therefore, in order to solve the problem, preferably, before the step of carrying out the scorification of described laser 20, first described first outermost layer substrate 110 stacked mutually and described first internal substrate 120 and described second outermost layer substrate 210 stacked mutually and described second internal substrate 220 are heated to 400 to 600 degree Celsius.Further, these substrates 110,120,210,220 are kept the step of carrying out laser 20 welding in the event of high temperatures, afterwards these substrates 110,120,210,220 is cooled to room temperature.Should be noted that, other suitable methods can be adopted in other embodiments described first outermost layer substrate 110, described first internal substrate 120, described second outermost layer substrate 210 and described second internal substrate 220 to be engaged, such as adopt the method for gluing, be not limited to this.
As shown in Figure 5, described first cascade substrate 100 of the present invention and described second layer laminated substrate 200 is adopted to carry out multiple tracks technique to form multiple display element, then described first internal substrate 120 or described second internal substrate 220 one of them on be coated with frame glue-line 400 after described first cascade substrate 100 and described second layer laminated substrate 200 are oppositely arranged, and then described first cascade substrate 100 and described second layer laminated substrate 200 are bonded together.Then between two multilayer boards 100,200, inject liquid crystal 300 finally carry out again having sealed the step that liquid crystal becomes box.It should be noted that when described first cascade substrate 100 and described second layer laminated substrate 200 are oppositely arranged, described first bonding land 130 of described first cascade substrate 100 is also relative to described second bonding land 230 of described second layer laminated substrate 200.
As shown in Figure 6, described first bonding land 130 of described first cascade substrate 100 and described second bonding land 230 of described second layer laminated substrate 200 are excised by the tangent line L1 along a vertical direction.As above-mentioned, because described first bonding land 130 is relative to described second bonding land 230, make can described second bonding land 230 of described second layer laminated substrate 200 be excised when cutting described first bonding land 130 of described first cascade substrate 100 along described tangent line L1 simultaneously.In addition, for meeting economic benefit, generally speaking can make multiple display panel on substrate, cut by substrate more afterwards, to be separated by each display panel, and single display panel is applicable to single electronic installation simultaneously simultaneously.Specifically, as shown in Figure 5, along the tangent line L2 in described vertical direction, described first cascade substrate 100 and described second layer laminated substrate 200 are cut into multiple display panel 10 (as shown in Figure 8).
As shown in Figure 7 and Figure 8, after described first cascade substrate 100 and described second layer laminated substrate 200 are carried out cutting step, described first outermost layer substrate 110 of described first cascade substrate 100 can be made to be separated with described first internal substrate 120, and described second outermost layer substrate 210 of described second layer laminated substrate 200 is separated with described second internal substrate 220.Then, described first outermost layer substrate 110 of described first cascade substrate 100 and described second outermost layer substrate 210 of described second layer laminated substrate 200 are removed, with retain described first internal substrate 120 of mutual gluing and described second internal substrate 220 and be sandwiched in described display element between described first internal substrate 120 and described second internal substrate 220 (as described in liquid crystal 300), and then obtain the display panel 10 of slimming.
In sum, the present invention passes through multi-piece substrate is stacked and is bonded together to form a multilayer board.And adopt described multilayer board as the upper and lower base plate of display panel, then, after completing liquid crystal to become the step of box, the joint of described multilayer board is excised, to make described multi-piece substrate be separated, and then obtain the display panel with thin base.
Although be described Illustrative embodiments of the present invention, but should be appreciated that ground, the present invention is not limited to these Illustrative embodiments, within the spirit and principles in the present invention all, any amendment that those of ordinary skill in the art do, equivalent replacement, improvement etc., all should be included within right of the present invention.In addition, the use of term " ", " " etc. does not represent number quantitative limitation, but represents the reference part that there is at least one.
Claims (10)
1. a thinning method for display panel, is characterized in that, the thinning method of described display panel comprises:
There is provided a first cascade substrate and a second layer laminated substrate, described first cascade substrate has the first bonding land that described first cascade substrate is engaged, and described second layer laminated substrate has the second bonding land that described second layer laminated substrate is engaged;
Described first cascade substrate and described second layer laminated substrate form display element;
Described first cascade substrate and described second layer laminated substrate to be oppositely arranged and by described first cascade substrate and described second layer laminated substrate gluing;
Excise described first bonding land of described first cascade substrate and described second bonding land of described second layer laminated substrate, one first internal substrate of described first cascade substrate is separated with one first outermost layer substrate, and one second internal substrate of described second layer laminated substrate is separated with one second outermost layer substrate; And
Remove described first outermost layer substrate of described first cascade substrate and described second outermost layer substrate of described second layer laminated substrate, with the described display element retaining described first internal substrate of mutual gluing and described second internal substrate and be sandwiched between described first internal substrate and described second internal substrate, and then form described display panel.
2. the thinning method of display panel according to claim 1, is characterized in that, also comprised before providing described display panel:
Described first internal substrate, described first outermost layer substrate, described second internal substrate and described second outermost layer substrate are provided;
By described first internal substrate and described first outermost layer substrate aligned with each other stacked and by described second internal substrate and described second outermost layer substrate aligned with each other stacked; And
Described first internal substrate stacked mutually and described first outermost layer substrate is engaged by described first bonding land, and engage described second internal substrate stacked mutually and described second outermost layer substrate, to form described first cascade substrate and described second layer laminated substrate by the second bonding land.
3. the thinning method of display panel according to claim 2, it is characterized in that, by described second bonding land of described first bonding land in the first internal substrate described in laser scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate, make described first internal substrate and described first outermost layer substrate welding and described second internal substrate and described second outermost layer substrate welding.
4. the thinning method of display panel according to claim 3, is characterized in that, the whole outer peripheral edges that described laser is stacked mutually in the first internal substrate described in scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate respectively.
5. the thinning method of display panel according to claim 3, is characterized in that, the side that described laser is stacked mutually in the first internal substrate described in scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate respectively.
6. the thinning method of display panel according to claim 3, it is characterized in that, also comprised before described second bonding land by described first bonding land in the first internal substrate described in laser scorification and described first outermost layer substrate and described second internal substrate and described second outermost layer substrate: described first internal substrate stacked mutually and described first outermost layer substrate and described second internal substrate stacked mutually and described second outermost layer substrate are heated to 400 to 600 degree Celsius.
7. the thinning method of display panel according to claim 1, it is characterized in that, described first bonding land and described second bonding land extend internally one apart from the scope defined from one of described first cascade substrate and described second bonding land side, and wherein said distance is between 1 millimeter to 15 millimeters.
8. the thinning method of display panel according to claim 1, it is characterized in that there is a frame glue-line for engaging described first internal substrate and described second internal substrate between described first internal substrate of described first cascade substrate and described second internal substrate of described second layer laminated substrate.
9. the thinning method of display panel according to claim 1, it is characterized in that, the material of described first cascade substrate and described second layer laminated substrate comprises glass or plastic cement.
10. the thinning method of display panel according to claim 1, it is characterized in that, when described first cascade substrate and described second layer laminated substrate are oppositely arranged, described first bonding land of described first cascade substrate is also relative to described second bonding land of described second layer laminated substrate, make when excising described first bonding land of described first cascade substrate along a vertical direction, can simultaneously by the described second bonding land excision of described second layer laminated substrate.
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| CN201510667121.6A CN105182575A (en) | 2015-10-15 | 2015-10-15 | Thinning method of display panel |
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| CN201510667121.6A CN105182575A (en) | 2015-10-15 | 2015-10-15 | Thinning method of display panel |
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| CN101187744A (en) * | 2007-12-11 | 2008-05-28 | 友达光电股份有限公司 | Thin substrate and production process and display panel manufacture process using the substrate |
| CN201303033Y (en) * | 2008-08-06 | 2009-09-02 | 顺达科技股份有限公司 | An integrated flexible composite substrate structure |
| CN102385186A (en) * | 2011-11-18 | 2012-03-21 | 深圳市华星光电技术有限公司 | Liquid crystal panel as well as manufacture method and manufacture equipment of liquid crystal panel |
| KR20140122312A (en) * | 2013-04-09 | 2014-10-20 | 엘지디스플레이 주식회사 | Liquid crystal display, method of manufacturing the same |
| CN104898316A (en) * | 2015-06-09 | 2015-09-09 | 武汉华星光电技术有限公司 | Manufacturing method for thin type liquid crystal panel |
-
2015
- 2015-10-15 CN CN201510667121.6A patent/CN105182575A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101187744A (en) * | 2007-12-11 | 2008-05-28 | 友达光电股份有限公司 | Thin substrate and production process and display panel manufacture process using the substrate |
| CN201303033Y (en) * | 2008-08-06 | 2009-09-02 | 顺达科技股份有限公司 | An integrated flexible composite substrate structure |
| CN102385186A (en) * | 2011-11-18 | 2012-03-21 | 深圳市华星光电技术有限公司 | Liquid crystal panel as well as manufacture method and manufacture equipment of liquid crystal panel |
| KR20140122312A (en) * | 2013-04-09 | 2014-10-20 | 엘지디스플레이 주식회사 | Liquid crystal display, method of manufacturing the same |
| CN104898316A (en) * | 2015-06-09 | 2015-09-09 | 武汉华星光电技术有限公司 | Manufacturing method for thin type liquid crystal panel |
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Application publication date: 20151223 |